ON Semiconductor NTMFS006N12MC Operating instructions

Brand: ON Semiconductor

Model: NTMFS006N12MC

Type: Operating instructions

The ON Semiconductor NTMFS006N12MC is a high-performance Power MOSFET designed for a wide range of applications, including power conversion, motor control, and load switching. It features an ultra-low on-resistance of 2.0-6.0 milliwatts, fast switching speed, and a high current-carrying capability of up to 93 amps, making it ideal for applications that demand high efficiency and power density. Additionally, the device incorporates a soft-body diode to minimize voltage ringing and improve system reliability.

October, 2020 − Rev. 0

1Publication Order Number:

NTMFS006N12MC/D

MOSFET - Power, Single

N-Channel

120 V, 6.0 mW, 93 A

NTMFS006N12MC

Features

•Small Footprint (5x6 mm) for Compact Design

•Low RDS(on) to Minimize Conduction Losses

•Low QG and Capacitance to Minimize Driver Losses

•Soft Body Diode Reduces Voltage Ringing

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)

Parameter Symbol Value Unit

Drain−to−Source Voltage VDSS 120 V

Gate−to−Source Voltage VGS ±20 V

Continuous Drain

Current RqJC

(Notes 1, 3) Steady

State

TC = 25°CID93 A

TC = 100°C 58

Power Dissipation

RqJC (Note 1)

TC = 25°CPD104 W

TC = 100°C 41

Continuous Drain

Current RqJA

(Notes 1, 2, 3) Steady

State

TA = 25°CID15 A

TA = 100°C 9

Power Dissipation

RqJA (Notes 1, 2)

TA = 25°CPD2.7 W

TA = 100°C 1.1

Pulsed Drain Current TA = 25°C, tp = 100 msIDM 522 A

Operating Junction and Storage Temperature

Range

TJ, Tstg −55 to

+ 150

°C

Source Current (Body Diode) IS86 A

Single Pulse Drain−to−Source Avalanche

Energy (IL(pk) = 49A)

EAS 120 mJ

Lead Temperature for Soldering Purposes

(1/8″ from case for 10 s)

TL260 °C

Stresses exceeding those listed in the Maximum Ratings table may damage the

device. If any of these limits are exceeded, device functionality should not be

assumed, damage may occur and reliability may be affected.

THERMAL RESISTANCE MAXIMUM RATINGS

Parameter Symbol Value Unit

Junction−to−Case − Steady State RqJC 1.2 °C/W

Junction−to−Ambient − Steady State (Note 2) RqJA 45

1. The entire application environment impacts the thermal resistance values shown,

they are not constants and are only valid for the particular conditions noted.

2. Surface−mounted on FR4 board using a 650 mm2, 2 oz. Cu pad.

3. Maximum current for pulses as long as 1 second is higher but is dependent

on pulse duration and duty cycle.

MARKING

DIAGRAM

www.onsemi.com

06N12C

AYWZZ

V(BR)DSS RDS(ON) MAX ID MAX

120 V

6.0 mW @ 10 V

93 A

G (4)

S (1,2,3)

N−CHANNEL MOSFET

D (5)

DFN5

(SO−8FL)

CASE 488AA

STYLE 1

See detailed ordering, marking and shipping information on

page 5 of this data sheet.

ORDERING INFORMATION

A = Assembly Location

Y = Year

W = Work Week

ZZ = Lot Traceability

13 mW @ 6.0 V

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ELECTRICAL CHARACTERISTICS (TJ = 25°C unless otherwise specified)

Parameter Symbol Test Condition Min Typ Max Unit

OFF CHARACTERISTICS

Drain−to−Source Breakdown Voltage V(BR)DSS VGS = 0 V, ID = 250 mA120 V

Drain−to−Source Breakdown Voltage

Temperature Coefficient

V(BR)DSS/

ID = 250 A, ref to 25°C 32 mV/°C

Zero Gate Voltage Drain Current IDSS VGS = 0 V,

VDS = 120 V

TJ = 25°C 1

TJ = 125°C 100

Gate−to−Source Leakage Current IGSS VDS = 0 V, VGS = ±20 V ±100 nA

ON CHARACTERISTICS (Note 4)

Gate Threshold Voltage VGS(TH) VGS = VDS, ID = 260 mA2.0 4.0 V

Threshold Temperature Coefficient VGS(TH)/TJID = 250 A, ref to 25°C−9.6 mV/°C

Drain−to−Source On Resistance RDS(on) VGS = 10 V ID = 46 A 5.0 6.0 mW

VGS = 6.0 V ID = 23 A 7.2 13 mW

Forward Transconductance gFS VDS =15 V, ID = 46 A 130 S

CHARGES, CAPACITANCES & GATE RESISTANCE

Input Capacitance CISS

VGS = 0 V, f = 1 MHz, VDS = 60 V

3365

Output Capacitance COSS 1490

Reverse Transfer Capacitance CRSS 5.8

Total Gate Charge QG(TOT) VGS = 10 V, VDS = 60 V; ID = 46 A 42

Threshold Gate Charge QG(TH)

