13611-A2-GZ43-30 December 1999
MODULAR TDM, FEATURE NUMBER 3600-F3-204
MODULAR MCMP, FEATURE NUMBER 3600-F3-205
Installation Instructions
Document Number 3611-A2-GZ43-30
December 1999
OVERVIEW
The Time Division Multiplexer (TDM) option, which is provided by the modular TDM circuit card, or the
Multichannel Multipoint (MCMP) option, which is provided by the modular MCMP circuit card, must be
physically and electrically connected to a Modular 3611 Data Service Unit (DSU), requiring two adjacent slots in
the COMSPHERE 3000 Series Carrier.
This document describes the procedure for adding a modular TDM, feature number 3600-F3-204, or modular
MCMP, feature number 3600-F3-205, onto a Modular 3611 DSU and then into a COMSPHERE 3000 Series
Carrier.
Each upgrade kit consists of the following components:
• One modular circuit card (modular TDM or modular MCMP)
• One connector module (6-port)
• One double-ended pin header (the electrical interface connector between the DSU and TDM or MCMP
circuit cards)
• Four metal standoff posts
• Two plastic snaplock posts
• Eight Phillips-head screws with captive lock washers
• Eight flat washers
If any items are not present, contact your sales representative.
A connector module, which is supplied with each modular TDM or MCMP card, has six ports (labeled Port 1
through Port 6). When the connector module is installed in a COMSPHERE 3000 Series Carrier, you can remove
the modular DSU with TDM (or MCMP) option without disconnecting the DTE cables attached to the connector
module at the rear of the carrier. Each port on the connector module is a DB25 connector which provides the
EIA-232 DTE interface. In addition, a 26-pin, high-density D connector is located at the top of the connector
module and provides the V.35 interface for either Port 1 or an aggregate data path. This connector requires a
6-port V.35 interconnect cable (supplied by the customer), which converts the 26-pin, high-density D interface to
the standard V.35 34-pin interface.
Prior to starting the installation, make a copy of the Configuration Worksheets provided in the appropriate
applications guide. Access the Configuration (Confg) branch and record all the current option sets, including the
directories if a DBM is installed, for the DSU and its options.
2 December 1999 3611-A2-GZ43-30
HANDLING PRECAUTIONS
FOR
STATIC-SENSITIVE DEVICES
This product is designed to protect sensitive components from damage due to
electrostatic discharge (ESD) during normal operation. When performing
installation procedures, however, take proper static control precautions to
prevent damage to equipment. If you are not sure of the proper static control
precautions, contact your nearest sales or service representative.
HARDWARE SWITCHES
Switches on the TDM and MCMP circuit cards are for factory test purposes only, and should not be changed.
S2
S1
*
FACEPLATE
494-12966b
*
SWITCH S1 ONLY APPEARS ON THE MCMP CIRCUIT CARDS.
(MUST BE IN
THE ON POSITION)
(MUST BE IN
THE ON POSITION)
REAR
Figure 1. Modular TDM or MCMP Circuit Card Hardware Switch Locations
REMOVING THE INSTALLED MODULAR 3611 DSU
FROM THE CARRIER
To remove an installed Modular 3611 DSU, perform the following steps:
1. Use a Phillips screwdriver to loosen the screw holding the circuit pack lock on the Modular 3611 DSU,
and rotate the lock to the open position (Figure 2).
33611-A2-GZ43-30 December 1999
2. Pull out and down on the latch at the bottom of the modular DSU’s faceplate until the circuit card starts to
come out of its slot in the carrier. Pull the circuit card free of the carrier and lay it on a clean, flat work
surface.
3. At the rear of the carrier, disconnect the DTE interface cable from the rear connector plate. (It is not
necessary to power down the carrier.)
4. Remove the rear connector plate.
ADDING THE TDM OR MCMP OPTION TO THE
MODULAR 3611 DSU
To install the 6-port connector module and add the TDM or MCMP option to a Modular 3611 DSU, perform the
following steps:
1. At the rear of the carrier, set the tabs on the 6-port connector module into the slotted grooves on the
carrier’s backplane. (Note that the connector module occupies two slot positions.) Make sure the
connector module uses the same slot positions intended for the modular DSU-TDM (or modular
DSU-MCMP) circuit cards.
2. Loosely fasten the screws attached to the connector module, allowing for slight adjustment that may be
needed when installing the modular DSU-TDM (or modular DSU-MCMP) circuit cards. The two screws
on the connector module must be alternately fastened.
3. Insert the two plastic snaplock posts into their respective holes in the modular DSU circuit card. See
Figure 2.
