Asus MAXIMUS_III_EXTREME Owner's manual

Motherboard

Maximus III

Extreme

ii

E5279

First Edition

January 2010

No part of this manual, including the products and software described in it, may be reproduced,

transmitted, transcribed, stored in a retrieval system, or translated into any language in any form or by any

means, except documentation kept by the purchaser for backup purposes, without the express written

permission of ASUSTeK COMPUTER INC. (“ASUS”).

Product warranty or service will not be extended if: (1) the product is repaired, modified or altered, unless

such repair, modification of alteration is authorized in writing by ASUS; or (2) the serial number of the

product is defaced or missing.

ASUS PROVIDES THIS MANUAL “AS IS” WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS

OR IMPLIED, INCLUDING BUT NOT LIMITED TO THE IMPLIED WARRANTIES OR CONDITIONS OF

MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT SHALL ASUS, ITS

DIRECTORS, OFFICERS, EMPLOYEES OR AGENTS BE LIABLE FOR ANY INDIRECT, SPECIAL,

INCIDENTAL, OR CONSEQUENTIAL DAMAGES (INCLUDING DAMAGES FOR LOSS OF PROFITS,

LOSS OF BUSINESS, LOSS OF USE OR DATA, INTERRUPTION OF BUSINESS AND THE LIKE),

EVEN IF ASUS HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES ARISING FROM ANY

DEFECT OR ERROR IN THIS MANUAL OR PRODUCT.

SPECIFICATIONS AND INFORMATION CONTAINED IN THIS MANUAL ARE FURNISHED FOR

INFORMATIONAL USE ONLY, AND ARE SUBJECT TO CHANGE AT ANY TIME WITHOUT NOTICE,

AND SHOULD NOT BE CONSTRUED AS A COMMITMENT BY ASUS. ASUS ASSUMES NO

RESPONSIBILITY OR LIABILITY FOR ANY ERRORS OR INACCURACIES THAT MAY APPEAR IN THIS

MANUAL, INCLUDING THE PRODUCTS AND SOFTWARE DESCRIBED IN IT.

Products and corporate names appearing in this manual may or may not be registered trademarks or

copyrights of their respective companies, and are used only for identification or explanation and to the

owners’ benefit, without intent to infringe.

iii

Contents

Notices ....................................................................................................... viii

Safety information ..................................................................................... xii

About this guide ....................................................................................... xiv

Maximus III Extreme specications summary ....................................... xvi

