DFI SD101/SD103-Q170 Owner's manual

1

SD101/SD103-Q170

Mini-ITX Industrial Motherboard

User’s Manual

A-411-M-2008

2

Copyright

This publication contains information that is protected by copyright. No part of it may be re-

produced in any form or by any means or used to make any transformation/adaptation without

the prior written permission from the copyright holders.

This publication is provided for informational purposes only. The manufacturer makes no

representations or warranties with respect to the contents or use of this manual and specifi-

cally disclaims any express or implied warranties of merchantability or fitness for any particular

purpose. The user will assume the entire risk of the use or the results of the use of this docu-

ment. Further, the manufacturer reserves the right to revise this publication and make changes

to its contents at any time, without obligation to notify any person or entity of such revisions

or changes.

Changes after the publication’s first release will be based on the product’s revision. The website

will always provide the most updated information.

Trademarks

Product names or trademarks appearing in this manual are for identification purpose only and

are the properties of the respective owners.

FCC and DOC Statement on Class B

This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reason-

able protection against harmful interference when the equipment is operated in a residential

installation. This equipment generates, uses and can radiate radio frequency energy and, if not

installed and used in accordance with the instruction manual, may cause harmful interference

to radio communications. However, there is no guarantee that interference will not occur in a

particular installation. If this equipment does cause harmful interference to radio or television

reception, which can be determined by turning the equipment off and on, the user is encour-

aged to try to correct the interference by one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the receiver.

• Connect the equipment into an outlet on a circuit different from that to which the receiver

is connected.

• Consult the dealer or an experienced radio TV technician for help.

Notice:

1. The changes or modifications not expressly approved by the party responsible for compli-

ance could void the user’s authority to operate the equipment.

2. Shielded interface cables must be used in order to comply with the emission limits.

3

Table of Contents

Copyright .............................................................................................................2

Trademarks ........................................................................................................2

FCC and DOC Statement on Class B .....................................................2

Warranty .............................................................................................................. 4

Static Electricity Precautions ......................................................................4

Safety Measures ..............................................................................................4

About the Package .........................................................................................5

Optional Items..................................................................................................5

Before Using the System Board ...............................................................5

Chapter 1 - Introduction .............................................................................6

Specifications ................................................................................................6

Features .......................................................................................................... 7

Chapter 2 - Hardware Installation ................................................9

Board Layout ................................................................................................. 9

System Memory ............................................................................................ 9

Installing the SODIMM Module .................................................................... 10

CPU ................................................................................................................ 11

Installing the CPU ....................................................................................... 12

Installing the Fan and Heat Sink.................................................................. 14

Jumper Settings ......................................................................................... 15

Clear CMOS Data ........................................................................................ 15

Auto Power-on Select .................................................................................. 15

Panel Power Select ..................................................................................... 16

COM1 RS232/Power Select .......................................................................... 16

LCD/Inverter Power Select .......................................................................... 17

Backlight Power Select ................................................................................ 17

Mini PCIe 1 Signal Select ............................................................................ 18

Mini PCIe 2 Signal Select ............................................................................ 18

Rear Panel I/O Ports ................................................................................. 19

12V DC-in (SD101)/15~36V DC-in (SD103) .................................................. 19

RJ45 LAN Ports ........................................................................................... 20

Graphics Interfaces ..................................................................................... 20

USB Ports ................................................................................................... 21

I/O Connectors ........................................................................................... 22

SATA (Serial ATA) Connectors ...................................................................... 22

SATA (Serial ATA) Power Connector ............................................................. 22

Digital I/O Connector .................................................................................. 23

Digital I/O Power Connector ........................................................................ 23

Cooling Fan Connectors............................................................................... 23

Chassis Intrusion Connector ........................................................................ 24

Front Panel Connector ................................................................................ 24

Expansion Slots .......................................................................................... 25

Standby Power LED .................................................................................... 25

LVDS LCD Panel Connector ......................................................................... 26

LCD/Inverter Power Connector .................................................................... 26

SMBus Connector ....................................................................................... 27

S/PDIF Connector ....................................................................................... 27

COM (Serial) Ports ...................................................................................... 28

