Samsung NP700G7CS02US User manual

NP700G7C

700G7C

SERVICE

MANUAL

70G7CContents

1.Precaution

2.Introduction

3.DesassemblyandReassembly

4.Troubleshooting

5.SystemWireDiagram

RefertotheservicemanualintheGSPN(seetherearcover)formoreinformation.

Contents

1.Precaution........................................................................................................................................1−1

1.1.GeneralAfter-SalesServicePrecautions.......................................................................................1−1

1.2.SafetyPrecautions...................................................................................................................1−2

1.3.Ground..................................................................................................................................1−3

1.4.StaticElectricityPrecautions......................................................................................................1−4

2.Introduction.....................................................................................................................................2−1

2.1.ProductFeatures......................................................................................................................2−1

2.2.Specication...........................................................................................................................2−3

2.3.Comparingproductspecications...............................................................................................2−9

2.4.OptionpartList.......................................................................................................................2−10

2.5.FunctionofProduct..................................................................................................................2−14

2.6.Hardware–NewH/W.............................................................................................................2−20

2.7.SWList.................................................................................................................................2−29

2.8.SystemSetup(BiosSetup).........................................................................................................2−31

2.9.MainBoardInformation............................................................................................................2−37

3.DesassemblyandReassembly..............................................................................................................3−1

3.1.MainSystem............................................................................................................................3−1

3.2.LCDPart................................................................................................................................3−4

4.Troubleshooting...............................................................................................................................4−1

4.1.Generalspec...........................................................................................................................4−1

4.2.DebuggingFlowChart..............................................................................................................4−2

4.3.SystemDiagnosis....................................................................................................................4−5

4.4.DiagnosticProgram..................................................................................................................4−6

4.5.HardwareTroubleshooting........................................................................................................4−8

4.5.1.LCD.........................................................................................................................4−8

4.5.2.MainSystem..............................................................................................................4−10

4.6.RTCBatteryReset...................................................................................................................4−17

4.7.CPUFANControl....................................................................................................................4−18

4.8.BatteryUsetime......................................................................................................................4−21

4.9.BiosUpdate............................................................................................................................4−24

4.10.H/WUpgrade.........................................................................................................................4−25

5.SystemWireDiagram........................................................................................................................5−1

5.1.SystemLayout........................................................................................................................5−1

5.2.BoardComponent....................................................................................................................5−4

1.Precaution

1.1.GeneralAfter-SalesServicePrecautions

1)Donotletcustomersrepairtheproductthemselves..

›Thereisadangerofinjuryandtheproductlifetimemaybeshortened.

2)Makesuretodisconnectthepowercordfromthewalloutletbeforerepairingtheproduct(especiallyforafter-sales

serviceofelectricparts).

›Thereisadangerofelectricshock.

3)Donotletcustomersplugseveralelectrichomeappliancesintoasinglewalloutletatthesametime.

›Thereisadangerofreduetooverheating.

4)Checkifthepowerplugorwalloutletaredamagedinanyway.

›Ifadefectisfound,repairorreplaceitimmediately.

(Thereisadangerofelectricshockorre)

5)Makesurethatitisproperlygrounded.

(Checkthegroundofthewalloutlet)

›Electricityleakagemaycauseelectricshock.

DEVICE

UNDER

TES T

(RE ADING S HOULD)

NOT BE ABOVE 0.5mA

LEAKAGE

CUR RENT

TES TER

TES T ALL

EXP OS ED METAL

S URFACES

2-WIRE CORD

*ALS O TES T WITH

P LUG REVERS ED

(US ING AC ADAP TER

P LUG AS REQUIRED)

EARTH

GR OUND

Figure1.1LeakageCurrentTestCircuit

6)Donotspraywaterontotheproducttocleanit.

›Thereisadangerofelectricshockorreanditmayshortenthelifetimeoftheproduct..

7)Checktheassemblystatusoftheproductaftertheafter-salesservice..

›Theassemblystatusoftheproductmustbethesameasbeforetheafter-salesservice.

