XP-SN70
US Model
Canadian Model
AEP Model
E Model
SERVICE MANUAL
PORTABLE CD PLAYER
Sony Corporation
Personal Audio Company
Published by Sony Engineering Corporation
9-961-142-02
2003J16-1
© 2003.10
SPECIFICATIONS
Ver 1.1 2003. 10
Model Name Using Similar Mechanism NEW
CD Mechanism Type CDM-3325EK
Optical Pick-up Name DAX-25E
System
Compact disc digital audio system
Laser diode properties
Material: GaAlAs
Wavelength: λ = 780 nm
Emission duration: Continuous
Laser output: Less than 44.6 µW
(This output is the value measured at a distance
of 200 mm from the objective lens surface on
the optical pick-up block with 7 mm aperture.)
D-A conversion
1-bit quartz time-axis control
Frequency response
20 - 20 000 Hz
+1
–2
dB (measured by JEITA CP-
307)
Output (at 4.5 V input level)
Headphones (stereo minijack):
Approx. 5 mW + Approx. 5 mW at 16 Ω
Power requirements
For the area code of the model you
purchased, check the upper left side of the
bar code on the package.
•Two LR6 (size AA) batteries: 1.5 V DC × 2
•AC power adaptor (DC IN 4.5 V jack):
Battery life*
1
(approx. hours)
(When you use the CD player on a flat and stable
surface)
Playing time varies depending on how the CD
player is used.
When using two Sony alkaline batteries
LR6 (SG) (produced in Japan)
E•A•S•S GP
12
Audio CD 50 45
ATRAC3plus files*
2
77
MP3 files*
3
72
*1 Measured value by the standard of JEITA
(Japan Electronics and Information Technology
Industries Association)
*2 When recorded at 48 kbps or 64 kbps
*3 When recorded at 128 kbps
Operating temperature
5°C - 35°C (41°F - 95°F)
Dimensions (w/h/d) (excluding
projecting parts and controls)
Approx. 133 × 34 × 151 mm
(5
1
⁄
4
× 1
3
⁄
8
× 6 in.)
Mass (excluding accessories)
Approx. 341 g (12.0 oz.)
Design and specifications are subject to change
without notice.
Headphones (1)
Hand strap (1)
AC power adaptor* (1)
CD-ROM (SonicStage Simple Burner)** (1)
* Not supplied with the U model. For the area
code of the model you purchased, check the
upper left side of the bar code on the package.
** Do not play a CD-ROM on an audio CD player.
US, Canadian models: 120V, 60Hz
AEP, MX models : 100-240V, 50/60Hz
•Abbreviation
MX : Mexican model
2
XP-SN70
Flexible Circuit Board Repairing
•
Keep the temperature of the soldering iron around 270 ˚C during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
•Never reuse a disconnected chip component.
•
Notice that the minus side of a tantalum capacitor may be damaged by heat.
This appliance is classified as a CLASS 1 LASER product.
The CLASS 1 LASER PRODUCT MARKING is located on
the rear exterior.
CAUTION
Use of controls or adjustments or performance of procedures
other than those specified herein may result in hazardous
radiation exposure.
On AC power adaptor
• Use only the commercially-available AC power
adaptor whose rated output is 4.5 V DC, 500 mA.
Do not use any other AC power adaptor. It may
cause a malfunction.
Polarity of the plug
TABLE OF CONTENTS
1. SERVICING NOTE ·························································· 3
2. GENERAL ·········································································· 5
3. DISASSEMBLY
3-1. CABINET (UPPER) SUB ASSY,
PANEL (UPPER) LID ASSY ········································ 6
3-2. CONTROL BOARD ····················································· 7
3-3. CD MECHANISM (CDM-3325EK)····························· 7
3-4. MAIN BOARD ····························································· 8
3-5. MOTOR ASSY (SLED)(M902),
OPTICAL PICK-UP (DAX-25E),
TURN TABLE MOTOR ASSY (SPINDLE)(M901) ···· 8
4. ELECTRICAL CHECKING··········································· 9
5. DIAGRAMS······································································ 10
5-1. BLOCK DIAGRAM ··················································· 11
5-2. PRINTED WIRING BOARDS
– MAIN BOARD (SIDE A) – ····································· 12
5-3. PRINTED WIRING BOARDS
– MAIN BOARD (SIDE B) – ····································· 13
5-4. SCHEMATIC DIAGRAMS
– MAIN BOARD (1/4) – ············································· 14
5-5. SCHEMATIC DIAGRAMS
– MAIN BOARD (2/4) – ············································· 15
5-6. SCHEMATIC DIAGRAMS
– MAIN BOARD (3/4) – ············································· 16
5-7. SCHEMATIC DIAGRAMS
– MAIN BOARD (4/4) – ············································· 17
5-8. PRINTED WIRING BOARDS
– CONTROL BOARD – ············································· 18
5-9. SCHEMATIC DIAGRAMS
– CONTROL BOARD – ············································· 19
5-10.IC BLOCK DIAGRAMS ············································ 20
5-11.IC PIN FUNCTION DESCRIPTIONS ······················· 21
6. EXPLODED VIEWS
6-1. CABINET (UPPER) SECTION ·································· 23
6-2. CABINET (LOWER) SECTION ································ 24
6-3. CD MECHANISM SECTION (CDM-3325EK)········· 25
7. ELECTRICAL PARTS LIST ······································· 26
SAFETY-RELATED COMPONENT WARNING!!