LPC Connector (Optional) ............................................................................ 29

Connecting the EXT-RS232/RS485 Card to the Motherboard ......................... 29

Front Audio ................................................................................................ 30

Battery ....................................................................................................... 30

Chapter 3 - BIOS Setup ............................................................... 31

Overview....................................................................................................... 31

Insyde BIOS Setup Utility (for Intel 6th Generation CPU) ............. 32

Main .......................................................................................................... 32

Advanced ................................................................................................... 32

Security ...................................................................................................... 40

Boot........................................................................................................... 41

Exit ............................................................................................................ 42

Insyde BIOS Setup Utility (for Intel 6/7th Generation CPU) ......... 43

Main .......................................................................................................... 43

Advanced ................................................................................................... 43

Security ...................................................................................................... 55

Boot........................................................................................................... 55

Exit ............................................................................................................ 56

Updaing the BIOS ...................................................................................... 57

Notice: BIOS SPI ROM ............................................................................. 57

Chapter 4 - Supported Software ........................................................... 58

Chapter 5 - RAID .......................................................................................... 71

Chapter 6 - Intel AMT Settings .............................................................. 75

Appendix A - Troubleshooting Checklist ............................................ 89

4

Warranty

1. Warranty does not cover damages or failures that arised from misuse of the product, in-

ability to use the product, unauthorized replacement or alteration of components and prod-

uct specifications.

2. The warranty is void if the product has been subjected to physical abuse, improper instal-

lation, modification, accidents or unauthorized repair of the product.

3. Unless otherwise instructed in this user’s manual, the user may not, under any circum-

stances, attempt to perform service, adjustments or repairs on the product, whether in or

out of warranty. It must be returned to the purchase point, factory or authorized service

agency for all such work.

4. We will not be liable for any indirect, special, incidental or consequencial damages to the

product that has been modified or altered.

Static Electricity Precautions

It is quite easy to inadvertently damage your PC, system board, components or devices even

before installing them in your system unit. Static electrical discharge can damage computer

components without causing any signs of physical damage. You must take extra care in han-

dling them to ensure against electrostatic build-up.

1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you are

ready to install it.

2. Wear an antistatic wrist strap.

3. Do all preparation work on a static-free surface.

4. Hold the device only by its edges. Be careful not to touch any of the components, contacts

or connections.

5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or con-

nectors by their ends.

Safety Measures

To avoid damage to the system:

• Use the correct AC input voltage range.

To reduce the risk of electric shock:

• Unplug the power cord before removing the system chassis cover for installation or servic-

ing. After installation or servicing, cover the system chassis before plugging the power

cord.

Important:

Electrostatic discharge (ESD) can damage your processor, disk drive and other com-

ponents. Perform the upgrade instruction procedures described at an ESD worksta-

tion only. If such a station is not available, you can provide some ESD protection by

wearing an antistatic wrist strap and attaching it to a metal part of the system chas-

sis. If a wrist strap is unavailable, establish and maintain contact with the system

chassis throughout any procedures requiring ESD protection.

5

About the Package

The package contains the following items. If any of these items are missing or damaged,

please contact your dealer or sales representative for assistance.

• 1 SD101/SD103-Q170 motherboard

• 1 COM port cable (Length: 250mm, 1 x COM port)

• 1 Serial ATA data cable (Length: 500mm)

• 1 Serial ATA power Y cable (Length: 300mm)

The board and accessories in the package may not come similar to the information listed

above. This may differ in accordance to the sales region or models in which it was sold. For

more information about the standard package in your region, please contact your dealer or

sales representative.

Optional Items

• COM port cable (Length: 250mm, 1 x COM port)

• Audio (Line-out/Mic-in) cable

• Power adapter (100W, 12V, Level 6)

• Power adapter (120W, 19V, Level 6)

• Thermal solution (For 35W, Height: 37.3mm)

• Thermal solution (For 65W, Height: 72.8mm)

• LPC EXT-RS232 module (4 x RS232 ports)

• LPC EXT-RS485 module (4 x RS485 ports)

• I/O shield

• DT122 Chassis

• Intel 750 Series PCIe SSD (400GB)

• Intel 750 Series PCIe SSD (800GB)

• Intel 750 Series PCIe SSD (1.2TB)

The board and accessories in the package may not come similar to the information listed

above. This may differ in accordance to the sales region or models in which it was sold. For

more information about the standard package in your region, please contact your dealer or

sales representative.