Chapter 1: Product introduction

1.1 Welcome! ...................................................................................... 1-1

1.2 Package contents ......................................................................... 1-1

1.3 Special features ............................................................................ 1-2

1.3.1 Product highlights ........................................................... 1-2

1.3.2 ROG Intelligent Performance & Overclocking features ... 1-3

1.3.3 ROG unique features ...................................................... 1-6

1.3.4 ASUS special features .................................................... 1-6

Chapter 2: Hardware information

2.1 Before you proceed ..................................................................... 2-1

2.2 Motherboard overview ................................................................. 2-6

2.2.1 Motherboard layout ......................................................... 2-6

2.2.2 Layout contents ............................................................... 2-7

2.2.3 Placement direction ........................................................ 2-8

2.2.4 Screw holes .................................................................... 2-8

2.3 Central Processing Unit (CPU) ................................................... 2-9

2.3.1 Installing the CPU ........................................................... 2-9

2.3.2 Installing the CPU heatsink and fan .............................. 2-12

2.3.3 Uninstalling the CPU heatsink and fan ......................... 2-13

2.4 System memory ......................................................................... 2-14

2.4.1 Overview ....................................................................... 2-14

2.4.2 Memory configurations .................................................. 2-15

2.4.3 Installing a DIMM .......................................................... 2-22

2.4.4 Removing a DIMM ........................................................ 2-22

2.5 Expansion slots .......................................................................... 2-23

2.5.1 Installing an expansion card ......................................... 2-23

2.5.2 Configuring an expansion card ..................................... 2-23

2.5.3 Interrupt assignments ................................................... 2-24

2.5.4 PCI slot ......................................................................... 2-25

2.5.5 PCI Express x16 slots ................................................... 2-25

2.6 Jumper ........................................................................................ 2-27

iv

Contents

2.7 RC Bluetooth card ...................................................................... 2-29

2.8 I/O shield Installation ................................................................. 2-30

2.9 Connectors ................................................................................. 2-31

2.9.1 Rear panel connectors .................................................. 2-31

2.9.2 ROG Connect switch and RC Bluetooth switch ............ 2-32

2.9.3 Audio I/O connections ................................................... 2-34

2.9.4 Internal connectors ....................................................... 2-37

2.9.5 Onboard switches ......................................................... 2-47

2.9.6 ProbeIt .......................................................................... 2-50

2.10 Starting up for the rst time ...................................................... 2-51

2.11 Turning off the computer ........................................................... 2-52

2.11.1 Using the OS shut down function .................................. 2-52

2.11.2 Using the dual function power switch ............................ 2-52

Chapter 3: BIOS setup

3.1 Managing and updating your BIOS ............................................ 3-1

3.1.1 ASUS Update utility ........................................................ 3-1

3.1.2 ASUS EZ Flash 2 utility ................................................... 3-4

3.1.3 ASUS CrashFree BIOS 3 utility ...................................... 3-5

3.2 BIOS setup program .................................................................... 3-6

3.2.1 BIOS menu screen .......................................................... 3-7

3.2.2 Menu bar ......................................................................... 3-7

3.2.3 Navigation keys ............................................................... 3-7

3.2.4 Menu items ..................................................................... 3-8

3.2.5 Submenu items ............................................................... 3-8

3.2.6 Configuration fields ......................................................... 3-8

3.2.7 Pop-up window ............................................................... 3-8

3.2.8 Scroll bar ......................................................................... 3-8

3.2.9 General help ................................................................... 3-8

3.3 Extreme Tweaker menu ............................................................... 3-9

3.3.1 CPU Level Up [Auto] ..................................................... 3-10

3.3.2 Memory Level Up [Auto] ............................................... 3-10

3.3.3 Ai Overclock Tuner [Auto] ............................................. 3-10

3.3.4 eXtreme Memory Profile [Disabled] .............................. 3-10

3.3.5 OC From CPU/Memory Level Up [Auto] ....................... 3-10

3.3.6 CPU Ratio Setting [Auto] ...............................................3-11

3.3.7 Intel(R) SpeedStep(TM) Tech [Enabled] ........................3-11

v

Contents

3.3.8 BCLK Frequency [XXX] .................................................3-11

3.3.9 DRAM Frequency [Auto] ................................................3-11

3.3.10 QPI Frequency [Auto] ....................................................3-11

3.3.11 Start auto tuning .............................................................3-11

3.3.12 OC Tuner [Good Performance] ......................................3-11

3.3.13 DRAM Timing Control ................................................... 3-12

3.3.14 CPU Clock Amplitude [Auto] ......................................... 3-13

3.3.15 PCH Clock Amplitude [Auto] ......................................... 3-13

3.3.16 CPU Clock Skew [Auto] ................................................ 3-13

3.3.17 PCH Clock Skew [Auto] ................................................ 3-13

3.3.18 Extreme OV [Disabled] ................................................. 3-13

3.3.19 CPU Vltage OCP [Enabled] .......................................... 3-14

3.3.20 PWM VGD [Auto] .......................................................... 3-14

3.3.22 CPU Load-Line Calibration [Auto] ................................. 3-14

3.3.23 CPU Voltage Mode [VID] ............................................. 3-14

3.3.24 CPU Voltage [Auto] ...................................................... 3-14

3.3.25 CPU PLL Voltage [Auto] ................................................ 3-14

3.3.26 IMC Voltage [Auto] ....................................................... 3-14

3.3.27 PCH Voltage [Auto] ....................................................... 3-14

3.3.28 DRAM Voltage [Auto] .................................................... 3-15

3.3.29 DRAM DATA REF Voltage on CHA/B [Auto] ................. 3-15

3.3.30 DRAM CTRL REF Voltage on CHA/B [Auto] ................. 3-15

3.3.31 CPU Spread Spectrum [Auto] ....................................... 3-15

3.3.32 PCIE Spread Spectrum [Auto] ...................................... 3-15

3.3.33 ASUS O.C. Profile ......................................................... 3-15

3.4 Main menu .................................................................................. 3-16

3.4.1 System Time [xx:xx:xx] ................................................. 3-16

3.4.2 System Date [Day xx/xx/xxxx] ....................................... 3-16

3.4.3 Language [English] ....................................................... 3-16

3.4.4 SATA 1–6 .........................................................................................3-17

3.4.5 Storage Configuration ................................................... 3-19

3.4.6 AHCI Configuration ....................................................... 3-20

3.4.7 System Information ....................................................... 3-20

3.5 Advanced menu ......................................................................... 3-21

3.5.1 CPU Configuration ........................................................ 3-21

3.5.2 Chipset .......................................................................... 3-24

vi

Contents

3.5.3 Onboard Device Configuration ...................................... 3-25

3.5.4 USB Configuration ........................................................ 3-27

3.5.5 LED Control .................................................................. 3-28

3.5.6 iROG Configuration ....................................................... 3-29

