Room cure or oven cure?
• The availability of ovens.
recommended.
• The application process (i.e., dipping, potting,
casting, impregnation, bonding).
have long pot lives and short cure times plus their
• The number of units to be processed.
• The mass of resin to be used per unit.
through the resin to the surrounding atmosphere
so the center does not become too hot. In larger
insulator and cause the interior temperature to rise
• Rate of cure.
temperature curing products can be oven cured.
Degree of exibility?
Are stress factors important?
stress on components.
• Will the component be subjected to thermal or
•
•
Filler?
• Unlled
• Filled
• thixotropic
• paste
Temperature Class?
Class O
Class A
Class B
Class F
Class H
Selection
Process
3M
™
Scotchcast
™
Electrical Liquid Resins
?
?
?
4
?