Before Using the System Board

Before using the system board, prepare basic system components.

If you are installing the system board in a new system, you will need at least the following

internal components.

• A CPU

• Memory module

• Storage devices such as hard disk drive, etc.

You will also need external system peripherals you intend to use which will normally include at

least a keyboard, a mouse and a video display monitor.

6

Chapter 1 - Introduction

Specifications

Chapter 1

Chapter 1 Introduction www.dﬁ .com

SYSTEM Processor 7th Generation Intel® Core™ Processors, LGA 1151 Socket

Intel® Core™ i7-7700 Processor, Quad Core, 8M Cache, 3.6GHz (4.2GHz), 65W

Intel® Core™ i5-7500 Processor, Quad Core, 6M Cache, 3.4GHz (3.8GHz), 65W

Intel® Core™ i3-7101E Processor, Dual Core, 3M Cache, 3.9GHz, 65W

6th Generation Intel® CoreTM Processors, LGA 1151 Socket

Intel® CoreTM i7-6700, Quad Core, 8M Cache, 3.4GHz (4.0GHz), 65W

Intel® CoreTM i7-6700TE, Quad Core, 8M Cache, 2.4GHz (3.4GHz), 35W

Intel® CoreTM i5-6500, Quad Core, 6M Cache, 3.2GHz (3.6GHz), 65W

Intel® CoreTM i5-6500TE, Quad Core, 6M Cache, 2.3GHz (3.3GHz), 35W

Intel® CoreTM i3-6100, Dual Core, 3M Cache, 3.7GHz, 47W

Intel® CoreTM i3-6100TE, Dual Core, 4M Cache, 2.7GHz, 35W

Intel® Pentium® G4400, Dual Core, 3M Cache, 3.3GHz, 47W

Intel® Pentium® G4400TE, Dual Core, 3M Cache, 2.4GHz, 35W

Intel® Celeron® Processor G3900, Dual Core, 2M Cache, 2.8GHz, 65W

Intel® Celeron® Processor G3900TE, Dual Core, 2M Cache, 2.6GHz, 35W

Chipset Intel® Q170 Chipset

Memory Two 260-pin SODIMM up to 32GB

Dual Channel DDR4 1866/2133MHz

BIOS Insyde SPI 128Mbit

GRAPHICS Controller Intel® HD Gen 9 Graphics

Feature OpenGL 5.0, DirectX 12, OpenCL 2.1

HW Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG, HEVC/H265, VP8, VP9

HW Encode: MPEG2, AVC/H264, JPEG, HEVC/H265, VP8, VP9

Display 1 x LVDS

1 x DVI-I (DVI-D signal)

1 x HDMI/DP (DP available upon request)

LVDS: dual channel, resolution up to 1920x1200 @ 60Hz

DVI-D: resolution up to 1920x1200 @ 60Hz

HDMI: resolution up to 2560x1600 @ 60Hz or 4096x2160 @ 24Hz

DP: resolution up to 4096x2304 @ 60Hz

Triple

Displays

LVDS + DVI-I (DVI-D signal) + HDMI

LVDS + DVI-I (DVI-D signal) + DP

EXPANSION Interface 1 x PCIe x4 (Gen 3)

1 x Full-size Mini PCIe (USB/PCIe/SATA, SATA by default)

1 x Half-size Mini PCIe (USB/PCIe/SATA, PCIe by default)

AUDIO Audio

Codec

Realtek ALC888S-VD2-GR

ETHERNET Controller 1 x Intel® I210AT PCIe (10/100/1000Mbps)

1 x Intel® I219LM PCIe with iAMT11.0 (10/100/1000Mbps) (only Core i7/i5 supports iAMT)

REAR I/O Ethernet 2 x GbE (RJ-45)

USB 4 x USB 3.0

Display 1 x DVI-I (DVI-D signal)

1 x HDMI/DP (DP available upon request)