COMPONENTS IDENTIFIED BY MARK 0 OR DOTTED LINE WITH
MARK 0 ON THE SCHEMATIC DIAGRAMS AND IN THE PARTS
LIST ARE CRITICAL TO SAFE OPERATION. REPLACE THESE
COMPONENTS WITH SONY PARTS WHOSE PART NUMBERS
APPEAR AS SHOWN IN THIS MANUAL OR IN SUPPLEMENTS
PUBLISHED BY SONY.
ATTENTION AU COMPOSANT AYANT RAPPORT
À LA SÉCURITÉ!
LES COMPOSANTS IDENTIFÉS PAR UNE MARQUE 0 SUR LES
DIAGRAMMES SCHÉMATIQUES ET LA LISTE DES PIÈCES SONT
CRITIQUES POUR LA SÉCURITÉ DE FONCTIONNEMENT. NE
REMPLACER CES COMPOSANTS QUE PAR DES PIÈSES SONY
DONT LES NUMÉROS SONT DONNÉS DANS CE MANUEL OU
DANS LES SUPPÉMENTS PUBLIÉS PAR SONY.
Unleaded solder
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size.)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40°C higher than
ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350°C.
Caution: The printed pattern (copper foil) may peel away if the
heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscous (sticky, less prone to flow) than
ordinary solder so use caution not to let solder bridges occur such
as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder.
3
XP-SN70
SECTION 1
SERVICING NOTE
The laser diode in the optical pick-up block may suffer electrostatic
breakdown because of the potential difference generated by the
charged electrostatic load, etc. on clothing and the human body.
During repair, pay attention to electrostatic breakdown and also use
the procedure in the printed matter which is included in the repair
parts.
The flexible board is easily damaged and should be handled with
care.
NOTES ON LASER DIODE EMISSION CHECK
The laser beam on this model is concentrated so as to be focused on
the disc reflective surface by the objective lens in the optical pick-
up block. Therefore, when checking the laser diode emission,
observe from more than 30 cm away from the objective lens.
BEFORE REPLACING THE OPTICAL PICK-UP BLOCK
Please be sure to check thoroughly the parameters as par the “Optical
Pick-Up Block Checking Procedures” (Part No.: 9-960-027-11)
issued separately before replacing the optical pick-up block.
LASER DIODE AND FOCUS SEARCH OPERATION
CHECK
During normal operation of the equipment, emission of the laser
diode is prohibited unless the upper lid is closed while turning ON
the S820. (push switch type)
The following checking method for the laser diode is operable.
• Method:
Emission of the laser diode is visually checked.
1. Open the upper lid.
2. With a disc not set, turn on the S820 with a screwdriver having a
thin tip as shown in Fig.1.
3. Press the u button.
4. Observing the objective lens, check that the laser diode emits
light.
When the laser diode does not emit light, automatic power control
circuit or optical pickup is faulty.
In this operation, the objective lens will move up and down 4
times along with inward motion for the focus search.
NOTES ON HANDLING THE OPTICAL PICK-UP
BLOCK OR BASE UNIT
Fig. 1 Method to push the S820
S820
(OPEN/CLOSE switch)
4
XP-SN70
TEST MODE
The software version display and LCD test can be performed when
the test mode is activated.
Procedure:
1. Confirm the set is not powered on. (Remove two batteries and
disconnect the AC power adaptor.)
2. Short the solder land SL806 (TEST) on the MAIN board.
3. Turn on the main power. (Insert two batteries.)
4. Microcomputer version is displayed for about a second.
5. After that all segments of the liquid crystal display are turned on.
6. Turn off the main power. (Remove two batteries.)
7. Open the solder land SL806 (TEST) on the MAIN board.
Note : The solder should be removed clean.
IC601
IC802
IC801
IC701
SL806
(TEST)
MAIN BOARD (SIDE A)
5
XP-SN70
SECTION 2
GENERAL
This section is extracted
from instruction manual.
Locating the controls
CD player (front)
CD player (inside)
Battery compartment
(pages 10, 23)
E•A•S•S GP switch
(page 20)
* The button has a tactile dot.
FOLDER SKIP +/– buttons
(page 12)
DISPLAY button
(pages 20, 21)
Display
(pages 13, 16, 19-23)
i (headphones) jack
(page 10)
DC IN 4.5 V (external
power input) jack (page 23)
HOLD switch (page 22)
u* (play/pause) button
(pages 11, 12, 16, 18, 19)
x (stop) button
(pages 12, 22)
./> (skip/search)
buttons (pages 12, 16, 19)
SOUND button
(pages 21, 22)
OPEN/LOCK knob
(pages 10, 11)
PLAY MODE/ (repeat)
button (pages 16-19)
VOLUME +*/– buttons
(page 11)
6
XP-SN70
SECTION 3
DISASSEMBLY
Note : Disassemble the unit in the order as shown below.
Note : Follow the disassembly procedure in the numerical order given.