VGS = 6.0 V, VDS = 60 V; ID = 46 A

10.0

Gate−to−Source Charge QGS 16

Gate−to−Drain Charge QGD 6.3

Plateau Voltage VGP 5.0 V

Total Gate Charge QG(TOT) 26 nC

Output Charge QOSS VGS = 0 V, VDS = 60 V 122 nC

SWITCHING CHARACTERISTICS (Note 5)

Turn−On Delay Time td(ON)

VGS = 10 V, VDS = 60 V,

ID = 46 A, RG = 2.5 W

Rise Time tr5.6

Turn−Off Delay Time td(OFF) 28

Fall Time tf5.7

DRAIN−SOURCE DIODE CHARACTERISTICS

Forward Diode Voltage VSD VGS = 0 V,

IS = 46 A

TJ = 25°C 0.86 1.2

TJ = 125°C 0.76

Reverse Recovery Time tRR

VGS = 0 V, dIS/dt = 300 A/ms,

IS = 46 A

Charge Time ta24

Discharge Time tb25

Reverse Recovery Charge QRR 161 nC

Reverse Recovery Time tRR VGS = 0 V, dIS/dt = 1000 A/ms,

IS = 46 A

44 ns

Charge Time ta27

Discharge Time tb17

Reverse Recovery Charge QRR 475 nC

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

4. Pulse Test: pulse width v 300 ms, duty cycle v 2%.

5. Switching characteristics are independent of operating junction temperatures.

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TYPICAL CHARACTERISTICS

Figure 1. On−Region Characteristics Figure 2. Transfer Characteristics

Figure 3. On−Resistance vs. Gate−to−Source

Voltage

Figure 4. On−Resistance vs. Drain Current and

Gate Voltage

VGS, GATE−TO−SOURCE VOLTAGE (V)

Figure 5. On−Resistance Variation with

Temperature

Figure 6. Drain−to−Source Leakage Current

vs. Voltage

TJ, JUNCTION TEMPERATURE (°C) VDS, DRAIN−TO−SOURCE VOLTAGE (V)

RDS(on), DRAIN−TO−SOURCE RESISTANCE (mW)

RDS(on), NORMALIZED DRAIN−TO−

SOURCE RESISTANCE

IDSS, LEAKAGE (nA)

TJ = 25°C

ID = 46 A

VGS = 10 V

ID = 46 A TJ = 125°C

TJ = 85°C

TJ = 150°C

TJ = 25°C

ID, DRAIN CURRENT (A)

RDS(on), DRAIN−TO−SOURCE RESISTANCE (mW)

TJ = 25°C

VGS = 6 V

VDS, DRAIN−TO−SOURCE VOLTAGE (V) VGS, GATE−TO−SOURCE VOLTAGE (V)

ID, DRAIN CURRENT (A)

6.5 V

TJ = 125°C

TJ = 25°C

TJ = −55°C

6.0 V

VDS = 5 V7 V to

10 V

VGS = 4.8 V

VGS = 10 V

5.5 V

100

150

200

250

0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0

4.5 V

2.4 V

100

150

200

250

0.00 1.00 2.00 3.00 4.00 5.00 6.00 7.00 8.00 9.00 10

4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 8.5 9.0 9.5 10 3

0 20 40 60 80 100 120 140 160 180 200

0.6

0.7

0.8

0.9

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

−50 −25 0 25 50 75 100 125 150

1.00E−02

1.00E−01

1.00E+00

1.00E+01

1.00E+02

1.00E+03

1.00E+04

1.00E+05

0 20 40 60 80 100 120

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TYPICAL CHARACTERISTICS

Figure 7. Capacitance Variation Figure 8. Gate−to−Source vs. Total Charge

VDS, DRAIN−TO−SOURCE VOLTAGE (V) QG, TOTAL GATE CHARGE (nC)

Figure 9. Resistive Switching Time Variation

vs. Gate Resistance

Figure 10. Diode Forward Voltage vs. Current

RG, GATE RESISTANCE (W)VSD, SOURCE−TO−DRAIN VOLTAGE (V)

Figure 11. Maximum Rated Forward Biased

Safe Operating Area

Figure 12. Maximum Drain Current vs. Time in

Avalanche

VDS, DRAIN−TO−SOURCE VOLTAGE (V) TIME IN AVALANCHE (s)

C, CAPACITANCE (pF)