INTERNAL

I/O Serial 1 x RS-232/422/485 (RS-232 w/ power) (2.00mm pitch)

3 x RS-232 (2.00mm pitch)

USB 4 x USB 2.0 (2.00mm pitch)

Display 1 x LVDS LCD Panel Connector

1 x LCD/Inverter Power

Audio 1 x Audio (Line-out/Mic-in)

1 x S/PDIF

SATA 2 x SATA 3.0 (up to 6Gb/s)

RAID 0/1/5/10

DIO 1 x 8-bit DIO

LPC 1 x LPC (supports LPC EXT-RS232/RS485 module) (available upon request)

SMBus 1 x SMBus

WATCHDOG

TIMER Output &

Interval

System Reset, Programmable via Software from 1 to 255 Second

POWER Type Single 12V +/-10% DC (SD101) Wide Range 15~36V (SD103)

Connector DC-in Jack Right Angle Connector (4-pin) (available upon request)

Vertical Type Connector (4-pin) (available upon request)

Consumption SD101-Q170

Typical: i5 65W: 12V @ 3.18A (38.16Watt)

Max.: i5 65W: 12V @ 5.51A (66.12Watt)

SD103-Q170

Typical: i5 65W: 19V @ 2.16A (41.04Watt)

Max.: i5 65W: 19V @ 3.68A (69.92Watt)

RTC Battery CR2032 Coin Cell

OS SUPPORT Microsoft Windows 7 (/WES7) 32/64-bit

Windows 8.1 (64-bit)

Windows 10 IoT Enterprise 64-bit

Note: 7th Gen Intel Core processors only support Win 10.

Linux Debian 8 (with VESA graphic driver)

CentOS 7 (with VESA graphic driver)

Ubuntu 15.10 (Intel graphic driver available)

ENVIRONMENT Temperature Operating: 0 to 60°C

Storage: -40 to 85°C

Humidity Operating: 5 to 90% RH

Storage: 5 to 90% RH

MTBF

SD101-Q170 : 435,042 hrs @ 25°C; 256,660 hrs @ 45°C ; 165,275 hrs @ 60°C

SD103-Q170 : 420,421 hrs @ 25°C; 246,826 hrs @ 45°C ; 158,744 hrs @ 60°C

Calculation model: Telcordia Issue 2, Method I Case 3

Environment: GB, GC – Ground Benign, Controlled

MECHANICAL Dimensions Mini-ITX Form Factor

170mm (6.7") x 170mm (6.7")

Height PCB: 1.6mm

Top Side: 20mm, Bottom Side: 3mm

CERTIFICATIONS CE, FCC Class B, RoHS, UL

7

Chapter 1

Chapter 1 Introduction www.dﬁ .comChapter 1 Introduction

Features

• Watchdog Timer

The Watchdog Timer function allows your application to regularly “clear” the system at the set

time interval. If the system hangs or fails to function, it will reset at the set time interval so

that your system will continue to operate.

• DDR4

DDR4 delivers increased system bandwidth and improves performance. The advantages of

DDR4 provide an extended battery life and improve the performance at a lower power than

DDR3/DDR2.

• Graphics

The integrated Intel® HD graphics engine delivers an excellent blend of graphics performance

and features to meet business needs. It provides excellent video and 3D graphics with out-

standing graphics responsiveness. These enhancements deliver the performance and compat-

ibility needed for today’s and tomorrow’s business applications. Supports 1 LVDS, 1 DVI-I (DVI-

D signal) and 1 HDMI/DP (DP available upon request) interfaces for display outputs.

• PCI Express

PCI Express is a high bandwidth I/O infrastructure that possesses the ability to scale speeds

by forming multiple lanes. The PCI Express architecture also supports high performance graph-

ics infrastructure by enhancing the capability of a PCIe x4.

• Serial ATA

Serial ATA is a storage interface that is compliant with SATA 1.0a specification. With speed of

up to 6Gb/s (SATA 3.0), it improves hard drive performance faster than the standard parallel

ATA whose data transfer rate is 100MB/s. The bandwidth of the SATA 3.0 will be limited by

carrier board design.