3-1. CABINET (UPPER) SUB ASSY, PANEL (UPPER) LID ASSY
CD MECHANISM
(CDM-3325EK)
CABINET (UPPER) SUB ASSY,
PANEL (UPPER) LID ASSY
CONTROL BOARD
MAIN BOARD
SET
MOTOR ASSY (SLED) (M902),
OPTICAL PICK-UP (DAX-25E),
TURN TABLE MOTOR ASSY (SPINDLE) (M901)
4
two hooks
5
eight screws (1.7)
2
screw (case)
3
screw (case)
6
cabinet (upper) sub assy
8
panel (upper) lid assy
1
7
flexible flat cable
(22P) (CN808)
7
XP-SN70
3-2. CONTROL BOARD
2
two hooks
1
eleven screws
3
plate (control)
4
CONTROL board
3-3. CD MECHANISM (CDM-3325EK)
5
CD mechanism
(CDM-3325EK
)
1
flexible board
(15P) (CN601)
4
three insulators
3
connector (4P)
(CN402)
2
connector (2P)
(CN401)
8
XP-SN70
3-4. MAIN BOARD
2
battery terminal (+
)
3
MAIN board
1
battery terminal (-)
When installing it,
align the switch position
as shown.
S810
3-5. MOTOR ASSY (SLED)(M902), OPTICAL PICK-UP (DAX-25E),
TURN TABLE MOTOR ASSY (SPINDLE)(M901)
1
three screws
(B1.7x4)
2
gear cover
4
optical pick-u
p
(DAX-25E)
chassis
5
three screws
(B1.7x4)
6
turn table motor assy
(spindle) (M901)
3
motor assy
(sled) (M902)
9
XP-SN70
SECTION 4
ELECTRICAL CHECKING
The CD section adjustments are done automatically in this set.
In case of operation check, confirm that RF level.
Precautions for Check
1. Perform check in the order given.
2. Use YEDS-18 disc (Part No.: 3-702-101-01) unless otherwise
indicated.
3. Power supply voltage requirement : DC4.5 V in DC IN jack.
(J401)
VOLUME button : Minimum
HOLD switch : OFF
E
.
A
.
S
.
S
GP switch : 1
RF Level Check
Condition:
• Hold the set in horizontal state.
Connection:
Procedure:
1. Connect the oscilloscope to the test points TJ601 (RF) and
TJ403 (RFGND) on the MAIN board.
2. Set a disc. (YEDS-18)
3. Press the u button.
4. Check the oscilloscope waveform is as shown below.
A good eye pattern means that the diamond shape (◊) in the
center of the waveform can be clearly distinguished.
RF Signal reference Waveform (Eye Pattern)
VOLT/DIV : 100 mV (With the 10:1 probe in use)
TIME/DIV : 500 ns
To watch the eye pattern, set the oscilloscope to AC range and
increase the vertical sensitivity of the oscilloscope for easy watch-
ing.
5. Stop revolving of the disc motor by pressing the x button.
RF level
0.45 to 0.65 Vp-p
oscilloscope
(AC range)
+
–
MAIN board
TJ601 (RF)
TJ403 (RFGND)
IC601
IC802
IC801
IC701
TJ403
(AGND
)
TJ601
(RF)
MAIN BOARD (SIDE A)
Checking Location:
10
XP-SN70
SECTION 5
DIAGRAMS
Note on Printed Wiring Board
• X : parts extracted from the component side.
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
• MAIN board is multi-layer printed board. However, the pat-
terns of intermediate-layer have not been included in the dia-
gram.
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side A) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side B) the parts face are indicated.
Note on Schematic Diagram:
• All capacitors are in µF unless otherwise noted. pF: µµF 50 WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in Ω and
1
/
4
W or less unless otherwise specified.
•%: indicates tolerance.
• C : panel designation.
• A : B+ Line.
•Total current is measured with CD installed.
•Power voltage is dc 4.5 V and fed with regulated dc power supply
from DC IN jack (J401).
•Voltages and waveforms are dc with respect to ground in playback
mode.
no mark : CD PLAY
*
: Imposible to measure
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production toler-
ances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler-
ances.
• Circled numbers refer to waveforms.
• Signal path.
J : CD
NOTE FOR PRINTED WIRING BOARDS AND SCHEMATIC DIAGRAMS
• WAVEFORMS
Note:
The components identi-
fied by mark 0 or dotted
line with mark 0 are criti-
cal for safety.
Replace only with part
number specified.
Note:
Les composants identifiés par
une marque 0 sont critiques
pour la sécurité.
Ne les remplacer que par une
piéce portant le numéro
spécifié.
600 mVp-p
1 IC601 if RFAC
100mV/DIV, 400ns/DIV
2 IC601 rk XTAO
1V/DIV, 20ns/DIV
3 IC801 wk XIN
1V/DIV, 40ns/DIV
4 IC403 ef SYNC
1V/DIV, 2us/DIV
59ns
118ns
5.7us
2.8 Vp-p
3.1 Vp-p
2.4 Vp-p
5 IC701 e; XTAL
(MP3 mode)
1V/DIV, 20ns/DIV
44ns
3.1 Vp-p
1111
XP-SN70
5-1. BLOCK DIAGRAM
+1.5V
REG
+2.4V
REG
• Signal Path
: CD
LASER
DIODE
OPTICAL PICK-UP
DAX-25E
PD
LD
M
FOCUS
COIL
TRACKING
COIL
SLED
MOTOR
SPINDLE
MOTOR
F+
F-
T+
T-
S+
S-
SYSTEM CONTROL
IC801
VCC
LD
VCC1
(2.25V)
DETECTOR
COIL/MOTOR
DRIVER
IC403(1/2)
RF
A
E
B
F
PWG
31
INM4(PD)
32
FO3
44
PD
RO3
42
FO2
48
RO2
46
FO1
52
RO1
50
COM
COM
80
W
W
6
V
V
4
U
U
2
56FI1
55RI1
60FI3
59
RI3
58
FI2
57
RI2
70XBRK
73
APWM
34SYNC
39
DATA
38
CLOK
40LATCH
74
FG
DSP,DSSP,DAC,
DRAM CONTROLLER
IC601
MP3 DECODER
IC701
EEPROM
IC803
RFDC
88
RFAC
84
A
92
B
91
E
89
F
90
X601
16.934MHz
47
XTAO
XTAI
48
SFDR
100
SRDR
99
FFDR
96
FRDR
95
TFDR
98
TRDR
97
MDP
103
C176
104
MDS
102
SDTO
21
CLOK
20
XLAT
23
SENS
22
SCOR
27
FOK
65
R8M
32
GFS
69
XRST
28
D0
D3
A0
A10
XRAS
5
DRAM
IC603
2
XWE
9
XCAS
1
XRAS
A0
A10
2
3
24
25
.
