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Contents
Contents
1.Precaution........................................................................................................................................1−1
1.1.GeneralAfter-SalesServicePrecautions.......................................................................................1−1
1.2.SafetyPrecautions...................................................................................................................1−2
1.3.Ground..................................................................................................................................1−3
1.4.StaticElectricityPrecautions......................................................................................................1−4
2.Introduction.....................................................................................................................................2−1
2.1.ProductFeatures......................................................................................................................2−1
2.2.Specication...........................................................................................................................2−3
2.3.Comparingproductspecications...............................................................................................2−9
2.4.OptionpartList.......................................................................................................................2−10
2.5.FunctionofProduct..................................................................................................................2−14
2.6.Hardware–NewH/W.............................................................................................................2−20
2.7.SWList.................................................................................................................................2−29
2.8.SystemSetup(BiosSetup).........................................................................................................2−31
2.9.MainBoardInformation............................................................................................................2−37
3.DesassemblyandReassembly..............................................................................................................3−1
3.1.MainSystem............................................................................................................................3−1
3.2.LCDPart................................................................................................................................3−4
4.Troubleshooting...............................................................................................................................4−1
4.1.Generalspec...........................................................................................................................4−1
4.2.DebuggingFlowChart..............................................................................................................4−2
4.3.SystemDiagnosis....................................................................................................................4−5
4.4.DiagnosticProgram..................................................................................................................4−6
4.5.HardwareTroubleshooting........................................................................................................4−8
4.5.1.LCD.........................................................................................................................4−8
4.5.2.MainSystem..............................................................................................................4−10
4.6.RTCBatteryReset...................................................................................................................4−17
4.7.CPUFANControl....................................................................................................................4−18
4.8.BatteryUsetime......................................................................................................................4−21
4.9.BiosUpdate............................................................................................................................4−24
4.10.H/WUpgrade.........................................................................................................................4−25
5.SystemWireDiagram........................................................................................................................5−1
5.1.SystemLayout........................................................................................................................5−1
5.2.BoardComponent....................................................................................................................5−4
iCopyright©1995-2012SAMSUNG.Allrightsreserved.
1.Precaution
1.Precaution
1.1.GeneralAfter-SalesServicePrecautions
1)Donotletcustomersrepairtheproductthemselves..
›Thereisadangerofinjuryandtheproductlifetimemaybeshortened.
2)Makesuretodisconnectthepowercordfromthewalloutletbeforerepairingtheproduct(especiallyforafter-sales
serviceofelectricparts).
›Thereisadangerofelectricshock.
3)Donotletcustomersplugseveralelectrichomeappliancesintoasinglewalloutletatthesametime.
›Thereisadangerofreduetooverheating.
4)Checkifthepowerplugorwalloutletaredamagedinanyway.
›Ifadefectisfound,repairorreplaceitimmediately.
(Thereisadangerofelectricshockorre)
5)Makesurethatitisproperlygrounded.
(Checkthegroundofthewalloutlet)
›Electricityleakagemaycauseelectricshock.
DEVICE
UNDER
TES T
(RE ADING S HOULD)
NOT BE ABOVE 0.5mA
LEAKAGE
CUR RENT
TES TER
TES T ALL
EXP OS ED METAL
S URFACES
2-WIRE CORD
*ALS O TES T WITH
P LUG REVERS ED
(US ING AC ADAP TER
P LUG AS REQUIRED)
EARTH
GR OUND
Figure1.1LeakageCurrentTestCircuit
6)Donotspraywaterontotheproducttocleanit.
›Thereisadangerofelectricshockorreanditmayshortenthelifetimeoftheproduct..
7)Checktheassemblystatusoftheproductaftertheafter-salesservice..
›Theassemblystatusoftheproductmustbethesameasbeforetheafter-salesservice.
8)Unplugthepowercordholdingthepowerplug(andnotthecord).
›Ifthecordisdisconnected,itmaycauseelectricshockorre.
9)Repairtheproductusingonlyauthorizedparts
10)Keeptheproductawayfromheatingdevicessuchasheaters.
›Exposuretoheatersmaycausedeformationoftheproductorre.