8)Unplugthepowercordholdingthepowerplug(andnotthecord).

›Ifthecordisdisconnected,itmaycauseelectricshockorre.

9)Repairtheproductusingonlyauthorizedparts

10)Keeptheproductawayfromheatingdevicessuchasheaters.

›Exposuretoheatersmaycausedeformationoftheproductorre.

1.Precaution

1.2.SafetyPrecautions

1)EMI

ThisdevicehasbeenregisteredregardingEMIforresidentialuse.Itcanbeusedinallareas.

2)CircuitTest(LogicTest)Precautions

TheLSIandMSIusedinthisproductaresemiconductorintegratedcircuitsbasedonMOS-FETorCMOS.Since

thesetypesofdevicesarehighlysusceptibletostaticelectricityorcurrentleakage,anisolationbreakmaybecaused.

Thereforereadandfollowtheinstructionsbelow.

a)WhenhandlinganLSIorMSI,makesureyourbodyisgroundedthroughafewmega-ohmsofresistance.In

addition,wearglovesandajacketmadeofcottonandnotofsyntheticbersthateasilygeneratestaticelectricity.

b)Whenrepairingtheproduct,placeaconductivematerial(e.g.aluminumfoil)groundedtotheearthontheworktable.

c)Youmustuseasolderingironwithoutaleakagecurrent.

d)DonottouchthepinofanICandcarefullyinserttheICintotheblackplasticpackage.

e)WheninsertinganICintoaPCB,becarefulwiththedirectionoftheIC.WheninstallinganICinthewrong

direction,itmightbecomedamaged.

f)WhencarryinganIC,packagetheICwithconductingmaterialsuchasaluminumfoilorconductingspongesoasto

keepthevoltagelevelofeachoftheterminalsthesame.

g)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.

h)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.

i)WhensolderinganIC,solderitinasshortatimeaspossiblesothatunnecessaryheatisnotappliedtothedevice.

j)AvoidleavingexcessiveamountsofuxwithinacustomICorbetweenthepinswhensolderingacustomIC.

k)TakecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard.

l)TakecaretonotbreaktheprintedcircuitpatternonthePCBwhenseparateanIC.

1.Precaution

1.3.Ground

Theproductmustbegroundedtoprotectitfromstaticelectricityandotherdangers.Whenusingamultitap,pleaseusea

multitapwithagroundterminalonly.

Ifyouusea220Vwalloutletwithagroundterminal,youdonotneedtogrounditadditionally.Avoidusingwalloutletsif

theyarenotgroundedeveniftheyhaveagroundterminal.

Togroundtheproduct,connectthegroundtoanexclusivegroundterminalormetalwaterpipe.Connectthegroundcableto

thegroundterminalattherearofthemainbody.Togroundtheproduct,connectthegroundterminaloftheproducttoa

metalwaterpipe,walloutletorexclusivegroundterminalwithanelectricwireequaltoorthickerthan#18.

NevergroundtheproducttoaPVCwaterpipe,phoneline,TV,radioantenna,aluminumwindoworgaspipe,becausethis

doesnotactuallygroundtheproductandmaybedangerous.

※Iftheproductisdamagedbygroundingunused:Paidserviceresponse

1.Precaution

1.4.StaticElectricityPrecautions

Manypartsofthesystemaresusceptibletostaticelectricity.Usinganelectrostaticdischarge(ESD)deviceisveryimportant

forthesafetyoftheuserandtheuser'ssurroundings.UsinganESDdeviceincreasestheprobabilityofasuccessfulrepair

andlowerstheexpensesfordamagedparts.

Topreventstaticelectricity,followtheinstructionsbelow.

1)Performtherepairinalocationwithoutstaticelectricity.

2)Touchyourhandstoametalwaterpipeorsomemetalobjectconnectedtothegroundtodischargeanystatic

Electricityfromyourbodybeforehandlingtheparts.

3)Touchonlytheedgesoftheboard,ifpossible.

4)Donottouchanypartsunlessabsolutelynecessary

5)Disassemblethepartsontheanti-static-electricitypad.