• Gigabit LAN

Intel® I210AT PCIe Gigabit Ethernet and Intel® I219LM PCIe with iAMT11.0 Gigabit Ethernet

Phy controllers support up to 1Gbps data transmission.

• Audio

The Realtek ALC888S-VD2-GR audio codec provides 5.1-channel High Definition audio output.

Important:

The 5V_standby power source of your power supply must support ≥720mA.

• Wake-On-USB

This function allows you to use a USB keyboard or USB mouse to wake up a system from the

S3 (STR - Suspend To RAM) state.

• RTC Timer

The RTC installed on the system board allows your system to automatically power-on on the

set date and time.

• ACPI STR

The system board is designed to meet the ACPI (Advanced Configuration and Power Interface)

specification. ACPI has energy saving features that enables PCs to implement Power Manage-

ment and Plug-and-Play with operating systems that support OS Direct Power Management.

ACPI when enabled in the Power Management Setup will allow you to use the Suspend to RAM

function.

With the Suspend to RAM function enabled, you can power-off the system at once by pressing

the power button or selecting “Standby” when you shut down Windows® without having to go

through the sometimes tiresome process of closing files, applications and operating system.

This is because the system is capable of storing all programs and data files during the entire

operating session into RAM (Random Access Memory) when it powers-off. The operating ses-

sion will resume exactly where you left off the next time you power-on the system.

Important:

If you are using the Wake-On-USB Keyboard/Mouse function for 2 USB ports, the

5V_standby power source of your power supply must support ≥1.5A. For 3 or more

USB ports, the 5V_standby power source of your power supply must support ≥2A.

• Wake-On-LAN

This feature allows the network to remotely wake up a Soft Power Down (Soft-Off) PC. It is

supported via the onboard LAN port or via a PCIe LAN card that uses the PCIe PME (Power

Management Event) signal. However, if your system is in the Suspend mode, you can power-

on the system only through an IRQ or DMA interrupt.

Important:

The 5V_standby power source of your power supply must support ≥720mA.

8

• Power Failure Recovery

When power returns after an AC power failure, you may choose to either power-on the system

manually or let the system power-on automatically.

• USB

The system board supports the new USB 3.0. It is capable of running at a maximum transmis-

sion speed of up to 5 Gbit/s (625 MB/s) and is faster than USB 2.0 (480 Mbit/s, or 60 MB/s)

and USB 1.1 (12Mb/s). USB 3.0 reduces the time required for data transmission, reduces

power consumption, and is backward compatible with USB 2.0. It is a marked improvement in

device transfer speeds between your computer and a wide range of simultaneously accessible

external Plug and Play peripherals.

Chapter 1

Chapter 1 Introduction www.dﬁ .com

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9

Chapter 2 Hardware Installation

Chapter 2

Chapter 2 - Hardware Installation

Board Layout

System Memory

Features

Important:

Electrostatic discharge (ESD) can damage your board, processor, disk drives, add-in

boards, and other components. Perform installation procedures at an ESD workstation

only. If such a station is not available, you can provide some ESD protection by wear-

ing an antistatic wrist strap and attaching it to a metal part of the system chassis. If

a wrist strap is unavailable, establish and maintain contact with the system chassis

throughout any procedures requiring ESD protection.

Important:

When the Standby Power LED lights red, it indicates that there is power on the sys-

tem board. Power-off the PC then unplug the power cord prior to installing any de-

vices. Failure to do so will cause severe damage to the motherboard and components.

• Two 260-pin SODIMM up to 32GB

• Dual Channel DDR4 1866/2133MHz

Socket LGA1151

2

139

40

LVDS LCD Panel

Mini PCIe 2

Mini PCIe 1

LAN 1

LAN 2

DC-in

4-pin Vertical Type (optional)

4-pin

Right Angle

(optional)

DDR4_2 SODIMM

DDR4_1 SODIMM

HDMI/DP

(DP optional)

DVI-I (DVI-D signal)

USB 3-4

USB 3.0

USB 1-2

USB 3.0

S/PDIF

1

10

9

Front Audio

2

1

Buzzer

1

2

Battery

Intel

Q170

SPI Flash

BIOS

PCIe 1 (PCIe x4)