Copyright©1995-2012SAMSUNG.Allrightsreserved.1-1
1.Precaution
1.2.SafetyPrecautions
1)EMI
ThisdevicehasbeenregisteredregardingEMIforresidentialuse.Itcanbeusedinallareas.
2)CircuitTest(LogicTest)Precautions
TheLSIandMSIusedinthisproductaresemiconductorintegratedcircuitsbasedonMOS-FETorCMOS.Since
thesetypesofdevicesarehighlysusceptibletostaticelectricityorcurrentleakage,anisolationbreakmaybecaused.
Thereforereadandfollowtheinstructionsbelow.
a)WhenhandlinganLSIorMSI,makesureyourbodyisgroundedthroughafewmega-ohmsofresistance.In
addition,wearglovesandajacketmadeofcottonandnotofsyntheticbersthateasilygeneratestaticelectricity.
b)Whenrepairingtheproduct,placeaconductivematerial(e.g.aluminumfoil)groundedtotheearthontheworktable.
c)Youmustuseasolderingironwithoutaleakagecurrent.
d)DonottouchthepinofanICandcarefullyinserttheICintotheblackplasticpackage.
e)WheninsertinganICintoaPCB,becarefulwiththedirectionoftheIC.WheninstallinganICinthewrong
direction,itmightbecomedamaged.
f)WhencarryinganIC,packagetheICwithconductingmaterialsuchasaluminumfoilorconductingspongesoasto
keepthevoltagelevelofeachoftheterminalsthesame.
g)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.
h)SincethestoragetemperatureofanICisbetween-20~+70degrees,keepitatroomtemperature,ifpossible.
i)WhensolderinganIC,solderitinasshortatimeaspossiblesothatunnecessaryheatisnotappliedtothedevice.
j)AvoidleavingexcessiveamountsofuxwithinacustomICorbetweenthepinswhensolderingacustomIC.
k)TakecaretonotdamagetheboardwheninstallingorseparatinganOptionBoard.
l)TakecaretonotbreaktheprintedcircuitpatternonthePCBwhenseparateanIC.
1-2Copyright©1995-2012SAMSUNG.Allrightsreserved.
1.Precaution
1.3.Ground
Theproductmustbegroundedtoprotectitfromstaticelectricityandotherdangers.Whenusingamultitap,pleaseusea
multitapwithagroundterminalonly.
Ifyouusea220Vwalloutletwithagroundterminal,youdonotneedtogrounditadditionally.Avoidusingwalloutletsif
theyarenotgroundedeveniftheyhaveagroundterminal.
Togroundtheproduct,connectthegroundtoanexclusivegroundterminalormetalwaterpipe.Connectthegroundcableto
thegroundterminalattherearofthemainbody.Togroundtheproduct,connectthegroundterminaloftheproducttoa
metalwaterpipe,walloutletorexclusivegroundterminalwithanelectricwireequaltoorthickerthan#18.
NevergroundtheproducttoaPVCwaterpipe,phoneline,TV,radioantenna,aluminumwindoworgaspipe,becausethis
doesnotactuallygroundtheproductandmaybedangerous.
※Iftheproductisdamagedbygroundingunused:Paidserviceresponse
Copyright©1995-2012SAMSUNG.Allrightsreserved.1-3
1.Precaution
1.4.StaticElectricityPrecautions
Manypartsofthesystemaresusceptibletostaticelectricity.Usinganelectrostaticdischarge(ESD)deviceisveryimportant
forthesafetyoftheuserandtheuser'ssurroundings.UsinganESDdeviceincreasestheprobabilityofasuccessfulrepair
andlowerstheexpensesfordamagedparts.
Topreventstaticelectricity,followtheinstructionsbelow.
1)Performtherepairinalocationwithoutstaticelectricity.
2)Touchyourhandstoametalwaterpipeorsomemetalobjectconnectedtothegroundtodischargeanystatic
Electricityfromyourbodybeforehandlingtheparts.
3)Touchonlytheedgesoftheboard,ifpossible.
4)Donottouchanypartsunlessabsolutelynecessary
5)Disassemblethepartsontheanti-static-electricitypad.
6)Whenaboardisnotinstalledinthesystem,packagetheboardwithananti-static-electricitypackaging.
1-4Copyright©1995-2012SAMSUNG.Allrightsreserved.
