Sanyo Xacti VPC-GH3PX User manual

Type
User manual
SERVICE MANUAL
Contents
1. OUTLINE OF CIRCUIT DESCRIPTION ............................... 3
2. DISASSEMBLY ................................................................... 10
3. ELECTRICAL ADJUSTMENT ............................................. 16
4. USB STORAGE INFORMATION REGISTRATION ............ 22
5. PARTS LIST........................................................................ 24
CIRCUIT DIAGRAMS & PRINTED WIRING BOARDS...........C1
CAUTION : Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the
manufacturer.
Discard used batteries according to the manufacturer’s instructions.
NOTE : 1. Parts order must contain model number, part number, and description.
2. Substitute parts may be supplied as the service parts.
3. N. S. P. : Not available as service parts.
Design and specification are subject to change without notice.
SG41K/U, EX, GX, PX, TA (R)
REFERENCE No. SM5310834
FILE NO.
Dual Camera
RoHS
This product does not contain any hazardous substances prohibited by the RoHS
Directive.
WARNING
You are requested to use RoHS compliant parts for maintenance or repair.
You are requested to use lead-free solder.
(This product has been manufactured using lead-free solder. Be sure to follow the
warning given on page 2 when carrying out repair work.)
VPC-GH4
(Product Code : 168 306 01)
(U.S.A.) (Canada) (Taiwan)
(General) (South America)
VPC-GH3EX
(Product Code : 168 306 02)
(Europe) (U.K.) (Russia)
(Middle East) (Africa)
(General) (Korea) (Taiwan)
VPC-GH3GX
(Product Code : 168 306 03)
(China) (Hong Kong)
(General) (Korea)
VPC-GH3PX
(Product Code : 168 306 04)
(General) (Korea) (Taiwan)
(South America)
VPC-GH3TA
(Product Code : 168 306 05)
(Southeast Asia) (Australia)
(General)
– 2 –
WARNING
Do not use solder containing lead.
This product has been manufactured using lead-free solder in
order to help preserve the environment.
Because of this, be sure to use lead-free solder when carrying
out repair work, and never use solder containing lead.
Lead-free solder has a melting point that is 30 - 40°C (86 -
104°F) higher than solder containing lead, and moreover it does
not contain lead which attaches easily to other metals. As a
result, it does not melt as easily as solder containing lead, and
soldering will be more difficult even if the temperature of the
soldering iron is increased.
The extra difficulty in soldering means that soldering time will
increase and damage to the components or the circuit board
may easily occur.
Because of this, you should use a soldering iron and solder
that satisfy the following conditions when carrying out repair
work.
Soldering iron
Use a soldering iron which is 70 W or equivalent, and which
lets you adjust the tip temperature up to 450°C (842°F). It
should also have as good temperature recovery characteris-
tics as possible.
Set the temperature to 350°C (662°F) or less for chip compo-
nents, to 380°C (716°F) for lead wires and similar, and to 420°C
(788°F) when installing and removing shield plates.
The tip of the soldering iron should have a C-cut shape or a
driver shape so that it can contact the circuit board as flat or in
a line as much as possible.
Solder
Use solder with the metal content and composition ratio by
weight given in the table below. Do not use solders which do
not meet these conditions.
Lead-free solder is available for purchase as a service tool.
Use the following part number when ordering:
Part name: Lead-free solder with resin (0.5 mm dia., 500 g)
Part number: VJ8-0270
Metal content
Tin (Sn) Silver (Ag)
Copper (Cu)
Composition
ratio by weight
96.5 %
3.0 %
0.5 %
Note:
If replacing existing solder containing lead with lead-free sol-
der in the soldered parts of products that have been manufac-
tured up until now, remove all of the existing solder at those
parts before applying the lead-free solder.
The components designated by a symbol ( ! ) in this schematic diagram designates components whose value are of
special significance to product safety. Should any component designated by a symbol need to be replaced, use only the part
designated in the Parts List. Do not deviate from the resistance, wattage, and voltage ratings shown.
PRODUCT SAFETY NOTICE
– 3 –
1. OUTLINE OF CIRCUIT DESCRIPTION
1-1. CMOS CIRCUIT DESCRIPTION
1. IC Configuration
The CMOS peripheral circuit block basically consists of the
following ICs.
IC911 (MT9J003I12STCV)
CMOS imager
CDS, AGC, ADC built-in
H driver, V driver, serial communication circuit built-in
2. IC911 (CMOS)
[Structure]
The electric charges which are generated when each pixel is
optically converted are in turn converted into signal voltages
by the FD amplifier, and they are then transmitted by the built-
in H driver and V driver. The signals are sampled and ampli-
fied by the CDS and PGA circuits at the point they are output,
and then they are AD converted and output. The output uses
the 12 bit LVDS interface.