10

91

210

91

210

91

210

91

2

COM 2 COM 3 COM 4COM 1

1

SATA 0

SATA 3

9

12

10 9

12

10

USB

5-6

USB

7-8

SATA 3.0

12

1112

Front

Panel

Digital

I/O

1

USB 2.0

LCD/Inverter

Power

Standby

Power LED

1

System Fan 2

System Fan 1

1

CPU Fan

Digital

I/O Power

1

SATA

Power

51

62

65

21

333

1

2

5

6

SMBus

Factory Setting (JP1)

(Default 1-2 On) COM 1

RS232/Power

Select (JP2)

LCD/Inverter Power Select (JP7)

Backlight

Power

Select

(JP6)

Panel Power

Select (JP8)

(JP3)

(JP4)

(JP5)

(JP4)

(JP3)

Mini PCIe 2 Signal Select

Mini PCIe 1 Signal Select

Clear CMOS Data

ASMedia

ASM1442

ASMedia

ASM1442

Intel

WGI210AT

Chassis

Intrusion

ME Disable

1

DDR4_1

DDR4_2

Standby

Power LED

• SD101-Q170: 12V DC-in jack (default) or 4-pin power Right/Vertical Angle Connector

(optional).

SD103-Q170: 15~36V DC-in jack (default) or 4-pin power Right/Vertical Angle Connector

(optional).

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10

Chapter 2 Hardware Installation

Chapter 2

The system board supports the following memory interface.

Single Channel (SC)

Data will be accessed in chunks of 64 bits (8B) from the memory channels.

Dual Channel (DC)

Data will be accessed in chunks of 128 bits from the memory channels. Dual channel provides

better system performance because it doubles the data transfer rate.

Single Channel

DIMMs are on the same channel.

DIMMs in a channel can be identical or

completely different. However, we highly

recommend using identical DIMMs.

Not all slots need to be populated.

Dual Channel DIMMs of the same memory configuration

are on different channels.

Installing the SODIMM Module

1. Make sure the PC and all other peripheral devices connected to it has been powered down.

2. Disconnect all power cords and cables.

3. Locate the SODIMM socket on the system board.

4. Note the key on the socket. The key ensures the module can be plugged into the socket in

only one direction.

Note:

The system board used in the following illustrations may not resemble the actual

board. These illustrations are for reference only.

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11

Chapter 2 Hardware Installation

Chapter 2

CPU

The system board is equipped with a surface mount LGA 1151 socket. This socket is exclu-

sively designed for installing a LGA 1151 packaged Intel CPU.

Protective

cap

Important:

1. Before you proceed, make sure (1) the LGA 1151 socket comes with a protective

cap, (2) the cap is not damaged and (3) the socket’s contact pins are not bent. If

the cap is missing or the cap and/or contact pins are damaged, contact your dealer

immediately.

2. Make sure to keep the protective cap. RMA requests will be accepted and pro-

cessed only if the LGA 1151 socket comes with the protective cap.

Note:

The system board used in the following illustrations may not resemble the actual

board. These illustrations are for reference only.

6. Push down the module until the clips at each end of the socket lock into position. You will

hear a distinctive “click”, indicating the module is correctly locked into position.

5. Grasping the module by its edges, align the module into the socket at an approximately 30

degrees angle. Apply firm even pressure to each end of the module until it slips down into

the socket. The contact fingers on the edge of the module will almost completely disappear

inside the socket.

Clip

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12

Chapter 2 Hardware Installation

Chapter 2

Important:

The CPU socket must not come in contact with anything other than the CPU. Avoid

unnecessary exposure. Remove the protective cap only when you are about to install

the CPU.

Installing the CPU

1. Make sure the PC and all other peripheral devices connected to it has been powered down.

2. Disconnect all power cords and cables.

3. Locate the LGA 1151 CPU

socket on the system

board.

4. Unlock the socket by push-

ing the load lever down,

moving it sideways until it

is released from the reten-

tion tab; then lift the load

lever up.

Retention tab

Load lever

6. Remove the protective cap

from the CPU socket. The

cap is used to protect the

CPU socket against dust

and harmful particles.