.
.
XWE
4
XCAS
23
BCK
2
PCMD_O
LRCK_O
BCK_O
PCMD
4
LRCK
1
SK
2
CS
1
XRESET_I
30
DO
4
DI
3
PI3
13
PCMD_I
LRCK_I
BCK_I
PF4
12
18
XRDE
PI0
15
PI2
14
D0
D3
17
15
13
.
11
.
116
113
.
117
9
12
15
.
19
21
.
8
.
51
AOUT1
56
AOUT2
61
LRMU
10
FG_I
90
POWLT_O
84
MSDTO0_O
83
MSCK0_O
87
XLAT0_O
85
MSDTI0_I
86
SCOR_I
52
FOK_I
28
XIN
53
GFS_I
4
XRST_O
77
PWRSW_O
6
BEEP_O
AD-DCINMNT
95
WAKE
36
LID-SW_I
37
VCC0
OPSTB
OPGSW
4
3
6
5
.
.
.
XSOE
24
88
XSOE_O
SYSM
25
7
AMUTE_O
NRST
33
PF0
34
PF3
37
PC1
40
PC2
41
60
AT3_MP3_V_O
66
WAKEUP_K_O
11
REQ_I
20
SDIN_I
19
SDOUT_O
PC0
38
18
SDCLK_O
PC3
42
17
SDXLAT_O
67
EEP_CS_O
HG_XSTB_O
12
HG_GUP_O
13
IC702
RSTB35
XWAKE_O 32 WAKEUP37
UI
79
VI
78
WI
77
X701
22MHz
29
XTAL
EXTAL
30
108
106
110
109
107
111
SWITCH
Q601
92
AD-BATMNT
1
2
E⋅A⋅S⋅S GP
S811
OFF
ON
HOLD
S810
5
VCC
VIN
LIN
14
RIN
15
BEEP
17
PWRSW
20
MUTE
19
8
LOUT
6ROUT
7VREF
HEADPHONE AMP
IC301
J301
DRY BATTERY
SIZE "AA"
(IEC DESIGNATION LR6)
2PCS, 3.0V
REG
Q402
62
RF1
61
DCIN
53
VD1
5
VD5
1
VD4
12
VIN
8
L5
IC403(2/2)
POWER CONTROL
D402
D405
41
VD3
45
VD23
49
VD12
VCC0VCC0 20
VLGO2
16
VCC218
DC IN 4.5V
J401
69
BATM2
VIN
VCPUVCPU
(2.0V)
IC701 AVD
19
VCC3VCC3
(2.65V)
11
+1.5V
IC806
32
SWITCH
Q801,802
VCC1VCC1
(2.25V)
VCC2
17
L7
10
S820
(OPEN/CLOSE)
AD-KEY2
97
ESP_I
39
HOLD_I
40
FUNCTION
KEY
S1101 - 1107
FUNCTION
KEY
S1108 - 1111
LCD401
LIQUID CRYSTAL DISPLAY
AD-KEY1
96
XRD_O
AD0 - AD7D0 -D7
71
XWR_O
72
LCD_A0
69
P/S_O
61
LCD-XRST_O
RD
WR
A0
P/S
RES
73
44-51
LCD VDD (+2.4V)
IC802
23
1212
XP-SN70
5-2. PRINTED WIRING BOARDS – MAIN BOARD (SIDE A) –
IC601
IC802
IC801
IC701
MAIN BOARD (SIDE A)
S820
(OPEN/CLOSE)
S811
2 1
J401
J301
DC IN 4.5V
2
1
2
4
3
R679
R678
R677
R676
R675
R674
R673
R672
R671
R681
R682
R683
R684
R685
R686
R687
C606
C697
TP601
TP952
TP602
TP603
TP604
TP609
TP610
TP650
TP953 TP613TP655
TP612
TP611
TP607
TP605
TP606
TP608
TP716
TP715
TP714
TP712
TP713
R721
R717
R716
R719
R715
TP703
TP702
TP701
TP955
X701
FB701
C713
C711
R731
R707
R706
R722
R724
R842
R897
R702
R703
TP709
TP824
TP851
TP825
TP831
TP817
TP814
TP818
TP819
TJ606
TP651
TP653
TP934
TP932
TJ301
TJ201
TJ101
TJ602
TJ604
TJ603
TP816
TP823
TP815
TP853
TP922
TP401
VDR803
VDR802
C898
R840
R971
R844
R845
R911
R935
R877
R816
R848
(AEP)
R817
R815
R839
R818
R833
R834
R838
C830
R886
R887
C835
C834
TP830
TP827
TP829 TP828
R824
R933
R934
R949
R814
R898
TJ801
EB409
TP419
TP801
TJ403
TP418
TP820
TJ404
(AGND)
TJ405
TJ408
TJ407
1-689-450-
FB404
FB406
FB407
FB801
R801
R487
R612
C897
TP711
TP710
TP708
C812
TP802
TP803
R734
R727
R728
R821
R811
R833
R723
R725
R732
R906
R822
R823
R841
C806
R733
C403
TJ401
TJ402
TP422
TJ503
TJ502
TJ406
TJ501
FB405
TP909
TP906
TP402
TP905
TP404
Q402