VGS, GATE−TO−SOURCE VOLTAGE (V)

t, TIME (ns)

IS, SOURCE CURRENT (A)

ID, DRAIN CURRENT (A)

IPEAK, (A)

VGS = 0 V

TJ = 25°C

f = 1 MHz

Ciss

Coss

Crss

VDS = 40 V

ID = 46 A

QGS QGD

VGS = 10 V

VDS = 60 V

ID = 46 A

td(off)

td(on)

trTJ = 125°C

TJ = 25°C

TJ = −55°C

VGS = 0 V

TJ (initial) = 100°C

TJ (initial) = 25°C

RDS(on) Limit

Thermal Limit

Package Limit

1 ms

10 ms

TC = 25°C

VGS ≤ 10 V

Single Pulse

10 ms

0.5 ms

0 5 10 15 20 25 30 35 40 45

QTOT

100

1000

0 102030405060

0.001

0.01

0.1

0.0 0.2 0.4 0.6 0.8 1.0 1.2

0.1

100

1000

0.1 1 10 100

100 ms

& 1 s

100 ms

100

0.00001 0.0001 0.001 0.01 0.1

0.1

100

1000

10000

0.1 1 10 100

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TYPICAL CHARACTERISTICS

0.0001

0.001

0.01

0.1

0.000001 0.00001 0.0001 0.001 0.01 0.1 1

Figure 13. Thermal Response

t, PULSE TIME (sec)

RqJA(t) (°C/W)

Single Pulse

50% Duty Cycle

20%

10%

DEVICE ORDERING INFORMATION

Device Marking Package Shipping

†

NTMFS006N12MCT1G 06N12C DFN5

(Pb−Free)

1500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

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M3.00 3.40

q0 −−−

3.80

DFN5 5x6, 1.27P

(SO−8FL)

CASE 488AA

ISSUE N DATE 25 JUN 201

SCALE 2:1

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION D1 AND E1 DO NOT INCLUDE

MOLD FLASH PROTRUSIONS OR GATE

BURRS.

XXXXXX = Specific Device Code

A = Assembly Location

Y = Year

W = Work Week

ZZ = Lot Traceability

1234

TOP VIEW

SIDE VIEW

BOTTOM VIEW

E1 q

0.20 C

2 X

DIM MIN NOM

MILLIMETERS

A0.90 1.00

A1 0.00 −−−

b0.33 0.41

c0.23 0.28

D5.15

D1 4.70 4.90

D2 3.80 4.00

E6.15

E1 5.70 5.90

E2 3.45 3.65

e1.27 BSC

G0.51 0.575

K1.20 1.35

L0.51 0.575

L1 0.125 REF

0.10 C

DETAIL A

e/2

A0.10 B

0.05 cL

DETAIL A

4 X

SEATING

PLANE

GENERIC

MARKING DIAGRAM*

XXXXXX

AYWZZ

MAX

1.10

0.05

0.51

0.33

5.10

4.20

6.10

3.85

0.71

1.50

0.71

STYLE 1:

PIN 1. SOURCE

2. SOURCE

3. SOURCE

4. GATE

5. DRAIN

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

1.270

0.750

1.000

0.905

4.530

1.530

4.5600.495

3.200

1.330

0.965

PIN 5

(EXPOSED PAD)

STYLE 2:

PIN 1. ANODE

2. ANODE

3. ANODE

4. NO CONNECT

5. CATHODE

5.00 5.30

6.00 6.30

PITCH

DIMENSIONS: MILLIMETERS

RECOMMENDED

0.475

*This information is generic. Please refer to

device data sheet for actual part marking.

Pb−Free indicator, “G” or microdot “ G”,

may or may not be present. Some product

may not follow the Generic Marking.

MECHANICAL CASE OUTLINE

PACKAGE DIMENSIONS

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.

ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically

disclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor the

rights of others.

98AON14036D

DOCUMENT NUMBER:

DESCRIPTION:

Electronic versions are uncontrolled except when accessed directly from the Document Repository.

Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.

PAGE 1 OF 1

DFN5 5x6, 1.27P (SO−8FL)

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PUBLICATION ORDERING INFORMATION

TECHNICAL SUPPORT

North American Technical Support:

Voice Mail: 1 800−282−9855 Toll Free USA/Canada

Phone: 011 421 33 790 2910

LITERATURE FULFILLMENT:

Email Requests to: [email protected]

onsemi Website: www.onsemi.com

Europe, Middle East and Africa Technical Support:

Phone: 00421 33 790 2910

For additional information, please contact your local Sales Representative

◊

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ON Semiconductor NTMFS006N12MC Operating instructions

ON Semiconductor NTMFS006N12MC Operating instructions

ON Semiconductor NTMFS006N12MC Operating instructions

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