6)Whenaboardisnotinstalledinthesystem,packagetheboardwithananti-static-electricitypackaging.

2.Introduction

2.1.ProductFeatures

2.Introduction

2.2.Specication

ProcessorandMotherboard

Intel®Core™i7Processor3610QM(2.30GHz,6MB)

Intel®Core™i7Processor3720QM(2.60GHz,6MB)

CPU***

(UpgradeNot,Useonekindof)

Intel®Core™i7Processor3820QM(2.70GHz,6MB)

SocketSocketG2(rPGA988B)

Manufacturingprocess0.022micron

CacheL2:6MB

i7-3610QM-Max3.3Ghz

i7-3720QM-Max3.6Ghz

IntelTurboBoost

i7-3610QM-Max3.7Ghz

ChipsetIntelHM76

BIOS64MbitSPIash

ThermalDesignPerformanceMAX.45W

Memory

Memory***/Max.MemoryMAX.16GB(Max4GBperSODIMM)

MemorytypePC3-12800(1600MHz)DDR3SODIMM

※PC3-10600(1333Mhz)

Memoryreliability/compatibilityvericationiscomplete

MemoryModules4GBSODIMM8GBSODIMM16GBSODIMM

Sockets4-slotSODIMMs

DisplayandGraphics

LCD***17.3"FHD+(16:9)Glare

VendorSamsungLCD

TypeLEDLCDwithGlare

LCDViewableArea381.888(H)x214.812(V)(17.3”diagonal)

LCDPanelTN

LCDResolutionFHD(1920x1080)

PixelPitch0.2175(H)x0.2088(V)(TYP.)

ViewingangleHorizontal65°/65°,Vertical45°/50°(TYP.)

ColorGamut72%(TYP.)

Brightness400cd/m2

Responsetime5ms(typ)

ThemaximumopeningangleLCD145º

GraphicsController***nVidia675M(N13E-GS1,MXM)

VideoMemory2GBgDDR5Descretedgraphicmemory

GPUTDPMax.75W

Max.ResolutionforLFPLVDSduallinkresolutionof1920X1200perlink/amaximum

theoreticalpixelrateof224MP/s

2.Introduction

Max.resolutionforVGAMaxresolutionof2,048x1,536at85Hzrefreshrate(ext.)

(640x480,800x600,1024x768,1152x864,

1280x800,1280x960,1280x1024,1400x1050,

1440x900,1600x1024,1600x1200,1680x1050,1920x1200,

1920x1440,2048x1536)

[Ext.monitorresolutionsSupportedbyEDIDinformation]

Max.resolutionforHDMISupportv1.4acompliant/aresolutionof2048x1536pixels

with32-bitcolorat75Hz

[Ext.monitorresolutionsSupportedbyEDIDinformation]

Max.resolutionforDisplayPortSupportDP++/aresolutionof2048x1536pixelswith32-bit

colorat75Hz

[Ext.monitorresolutionsSupportedbyEDIDinformation]

3DFunctionNotsupport

AudioandVideo

Sound

ChipsetREALTEKALC269Q-VB2-GR

CodecHDAudioCodec,ALC269Q-VB2-GR

ConversionBuilt-inhighperformance24-bitADC&24-bitDAC

SoundeffectDolby

InternalInterfacesEmbeddedstereospeakers&integratedmonomicrophone

SpeakerPowerRating2speakersx2Wwithenclosureeach+Woofer3W

ExternalInterfacesMicrophone,Headphone,SPDIFNOTSUP

ControlsKeyboardvolumecontrol

Microphone

Type1integratedmonomicrophone

Sensitivity.-42dB[0dB=1V/Pa,at1KHz]

OutputimpedaceMax.2,200Ohmat1KHz

NoisesupressionNoisesupression

Camera

Type2.0FHDWeb-Cam(interface:USB2.0)

ChipsetSC_20FHL11146M(MCNEX)

Imagesensor.1/6”ColorCMOS2.0MFHD(1920X1080)