3.5.7 ROG Connect ............................................................... 3-29

3.6 Power menu ................................................................................ 3-30

3.6.1 Suspend Mode [Auto] ................................................... 3-30

3.6.2 Repost Video on S3 Resume [No] ................................ 3-30

3.6.3 ACPI 2.0 Support [Disabled] ......................................... 3-30

3.6.4 ACPI APIC Support [Enabled] ....................................... 3-31

3.6.5 EuP Ready [Disabled] ................................................... 3-31

3.6.6 APM Configuration ........................................................ 3-31

3.6.7 Hardware Monitor ......................................................... 3-33

3.7 Boot menu .................................................................................. 3-36

3.7.1 Boot Device Priority ...................................................... 3-36

3.7.2 Boot Settings Configuration .......................................... 3-37

3.7.3 Security ......................................................................... 3-38

3.8 Tools menu ................................................................................. 3-40

3.8.1 ASUS O.C. Profile ......................................................... 3-40

3.6.2 GO_Button File ............................................................. 3-42

3.6.3 AI NET 2........................................................................ 3-42

3.6.4 ASUS EZ Flash 2 .......................................................... 3-43

3.9 Exit menu .................................................................................... 3-44

Chapter 4: Software support

4.1 Installing an operating system ................................................... 4-1

4.2 Support DVD information ............................................................ 4-1

4.2.1 Running the support DVD ............................................... 4-1

4.2.2 Drivers menu ................................................................... 4-2

4.2.3 Utilities menu .................................................................. 4-3

4.2.4 Make disk menu .............................................................. 4-4

4.2.5 Manual menu .................................................................. 4-4

4.2.6 Video menu ..................................................................... 4-5

4.2.7 ASUS Contact information .............................................. 4-5

4.2.8 Other information ............................................................ 4-6

4.2.2 Obtaining the software manuals ..................................... 4-8

4.3 Software information ................................................................... 4-9

vii

4.3.1 VIA

®

High Definition Audio utility ..................................... 4-9

4.3.2 ASUS PC Probe II ..........................................................4-11

4.3.3 ASUS AI Suite ............................................................... 4-17

4.3.4 ASUS Fan Xpert ........................................................... 4-19

4.3.5 CPU Level Up ............................................................... 4-20

4.3.6 TurboV EVO .................................................................. 4-21

4.3.7 ROG Connect ............................................................... 4-22

4.4 RAID congurations .................................................................. 4-24

4.4.1 RAID definitions ............................................................ 4-24

4.4.2 Installing Serial ATA hard disks ..................................... 4-25

4.4.3 Setting the RAID item in BIOS ...................................... 4-25

4.4.4 Intel

®

Matrix Storage Manager option ROM utility ......... 4-25

4.5 Creating a RAID driver disk ....................................................... 4-29

4.5.1 Creating a RAID driver disk without entering the OS .... 4-29

4.5.2 Creating a RAID driver disk in Windows

®

...................... 4-29

4.5.3 Installing the RAID driver

during Windows

®

OS installation ................................... 4-30

4.5.4 Using a USB floppy disk drive ....................................... 4-30

Chapter 5: ATI

®

CrossFireX™ technology support

5.1 ATI

®

CrossFireX™ technology .................................................... 5-1

5.1.1 Requirements .................................................................. 5-1

5.1.2 Before you begin ............................................................. 5-1

5.1.3 Installing CrossFireX graphics cards .............................. 5-2