EBC
R452
C416
R453
R415
TP927
R422
R424
R429
C404
C430
R406
R414
D421
D422
R477
C447
C706
VOR601
R720
C705
C853
C852
R1002
C899
R710
R711
R708
R709
C628
R648
FB602
R688
C696
R636
R626
C619
C621
C620
C698
TP951
TP617
TP619 TP622
TP621
TP618
C624
R619
R625
R629
R602
R668
R658
C601
R603
C611
TP625
TJ601(RF)
TP620
TP916
C609
R656
R624
C608
C605
R663
R662
R628
R665
R633
R632
R637C618C630
R617
R616
R604R605
R621
R618
C607
C637
R655
R622
R625
R626
C613
C640
C612
TP626
C699
C614
R623
TP656
C638
TP627
TP949
TP948
TP630
TP950
TP637TP638
TP634
TP639TP642
TP643
TP644
TP640
TP641
TP635
TP636
TP631
TP632
TP633
TP629
TP628
TP614
R614
X601
C627 FB601
R639
R638
R640
R645
R641
R649
R642
R651
R643
R689
TP826
C426
C432
C437
C435
(11)
11
12
A
B
C
D
E
F
G
H
I
3456789
10
• : Uses unleaded solder.
Ref. No. Location
D421 F-3
D422 F-3
Q402 G-3
IC601 B-6
IC701 E-4
IC801 E-6
IC802 D-5
• Semiconductor
Location
Ver 1.1 2003.10
1313
XP-SN70
5-3. PRINTED WIRING BOARDS – MAIN BOARD (SIDE B) –
MAIN BOARD (SIDE B)
A
TO
CONTROL BOARD
CN1101
(Page 18)
OPTICAL
PICK-UP
BLOCK
(DAX-25E)
S810
HOLD
OFF
ON
M901
SPINDLE
MOTOR
DRY BATTERY SIZE "AA"
(IEC DESIGNATION LR6)
2PCS, 3.0V
M902
SLED
MOTOR
12
A
B
C
D
E
F
G
H
I
345678910
TAP805
C808
R865
TP821
TP954
L603
FB402
FB401
C623
C622
VDR405
C445
C446
R434
R433
R438
C440
C429
R498
C432
C436C434
C450
C433
L407
L403
L408
L404
FB403
TP907TP908
BT403
BT402
C428
C437
TP417
FB414FB413
VDR406
TP904
C425
C406
C454
C709
C714
C710
C701
C702
C703
C712
C708
C805
C821
C419
C810
C420
C455
L704
L703
C421
C417
C422
C423
C458
R416
C718
FB408
D405
TP411
TP414
TP413
CN402 CN401
TP412
TP410
TP409
R460
R876R894
R419
R417
R403
R459
R812
R813
R914
R912
R831
Q802
R819
TP812
TP811
C426
R843
R908
R913
C896
VDR806
Q801
R825
R830
D801
R826
R828
FB410
R1003
R820
R837
R715
R714
R713
R730
R719
R718
R717
R454
R476
R489
R456
R418
Q402
TP403
TP420
TP901
TP902
TP920
TP918
TP919
R1001
TP917
TP852
TP416
TP415
L411
L406
L409
L411
R440
TP423
TP424
TP425
R436
R432
R431
R430
C438
R427
VDR404
C427
R480
R495
C463
D403
BT404
TP822
FB416
TP421
TP914
TP933
TP910
TP946
TP911
VDR901
TP935
TP939
TP652
TP654
TP647
TP646 TP648
TP645
TP941
TP940 TP936
TP938
TP942
TP937
TP943
VDR308
FB201 FB101
C405
L402
L412
C415
C306
C309
C307
D308
C308
C301
R201 R101
R650
C632
C631
Q601
L601
R922
CN808
22
21
2
1
1
15
R920
R901
R610
R699
C313
C207 C103
C203
R111R211
C304
R202
R102
R318R305
CN601
R646
R606
R608
R670
R930
R928
R929
R919
R921
R923
R925
R927
R926 R924
C610
FB305
C302C303
FB303
R301
R302
C305
D402
R411
R413
R412
L413
FB415
L401
C410
L301
VDR402
VDR401
R866
14
85
1
1
2
1
4
23
IC301
IC803
IC806
IC702
IC403
IC603
1-689-450-
(11)
11
• : Uses unleaded solder.