1/2.3-inch positive pixel array CMOS-type fixed imaging ele-
ment
Effective pixels 3664 (H) X 2742 (V)
– 4 –
1-2. CP1 and VF1 CIRCUIT DESCRIPTION
1. Circuit Description
1-1. Digital clamp
The optical black section extracts averaged values from the
subsequent data to make the black level of the sensor output
data uniform for each line. The optical black section averaged
value for each line is taken as the sum of the value for the
previous line multiplied by the coefficient k and the value for
the current line multiplied by the coefficient k-1.
1-2. Signal processor
1. γ correction circuit
This circuit performs (gamma) correction in order to maintain
a linear relationship between the light input to the camera and
the light output from the picture screen.
2. Color generation circuit
This circuit converts the image sensor into RGB signals.
3. Matrix circuit
This circuit generates the Y signals, R-Y signals and B-Y sig-
nals from the RGB signals.
4. Horizontal and vertical aperture circuit
This circuit is used gemerate the aperture signal.
1-3. AE/AWB and AF computing circuit
The AE/AWB carries out computation based on a 64-segment
screen, and the AF carries out computations based on a 6-
segment screen.
1-4. SDRAM controller
This circuit outputs address, RAS, CAS and CLOCK data for
controlling the SDRAM. It also refreshes the SDRAM.
1-5. PIO/PWM/SIO for LCD
It possible to switch between individual input/output and PWM
input/output.
1-6. TG/SG
Timing generated for image sensor control.
1-7. Digital encoder
It generates chroma signal from color difference signal.
2. Outline of Operation
When the shutter opens, the switch signal is input to ASIC and
CPU, and then operation starts. When the TG/SG drives the
image sensor, picture data is converted internally into a small-
amplitude actuating signal, and is then input to ASIC. The
data that is input to the ASIC is input to the SDRAM through
digital clamp.
The AF, AE, AWB, shutter, and AGC value are computed from
this data, and obtain the optimum picture. The data which has
already been stored in the SDRAM is read by the CPU and
color generation is carried out. Each pixel is interpolated from
the surrounding data as being either R, G, and B primary color
data to produce R, G and B data. At this time, correction of the
lens distortion which is a characteristic of wide-angle lenses is
carried out. After AWB and γ processing are carried out, a matrix
is generated and aperture correction is carried out for the Y
signal, and the data is then compressed by JPEG and is then
written to card memory (SD card).
When played back on the LCD and monitor, data is transferred
from memery to the SDRAM, and the image is then elongated
so that it is displayed over the SDRAM display area.
3. LCD Block
The LCD display circuit is located on the CP1 board, and
consists of components such as a power circuit.
The signals from the ASIC are 8-bit digital signals, that is
input to the LCD directly. The 8-bit digital signals are con-
verted to RGB signals inside the LCD driver circuit . This LCD
has a 3-wire serial, and functions such as the brightness and
image quality are controlled.
Because the LCD closes more as the difference in potential
between the VCOM (common polar voltage: AC) and the R,
G and B signals becomes greater, the display becomes darker;
if the difference in potential is smaller, the element opens and
the LCD become brighter.
In addition, the timing pulses for signals other than the video
signals are also input from the ASIC directory to the LCD.
– 5 –
5. Video Clip Recording and Playback
5-1. Recording
The signal from the camera block is input to IC101 (ASIC). The
data that is input to the ASIC is input to SDRAM, and converts
this data to encoded MPEG4 data, after which it is written in
sequence onto the SD card as streaming data. At this time,
the audio signals that are input to the built-in microphone are
converted into digital data by the audio CODEC IC of IC181,
and they are then input to ASIC. The audio data is then en-
coded (AAC), and then it is written in sequence onto the SD
card together as streaming data with the image signals de-
scribed above.
5-2. Playback
The data is read from the SD card, and the encoded data is
decoded into image data where it is displayed by the LCD or
on a TV monitor. At the same time, the audio data is also de-
coded, and is input to IC181 as digital data. D/A conversion is
carried out at IC181, and the sound is then output to the speaker
or to the LINE OUT terminal.
6. Audio CODEC Circuit (IC181)
The audio signals from the microphone are converted into 16-
bit digital data. AD conversion is carried out at a maximum
sampling frequency of 48 kHz.
During audio playback, the 16-bit digital data is converted into
analog signals and these are output to the speaker or line out
system. DA conversion is carried out at a maximum sampling
frequency of 48 kHz.