5.1.4 Installing the device drivers ............................................. 5-3

5.1.5 Enabling the ATI

®

CrossFireX™ technology ................... 5-3

5.2 NVIDIA

®

SLI™ technology ........................................................... 5-5

5.2.1 Requirements .................................................................. 5-5

5.2.2 Installing two SLI-ready graphics cards .......................... 5-5

5.2.3 Installing the device drivers ............................................. 5-6

5.2.4 Enabling the NVIDIA

®

SLI™ technology ......................... 5-6

Appendix: Reference information

A.1 Debug code table .........................................................................A-1

A.2 Qualied Vendors Lists (QVL) for BIOS FlashBack ..................A-4

A.3 Qualied Vendors Lists (QVL) for RC Bluetooth .......................A-4

A.4 Qualied Vendors Lists (QVL) for

500W Power Supply or above ....................................................A-5

Contents

viii

Notices

Federal Communications Commission Statement

This device complies with Part 15 of the FCC Rules. Operation is subject to the

following two conditions:

• This device may not cause harmful interference, and

• This device must accept any interference received including interference that

may cause undesired operation.

This equipment has been tested and found to comply with the limits for a

Class B digital device, pursuant to Part 15 of the FCC Rules. These limits are

designed to provide reasonable protection against harmful interference in a

residential installation. This equipment generates, uses and can radiate radio

frequency energy and, if not installed and used in accordance with manufacturer’s

instructions, may cause harmful interference to radio communications. However,

there is no guarantee that interference will not occur in a particular installation. If

this equipment does cause harmful interference to radio or television reception,

which can be determined by turning the equipment off and on, the user is

encouraged to try to correct the interference by one or more of the following

measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment to an outlet on a circuit different from that to which the

receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help.

The use of shielded cables for connection of the monitor to the graphics card is

required to assure compliance with FCC regulations. Changes or modifications

to this unit not expressly approved by the party responsible for compliance

could void the user’s authority to operate this equipment.

FCC Radio Frequency (RF) Exposure Caution Statement

Any changes or modifications not expressly approved by the party responsible

for compliance could void the user’s authority to operate this equipment. “The

manufacture declares that this device is limited to Channels 1 through 11 in the

2.4GHz frequency by specified firmware controlled in the USA.”

This equipment complies with FCC radiation exposure limits set forth for an

uncontrolled environment. To maintain compliance with FCC RF exposure

compliance requirements, please avoid direct contact to the transmitting antenna

during transmitting. End users must follow the specific operating instructions for

satisfying RF exposure compliance.

ix

RF exposure warning

This equipment must be installed and operated in accordance with provided

instructions and the antenna(s) used for this transmitter must be installed to

provide a separation distance of at least 20 cm from all persons and must not

be co-located or operating in conjunction with any other antenna or transmitter.

End-users and installers must be provide with antenna installation instructions and

transmitter operating conditions for satisfying RF exposure compliance.

Declaration of Conformity (R&TTE directive 1999/5/EC)

The following items were completed and are considered relevant and sufficient:

• Essential requirements as in [Article 3]

• Protection requirements for health and safety as in [Article 3.1a]

• Testing for electric safety according to [EN 60950]

• Protection requirements for electromagnetic compatibility in [Article 3.1b]

• Testing for electromagnetic compatibility in [EN 301 489-1] & [EN 301 489-17]

• Effective use of the radio spectrum as in [Article 3.2]

• Radio test suites according to [EN 300 328-2]

CE Marking

CE marking for devices without wireless LAN/Bluetooth

The shipped version of this device complies with the requirements of the EEC

directives 2004/108/EC “Electromagnetic compatibility” and 2006/95/EC “Low

voltage directive”.

