Supermicro X11SPD-F User manual

USER’S MANUAL

Revision 1.0

X11SPD-F

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The vendor assumes

no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update

or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual

at any time and without notice. This product, including software and documentation, is the property of Supermicro and/

or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except

as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,

SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT

OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER

MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED

OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,

INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the

State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution

of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class B digital device

pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can

radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,

may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely

to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only

to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.

See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,

nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products

for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully

indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and

proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision Draft 2

Release Date: April 29, 2019

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Printed in the United States of America

3

Preface

About This Manual

This manual is written for system integrators, IT technicians, and knowledgeable end users.

It provides information for the installation and use of the X11SPD-F motherboard.

About This Motherboard

The Super X11SPD-F motherboard supports an Intel® Xeon E-2100 series, 8th Generation

Core i3, Pentium, and Celeron processor in an LGA3647 socket. The X11SPD-F provides

maximum performance and is designed for 3U 8-node Micro Cloud servers with up to 2NVMe/

SAS3/SATA3 per node. Built with the Intel PCH C621 (products formerly Coee Lake), this

motherboard supports 4-DIMM DDR4 ECC 3DS LRDIMM with speeds of up to 2933MHz

and a capacity of up to 532GB. It features a PCI-e 3.0 x 8 (MicroLP), one PCI-e 3.0 x 16,

and a two M.2 2280 NVMe/SATA connectors onboard. The X11SPD-F is optimized for high-

performance computing, supporting many onboard features that address the needs of next

generation server applications. Please note that this motherboard is intended to be installed

and serviced by professional technicians only. For processor/memory updates, please refer

to our website at http://www.supermicro.com/products/.

Manual Organization

Chapter 1 describes the features, specications and performance of the motherboard, and

provides detailed information on the C621 chipset.

Chapter 2 provides hardware installation instructions. Read this chapter when installing the

processor, memory modules, and other hardware components into the system.

If you encounter any problems, see Chapter 3, which describes troubleshooting procedures

for video, memory, and system setup stored in the CMOS.

Chapter 4 includes an introduction to the BIOS, and provides detailed information on running

the CMOS Setup utility.

Appendix A provides BIOS Error Beep Codes.

Appendix B lists software program installation instructions.

Appendix C lists standardized warning statements in various languages.

Appendix D provides UEFI BIOS Recovery instructions.

4

Super X11SPD-F User's Manual

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: +1 (408) 503-8000

Fax: +1 (408) 503-8008

Email: [email protected] (General Information)

[email protected] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: +31 (0) 73-6400390

Fax: +31 (0) 73-6416525

Email: [email protected] (General Information)

[email protected] (Technical Support)

[email protected] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: +886-(2) 8226-3990

Fax: +886-(2) 8226-3992

Email: [email protected]

Website: www.supermicro.com.tw

5

Table of Contents

Chapter 1 Introduction

1.1 Checklist ...............................................................................................................................8

Quick Reference Table ...................................................................................................... 11

Motherboard Features .......................................................................................................12

1.2 Processor and Chipset Overview .......................................................................................15

1.3 Special Features ................................................................................................................16

Recovery from AC Power Loss .........................................................................................16

1.4 System Health Monitoring ..................................................................................................16

Onboard Voltage Monitors ................................................................................................16

Fan Status Monitor with Firmware Control .......................................................................16

Environmental Temperature Control .................................................................................16

System Resource Alert......................................................................................................17

1.5 ACPI Features ....................................................................................................................17

1.6 Power Supply .....................................................................................................................17

1.7 Super I/O ............................................................................................................................17

1.8 Advanced Power Management ..........................................................................................18

Intel

®

Intelligent Power Node Manager (IPNM).................................................................18

Management Engine (ME) ................................................................................................18

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................19

Precautions .......................................................................................................................19

Unpacking .........................................................................................................................19

2.2 Processor and Heatsink Installation ...................................................................................20

