3.1 Modular Structure ....................................................................................................... 3-1
3.2 Operator-Machine Communication ............................................................................. 3-3
3.3 Configuration of the Local Control Panel (Function Group LOC) ..................................3-4
3.3.1 Bay Panel (Graphic Display) .......................................................................................................................... 3-5
3.3.2 Bay Panel (Text Display) ................................................................................................................................3-7
3.3.3 Signal Panel ...................................................................................................................................................3-9
3.3.4 Operation Panel ...........................................................................................................................................3-10
3.3.5 Fault Panel ...................................................................................................................................................3-11
3.3.6 Selection of the Control Point ...................................................................................................................... 3-12
3.3.7 Configurable Clear Key ................................................................................................................................3-12
3.4 Communication Interfaces ........................................................................................ 3-13
3.4.1 PC Interface (Function Group PC) ................................................................................................................ 3-14
3.4.2 Communication Interface 1 (Function Group COMM1) ................................................................................ 3-15
3.4.3 Communication Interface 2 (Function Group COMM2) ................................................................................ 3-24
3.4.4 Communication Interface IEC 61850 (Function Groups IEC and GOOSE) .................................................... 3-26
3.4.5 Redundant Ethernet Board .......................................................................................................................... 3-39
3.5 IRIG-B Clock Synchronization (Function Group IRIGB) ...............................................3-42
3.6 Configurable Function Keys (Function Group F_KEY) ................................................ 3-43
3.7 Configuration and Operating Mode of the Binary Inputs (Function Group INP) ......... 3-45
3.8 Measured Data Input (Function Group MEASI) .......................................................... 3-47
3.8.1 Direct Current Input on the Analog (I/O) Module Y ...................................................................................... 3-48
3.8.2 Connecting a Resistance Thermometer to the “PT 100 Analog Input” on the Analog (I/O) Module Y .......... 3-51
3.9 Configuration, Operating Mode, and Blocking of the Output Relays (Function Group
OUTP) ........................................................................................................................3-53
3.10 Measured Data Output (Function Group MEASO) ......................................................3-55
3.10.1 General Settings ..........................................................................................................................................3-55
3.10.2 BCD Measured Data Output ........................................................................................................................ 3-57
3.10.3 Analog Measured Data Output .................................................................................................................... 3-60
3.10.4 Output of “External” Measured Data ...........................................................................................................3-66
3.11 Configuration and Operating Mode of the LED Indicators (Function Group LED) ...... 3-67
3.11.1 Configuring the LED Indicators .................................................................................................................... 3-67
3.11.2 Layout of the LED Indicators ........................................................................................................................3-67
3.11.3 Operating Mode of the LED Indicators .........................................................................................................3-69
3.12 Main Functions of the C434 (Function Group MAIN) ..................................................3-72
3.12.1 Conditioning of the Measured Variables ...................................................................................................... 3-72
3.12.2 Operating Data Measurement ..................................................................................................................... 3-74
3.12.3 Configuring and Enabling the Device Functions .......................................................................................... 3-86
3.12.4 Function Blocks ........................................................................................................................................... 3-87
3.12.5 Blocked/Faulty .............................................................................................................................................3-88
3.12.6 Multiple Signaling ........................................................................................................................................ 3-88
3.12.7 CB Trip Signal .............................................................................................................................................. 3-90
3.12.8 Communication Error ...................................................................................................................................3-91
3.12.9 Time Tagging and Clock Synchronization ....................................................................................................3-91
3.12.10 Resetting Actions .........................................................................................................................................3-93
3.12.11 Assigning Communications Interfaces to Physical Communications Channels ............................................3-95
3.12.12 Test Mode ....................................................................................................................................................3-96
3.13 Parameter Subset Selection (Function Group PSS) ................................................... 3-97
3.14 Self-Monitoring (Function Group SFMON) ..................................................................3-99
3.14.1 Tests During Start-up .................................................................................................................................. 3-99
3.14.2 Cyclic Tests ..................................................................................................................................................3-99
3.14.3 Signals .........................................................................................................................................................3-99
3.14.4 Device Response ....................................................................................................................................... 3-100
3.14.5 Monitoring Signal Memory .........................................................................................................................3-101
C434 Table of Contents
2 C434/EN M/R-32-A // C434‑307‑652