4. Lens drive block
4-1. Focus drive
The serial signals (LENS_SDATA, LENS_SCLK and
LENS_EN) and F_CLK which are output from the ASIC
(IC101) are used to drive (FOCUS_A+, FOCUS_A-,
FOCUS_B+ and FOCUS_B-) by the motor driver IC (IC951),
and then used to microstep-drive the focus stepping motor.
Detection of the standard focusing positions is carried out by
means of the photointerruptor (FOCUS_PI_E) inside the lens
block.
4-2. Zoom drive
The serial signals (LENS_SDATA, LENS_SCLK and
LENS_EN) and Z_CLK which are output from the ASIC
(IC101) are used to drive (ZOOM_A+, ZOOM_A-, ZOOM_B+
and ZOOM_B-) by the motor driver IC (IC951), and then used
to microstep-drive the zoom stepping motor. Detection of the
standard zooming positions is carried out by means of the
photointerruptor (ZOOM_PI_E) inside the lens block.
4-3. Iris drive
The serial signals (LENS_SDATA, LENS_SCLK and
LENS_EN) which are output from the ASIC (IC101) are used
to drive regular current (ND+ and ND-) by the motor driver IC
(IC951), and are then used to microstep-drive iris operation.
4-4. Shutter drive
The shutter drive signals (SHUTTER+) which are output from
the ASIC (IC101) are used to drive regular current (DRIVE+
and DRIVE-) by the motor driver (IC951), and then mecha
shutter is opened and closed.
– 6 –
7. Power Sequencer Description
For the overall configuration of the power sequenser, refer to the block diagram. This circuit block consists primarily of the power
sequencer block inside the ASIC.
The power sequencer have functions for receiving user operations which signify that the camera has been turned on and power
ON/OFF function.
Pin Signal
zSYRSTI
SYCKI
BATI
PON[1]
PON[0]
GPIOS[9]
GPIOS[8]
GPIOS[7]
GPIOS[5]
GPIOS[4]
GPIOS[3]
GPIOS[2]
GPIOS[1]
GPIOS[0]
KSO[4]
KSO[0]
KSI[3]
KSI[2]
KSI[1]
KSI[0]
BSRST
CLK32K
-
-
PON
-
-
SW3.2ON
PANEL_OPEN
ZCARD
KEY_1ST
KEY_2ND
ZUSB_DET
GREEN_LED
RED_LED
SCAN OUT0
SCAN_IN3
SCAN_IN2
SCAN_IN1
SCAN_IN0
I/O
I
I
I
O
O
O
O
O
I
I
I
I
I
O
O
O
I
I
I
I
Outline
Power sequencer block initializataion signal
32 kHz clock input
-
-
VDD1.1, VDD1.8, VDD3 control signal
-
SW3.2 V power ON/OFF control
LCD panel open/close detection
SD card detection
Key input 1st shutter
Key input 2nd shutter
USB detection
Green LED lighting control
Keyscan output signal
Keyscan input signal
Keyscan input signal
Keyscan input signal
Keyscan input signal
Red LED lighting control
GPIOS[6]
DC_IN
I
DC jack input detection
KSO[3]
SCAN OUT3
O
Keyscan output signal
KSO[2]
SCAN OUT2
O
Keyscan output signal
KSO[1]
SCAN OUT1
O
Keyscan output signal
-
KSI[4]
SCAN_IN4 I
Keyscan input signal
Table 2-1. Power Sequencer Port Specification
– 7 –
8. Key Operation
For details of the key operation, refer to the instruction manual.
Table 2-2. Key Operation
0
0
123
SCAN
OUT
SCAN
IN
LEFT
VRECPOWER
1
2
DOWN
--
-
MENU
-
RIGHT
PLAY
UP
4
-
-
SET
ASIC/memory/LCD
CMOS
Power OFF
Play mode
VDD1.1, VDD1.8, VDD3
OFF
OFF
ON
ON
Shooting mode
CMOS1.8, VAA2.8
ON
OFF
Table 2-3. Power Control
9. Power Supply Control
When the battery is attached, a AL3.2 V power is normally input to the power sequencer block, so that key scanning is carried out
even when the power switch is turned off, so that the camera can start up request again from user.
If the start up request is occured, the PON signal set to high, and then turns on the DC/DC converter.
In addition, the resetting of the CPU inside the ASIC is canceled. This causes all blocks and memories other than the power
sequencer of the ASIC to start operating.
When the power switch is turned off, the ASIC returns to the reset condition, all DC/DC converters are turned off and the power
supply to the whole system is halted.