2.Introduction
2.Introduction
2.1.ProductFeatures
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-1
2.Introduction
2-2Copyright©1995-2012SAMSUNG.Allrightsreserved.
2.Introduction
2.2.Specication
ProcessorandMotherboard
Intel®Core™i7Processor3610QM(2.30GHz,6MB)
Intel®Core™i7Processor3720QM(2.60GHz,6MB)
CPU***
(UpgradeNot,Useonekindof)
Intel®Core™i7Processor3820QM(2.70GHz,6MB)
SocketSocketG2(rPGA988B)
Manufacturingprocess0.022micron
CacheL2:6MB
i7-3610QM-Max3.3Ghz
i7-3720QM-Max3.6Ghz
IntelTurboBoost
i7-3610QM-Max3.7Ghz
ChipsetIntelHM76
BIOS64MbitSPIash
ThermalDesignPerformanceMAX.45W
Memory
Memory***/Max.MemoryMAX.16GB(Max4GBperSODIMM)
MemorytypePC3-12800(1600MHz)DDR3SODIMM
※PC3-10600(1333Mhz)
Memoryreliability/compatibilityvericationiscomplete
MemoryModules4GBSODIMM8GBSODIMM16GBSODIMM
Sockets4-slotSODIMMs
DisplayandGraphics
LCD***17.3"FHD+(16:9)Glare
VendorSamsungLCD
TypeLEDLCDwithGlare
LCDViewableArea381.888(H)x214.812(V)(17.3”diagonal)
LCDPanelTN
LCDResolutionFHD(1920x1080)
PixelPitch0.2175(H)x0.2088(V)(TYP.)
ViewingangleHorizontal65°/65°,Vertical45°/50°(TYP.)
ColorGamut72%(TYP.)
Brightness400cd/m2
Responsetime5ms(typ)
ThemaximumopeningangleLCD145º
GraphicsController***nVidia675M(N13E-GS1,MXM)
VideoMemory2GBgDDR5Descretedgraphicmemory
GPUTDPMax.75W
Max.ResolutionforLFPLVDSduallinkresolutionof1920X1200perlink/amaximum
theoreticalpixelrateof224MP/s
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-3
2.Introduction
Max.resolutionforVGAMaxresolutionof2,048x1,536at85Hzrefreshrate(ext.)
(640x480,800x600,1024x768,1152x864,
1280x800,1280x960,1280x1024,1400x1050,
1440x900,1600x1024,1600x1200,1680x1050,1920x1200,
1920x1440,2048x1536)
[Ext.monitorresolutionsSupportedbyEDIDinformation]
Max.resolutionforHDMISupportv1.4acompliant/aresolutionof2048x1536pixels
with32-bitcolorat75Hz
[Ext.monitorresolutionsSupportedbyEDIDinformation]
Max.resolutionforDisplayPortSupportDP++/aresolutionof2048x1536pixelswith32-bit
colorat75Hz
[Ext.monitorresolutionsSupportedbyEDIDinformation]
3DFunctionNotsupport
AudioandVideo
Sound
ChipsetREALTEKALC269Q-VB2-GR
CodecHDAudioCodec,ALC269Q-VB2-GR
ConversionBuilt-inhighperformance24-bitADC&24-bitDAC
SoundeffectDolby
InternalInterfacesEmbeddedstereospeakers&integratedmonomicrophone
SpeakerPowerRating2speakersx2Wwithenclosureeach+Woofer3W
ExternalInterfacesMicrophone,Headphone,SPDIFNOTSUP
ControlsKeyboardvolumecontrol
Microphone
Type1integratedmonomicrophone
Sensitivity.-42dB[0dB=1V/Pa,at1KHz]
OutputimpedaceMax.2,200Ohmat1KHz
NoisesupressionNoisesupression
Camera
Type2.0FHDWeb-Cam(interface:USB2.0)
ChipsetSC_20FHL11146M(MCNEX)
Imagesensor.1/6”ColorCMOS2.0MFHD(1920X1080)
StillImageCaptureResolution1920x1080(FullHD1080P),1280x720(HD720P),800x
600(SVGA),
640x480(VGA),352x288(CIF),320x240(QVGA),176
x144(QCIF)
160x120(QQVGA)
VideoCaptureResolution1920x1080(FullHD1080P),1280x720(HD720P),800x
600(SVGA),
640x480(VGA),352x288(CIF),320x240(QVGA),176
x144(QCIF)
160x120(QQVGA)
OutputVideoFormatUncompressed–basedonCameraH/W
UVCSupportSupproted
Storage
2-4Copyright©1995-2012SAMSUNG.Allrightsreserved.
