Cooler Master RG-TF4-TGU1-GP Datasheet

Cooler Master
Brand
Cooler Master
Model
RG-TF4-TGU1-GP
Category
Heat sink compounds
Type
Datasheet
2008
ThermalFusion
400
ThermalFusion
400
ThermalFusion
400
ThermalFusion 400 is a supreme
thermal compound that includes high
thermal conductivity with low thermal
resistance. Its non-curing and non-
electrical conductive traits can avoid any
short circuit incidence. ThermalFusion
400 is the ultimate solution for thermal
dissipation to improve CPU, GPU cooling
and other bonding applications.
Packaging Information
RG-TF4-TGU1-GP
Specifications
Gray
3.5
2.89
2.0E+10
0.032
0.008
<0.1
Color
Specific Gravity (25℃)
Thermal Conductivity (W/m-K)
Thermal Resistance ( -cm²/W)℃
Bond Line Thickness (mm)
Volatile Content (%)
Volume Resistivity (ohm-cm)
4
Net Weight (g)
Features
High Thermal Conductivity
Low Thermal Resistance
Non-Curing
Non-Corrosive
Non-Electrical Conductive
EAN Code
4719512013182
UPC Code
Carton Size
Units / Carton
485x400x405mm
200
Cuft
2.77
884102002687
  • Page 1 1

Cooler Master RG-TF4-TGU1-GP Datasheet

Cooler Master
Brand
Cooler Master
Model
RG-TF4-TGU1-GP
Category
Heat sink compounds
Type
Datasheet
Download PDF
report

Ask a question and I''ll find the answer in the document

Finding information in a document is now easier with AI

Related papers

Other documents