Remove the protective cap

only when you are about

to install the CPU.

Load lever

Load

plate

5. Lifting the load lever will at

the same time lift the load

plate.

Lift the load lever up to

the angle shown on the

photo.

Protective cap

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13

Chapter 2 Hardware Installation

Chapter 2

Important:

The CPU will fit in only one orientation and can easily be inserted without exerting

any force.

7. Insert the CPU into the

socket. The gold triangular

mark on the CPU must

align with the corner of

the CPU socket shown on

the photo.

The CPU’s notch will at

the same time fit into the

socket’s alignment key.

Alignment key

Gold triangular mark

8. Close the load plate then

push the load lever down.

While closing the load

plate, make sure the front

edge of the load plate

slides under the retention

knob.

Retention knob

9. Hook the load lever under

the retention tab.

Load lever

Retention tab

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Chapter 2 Hardware Installation

Chapter 2

Installing the Fan and Heat Sink

The CPU must be kept cool by using a CPU fan with heat sink. Without sufficient air circula-

tion across the CPU and heat sink, the CPU will overheat damaging both the CPU and system

board.

1. Before you install the fan / heat sink, you must apply a thermal paste onto the top of the

CPU. The thermal paste is usually supplied when you purchase the fan / heat sink assem-

bly. Do not spread the paste all over the surface. When you later place the heat sink on

top of the CPU, the compound will disperse evenly.

Some heat sinks come with a patch of pre-applied thermal paste. Do not apply thermal

paste if the fan / heat sink already has a patch of thermal paste on its underside. Peel the

strip that covers the paste before you place the fan / heat sink on top of the CPU.

2. Place the heat sink on top

of the CPU. The 4 push-

pins around the heat sink,

which are used to secure

the heat sink onto the sys-

tem board, must match the

4 mounting holes around

the socket.

3. Orient the heat sink such

that the CPU fan’s cable is

nearest the CPU fan con-

nector.

Note:

A boxed Intel® processor already includes the CPU fan and heat sink assembly. If your

CPU was purchased separately, make sure to only use Intel®-certified fan and heat

sink.

CPU fan connector

Mounting hole

5. Connect the CPU fan’s

cable to the CPU fan

connector on the system

board.

CPU fan connector

4. Rotate each screw that are

diagonally across the heat

sink. Perform the same

procedure for the other

screws.

Heat sink

“Locked” position of

screw

“Unlocked” position

of screw

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15

Chapter 2 Hardware Installation

Chapter 2

Jumper Settings

Clear CMOS Data

If you encounter the following,

a) CMOS data becomes corrupted.

b) You forgot the supervisor or user password.

you can reconfigure the system with the default values stored in the ROM BIOS.

To load the default values stored in the ROM BIOS, please follow the steps below.

1. Power-off the system and unplug the power cord.

2. Set JP5 pins 2 and 3 to On. Wait for a few seconds and set JP5 back to its default setting,

pins 1 and 2 On.

3. Now plug the power cord and power-on the system.

2-3 On:

Clear CMOS Data

1-2 On:

Normal (default)

JP5

3

1

2

3

1

2

Factory Setting

JP1 is used for factory setting only.

1-2 On:

For internal use only (default)

JP1

132

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Chapter 2 Hardware Installation

Chapter 2

Panel Power Select

JP8

1-2 On: +12V

3-4 On: +5V

5-6 On: +3.3V (default)

1

6

4

2

5

3

JP8 is used to select the power supplied with the LCD panel.

Important:

Before powering-on the system, make sure that the power settings of JP8 match the

LCD panel’s specification. Selecting the incorrect voltage will seriously damage the

LCD panel.

1

5

3

1

5

3

6

4

2

6

4

2

COM 1 RS232/Power Select

2

19

DCD RD

TD DTR

JP2

COM 1

1-3 (RI), 2-4 (DCD) On:

RS232 (default) 3-5 (+5V), 4-6 (+12V) On:

RS232 with power

26

5

2

1

6

5

GND DSR

RTS CTS

RI

2

19

JP2 (for COM 1) is designed to configure the Serial COM port to pure RS232 or RS232 with

power. The pin functions of COM 1 will vary according to JP2’s setting respectively.