2.Introduction
HardDiskDrive-7200rpm***9.5mmH2.5"SATAHDD,Removable
HDDVendorHGST,Fujitsu,SamsungStorage,Toshiba,WD
Type9.5mmHeight2.5"S-ATA
SupportsSATAhostcontrollersupport48bitLBA(HDDInterface
supportsSATA1
-1stHDD/SATA2-2ndHDD)
AverageAccessTime13msec.
Speed5400rpm/7200rpmSATA
Capacity500GB,750GB,1TB,1.5TB,2TB(F.option)
*SSDSupport(1stHDD:SATA3/2ndHDD:SATA2
Support)
2ndHDDAssyUnitBA96-05817A
-includedinbundleUNIT_BRACKET-HDD_SUPPORT
RUBBER-HDD
SCREW-MACHINEMANUAL-1SHEET_GUIDE
LABEL-PPID_E
ExpressCache(ISSD)SandiskExpressCachei100adpot(Interface:P5:SATA3,
P4:SATA2)
SpeedMaximumHosttrasferRate6Gb/s
Capacity8GB
OpticalDriverModules
OpticalDiskDriver***Blue-rayComboDrive1(Blue-rayReadonly)-SATA2
Interface
VendorTSST/PLDS
Moduletype12.7mmFixedtype,S-ATA
Speed4xBD-R/BD-RE,2xBD-RDL/BD-REDL,5xDVD-RAM,
8xDVD±R,
6xDVD±RDL,8xDVD+RW,6xDVD-RW,24xCD-R/RW,
8xDVD,24xCD
AverageAccessTimeBD250~400ms,DVD150~350ms.,CD150~170ms.
Weight175g+/-5g
S/WSuppliedCyberlinkMediaSuite8BlurayDisc3D,Bluray,
Supermulti(F.option)
SecurityRPC-IIRegionalEncoding
OpticalDiskDriver***SuperMultiDualLayer
VendorTSST/TEAC/PLDS
Moduletype12.7mm,S-ATA,Fixedtype
SpeedWriting(CD-R24X/CD-RW24X/DVD±R8X/DVD+RW
8X(4X)/DVD-RW6X/DVD-RAM5X),
Reading(CD24X/DVD8X)
AverageAccessTimeDVD130~160msTyp,CD130~160msTyp
Weightmax.140g
S/WSuppliedCyberlinkDVDSolution
SecurityRPC-IIRegionalEncoding
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-5
2.Introduction
NetworkT ools
LAN***Integrated10/100/1000MbpsEthernet
ChipsetRTL8111E
FeaturesRJ45Output
Combomodule***IntelJacksonpeak2WLAN+BTCombo
TypeIntelJacksonPeak2,802.11a/g/n2x2WiFi_Bluetooth(4.0)
Combocard(Vendor:Intel)
MaxSpeed300Mbps(LinkSpeedisonlystandardvalue,Actuallyvalue
willdecidedbyeachenvironmant)
InterfaceHalfMinicardtype
Chipset1.Jackson-Peak2MAC/BBSilicon2.Jackson-Peak22x2
Wi-Fi-BTRadioSilicon
Antenna2AntennaSupport:WLAN(2TX,2RX),BT(1TX/RX)
BluetoothModule
TypeIntel802.11agn(2x2)+Bluetooth4.0(HalfMiniCardSTD)
VendorIntel
InterfacePCIe(WLAN)+USB(Bluetooth)
I/OInterface
MemorycardslotMemorycardchip7-in-1RTS5209
VendorRealtek
Support(SD/SDHC/SDXC/XD/MMC/Memorystick/
MemorystickPro)
testedupto32GB
Size27mm*5mm
I/OPorts
USBPort2xUSB2.0portsand2xUSB3.0ports(incl.1Chargeable)
VGAPort1CRT
AudioJacksHeadPhone-out,MIC-in
LANRJ45
TV1HDMI(15mm*6mm),1DP(16mm*7mm)
SecurityKensingtonLock(8mm*3mm)
Power1xDC-injackforACadapter(12.8pie)
InputDevices
Keyboard"100(KOR,RUS,UKR,US)101(UK,FR,GM,SP)"
└NumKeypad
Yes
TouchpadELANtouchpad(withgesturefunction)
PowerandPowerManagement
Systempowermanagement
PowermanagementfeaturesACPIV2.0compliant,Standby(S3),Hibernate(S4)
Standardbattery***
ModelcodeAA-PBAN8AB
2-6Copyright©1995-2012SAMSUNG.Allrightsreserved.