PHILLIPS-HEAD
SCREW
CIRCUIT PACK
LOCK
EPROM
PHILLIPS-HEAD
SCREW
PHILLIPS-HEAD
SCREW
99-13859-01
Open
Closed
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NOTCH
DOUBLE-ENDED
PIN HEADER
LATCH
3611 DSU
FACEPLATE
CIRCUIT
PACK
LOCK
SNAPLOCK
POST
SNAPLOCK
POST
BLACK
BAND
STANDOFF
POSTS
TDM
FACEPLATE
FLAT
WASHERS
FLAT
WASHERS
LATCH
Figure 2. Modular TDM or MCMP Installation
4 December 1999 3611-A2-GZ43-30
4. Attach the four metal standoff posts to the DSU with the four Phillips-head screws and flat washers.
Tighten the screws until the standoff posts fit snugly against the circuit card. Do not overtighten.
5. Install the black-banded end of the double-ended pin header into its mating connector on the DSU. Make
sure that the double-ended pin header is full seated.
6. On a flat work surface, orient the DSU to its upright position, with the faceplate over the edge of the table
(so the latches hang over) and pointing toward you (just as it would sit in the carrier). Orient the modular
TDM (or modular MCMP) circuit card in the same manner, to the immediate right of the modular DSU
circuit card.
Keeping the modular circuit cards (that is, the modular TDM and modular DSU, or the modular MCMP
and modular DSU) perpendicular to the work surface, move the modular circuit cards closer to one
another, ensuring that their bottom edges are flat against the work surface. Look between the circuit cards
to guide the double-ended pin header into its mating connector on the modular TDM (or modular MCMP)
and at the same time, ensure that the snaplock posts are aligned with their mating holes in the modular
TDM (or modular MCMP). Make sure that the double-ended pin header is properly aligned. Then, snap
the snaplock posts into the modular TDM (or modular MCMP).
7. Use the remaining four Phillips-head screws and flat washers to secure the standoff posts to the modular
TDM (or modular MCMP).
8. At the front of the carrier, make sure that both the top and bottom edges of the modular DSU and modular
TDM (or modular DSU and modular MCMP) circuit cards are correctly aligned in their respective circuit
card guides. Then, slide the modular DSU-TDM unit into the carrier and press the faceplate latches on
both the modular DSU-TDM (or modular DSU-MCMP) circuit cards to secure the circuit cards to the
connector module.
9. Rotate the circuit pack lock on the modular DSU circuit card faceplate back into the closed position and
tighten the screw (Figure 2).
10. Return to the rear of the carrier and tighten the screws on the connector module.
11. Connect the DTE interface cables (Figure 3). Install ferrite chokes, if provided, as close to the cable
connector as possible.
When power is applied to the modular circuit cards, the modular DSU performs a self-test routine. The
modular DSU determines what options (DBM, MUX–TDM or MCMP) are installed. It then initiates a
Device Test on itself and each of the available options. During the tests, all indicators on the modular
DSU’s faceplate light briefly.
53611-A2-GZ43-30 December 1999
494-14112-02
60-PIN
HIGH-DENSITY
CONNECTOR
TDM/MCMP
CIRCUIT
CARD
60-PIN
HIGH-DENSITY
INTERFACE
DTE
CONNECTOR
6-PORT V.35
INTERCONNECT
CABLE
FERRITE
CHOKE
DTE
CONNECTOR
6-PORT
CONNECTOR
MODULE
25-PIN V.35
INTERFACE
TDM OR DIGITAL
BRIDGE INTERFACE
CABLE
CABLE
TIE
FERRITE
CHOKES
34-PIN V.35
INTERFACE
25-PIN
EIA-232/V.24
INTERFACE
Figure 3. COMSPHERE 3000 Series Carrier (Rear)
If the Shared Diagnostic Control Panel (SDCP) is installed and if the modular DSU’s carrier and slot is
the one selected at the SDCP, the LCD displays the message Power-up Tests. Upon completion of the
tests, the LCD momentarily displays messages indicating that each device (DSU, MUX, and DBM, if
installed) has passed the power-up test.
Reinstall the factory configuration options (use the FacC configuration for a control or FacT for a
tributary).
12. Perform a DSU Device Test from the SDCP to ensure that the modular DSU-TDM combination is
functioning properly. If the test fails, call your service representative for assistance. If the test passes,
continue with this procedure.
13. Make any desired configuration option changes in the DSU, Diag, DBM, Gen, Bckup, MUX, and
LPDA-2 option sets. For information on these option sets, see the COMSPHERE 3600 Series Data
Service Units, Models 3610 and 3611, Time Division Multiplexer, Multichannel Multipoint, and Digital
Bridge Options, Applications Guide, Document Number 3610-A2-GB41.
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