Ref. No. Location
D308 D-2
D402 F-2
D403 H-3
D405 G-6
D801 E-5
IC301 D-2
IC403 F-8
IC603 B-7
IC702 E-6
IC803 E-6
IC806 F-6
Q601 C-3
Q801 E-4
Q802 E-4
• Semiconductor
Location
1414
XP-SN70
5-4. SCHEMATIC DIAGRAMS – MAIN BOARD (1/4) –
X601
TP631
TP632
TP633
TP634
TP635
TP636
IC601
TP409
TP410
TP411
TP412
CN401
CN601
C606
R645
R649 R648
C628
TP601
TP602
TP603
TP604
TP605
TP606
TP607
TP608
TP609
TP610
TP650
TP952
C619
TP951
FB601
C620
C621
C626
TP613
TP612
TP655
L602
R636
TP611
TP953
FB602
C696
TP614
TP617
TP618
TP619
TP621
TP622
TP625
C624
R619
C607
C608
R622
R624
C609
R625
VDR612
TP916
R630
R629
TP620
R662
SL602
R603
TP626
TP948
TP949
C611
R633
C601
R632
SL601
TP629
TP630
TP950
TP637
TP638
C630
TP639
TP640
TP641
TP642
TP643
TP644
TP651
TJ601
TP653
TJ604
TJ602
TP654
TP645
TP646
TP647
TP648
C631
C632
R646
R670
TJ603
R608
TJ606
R610
TP652
(OPEN)
(OPEN)
(OPEN)
R699
R650
C610
R606
TP413
TP414
R415
D422
D421
C416
FB401
FB402
R607
VDR601
C614R663
C613
C627
C697
R611
R651
R643
R642
R641
R640
R639
R638
C618
L601
R414
R604
R605
C616
C617
C605
R621
R618
R623
R626
C699
C698
R628
C612
R602
TP627
TP628
CN402
R452
R453
Q601
R612
16.934MHz
CXD3048R
U
V
W
COM
2P
15P
1000p
0
0 100k
0.1
22
6.3V
100p
47 6.3V
0.1
470
XWRE
10p
FOK
GFS
1
2.2k
4700p
0.47
1M
10k
0.47
470k
NM
47k
47k
AVSS
47k
22k
RFCD
470p
100k
470p
100k
0.1
RF
PD
LD
22
6.3V
0.1
0
4.7k
LD-
2.2
LD+
100k
0
0
R655
0
R656
0
R665
0
C637
0
R658
0
C640
0
R668
0
C638
0
10
6.3V
0
470k
MA111-TX
MA111-TX
4.7
0
22p100k
2200p
1
0.1
0
470
470
470
470
470
470
470
0.1
0
22k
22k
470p
470p
0.1
10k
2.2k
220k
0
0.1
22
6.3V
22k
100p
22k
E
F
4P
220k
1M
2SB167900LS0
47
• See page 10 for Waveforms. • See page 20 for IC Block Diagrams.
1515
XP-SN70
5-5. SCHEMATIC DIAGRAMS – MAIN BOARD (2/4) –
TP954
L603
TP942
TP938 TP937
TP941
TP930
TP940
TP935
TP911
TP910
TP932
TP933
TP934
L301
TP943
TP939
FB201
FB101
FB303
TJ101
TJ301
TJ201
TP946
VDR308
L703
L704
TP920
TP955
TP
701
TP
702
TP703
FB701
TP922
TP708
TP709
TP710
TP711
TP919
TP918
TP
712
TP
713
TP714
TP715
TP
716
IC301
X701
D
308
J301
R679
R678
R677
R676
R675
R
674
R673
R672
R671
R689
R688
R687
R686
R685
R684
R683
R682
R681
C623
C622
R101
R201
FB409
FB305
C107
C207
R202
R102
R211
R
111
R318
C
103
C203
C313
C304
C302
C303
C306
C305
R305
C309
R302
C301
C708
C713
C711
C709
R706
R707
R731
C714
R732
R722
R723
R725
R724
R702
R703
R728
R733
R
734
R727
C701
C702
R717
R718
R719
R730
R713
R714
C715
C717
C718
R715
R720
R
708
R
709
R
710
C706
C712 R721
C705
R711
C716
C719
C703
C307
R301
IC603
IC701
IC702
C308
C710
L
COM
R
TP914
TA2120FN(EL)
22MHz
M
A147-TX
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
10
6.3V
0
0
2.2
2.2
100k
100k
22k
22k
0
100p
100p
0.1
0.47
10 6.3V
10 6.3V
1
22 10V
0
0.1
4.7
0.01
0.1
0.1
0.1
0.1
100k
100k
1M
22
6.3V
1M
0
0
0
0
0
0
100k
1M
10k
0
0.1
22
6.3V
0
0
0
0
0
0
0.1
0.1
0.1
0
100k
100k
100k
100k
0.1
0.1 0
22
6.3V
100k
0.1
0.1
0.1
0.1
4.7
MSM51X17400F- 10TFSR1
CXR712160-203R
XN0NE9200LS0
2.2
0.1
• See page 10 for Waveforms. • See page 20 for IC Block Diagrams.