StillImageCaptureResolution1920x1080(FullHD1080P),1280x720(HD720P),800x

600(SVGA),

640x480(VGA),352x288(CIF),320x240(QVGA),176

x144(QCIF)

160x120(QQVGA)

VideoCaptureResolution1920x1080(FullHD1080P),1280x720(HD720P),800x

600(SVGA),

640x480(VGA),352x288(CIF),320x240(QVGA),176

x144(QCIF)

160x120(QQVGA)

OutputVideoFormatUncompressed–basedonCameraH/W

UVCSupportSupproted

Storage

2.Introduction

HardDiskDrive-7200rpm***9.5mmH2.5"SATAHDD,Removable

HDDVendorHGST,Fujitsu,SamsungStorage,Toshiba,WD

Type9.5mmHeight2.5"S-ATA

SupportsSATAhostcontrollersupport48bitLBA(HDDInterface

supportsSATA1

-1stHDD/SATA2-2ndHDD)

AverageAccessTime13msec.

Speed5400rpm/7200rpmSATA

Capacity500GB,750GB,1TB,1.5TB,2TB(F.option)

*SSDSupport(1stHDD:SATA3/2ndHDD:SATA2

Support)

2ndHDDAssyUnitBA96-05817A

-includedinbundleUNIT_BRACKET-HDD_SUPPORT

RUBBER-HDD

SCREW-MACHINEMANUAL-1SHEET_GUIDE

LABEL-PPID_E

ExpressCache(ISSD)SandiskExpressCachei100adpot(Interface:P5:SATA3,

P4:SATA2)

SpeedMaximumHosttrasferRate6Gb/s

Capacity8GB

OpticalDriverModules

OpticalDiskDriver***Blue-rayComboDrive1(Blue-rayReadonly)-SATA2

Interface

VendorTSST/PLDS

Moduletype12.7mmFixedtype,S-ATA

Speed4xBD-R/BD-RE,2xBD-RDL/BD-REDL,5xDVD-RAM,

8xDVD±R,

6xDVD±RDL,8xDVD+RW,6xDVD-RW,24xCD-R/RW,

8xDVD,24xCD

AverageAccessTimeBD250~400ms,DVD150~350ms.,CD150~170ms.

Weight175g+/-5g

S/WSuppliedCyberlinkMediaSuite8BlurayDisc3D,Bluray,

Supermulti(F.option)

SecurityRPC-IIRegionalEncoding

OpticalDiskDriver***SuperMultiDualLayer

VendorTSST/TEAC/PLDS

Moduletype12.7mm,S-ATA,Fixedtype

SpeedWriting(CD-R24X/CD-RW24X/DVD±R8X/DVD+RW

8X(4X)/DVD-RW6X/DVD-RAM5X),

Reading(CD24X/DVD8X)

AverageAccessTimeDVD130~160msTyp,CD130~160msTyp

Weightmax.140g

S/WSuppliedCyberlinkDVDSolution

SecurityRPC-IIRegionalEncoding

2.Introduction

NetworkT ools

LAN***Integrated10/100/1000MbpsEthernet

ChipsetRTL8111E

FeaturesRJ45Output

Combomodule***IntelJacksonpeak2WLAN+BTCombo

TypeIntelJacksonPeak2,802.11a/g/n2x2WiFi_Bluetooth(4.0)

Combocard(Vendor:Intel)

MaxSpeed300Mbps(LinkSpeedisonlystandardvalue,Actuallyvalue

willdecidedbyeachenvironmant)

InterfaceHalfMinicardtype

Chipset1.Jackson-Peak2MAC/BBSilicon2.Jackson-Peak22x2

Wi-Fi-BTRadioSilicon

Antenna2AntennaSupport:WLAN(2TX,2RX),BT(1TX/RX)

BluetoothModule

TypeIntel802.11agn(2x2)+Bluetooth4.0(HalfMiniCardSTD)

VendorIntel

InterfacePCIe(WLAN)+USB(Bluetooth)