3
WIDE ZOOMSEL
TELE
-
SUBREC
– 8 –
1-3. PWA POWER CIRCUIT DESCRIPTION
1. Outline
This is the main power circuit, and is comprised of the follow-
ing blocks.
Switching controller (IC501)
VAA 2.8 CMOS power output (L5041)
CMOS 1.8 CMOS power output (IC501 ch5)
VDD 3 power output (L5021)
VDD 1.8 power output (L5061)
VDD 1.1 power output (L5031)
LCD backlight system power output (L5071)
Motor system power BOOST 5.0 V output (L5301)
VDD 5 power output (IC502)
2. Switching Controller (IC501)
This is the basic circuit which is necessary for controlling the
power supply for a PWM-type switching regulator, and is pro-
vided with six channels, linear regulator one channel and load
switch one channel. This model is used six channels for switch-
ing regulator and one channel for load switch.
Only CH1 (BOOST 5.0 V), CH2 (VDD 3), CH3 (VDD 1.1),
CH4 (VAA 2.8), CH6 (VDD 1.8), CH7 (LCD backlight) and
CH5 (CMOS 1.8) are used.
Feedback from CH1 (BOOST 5.0 V), CH2 (VDD 3), CH3 (VDD
1.1), CH4 (VAA 2.8), CH6 (VDD 1.8) power supply outputs
are received, and the PWM duty is varied so that each one is
maintained at the correct voltage setting level.
Feedback for the CH7 (LCD backlight power) is provided to
the both ends voltage of registance so that regular current
can be controlled to be current that was setting.
CH5 (CMOS 1.8) is as source of CH6 (VDD 1.8) output so
that ON/OFF control can be carried out.
2-1. Short-circuit protection circuit
If output is short-circuited for the length of time determined
by IC501, all output is turned off. The control signal (P ON)
are recontrolled to restore output.
3. VAA 2.8 Power Output
VAA 2.8 (2.8 V) is output. Feedback for the VAA 2.8 is pro-
vided to the switching controller (Pin (G3) of IC501) so that
PWM control can be carried out.
4. CMOS 1.8 Power Output
CMOS 1.8 (1.8 V) is output. +1.8 V (D) is as source of VDD
1.8 power so that ON/OFF control can be carried out at IC501
ch5.
5. VDD 3 Power Output
VDD 3 (3.25 V) is output. Feedback for the VDD 3 output is
provided to the switching controller (IC501) so that PWM con-
trol can be carried out.
6. VDD 1.8 Power Output
VDD 1.8 (1.8 V) is output. Feedback for the VDD 1.8 output is
provided to the switching controller (Pin (G2) of IC501) so
that PWM control can be carried out.
7. VDD 1.1 Power Output
VDD 1.1 (1.1 V) is output. Feedback for the VDD 1.1 output is
provided to the switching controller (Pin (C6) of IC501) so
that PWM control can be carried out.
8. LCD Backlight Power Output
Regular current is being transmitted to LED for LCD back-
light. Feedback for the LED cathode is provided to the switch-
ing controller (Pin (B4) of IC501) so that PWM control to be
carried out.
9. Motor System Power Output
BOOST 5.0 V is output. Feedback for the BOOST 5.0 V out-
put is provided to the switching controller (IC501) so that PWM
control can be carried out.
10. HDMI VDD 5 Power Output
HDMI power VDD 5 (5 V) is output. Feedback for the VDD5
output is as source of BOOST 5.0 V power so that ON/OFF
control can be carried out at the IC502.
– 9 –
1-4. ST1 STROBE CIRCUIT DESCRIPTION
1. Charging Circuit
When UNREG power is supplied to the charge circuit and the
CHG signal from microprocessor becomes High (3.3 V), the
charging circuit starts operating and the main electorolytic
capacitor is charged with high-voltage direct current.
However, when the CHG signal is Low (0 V), the charging
circuit does not operate.
1-1. Charge switch
When the CHG signal switches to Hi, IC541 starts charging
operation.
1-2. Power supply filter
C5401 constitutes the power supply filter. They smooth out
ripples in the current which accompany the switching of the
oscillation transformer.
1-3. Oscillation circuit
This circuit generates an AC voltage (pulse) in order to in-
crease the UNREG power supply voltage when drops in cur-
rent occur. This circuit generates a drive pulse with a frequency
of approximately 200-300 kHz, and drive the oscillation trans-
former.
1-4. Oscillation transformer
The low-voltage alternating current which is generated by the
oscillation control circuit is converted to a high-voltage alter-
nating current by the oscillation transformer.
1-5. Rectifier circuit
The high-voltage alternating current which is generated at
the secondary side of T5401 is rectified to produce a high-
voltage direct current and is accumulated at electrolytic ca-
pacitor C5412.