1616
XP-SN70
5-6. SCHEMATIC DIAGRAMS – MAIN BOARD (3/4) –
BT401
BT402
BT403
BT404
J401
C423
C422
C421
C420
C419
TP402
TP403
TP404
TP415
TP416
TP902
TP905
VDR406
TP401
TP907
TP908
TP927
TP904
C450
C433
C429
TP417
TP906
TJ408
TJ407
TJ409
VDR402
VDR401
TP419
TP418
TP420
TJ405 TJ403
TJ404
L406 L409
TP423
TP424
TP425
TP422
TJ402
TJ401
VDR404
VDR405
C446
C427
C430
C404
C440
C447
TJ503
TJ502
TJ
TJ406
Q402
R489
R460
R459
C458
C455
C406
R403
R476
R454
D405
C454
R419
FB413
R456
C425
L407
L408
L404
C428
FB414
C463
C437
C436
C434
C432
L403
C405
C410
FB416
0
FB415
0
L402
L401
L413
D402
R411
R412
R413C415
R418
R417
C417
C426
FB404
L412
R487
C403
C438
R429R424
R406
R430
R431
R432
R436
R433
R427
R434
R438
R480
R477
C445
L411
R440
R495
R498
FB405
FB403
R422
C435
D403
IC403
1000p
1000p
1000p
0.1
0.1
1
1
0.1
B-
B+
DC+
MAINGND A GND
AU GND
4700p
0.1
2200p
0.1
2200p
1000p
VCC3
VCC2
VCC1
VCPU
2SB1237TV2PQR
0
100
100k
R416
0
1
4700p
2.2
0
0
0
RB160M-30TR
0.1
47k
0
100
6.3V
4.7 16V
4.7
10V
220
6.3V
10
6.3V
10
6.3V
220
6.3V
1
1
RB160M-30TR
220k
47k
22k0.22
100k
100k
0.1
220
6.3V
0
0
0
470p
1
00
2.2M
0
0
0
0
0
100k
470
10k
1M
0
1
1M
0
0
0
47
6.3V
RB160M-30TR
TB2138AFG
• See page 10 for Waveforms.
1717
XP-SN70
5-7. SCHEMATIC DIAGRAMS – MAIN BOARD (4/4) –
IC806
Q801
IC803
IC802
CN808
S820
TP917
TP818
TP819
TP816
TP815
TP814
TP817
VDR806
TP827
TP801
TP820
C897
TP828
TP829
TP830
TP802
TP803
TP811
TP812
VDR803
VDR802
TP831
TJ801
TP823
TP824
TP851
TP825
TP853
TP852
VDR901
TP826
Q802
R1001
FB408
R949
R933
R934
R911
R898
SL805
R935
R877
R816
R848
R839
R818
R815
R824
R833
R834
R838
C896
C835
C834
C833
C830
C812
R811
R1002
R887
R886
R821
FB407
FB406
R801
FB801
R814
FB410
C899
R812
R813
R842
R897
R906
R908
R822
R823
R912
R913
R914
SL802
SL803
SL804
R826
R828
R830
R831
D801
C898
R837
R820
R841
SL801
R840
R1003
R971
R843
R819
R844
R845
SL806
C806
R876
C805
R894
R927
R926
R925
R924
R923
R922
R921
R920
R919
R901
R929
R928
R930
C852
C853
R865
R866
TAP805
C808
IC801
C810
C821
TP821
TP822
S810
S811
XC6206P152MR
XP4501-TXE
AK6417CH-E2
MM3032EULE
22P
0.1
TEST
OPEN
DTC143TUA-T106
470k
100k
10k
10k
100k
1k
100k
100k
0
0
R817
AEP
0
0
0
0
0
0
0
0
0.1
4700p
4700p
4700p
4700p
0.1
10k
10k
0
100k
0
0
0
0.1
0
0
0
0
0
0
0
0
10k
100k
100k
1M
2.2M
470k
1M
MA728-TX
0.1
0
0
1k
1k
1M
100k
0
0
0
0
0.1
0
1
10k
0
0
0
0
0
0
0
0
0
0
0
0
10k
1
1
10k
10k
4700p
TMP91CW28FG
1
0.1
EASS
HOLD
• See page 10 for Waveforms.
Ver 1.1 2003.10
1818
XP-SN70
5-8. PRINTED WIRING BOARDS – CONTROL BOARD –
R1119
R1120
R1122
R1114
S1111
S1110
S1107
S1106
LCD401
LIQUID CRYSTAL
DISPLAY
C1106
R1127
C1103
C1102
R1123
R1124
R1116
R1115
R1103
C1104
C1105
TP1
C1101
R1125
CN1101
R1126
S1108
S1101
S1109
S1102
S1103
S1105
S1104
R1113
R1112
R1111
R1110
R1109
R1108
R1107
R1106
R1105
R1104R1102
R1118
R1101
CONTROL BOARD
A
TO
MAIN BOARD
CN808
(Page 13)
VOLUME
+
-
PLAY MODE/
f
SOUND
+
+
+
-
FOLDER
SKIP
22
1
1
24
12
A
B
C
D
E
F
G
H
I
3456789
1-689-450-
(11)
11
• : Uses unleaded solder.