COM 1: RS232/422/485

1

JP2

1

26

5

2

19

+12V RD

TD DTR

GND DSR

RTS CTS

+5V

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17

Chapter 2 Hardware Installation

Chapter 2

JP6

1-2 On: +12V

(default)

2-3 On: +5V

JP7

1

3

2

LCD/Inverter Power Select

JP7 is used to select the power level of the LVDS LCD/inverter power connector.

1

3

2

Backlight Power Select

JP6 is used to select the power level of backlight brightness control: +3.3V or +5V.

1-2 On: +3.3V

(default)

2-3 On: +5V

1

3

2

1

3

2

Important:

Before powering-on the system, make sure that the power settings of JP6 match the

power specification of backlight control. Selecting the incorrect voltage will seriously

damage the backlight.

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Chapter 2 Hardware Installation

Chapter 2

Mini PCIe 1 Signal Select

JP4 is used to select the full Mini PCIe 1 signal: Mini PCIe or mSATA (default).

JP4

2-3 On: mSATA

1-2 On:

Mini PCIe (default)

Mini PCIe 2 Signal Select

JP3

JP3 is used to select the half Mini PCIe 2 signal: Mini PCIe (default) or mSATA.

3

1

2

3

1

2

2-3 On:

mSATA (default)

1-2 On: Mini PCIe

3

1

2

3

1

2

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Chapter 2 Hardware Installation

Chapter 2

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Rear Panel I/O Ports

USB 3.0

DC-in DVI-I

(DVI-D signal) LAN 1 LAN 2

The rear panel I/O ports consist of the following:

• 1 DC-in

• 1 DVI-I (DVI-D signal) port

• 1 HDMI/DP (DP available upon request) port

• 4 USB 3.0 ports

• 2 RJ45 LAN ports

12V DC-in (SD101)/15~36V DC-in (SD103)

DC-in

HDMI

This jack is considered a low power solution. Connect a DC power cord to this jack. Using a

voltage more than the recommended range may fail to boot the system or cause damage to

the system board.

The DC-in jack on the system board co-lays with a 4-pin right angle connector (optional) or

4-pin vertical type connector (optional) as the photo displayed below.

DC-in (default)

4-pin Vertical Type (optional)

4-pin Right Angle

(optional)

20

Chapter 2 Hardware Installation

Chapter 2

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Graphics Interfaces

The display ports consist of the following:

• 1 DVI-I (DVI-D signal) port

• 1 HDMI/DP (DP available upon request) port

DVI-I (DVI-D signal)

DVI-I (DVI-D signal) Port

The DVI-I port is used to connect an LCD monitor. This port supports DVI-D signal only.

Connect the display device’s cable connector to the DVI-I port. After plugging the cable con-

nector into the port, gently tighten the cable screws to hold the connector in place.

HDMI/DP (DP available upon request) Port

The HDMI port which carries both digital audio and video signals is used to connect a LCD

monitor or digital TV that has the HDMI port.

The DisplayPort (available upon request) is a digital display interface used to connect a display

device such as a computer monitor. It is used to transmit audio and video simultaneously. The

interface, which is developed by VESA, delivers higher performance features than any other

digital interface.

BIOS Setting

Configure the display devices in the Advanced menu (“Video Configuration” submenu) of the

BIOS. Refer to the chapter 3 for more information.

Driver Installation

Install the graphics driver. Refer to chapter 4 for more information.

HDMI

RJ45 LAN Ports

The two LAN ports allow the system board to connect to a local area network by means of a

network hub.

BIOS Setting

Configure the onboard LAN ports in the Advanced menu (“ACPI Configuration” submenu) of

the BIOS. Refer to the chapter 3 for more information.

Driver Installation

Install the LAN drivers. Refer to the chapter 4 for more information.

LAN 1

Features

• Intel® I210AT PCI Express Gigabit Ethernet controller

• Intel® I219LM PCIe with iAMT11.0 Gigabit Ethernet Phy

LAN 2

LAN 1

LAN 2

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DFI SD101/SD103-Q170 Owner's manual

DFI SD101/SD103-Q170 Owner's manual

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