The Intel Xeon 81xx/61xx/51xx/41xx/31xx and the 82xx/62xx/52xx/42xx/32xx Series

Processors ........................................................................................................................20

Overview of the Processor Carrier Assembly ...................................................................21

Overview of the CPU Socket ............................................................................................21

Overview of the Processor Heatsink Module ....................................................................22

Creating the Non-F Model Processor Carrier Assembly...................................................23

Assembling the Processor Heatsink Module ....................................................................24

Preparing the CPU Socket for Installation ........................................................................25

Installing the Processor Heatsink Module .........................................................................26

Removing the Processor Heatsink Module .......................................................................27

Table of Contents

6

2.2 Motherboard Installation .....................................................................................................28

Tools Needed ....................................................................................................................28

Location of Mounting Holes ..............................................................................................28

Installing the Motherboard.................................................................................................29

Installing the Motherboard into the Microblade Chassis ...................................................30

2.4 Memory Support and Installation .......................................................................................31

Memory Support ................................................................................................................31

DIMM Population Requirements .......................................................................................31

DIMM Installation ..............................................................................................................32

DIMM Removal .................................................................................................................32

2.5 Connectors .........................................................................................................................33

2.6 Jumper Settings .................................................................................................................43

How Jumpers Work ...........................................................................................................43

2.7 LED Indicators ....................................................................................................................47

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................51

Before Power On ..............................................................................................................51

No Power ..........................................................................................................................51

No Video ...........................................................................................................................52

System Boot Failure .......................................................................................................52

Memory Errors ..................................................................................................................52

Losing the System's Setup Conguration .........................................................................53

When the System Becomes Unstable ..............................................................................53

3.2 Technical Support Procedures ...........................................................................................55

3.3 Frequently Asked Questions ..............................................................................................56

3.4 Battery Removal and Installation .......................................................................................57

Battery Removal ................................................................................................................57

Proper Battery Disposal ....................................................................................................57

Battery Installation .............................................................................................................57

Super X11SPD-F User's Manual

7

3.5 Returning Merchandise for Service ....................................................................................58

4.1 Introduction .........................................................................................................................59

Starting the Setup Utility ...................................................................................................59

4.2 Main Setup .........................................................................................................................60

4.3 Advanced ............................................................................................................................62

4.3 Event Logs .........................................................................................................................92

4.4 IPMI ....................................................................................................................................94

4.5 Security ...............................................................................................................................97

4.7 Boot ..................................................................................................................................101

4.8 Save & Exit .......................................................................................................................103

Appendix A Software Installation

A.1 Installing Software Programs ...........................................................................................105

A.2 SuperDoctor

®

5 .................................................................................................................106

Appendix B Software Installation

B.1 Installing Software Programs ...........................................................................................107

B.2 SuperDoctor

®

5 .................................................................................................................108

Appendix C Standardized Warning Statements

Appendix D UEFI BIOS Recovery

D.1 Overview ........................................................................................................................... 112

D.2 Recovering the UEFI BIOS Image ...................................................................................112

D.3 Recovering the Main BIOS Block with a USB Device .....................................................113

Table of Contents

8

Super X11SPD-F User's Manual

Main Parts List

Description Part Number Quantity

Supermicro Motherboard X11SPD-F 1

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader.

Supermicro motherboards are designed to provide you with the highest standards in quality

and performance.

In addition to the motherboard, several important parts that are included with your shipment

are listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

Important Links

For your system to work properly, please follow the links below to download all necessary

drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: https://www.supermicro.com/wftp/driver/

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [email protected]m

This manual may be periodically updated without notice. Please check the Supermicro website

for possible updates to the manual revision level.

Delete unused rows -->

9

Chapter 1: Introduction

Figure 1-1. X11SPD-F Motherboard Image

Note: All graphics shown in this manual were based upon the latest PCB revision

available at the time of publication of the manual. The motherboard you received may

or may not look exactly the same as the graphics shown in this manual.