1-6. Charge monitoring circuit
The functions programmed in the IC541 monitor oscillations
and estimate the charging voltage. If the voltage exceeds the
rated value, charging automatically stops. Then, the
CHGDONE signal is changed to Lo output and a "charging
stopped" signal is sent to the microcomputer.
2. Light Emission Circuit
When FLCTL signal is input from the ASIC, the stroboscope
emits light.
2-1. Emission control circuit
When the FLCTL signal is input to the emission control cir-
cuit, Q5402 switches on and preparation is made to the light
emitting. Moreover, when a FLCTL signal becomes Lo, the
stroboscope stops emitting light.
2-2. Trigger circuit
The Q5402 is turned ON by the FLCTL signal and light emis-
sion preparation is preformed. Simultaneously, high voltage
pulses of several kV are emitted from the trigger coil and ap-
plied to the light emitter.
2-3. Light emitting element
When the high-voltage pulse form the trigger circuit is ap-
plied to the light emitting part, currnet flows to the light emit-
ting element and light is emitted.
Beware of electric shocks.
– 10 –
26
25
28
32
31
34
33
12
29
24
35
20
14
13
18
11
19
17
18
16
10
21
2
E
B
C
22
23
16
1
F
15
3
4
6
5
D
3
3
A
8
9
27
7
30
2. DISASSEMBLY
2-1. REMOVAL OF CABI FRONT AND ST1 BOARD
NOTE: Discharge a strobe capacitor with the
discharge jig (VJ8-0188) for electric shock prevention.
When assembling,
tighten the screws order.
A B C D E F
11
1. Screw 1.7 x 2.5
2. Screw 1.7 x 4.5
3. Four screws 1.7 x 4.5
4. Assy, cabi left
5. Cover BATT
6. Cover BATT inner
7. Adhesive dec back 4
8. Holder lens
9. Shaft strap
10. Remover the solder.
11. Screw 1.7 x 2.5
12. Screw 1.4 x 4
13. Assy, cabi front
14. Spacer flash top 2
15. Spacer chassis F2
16. Two screws 1.4 x 4
17. Assy, lamp SV
18. Spacer cabi front 3
19. Spacer cabi front 1
20. Spacer ring lens
21. Screw 1.4 x 4
22. Connector (CN541)
23. ST1 board
24. Screw 1.7 x 2
25. Screw 1.4 x 4
26. Assy, dec T B
27. Remover the solder.
28. Spacer speaker
29. Speaker, 8
30. Spacer lens left
31. Two screws 1.4 x 3
32. Spring zoom
33. Button sub movie
34. Button sub photo
35. Two screws 1.7 x 2
– 12 –
22
21
25
c
G
a
(
a
)
(
b
)
F
b
14
23
17
16
9
10
11
5
18
B
C
A
21
13
12
1
2
3
6
15
D
7
8
19
24
20
E
4
2-2. REMOVAL OF CABI RIGHT
1. Assy, heat sink L SV
2. Screw 1.4 x 4
3. Holder ST1
4. Spacer chassis F2
5. Spacer CP1 lens
6. Assy, FPC CA1 SV
7. Connector (CN901)
8. Connector (CN951)
9. Holder lens
10. Spacer flash lens
11. Spacer trigger
12. Spacer lens left
13. Spacer CA1 CN
14. Two screws 1.4 x 4
15. Two screws 1.4 x 4
16. Screw 1.7 x 3
17. Screw 1.7 x 3.5
18. Screw 1.7 x 2
19. Connector (CN103)
20. Spacer LCD harnss 2
21. Three screws 1.7 x 6
22. Dec joint
23. Two screws 1.7 x 3
24. Holder A joint
25. Compl, cabi right
When assembling,
tighten the screws order.
A B C D E F G
When assembling,
tighten the screws order.
(a) (b)
When assembling,
tighten the screws order.
a b c
13
2-3. REMOVAL OF TB4 BOARD, TB3 BOARD, TB2 BOARD AND CP1 BOARD
6
5
4
18
19
3
7
12
23
24
1
11
8
9
2
27
25
10
A
C
B
28
22
20
21
17
16
14
15
13
26
When assembling,
tighten the screws order.