CE marking for devices with wireless LAN/ Bluetooth

This equipment complies with the requirements of Directive 1999/5/EC of the

European Parliament and Commission from 9 March, 1999 governing Radio and

Telecommunications Equipment and mutual recognition of conformity.

x

Wireless Operation Channel for Different Domains

N. America 2.412-2.462 GHz Ch01 through CH11

Japan 2.412-2.484 GHz Ch01 through Ch14

Europe ETSI 2.412-2.472 GHz Ch01 through Ch13

France Restricted Wireless Frequency Bands

Some areas of France have a restricted frequency band. The worst case maximum

authorized power indoors are:

• 10mW for the entire 2.4 GHz band (2400 MHz–2483.5 MHz)

• 100mW for frequencies between 2446.5 MHz and 2483.5 MHz

Channels 10 through 13 inclusive operate in the band 2446.6 MHz to 2483.5

MHz.

There are few possibilities for outdoor use: On private property or on the private

property of public persons, use is subject to a preliminary authorization procedure

by the Ministry of Defense, with maximum authorized power of 100mW in the

2446.5–2483.5 MHz band. Use outdoors on public property is not permitted.

In the departments listed below, for the entire 2.4 GHz band:

• Maximum authorized power indoors is 100mW

• Maximum authorized power outdoors is 10mW

Departments in which the use of the 2400–2483.5 MHz band is permitted with an

EIRP of less than 100mW indoors and less than 10mW outdoors:

01 Ain 02 Aisne 03 Allier 05 Hautes Alpes

08 Ardennes 09 Ariège 11 Aude 12 Aveyron

16 Charente 24 Dordogne 25 Doubs 26 Drôme

32 Gers 36 Indre 37 Indre et Loire 41 Loir et Cher

45 Loiret 50 Manche 55 Meuse 58 Nièvre

59 Nord 60 Oise 61 Orne 63 Puy du Dôme

64 Pyrénées Atlantique 66 Pyrénées Orientales

67 Bas Rhin 68 Haut Rhin 70 Haute Saône 71 Saône et Loire

75 Paris 82 Tarn et Garonne 84 Vaucluse

88 Vosges 89 Yonne 90 Territoire de Belfort

94 Val de Marne

This requirement is likely to change over time, allowing you to use your wireless

LAN card in more areas within France. Please check with ART for the latest

information (www.art-telecom.fr)

Your WLAN Card transmits less than 100mW, but more than 10mW.

xi

Canadian Department of Communications Statement

This digital apparatus does not exceed the Class B limits for radio noise emissions

from digital apparatus set out in the Radio Interference Regulations of the

Canadian Department of Communications.

This class B digital apparatus complies with Canadian ICES-003.

Cet appareil numérique de la classe [B] est conforme à la norme NMB-003 du

Canada.

IC Radiation Exposure Statement for Canada

This equipment complies with IC radiation exposure limits set forth for an

uncontrolled environment. To maintain compliance with IC RF exposure

compliance requirements, please avoid direct contact to the transmitting antenna

during transmitting. End users must follow the specific operating instructions for

satisfying RF exposure compliance.

Operation is subject to the following two conditions:

• This device may not cause interference and

• This device must accept any interference, including interference that may

cause undesired operation of the device.

To prevent radio interference to the licensed service (i.e. co-channel Mobile

Satellite systems) this device is intended to be operated indoors and away from

windows to provide maximum shielding. Equipment (or its transmit antenna) that is

installed outdoors is subject to licensing.

The user is cautioned that this device should be used only as specified within

this manual to meet RF exposure requirements. Use of this device in a manner

inconsistent with this manual could lead to excessive RF exposure conditions.

This device and its antenna(s) must not be co-located or operating in conjunction

with any other antenna or transmitter.

Country Code selection feature to be disabled for products marketed to the US/

CANADA.

xii

Safety information

Electrical safety

• To prevent electrical shock hazard, disconnect the power cable from the

electrical outlet before relocating the system.