I/OInterface

MemorycardslotMemorycardchip7-in-1RTS5209

VendorRealtek

Support(SD/SDHC/SDXC/XD/MMC/Memorystick/

MemorystickPro)

testedupto32GB

Size27mm*5mm

I/OPorts

USBPort2xUSB2.0portsand2xUSB3.0ports(incl.1Chargeable)

VGAPort1CRT

AudioJacksHeadPhone-out,MIC-in

LANRJ45

TV1HDMI(15mm*6mm),1DP(16mm*7mm)

SecurityKensingtonLock(8mm*3mm)

Power1xDC-injackforACadapter(12.8pie)

InputDevices

Keyboard"100(KOR,RUS,UKR,US)101(UK,FR,GM,SP)"

└NumKeypad

Yes

TouchpadELANtouchpad(withgesturefunction)

PowerandPowerManagement

Systempowermanagement

PowermanagementfeaturesACPIV2.0compliant,Standby(S3),Hibernate(S4)

Standardbattery***

ModelcodeAA-PBAN8AB

2.Introduction

TypeLi-ion

Detailsofcell8cells

Batterycapacity5,900mAh

Voltage15.1V

Batteryrating89Wh

ColorBlack/Yellow

Dimension140x85x30.0mm(WxHxD)

WeightMax.400g

RechargetimeApprox.3.0hours

ACAdapter***A11-200P1A

OutputPower200W

Dimension170X85X35mm(WxHxD)

Weight(ACAdapter)Typ.750g

WorldwideCompatibilityAuto-sensing110-240V AC

LineFrequency50Hz/60Hz

AdapterRating-Input100VAC~240VAC,1.5A

AdapterRating-Output19.0VDC,10.5A

SystemDimensions

Dimensions(WXDXH)W409.84xL284.8xH32.99~52.6

Weight3.81KG(3.4KGwithoutbattery)

ConditionSM-DL,8cellbattery,2.5"500GBHDD

PackageDimensions(WXDXH)

PackageWeight6.6kg

ConditionSM-DL,8cellbattery,2.5"500GBHDD

MaterialsPC/ABS

Design

LCDBackNCVM

Safeplasticlmsupport

LCDFrontUVCoat

SystemTopUVMolding

SystemBottomPC+ABS

ProtectFilm

SystemTopYes

SystemYes

LCD-BACKYES

O/S

XPDriverN/A(Because3Dfunction)

LabelLocation

2.Introduction

Accessories

AccessoriesintheboxBattery,Adapter,PowerCode,InstallationGuide(paper),OS

CD,S/WMedia,TCOSheet,

3Dglasses(option,rechargeable)

2.Introduction

2.3.Comparingproductspecications

700G7A700G7C

ITEM

Ext.Gfx.Ext.Gfx.

ProcessorHuronRiveri7ChiefRiveri7

ChipsetHM65HM76

MemoryDDR34GB~16GB(MaxClock1333Mhz)DDR34GB~16GB(MaxClock1600Mhz)

LCD17.3”FHDLED(Glare,400nit)←

Gfx.AMDRadeonHD6970M

nVIDIAGeforce675M(N13E–GS1)

AMD7970M(TBD)

HDD500GB~1.5TB(SATA5400,7200rpm)500GB~2TB(SATA5400,7200rpm)

ODDSuperMulti/Bluray←

LAN/WLANGigabitMbps,abg/n←

BTBluetoothv.3.0HighSpeedBluetoothv.4.0HighSpeed

I/OPort

USB3.0x2(USB2.0x2),

7-in-1

←

Convergence

EasyContentshare(3Screen),

Easyleshare(PC-PC)

←

Size/WeightW409.84xL284.8xH32.99~52.6/3.81kg←

AVButton

Poweron/off,Wirelesson/off

LightingOn/OffMute,V olumnUp/Down

ModeDial

←

DesignA:LCDBackPatternIMR/B:RTCM/C:VacuumPlatingIMR/D:Spray

2.Introduction

2.4.OptionpartList

2.Introduction

KBD

Keyboardarrangementandsizecandiffertobyeachcountry

2.Introduction

2.5.FunctionofProduct

KBDBacklit

ModeShift

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