Image of motherboard is not in image database

10

Super X11SPD-F User's Manual

BAR CODE

J1

J3

145

1

DIMMD1

DIMME1

DIMMB1

DIMMA1

J9

J7

BT1

S-SGPIO1

MH2

MH1

JWD1

J25

JPME2

JVR1

JBT1

JRK1

MH4

MH9

MH7

MH3

MH8

JMD2

JMD1

SRW6

SRW3

SRW8

SRW7

SRW4

SRW5

JUIDB1

BMC_HB_LED1

JUSB3A1

JCPLD1

JIPMB1

UID_LED1

ALERT_LED1

LEDPWR

JTPM1

J20

JKVM1

SAS1

SAS0

MH10

MH11

JPWR1

JPCIE1

SRW3

SRW7

SRW5

SRW3

SRW7

SRW5

SW1

/ S-SATA5

PCI-E 3.0 X4

JMD1:M.2-H

PCI-E 3.0 X4 / S-SATA1

JMD2:M.2-H

USB0/1

FAN1

2-3:NMI

1-2:RST

JWD1:WATCH DOG

CPU SLOT1 PCIE 3.0 X16

CPU MICRO-LP PCIE 3.0 X8

1-2:NORMAL

2-3:ME MANUFACTURING MODE

TPM/PORT80

J25 : SATA/SAS SELECT

2-3:AOC SAS

1-2:ONBOARD SATA

JPME2

JBT1 : CMOS CLEAR

CPU

DESIGNED IN USA

X11SPD-F

REV: 1.0

USB2(3.0)

1

3

1

7

Figure 1-2. X11SPD-F Motherboard Layout

(not drawn to scale)

Notes:

• See Chapter 2 for detailed information on jumpers and I/O ports. Jumpers/components/

LED indicators not indicated are used for internal testing only.

• " " indicates the location of Pin 1.

• Use only the correct type of onboard CMOS battery as specied by the manufacturer. Do

not install the onboard battery upside down to avoid possible explosion.

JKVM1

JCPCIE1

DIMMB1

DIMMD1

DIMME1

DIMMA2

JMD1

LEDPWR

JMD2

ALERT_LED1

JUSB3A1

SRW7

SRW5

SAS0

Top View

Bottom View

JTPM1

JWD1

BMC_HB_LED1

SRW6

SRW8

J20

JIPMB1

UID_LED1

JPME2

SRW4

SRW3

UID

JVR1

JBT1

BT1

SAS1

JPWR1

JCPLD1

JRK1

SW1

S-SGPIO1

J25

CPU

11

Chapter 1: Introduction

Quick Reference Table

Jumper Description Default Setting

JBT1 CMOS Clear Open (Normal)

JPME2 Manufacturing Mode Pins 1-2 (Normal)

JWD1 Watch Dog Timer Pins 1-2 (Normal)

Connector Description

BT1 Onboard CMOS battery socket

J20 CPU Micro-LP PCI-E 3.0 X 18

J25 Onboard PCH sSATA or SAS Add-On Card IO Selection

JPCIE1 CPU Slot1 PCI-E 3.0 X 16

JCPLD1 Complex-Programmable Logical Device (CPLD) header

JBT1 CMOS Clear

JIPMB1 4-pin BMC External I

2

C Header (for an IMPI card)

JKVM1 VGA and USB 01 Connector on the I/O backplane

JMD1 M.2-H M-Key PCI-E 3.0 X 4 / S-SATA1

JMD2 M.2-H M-Key PCI-E 3.0 X 4 / S-SATA5

JPWR1 Power Connector

JRK1 Intel RAID Key Header

JTPM1 Trusted Platform Module (TPM)/Port 80 connector

S-SGPIO1 Serial Link General Purpose I/O Headers

SAS0 - SAS1 Serial Attached SCSI 3.0 Ports where a SAS Add On Card is installed

LED Description Status

ALERT_LED1 System Failure LED

Solid Red: Overheating

Blinking Red: Power or Fan Failure

BMC_HB_LED1 BMC Heartbeat LED Blinking Green: BMC normal

LEDPWR Onboard Power LED Solid Green: Power on

UID_LED1 Unit Identier (UID) LED Solid Blue: Unit Identied

12

Super X11SPD-F User's Manual

Motherboard Features

CPU

• Supports an Intel Xeon E-2100 series, 8th Gen Core i3, Pentium, Celeron processors in an LGA3647 socket.