• When adding or removing devices to or from the system, ensure that the power

cables for the devices are unplugged before the signal cables are connected. If

possible, disconnect all power cables from the existing system before you add

a device.

• Before connecting or removing signal cables from the motherboard, ensure

that all power cables are unplugged.

• Seek professional assistance before using an adapter or extension cord.

These devices could interrupt the grounding circuit.

• Ensure that your power supply is set to the correct voltage in your area. If you

are not sure about the voltage of the electrical outlet you are using, contact

your local power company.

• If the power supply is broken, do not try to fix it by yourself. Contact a qualified

service technician or your retailer.

• The optical S/PDIF is an optional component (may or may not be included in

your motherboard) and is defined as a CLASS 1 LASER PRODUCT.

INVISIBLE LASER RADIATION, AVOID EXPOSURE TO BEAM.

• Never dispose of the battery in fire. It could explode and release harmful

substances into the environment.

• Never dispose of the battery with your regular household waste. Take it to a

hazardous material collection point.

• Never replace the battery with an incorrect battery type.

• RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT

TYPE.

• DISPOSE OF USED BATTERIES ACCORDING TO THE ABOVE

BATTERY-RELATED INSTRUCTIONS.

xiii

Operation safety

• Before installing the motherboard and adding devices on it, carefully read all

the manuals that came with the package.

• Before using the product, ensure all cables are correctly connected and the

power cables are not damaged. If you detect any damage, contact your dealer

immediately.

• To avoid short circuits, keep paper clips, screws, and staples away from

connectors, slots, sockets and circuitry.

• Avoid dust, humidity, and temperature extremes. Do not place the product in

any area where it may become wet.

This motherboard should only be used in environments with ambient

temperatures between 5ºC (41ºF) and 40ºC (104ºF).

• Place the product on a stable surface.

• If you encounter technical problems with the product, contact a qualified

service technician or your retailer.

DO NOT throw the motherboard in municipal waste. This product has been

designed to enable proper reuse of parts and recycling. This symbol of the

crossed out wheeled bin indicates that the product (electrical and electronic

equipment) should not be placed in municipal waste. Check local regulations for

disposal of electronic products.

DO NOT throw the mercury-containing button cell battery in municipal waste.

This symbol of the crossed out wheeled bin indicates that the battery should not

be placed in municipal waste.

xiv

Where to nd more information

Refer to the following sources for additional information and for product and

software updates.

1. ASUS websites

The ASUS website provides updated information on ASUS hardware and

software products. Refer to the ASUS contact information.

2. Optional documentation

Your product package may include optional documentation, such as warranty

flyers, that may have been added by your dealer. These documents are not

part of the standard package.

About this guide

This user guide contains the information you need when installing and configuring

the motherboard.

How this guide is organized

This guide contains the following parts:

• Chapter 1: Product introduction

This chapter describes the features of the motherboard and the new

technology it supports.

• Chapter 2: Hardware information

This chapter lists the hardware setup procedures that you have to perform

when installing system components. It includes description of the switches,

jumpers, and connectors on the motherboard.

• Chapter 3: BIOS setup

This chapter tells how to change system settings through the BIOS Setup

menus. Detailed descriptions of the BIOS parameters are also provided.

• Chapter 4: Software support

This chapter describes the contents of the support DVD that comes with the

motherboard package and the software.

• Chapter 5: Multiple GPU technology support

This chapter describes how to install and configure multiple ATI

®

CrossFireX™ and NVIDIA

®

SLI™ graphics cards.

• Appendix: Reference information

This appendix includes additional information that you may refer to when

configuring the motherboard.

xv

DANGER/WARNING: Information to prevent injury to yourself

when trying to complete a task.

CAUTION: Information to prevent damage to the components

when trying to complete a task.

NOTE: Tips and additional information to help you complete a

task.

IMPORTANT: Instructions that you MUST follow to complete a

task.

Conventions used in this guide

To ensure that you perform certain tasks properly, take note of the following

symbols used throughout this manual.

Typography

Bold text Indicates a menu or an item to select.

Italics

Used to emphasize a word or a phrase.