1919
XP-SN70
5-9. SCHEMATIC DIAGRAMS – CONTROL BOARD –
R1101
C1104
C1105
C1101
C1102
C1103
R1123R1124R1125R1126
TP
CN1101
S1101
S1102
S1103
S1104
S1105
S1106
S1107
S1108
S1109
S1111
R1103
R1115
R1102
R1104
R1105
R1106
R1107
R1108 R1109
R1110 R1111
R1112 R1113
R1114
R1116
R1118
R1119R1120
R1122
C1106
R1127
LCD401
S1110
4.7k
1
1
1
1
1
1M100k470k1M
10k
10k
1k
2.2k
2.2k
10k
4.7k
47k 4.7k
22k 10k
47k 22k
47k
2.2k
2.2k
10k22k
22k
0.1
0
2020
XP-SN70
5-10. IC BLOCK DIAGRAMS
IC301 TA2120FN (EL)
IC601 CXD3048R
+
–
+
–
+
–
23
18
17
16
15
14
13
2
3
4
5
6
7
8
9
11
12
1
24
BIAS
BEEP
PW
SW
MT
SW
ALC
DET
ATT
SW
PWC
SW
ROUT
LOUT
BEEPMUTE MUTEC
BST
PW
B
PW
C
BST
NF
ADDO RF IN OCL ROUT VREF LOUT PGND MIXO ALC
IN
ALC
DET
ATT
LINRINGND
PWR
SW
BIAS
BIASI
BB
SW
BSTO
VCC
ADD
A
ADD
B
21
22
PW
A
ALC ALC
20 19
10
21
22
23 24 25 26 27
28 29
30
2
3
5
4
6
7
8
9
10
1
11
12
13
14
15
16
17
18
19
20
31
32
33
34
35
36
37
38
39
40
51
52
53
54
55
56
57
58
59
60
61
62
6364
65
6667
68
6970
41
42
43
44
45
46
47
48
49
50
7172
73
747576
77
78
7980
81
82
838485
86
8768
89
90
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
91
92
93
94
95
96
97
98
99
AVDD
F
E
RFDC
AVSS0
IGEN
AVDD0
RFAC
AVDD3
BIAS
ASY_I
ASY_O
AVSS3
VPCO
CVTL
CVTV
FILO
FILI
PCO
VDDI
XPCK
XUGF
GFS
CZPO
COUT
MIRR
FOK
DFCK
ATSK
DOUT
LRMU
VSSI
TEST
TEST1
AVDD2
AOUT2
VREFR
AVSS2
AVSS1
VREFL
AOUT1
AVDD1
XVSS
XTAO
XTAI
XVDD
HPVDD
HPR
HPL
HVSS
XTSL
EXCK
SBSO
XWIH
XEMP
SQSO
SCLK
BQCK
VSS0
R4M
XWRE
B
A
VC
VSS2
FRDR
FFDR
TRDR
TFDR
SRDR
SFDR
SSTP
MDS
MDP
SYNC
VDD2
LRCK_O
LRCK_I
PCMD_O
PCMD_I
BCK_O
BCK_I
DVDD
A3
A2
A1
A0
A10
A11
A12
A13
XRAS
XWE
D1
D0
D3
D2
DCLK
DCKE
XCAS
WFCK/DQM
A9
A8
A7
DVSS
A6
A5
A4
XRDE
VDD0
CLOCK_I
SQTO_I
SENS_O
XLAT_I
XSOE_I
SYSM_I
WQCK_O
SCOR_O
XRST_I
PWMI
XQOK
ANALOG SW
A/D
ASYMMETRY
CORRECTOR
FOCUS
PWM
SLED
PWM
PWM GENERATOR
SERVO DSP
TRACKING
PWM
VDD
AVDD
DIGITAL
PLL
DIGITAL
OUT
MIRR
DFCT
FOK
TEST
TES1
LPF
LPF
DAC
CLOCK
GENERATOR
EFM
DEMODULATOR
D/A
INTERFACE
ERROR
CORRECTOR
32K
RAM
SUB CODE
PROCESSOR
DIGITAL
CLV
VDD
VDD
SELECTOR
SERVO
INTERFACE
MDS
SYNC
SERVO
AUTO
SEQUENCER
MEMORY
CONTROLER
TEST
3, 4
TEST
1, 2
CPU
INTERFACE
VDD
XRST
R4M
AVDD
VDD
VDD
ARM77TDMI
CPU CORE
VIRTUAL ENGINE
CORE
HUFFMAN HW
MAGIC GATE
CORE
CLOCK GENERATOR/
SYSTEM CONTROLLER
DMAC (CH0)
DMAC (CH1)
DMAC (CH2)
WATCHDOG TIMER
PRESCALLER/
TIME BASETIMER
RAM
160K BYTES
RAM
512K BYTES
EEPROM SERIAL
INTERFACE
CD-ROM
INTERFACE
DAC
INTERFACE
DMAC (CH3)
SERIAL INTERFACE
(CH0)
UART (CH0)
UART (CH1)
RAM
2
8
2
TRST
TDO
TMS
VDIO3
TDI
TCK
TEST0
DVSS1
DVDD3
TEST2
TEST1
TRST (TEST4)
TEST3
XOUT (TEST5)
TACK (TEST6)
VDIO2
LRCK
BCK
VDIOCD0
PCMDI
DVDD4
TAP TD0
SCANEN
DVDD0
DVSS0
DVIO0
VDIOCD1
PF4
P13
P12
P10
EVA
DVDD2
DVSS2
PC3
PC2
PC1
VDIOCD2
PC0
PF3
PF2
PF1
PF0
NRST
KCS
VDIO1
KDO
KDI
KRB
DVDD1
DVSS3
AVDPLL
AVSPLL
AVSSOSC
AVDMO
EXTAL
XTAL
XIN
OSSEL
KCLK
INTERRUPT CONTROLLER
8BIT TIMER (CH7)
8BIT TIMER (CH6)
8BIT TIMER (CH5)
8BIT TIMER (CH4)
8BIT TIME
8BIT TIMER/COUNTER (CH2)
8BIT TIMER (CH1)
8BIT TIMER/COUNTER (CH0)
17 18 19 20 21 22 23 24 25 26
27 28 29
30
31 32
42
41
40
39
38
37
36
35
34
33
44
43
PE348
PE247
PE146
PE045
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
64 63 62 61 60 59 58 57 56 55 5453 52 51 50 49
IC701 CXR712160-203R
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