Memory

• Supports up to 512GB of ECC 3DS LRDIMM with speeds of up to 2933MHz in four slots

DIMM Size

• Up to 32GB at 1.2V

Note 1: Refer to the motherboard product page for the list of supported memory.

Chipset

• Intel C621

Expansion Slots

• One (1) Micro LP PCI-E 3.0 x8 slot

• Two (2) M.2 PCI-E 3.0 x4 slots with S-SATA1/5 support

• One (1) PCI-E 3.0 x 16 slot

• Two (2) NVMe U.2 PCI-E x4 slots via the backplane

BaseBoard Management Controller (BMC)

• ASpeed AST 2500

Graphics

• Graphics controller via AST 2500 BMC

I/O Devices

• COM Port • One (1) COM port via the KVM connector

• SATA 3.0

• Five (5) SATA 3.0 ports via the backplane (RAID 0, 1, 5, 10 support)

• One (1) SATA 3.0 via the right angle receptable connector

• One (1) SATA with DOM power recepetable connector

Peripheral Devices

• One (1) USB 2.0 ports via the KVM connector (USB0/1)

• One (1) USB 3.1 Gen 1 header for front access (USB2)

Motherboard Features

13

Chapter 1: Introduction

Motherboard Features

BIOS

• 256Mb SPI AMI BIOS

®

SM Flash UEFI BIOS

• ACPI 6.1, SMBIOS 2.7, PCI F/W 3.0, Plug-and-Play (PnP), RTC wakeup

Power Management

• Power button override mechanism

• Intel Intelligent Power Node Manager (available when the Supermicro Power Manager [SPM] is installed and a special

power supply is used)

• Management Engine (ME)

System Health Monitoring

• Onboard voltage monitoring for +1.8V, +3.3V, +3.3V standby, +5V, +5V standby, +/-12V, VBAT, HT, Memory, PCH Temp.,

System Temp., Memory Temp.

• CPU switching phase voltage regulator

• CPU System LED and control

• CPU Thermal Trip support

• CPU Thermal Design Power (TDP)

System Management

• Trusted Platform Module (TPM) support

• PECI (Platform Environment Control Interface) 3.1 support

• UID (Unit Identication)/Remote UID

• System resource alert via SuperDoctor® 5

• Watch Dog, NMI

LED Indicators

• CPU/System Overheat

• UID/remote UID

• Fan Failed

Dimensions

• 15.689" (L) x 4.75" (W) (398.50 mm x 120.65 mm)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and

heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

Note 2: For IPMI conguration instructions, please refer to the Embedded IPMI Con-

guration User's Guide available at http://www.supermicro.com/support/manuals/.

14

Super X11SPD-F User's Manual

Note: This is a general block diagram and may not exactly represent the features on

your motherboard. See the previous pages for the actual specications of your moth-

erboard.

Figure 1-3.

C621 System Block Diagram

DMI

Intel

Xeon

PCH

C621

MUX

PCIe x 16 SLOT

2 sSATA PORTS

PCIe x8 MLP SLOT

2 NVMe Ports

2 SAS PORTS

(from SAS AOC)

2 USB PORTS (KVM)

2 M.2 PORTS

(PCIE or SATA)

TPM (header)

FLASH SPI 256Mb

PCIe3.0 x 16

PCIe3.0 x 8

PCIe3.0 x 4

SATA III

USB2.0 X 2

SPI

J25 jumper:

1-2: sSATA

2-3: SAS

BMC

ASP2500

RGMII

RTL8211

PHY

VGA/COM

(KVM)

eSPI

PCIe3.0 x 1

USB2.0 x 1

DDR 4

2933/2666/2400/2133MHz

DIMMA A

DIMMA B (FAR)