2.Introduction
TypeLi-ion
Detailsofcell8cells
Batterycapacity5,900mAh
Voltage15.1V
Batteryrating89Wh
ColorBlack/Yellow
Dimension140x85x30.0mm(WxHxD)
WeightMax.400g
RechargetimeApprox.3.0hours
ACAdapter***A11-200P1A
OutputPower200W
Dimension170X85X35mm(WxHxD)
Weight(ACAdapter)Typ.750g
WorldwideCompatibilityAuto-sensing110-240V AC
LineFrequency50Hz/60Hz
AdapterRating-Input100VAC~240VAC,1.5A
AdapterRating-Output19.0VDC,10.5A
SystemDimensions
Dimensions(WXDXH)W409.84xL284.8xH32.99~52.6
Weight3.81KG(3.4KGwithoutbattery)
ConditionSM-DL,8cellbattery,2.5"500GBHDD
PackageDimensions(WXDXH)
PackageWeight6.6kg
ConditionSM-DL,8cellbattery,2.5"500GBHDD
MaterialsPC/ABS
Design
LCDBackNCVM
Safeplasticlmsupport
LCDFrontUVCoat
SystemTopUVMolding
SystemBottomPC+ABS
ProtectFilm
SystemTopYes
SystemYes
LCD-BACKYES
O/S
XPDriverN/A(Because3Dfunction)
LabelLocation
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-7
2.Introduction
Accessories
AccessoriesintheboxBattery,Adapter,PowerCode,InstallationGuide(paper),OS
CD,S/WMedia,TCOSheet,
3Dglasses(option,rechargeable)
2-8Copyright©1995-2012SAMSUNG.Allrightsreserved.
2.Introduction
2.3.Comparingproductspecications
700G7A700G7C
ITEM
Ext.Gfx.Ext.Gfx.
ProcessorHuronRiveri7ChiefRiveri7
ChipsetHM65HM76
MemoryDDR34GB~16GB(MaxClock1333Mhz)DDR34GB~16GB(MaxClock1600Mhz)
LCD17.3”FHDLED(Glare,400nit)←
Gfx.AMDRadeonHD6970M
nVIDIAGeforce675M(N13E–GS1)
AMD7970M(TBD)
HDD500GB~1.5TB(SATA5400,7200rpm)500GB~2TB(SATA5400,7200rpm)
ODDSuperMulti/Bluray←
LAN/WLANGigabitMbps,abg/n←
BTBluetoothv.3.0HighSpeedBluetoothv.4.0HighSpeed
I/OPort
USB3.0x2(USB2.0x2),
7-in-1
←
Convergence
EasyContentshare(3Screen),
Easyleshare(PC-PC)
←
Size/WeightW409.84xL284.8xH32.99~52.6/3.81kg←
AVButton
Poweron/off,Wirelesson/off
LightingOn/OffMute,V olumnUp/Down
ModeDial
←
DesignA:LCDBackPatternIMR/B:RTCM/C:VacuumPlatingIMR/D:Spray
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-9
2.Introduction
2.4.OptionpartList
2-10Copyright©1995-2012SAMSUNG.Allrightsreserved.
2.Introduction
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-11
2.Introduction
2-12Copyright©1995-2012SAMSUNG.Allrightsreserved.
2.Introduction
KBD
Keyboardarrangementandsizecandiffertobyeachcountry
Copyright©1995-2012SAMSUNG.Allrightsreserved.2-13
2.Introduction
2.5.FunctionofProduct
KBDBacklit
ModeShift
2-14Copyright©1995-2012SAMSUNG.Allrightsreserved.
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