A B C
1. Connector (CN161)
2. Flexible PWB CP1-ST1
3. Spacer lens left
4. Spacer rubber zoom
5. Spacer TB3
6. Spacer TB3A
7. Remove the solder.
8. Remove the solder.
9. Remove the solder.
10. Three screws 1.4 x 4
11. Assy, heat sink R SV
12. Spacer CP1
13. Screw 1.4 x 4
14. Two screws 1.4 x 3
15. Earth TB3 TB4
16. Earth TB4
17. TB4 board
18. Screw 1.4 x 4
19. TB3 board
20. Screw 1.7 x 3.5
21. Connector
22. TB2 board
23. Two screws 1.4 x 4
24. CP1 board
25. Spacer lens right
26. Spacer CP1 lens
27. Assy, chassis
28. Terminal battery
14
18
20
19
23
27
28
22
24
B
A
C
17
25
3
26
2
17
15
13
11
10
7
1
8
12
21
6
14
4
5
16
9
2-4. REMOVAL OF TB1 BOARD, VF1 BOARD AND LCD
When assembling,
tighten the screws order.
A B C
When assembling
10
8
11
10
12
10
1. Screw 1.7 x 2
2. Two screws 1.7 x 4
3. Assy, cover LCD B
4. Remove the solder.
5. Connector (CN172)
6. Spacer MR
7. Cover joint B
8. Cover joint
9. Adhesive joint B
10. Spacer joint (removed after assembly)
11. Assy, joint
12. Assy, wire VF1 & CP1
13. Assy, magnet
14. Screw 1.7 x 2.5
15. TB1 board
16. Spacer TB1
17. Three screws 1.7 x 3
18. Compl, COV LCD FRT SV
19. Connector (CN171)
20. LCD
21. Spacer LCD
22. Spacer HL monitor
23. Three screws 1.7 x 2
24. Holder monitor
25. Earth MIC
26. Spacer earth MIC
27. VF1 board
28. Spacer MIC
15
2-5. BOARD LOCATION
VF1 board
TB1 board
CP1 board
ST1 board
TB2 board
TB4 board
TB3 board
– 16 –
3. ELECTRICAL ADJUSTMENT
3-1. Table for Servicing Tools
Download the calibration software and the firmware
from the following URL.
http://www.overseas.sanyo.com/dcamera service/
Place the DscCalDi.exe file, camapi32.dll file and
QrCodeInfo.dll file together into a folder of your
choice.
3-2. Equipment
1. AC adaptor
2. PC (IBM R -compatible PC, Windows 2000 or XP or Vista
or 7)
3-3. Adjustment Items and Order
1. Lens Adjustment (1 m)
2. Lens Adjustment (Infinity)
3. AWB Adjustment
4. White Point Defect Detect Adjustment
5. Black Point And White Point Defect Detect Adjustment In
Lighted
Note: If the lens, board and changing the part, it is necessary
to adjust again. Item 1-5 adjustments should be carried out in
sequence.
*Adjustment environment
Temperature: 25 ± 10 degrees
Humidity: 55 ± 25 %
3-4. Setup
1. System requirements
Windows 2000 or XP or Vista or 7
IBM R -compatible PC with pentium processor
USB port
40 MB RAM
Hard disk drive with at least 15 MB available
VGA or SVGA monitor with at least 256-color display
2. Pattern box
Turn on the switch and wait for 30 minutes for aging to take
place before using Color Pure. It is used after adjusting the
chroma meter (VJ8-0192) adjust color temperature to 3100 ±
20 K and luminosity to 900 ± 20 cd/m
2
. Be careful of handling
the lump and its circumference are high temperature during
use and after power off for a while.
3. Computer screen during adjustment
3-5. Connecting the camera to the computer
1. Use the supplied dedicated USB interface cable to connect
the camera to the computer.
2. Turn on the camera.
3. Choose the “COMPUTER”, and press the SET button.
Next, choose the “CARD READER”, and press the SET
button.
Ref. No.
Name
Part code
J-1
J-2
J-3
VJ8-0190
Pattern box
Calibration software
J-4
Number
1
1
1
Chroma meter
VJ8-0192
1
Spare lump (pattern box)
VJ8-0191
J-5
J-1 J-3
J-4
J-5
1
Discharge jig
VJ8-0188
J-6
1
Collimator
VJ8-0260
J-7
1
Spare lump (collimator)
VJ8-0282
J-8
1
Siemens star chart
J-8
Firmware
Data
AWB
Focus
UV Matrix
R Bright
RGB Offset
Tint
B Bright
Gain
Phase
LCD
Calibration
Upload
Initialize
LCD Type
H AFC Test
VCOMDC
VCOMPP
Cal Data
Cal Mode
OK
OK
EVF
USB storage
Get
Set
VID
Set
PID
Set
Serial
Set
Rev.
Set
Setting
Language
Video Mode
VCO
Factory Code
Hall Cal.