<Key> Keys enclosed in the less-than and greater-than sign

means that you must press the enclosed key.

Example: <Enter> means that you must press the

Enter or Return key.

<Key1+Key2+Key3> If you must press two or more keys simultaneously, the

key names are linked with a plus sign (+).

Example: <Ctrl+Alt+D>

Command Means that you must type the command exactly as

shown, then supply the required item or value enclosed

in brackets.

Example: At the DOS prompt, type the command line:

afudos /iM3E.ROM

xvi

Maximus III Extreme specications summary

CPU Supports the Intel

®

Core™i7, Intel

®

Core™i5 and

Intel

®

Core™i3 Processor in the LGA1156 package

Supports Intel

®

Turbo Boost Technology

* Refer to www.asus.com for Intel CPU support list

Chipset Intel

®

P55 Express Chipset

Memory Dual channel memory architecture

4 x DIMM, max. 16GB, DDR3 2200(O.C.) /2133(O.C.)

/2000(O.C.) /1800(O.C.) /1600/1333/1066 MHz, non-/2000(O.C.) /1800(O.C.) /1600/1333/1066 MHz, non-

ECC, un-buffered memory modulesECC, un-buffered memory modules

* Hyper DIMM support is subject to the physical

characteristics of individual CPUs.characteristics of individual CPUs.

* Supports Intel

®

Extreme Memory Profile (XMP)

* Please refer to www.asus.com or user manual for the

Memory QVL(Qualified Vendors List).Memory QVL(Qualified Vendors List).

Expansion Slots 5 x PCIe x16 slots

- Supports single at x16; dual at x16; triple at x 16- Supports single at x16; dual at x16; triple at x 16 Supports single at x16; dual at x16; triple at x 16Supports single at x16; dual at x16; triple at x 16

x16 and x8; quad at x8, or 5 at x8x16 and x8; quad at x8, or 5 at x8

1 x PCI 2.2

Multi-GPU Technology Supports NVIDIA

®

SLI™ Technology / ATI

®

CrossFireX™

TechnologyTechnology

Storage Intel

®

P55 Express Chipset built-in:

- 6 x SATA 3.0 Gb/s ports- 6 x SATA 3.0 Gb/s ports 6 x SATA 3.0 Gb/s ports

- Intel Matrix Storage Technology supports RAID 0, 1,- Intel Matrix Storage Technology supports RAID 0, 1, Intel Matrix Storage Technology supports RAID 0, 1,

5 and 10

JMicron

®

363 controllers:

- 1 x SATA 3.0 Gb/s port (Red)- 1 x SATA 3.0 Gb/s port (Red) 1 x SATA 3.0 Gb/s port (Red)

- 1 x External SATA 3.0 Gb/s port (SATA On-the-Go)- 1 x External SATA 3.0 Gb/s port (SATA On-the-Go) 1 x External SATA 3.0 Gb/s port (SATA On-the-Go)

Marvell

®

PCIe SATA 6Gb/s controller

- 2 x SATA 6.0 Gb/s ports- 2 x SATA 6.0 Gb/s ports 2 x SATA 6.0 Gb/s ports

LAN Realtek

®

RTL8112L Gigabit LAN controller

High Denition Audio VIA

®

VT2020 10-channel High Definition Audio CODEC

- Supports Blu-ray audio layer content protection- Supports Blu-ray audio layer content protection Supports Blu-ray audio layer content protection

- Supports 1 Optical S/PDIF out port at back I/O- Supports 1 Optical S/PDIF out port at back I/O Supports 1 Optical S/PDIF out port at back I/O

- Supports 1 x S/PDIF out header- Supports 1 x S/PDIF out header Supports 1 x S/PDIF out header

- Supports Jack-Detection, Multi-streaming, Front- Supports Jack-Detection, Multi-streaming, Front Supports Jack-Detection, Multi-streaming, Front

Panel Jack-Retasking

IEEE 1394a 2 x 1394a ports (1 port onboard, 1 port at back I/O)

(continued on the next page)

xvii

USB NEC

®

USB 3.0 controller

- 2 x USB 3.0/2.0 ports (at back I/O)