Backrush pulse :
Set
Get
17
LENS
ASSY, FLEXIBLE PWB CA1
Preparation:
POWER switch: ON
Adjustment condition:
Siemens star chart (A3)
Fluorescent light illumination with no flicker
Illumination above the subject should be 700 lux ± 10%.
Note:
Do not vibrate during the adjustment.
If readjusting after it has already been adjusted, wait for 15
minutes or more for the unit to cool down first.
Adjustment method:
1. Set the siemens star chart 100 ± 0.5 cm from lens surface
so that it becomes center of the screen (zoom wide and
tele). Set the camera and the chart in a straight, and do not
put optical systems (mirror and conversion lens etc.)
2. Double-click on the DscCalDi.exe.
3. Click the Focus, and Click the Ye s.
4. Lens adjustment value will appear on the screen.
5. Click the OK.
2. Lens Adjustment (Infinity) is carried out after this ad-
justment.
3-8. Adjust Specifications
1. Lens Adjustment (1 m)
3-6. The adjustment item which in necessary in part exchange
COMPL PWB CP1
Factory
Cord
Setting
Language
Setting
COMPL PWB VF1
COMPL PWB ST1
COMPL PWB TB1
Reset
Setting
Lens
Adjust-
ment
(Infinity)
AWB
Adjust-
ment
USB
storage
information
registration
White Point
Defect
Detect
Adjustment
Black Point
And
White Point
Defect Detect
Adjustment
In Lighted
: Be sure to carry out the necessary adjustments after replacing the unit.
: Adjustment is possible from the menu setting screen of the camera and by using the calibration software.
COMPL PWB TB2
Lens
Adjust-
ment
(1 m)
3-7. Updating the firmware
Check the firmware version immediately after the CP1 board has been replaced. If an old version is being used, interfer-
ence and errors in operation may also occur. If an old version is being used, update it with a newer version.
Refer to
3-13. Firmware uploading procedure. (Page 21)
COMPL PWB TB4
COMPL PWB TB3
Camera
100 0.5 cm
Siemens
star chart
18
Preparation:
POWER switch: ON
If using a ready-made collimator, set to infinity.
Note:
Do not vibrate during the adjustment.
If readjusting after it has already been adjusted, wait for 15
minutes or more for the unit to cool down first.
Adjustment method:
1. Set the camera so that it becomes center of the siemens
star chart in the collimator (zoom wide and tele).
(Set a distance of 0.5-1.0 cm between camera lens and
collimator lens. Do not touch the each lens.)
2. Double-click on the DscCalDi.exe.
3. Select Infinity Cal. on the LCD Test, and click the Ye s .
4. Lens infinity adjustment value will appear on the screen.
5. Click the OK.
Adjustment value determination is effectuated using below
values.
The adjustment values fulfill the conditions below, they are de-
termined as within specifications.
Adjustment value determination
AF_TEMP_AD: ATAD
ATAD: adjustment value of focus temperature A/D
(250<=ATAD<=893)
PZ_BR: PBR
PBR: adjustment value of zoom backrush pulse
(0<=PBR<=10)
AF_BR: ABR
ABR: adjustment value of focus backrush pulse
(0<=ABR<=10)
AF_I_WIDE: ZIW
ZIW: infinity adjustment value of focus at zoom position
wide (90<=ZIW<=415)
AF_I_MID1: ZIM1
ZIM1: infinity adjustment value of focus at zoom position
middle1 (567<=ZIM1<=169)
AF_I_MID2: ZIM2
ZIM2: infinity adjustment value of focus at zoom position
middle2 (581<=ZIM2<=141)
Adjustment value determination is effectuated using below val-
ues.
The adjustment values fulfill the conditions below, they are de-
termined as within specifications.
Adjustment value determination
AF_WIDE: ZW
ZW: adjustment value of focus at zoom position wide
(415<=ZW<=286)
AF_MID1: ZM1
ZM1: adjustment value of focus at zoom position middle1
(169<=ZM1<=50)
AF_MID2: ZM2
ZM2: adjustment value of focus at zoom position middle2
(-141<=ZM2<=64)
AF_MID3: ZM3
ZM3: adjustment value of focus at zoom position middle3
(-133<=ZM3<=107)
AF_MID4: ZM4
ZM4: adjustment value of focus at zoom position middle4
(-175<=ZM4<=151)
AF_TELE: ZT
ZT: adjustment value of focus at zoom position tele
(267<=ZT<=309)
2. Lens Adjustment (Infinity)
Camera
Collimator
DscCalDi x
OK
Focus Result
AF_WIDE: 0
AF_MID1: 42
AF_MID2: 56
AF_MID3: 84
AF_MID4: 109
AF_TELE: 165
!