Intel

®

P55 Express Chipset

- 11 USB 2.0 ports (4 ports at mid-board, 7 ports at

back I/O)

Bluetooth Module

Accessory Card

Bluetooth V2.0/V2.1+EDR

RC Bluetooth On/Off Switch

ROG Exclusive

Overclocking Features

ROG Connect

RC Bluetooth

Extreme Engine Power Design with digital VRM

- 8-phase CPU digital VRM power8-phase CPU digital VRM power

- 3-phase VTT digital VRM power3-phase VTT digital VRM power

- 3-phase Memory power3-phase Memory power

- ML Cap on CPUML Cap on CPU

ProbeIt

iROG

Extreme Tweaker

BIOS Flashback

Loadline Calibration

Intelligent overclocking tools:

- ASUS AI Booster UtilityASUS AI Booster Utility

- O.C. ProfileO.C. Profile

Overclocking Protection:

- COP EX (Component Overheat Protection - EX)COP EX (Component Overheat Protection - EX)

- Voltiminder LEDVoltiminder LED

- ASUS C.P.R.(CPU Parameter Recall)ASUS C.P.R.(CPU Parameter Recall)

Other Special Features CPU Level Up

MemOK!

Onboard Button: Power / Reset / Clr CMOS (at back IO)

ASUS MyLogo3

ASUS Fan Xpert

ASUS EZ Flash 2

ASUS CrashFree BIOS 3

ASUS Q-Connector

ASUS Q-LED (CPU, DRAM, VGA, Boot Device LED)

ASUS Q-Slot

ASUS Q-DIMM

BIOS Features 16Mb AMI BIOS, PnP, DMI2.0, WfM2.0, SM BIOS 2.5,

ACPI2.0a Multi-Language BIOS

Manageability WOL by PME, WOR by PME, PXE

(continued on the next page)

Maximus III Extreme specications summary

xviii

Back Panel I/O Ports 1 x PS/2 Keyboard port (purple)

2 x USB 3.0/2.0 ports

7 x USB 2.0 ports (1 port also for ROG Connect)

1 x External SATA port

1 x LAN (RJ45) port

1 x Clr CMOS switch

1 x ROG Connect On/Off switch

1 x S/PDIF Out (Optical)

1 x IEEE1394a port

10-channel Audio I/O

Internal I/O Connectors 2 x USB 2.0 connectors support additional 4 USB 2.0

portsports

9 x SATA connectors: 2 x SATA 6.0Gb/s connectors

(Red) / 6 x standard SATA connectors (Black) / 1 x

SATA_E(Red)

8 x Fan connectors: 1 x CPU / 1 x PWR / 3 x Chassis / 3

x Optional

5 x ProbeIt Measurement Points

3 x Thermal Sensor Connectors

1 x IEEE1394a Connector

1 x SPDIF_Out Connector

1 x 24-pin ATX Power Connector

1 x 8-pin ATX 12V Power Connector

1 x En/Dis-able Clr CMOS Switch

1 x LN2 Mode Header

1 x Power on Switch

1 x Reset Switch

2 x EZ Plug Connectors

1 x OC Station Header

1 x RC Bluetooth Header

1 x Go Button

1 x BIOS Button

1 x System Panel Connector

Software Support DVD:

- Drivers and Applications

Futuremark

®

3DMark

®

Vantage Advanced Edition

Kaspersky

®

Anti-Virus

ASUS TurboV EVO Utility

ASUS PC Probe II

ASUS Update

ASUS AI Suite

Form Factor ATX Form Factor, 12”x 9.6” (30.5cm x 24.4cm)

*Specications are subject to change without notice.

Maximus III Extreme specications summary

1

Chapter 1: Product

introduction

This chapter describes the motherboard

features and the new technologies

it supports.

ROG Maximus III Extreme

Chapter summary

1

1.1 Welcome! ...................................................................................... 1-1

1.2 Package contents ......................................................................... 1-1

1.3 Special features ............................................................................ 1-2

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Asus MAXIMUS_III_EXTREME Owner's manual

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