Dsc Calibration x
OK
Infinity calibration :
AF_TEMP_AD: 464
PZ_BR: 3
AF_BR: 4
AF_I_WIDE: -3
AF_I_MID1: 8
AF_I_MID2: 13
AF_I_MID3: 21
AF_I_MID4: 30
AF_I_TELE: 48
Copy
19
Adjustment value determination is effectuated using the WB,
"CHECK" and "MS" values. If
WB = W1, W2, W3
CHECK = wc0, wc1, wc2
MS = ms1, ms2
the adjustment values fulfill the conditions below, they are
determined as within specifications.
Adjustment value determination
200<=w1<=310, 330<=w3<=500
wc0=128 ± 2, wc1=128 ± 2, wc2=150 ± 50
2000<=ms1<=4000, 2500<=ms2<=4500
Adjustment values other than the above are irrelevant.
4. White Point Defect Detect Adjustment
Preparation:
POWER switch: ON
Adjustment method:
1. Double-click on the DscCalDi.exe.
2. Select CCD Defect on the LCD Test, and click the Ye s.
3. After the adjustment is completed, OK will display.
4. Click the OK.
AF_I_MID3: ZIM3
ZIM3: infinity adjustment value of focus at zoom position
middle3 (540<=ZIM3<=133)
AF_I_MID4: ZIM4
ZIM4: infinity adjustment value of focus at zoom position
middle4 (456<=ZIM4<=175)
AF_I_TELE: ZIT
ZIT: infinity adjustment value of focus at zoom position
tele (189<=ZIT<=267)
3. AWB Adjustment
Preparation:
POWER switch: ON
Setting of pattern box:
Color temperature: 3100 ± 20 (K)
Luminance: 900 ± 20 (cd/m
2
)
Adjusting method:
1. Set a distance of 0.5-1.0 cm between the pattern box and
the camera. (Do not enter any light.)
2. Double-click on the DscCalDi.exe.
3. Click the AWB, and click the Yes.
4. AWB adjustment value will appear on the screen.
5. Click the OK.
Camera
Pattern box
(color viewer)
Dsc Calibration
x
OK
AWB Results:
1:
WB=245,482,418
CHECK=128,129,138
MS=2556,2891
Fno_FOR_ISO=-1
SS_FOR_ISO=-1
YLEVEL_FOR_ISO=-1
Copy
20
5. Black Point And White Point Defect Detect
Adjustment In Lighted
Preparation:
POWER switch: ON
Setting of pattern box:
Color temperature: 3100 ± 20 (K)
Luminance: 900 ± 20 (cd/m
2
)
Adjusting method:
1. Set a distance of 0.5-1.0 cm between the pattern box and
the camera.
2. Double-click on the DscCalDi.exe.
3. Select CCD Black on the LCD Test, and click the Ye s .
4. After the adjustment is completed, the number of defect
will appear.
5. Click the OK.
Camera
Pattern box
(color viewer)
3-9. Factory Code Setting
1. Check the "Factory Code" display within the Setting group.
2. For U.S.A., Canada and NTSC general area
If "FC_SANYO_U" does not appear, click on the " " mark
located on the right of the "Factory Code" display BOX and
select "FC_SANYO_U".
3. For Europe and PAL general area
If "FC_SANYO_EX" does not appear, click on the " " mark
located on the right of the "Factory Code" display BOX and
select "FC_SANYO_EX".
3-10. Language Setting
1. Click on the " " mark located on the right of the
"Language" display BOX.
2. Select language. (Default is English.)
3. End "DscCal" and remove the camera before turning the
camera power OFF.
3-11. Reset Setting
Carry out reset settings after replacing CP1 board.
1. Turn on the camera.
2. Set the NORMAL mode, and press the MENU button.
3. Choose the OPTION MENU 3.
4. Choose the RESET SETTINGS, and press the SET button.
5. Select YES, and press the SET button.
3-12. The Compulsive boot starting method
1. Keep the SHUTTER button depressed while switching on
the power.
2. Connect the camera and the computer with USB cable.
Firmware
Data
AWB
Focus
UV Matrix
R Bright
RGB Offset
Tint
B Bright
Gain
Phase
LCD
Calibration
Upload
Initialize
LCD Type
H AFC Test
VCOMDC
VCOMPP
Cal Data
Cal Mode
OK
OK
EVF
USB storage
Get
Set
VID
Set
PID
Set
Serial
Set
Rev.
Set
Setting
Language
Video Mode
VCO
Factory Code
Hall Cal.
Backrush pulse :
Set
Get
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Sanyo Xacti VPC-GH3PX User manual

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