DIMMA D

DIMMA E (FAR)

PCIe3.0 x 4/SATA III

2 HDD PORTS

NVMe/SAS/SATA

(system front)

AOM-BPN-938NH

PCIe3.0 x 4

SPI

SERDES

2933/2666/2400/2133MHz

PCIe3.0 x 4/SATA III

15

Chapter 1: Introduction

1.2 Processor and Chipset Overview

Built upon the functionality and capability of the Intel Xeon E-2100 series, 8th Generation

Core i3, Pentium, Celeron processor, and the C621 chipset, this motherboard provides superb

system performance, ecient power management, and a set of features based on cutting

edge technology to address the needs of next-generation computer users. This motherboard

is optimized for 8-node Micro Cloud servers with up to 2NVMe/SAS3/SATA3 per node.

The Intel Xeon E-2100 series, 8th Gen Core i3, Pentium, Celeron processor, and the C621

chipset support the following features:

• Xeon E-2100 processor supports up to 3.8 GHz base frequency with Intel Turbo Boost

Technology 2.0 frequency up to 4.7 GHz

• Up to 12MB Intel Smart Cache, 6 Core and 12 Threads

• Intel Virtualization Technology (Intel VT) and Trusted Execution Technology (Intel TXT)

• Intel Streaming SIMD Extensions 4.2 (Intel SSE4.2), Intel AVX2, and Advanced Encryption

Standard New Instructions (Intel AES-NI)

• Intel 64 Architecture, Execute Disable Bit, Turbo Boost Technology 2.0, Hyper-Threading

Technology (Intel HT Technology)

• Up to 512GB ECC 3DS LRDIMM with up to 2933MHz in four DIMM slots

• Intel Server Platform Services (Intel SPS): Designed for managing rack-mount servers, with

a suite of tools to control and monitor power, thermal, and resource utilization

• PCI Express 3.0, USB 3.1, SATA 3.0, DMI – Up to four lanes, Gen 3

• Intel Rapid Storage Technology enterprise (Intel RSTe)

• PCI-E 3.0, SATA 3.0, NVMe

• System Management Bus (SMBus)

CONFIRM

16

Super X11SPD-F User's Manual

1.3 Special Features

This section describes the health monitoring features of the X11SPD-F motherboard. The

motherboard has an onboard ASpeed 2500 Baseboard Management Controller (BMC) that

supports system health monitoring.

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond

when AC power is lost and then restored to the system. You can choose for the system to

remain powered o (in which case you must press the power switch to turn it back on), or

for it to automatically return to the power-on state. See the Advanced BIOS Setup section

for this setting. The default setting is Last State.

1.4 System Health Monitoring

This section describes the health monitoring features of the X11SPD-F motherboard. The

motherboard has an onboard Baseboard Management Controller (BMC) chip that supports

system health monitoring. Once a voltage becomes unstable, a warning is given or an error

message is sent to the screen. The user can adjust the voltage thresholds to dene the

sensitivity of the voltage monitor.

Onboard Voltage Monitors

The onboard voltage monitor will continuously scan crucial voltage levels. Once a voltage

becomes unstable, it will give a warning or send an error message to the screen. The user

can adjust the voltage thresholds to dene the sensitivity of the voltage monitor. Real time

readings of these voltage levels are all displayed in the BIOS.

Fan Status Monitor with Firmware Control

The system health monitor embedded in the BMC chip can check the RPM status of the

cooling fans. The CPU and chassis fans are controlled via lPMI.

Environmental Temperature Control

System Health sensors in the BMC monitor the temperatures and voltage settings of onboard

processors and the system in real time via the IPMI interface. Whenever the temperature of

the CPU or the system exceeds a user-dened threshold, system/CPU cooling fans will be

turned on to prevent the CPU or the system from overheating.

Note: To avoid possible system overheating, please provide adequate airow to your

system.

17

Chapter 1: Introduction

System Resource Alert

This feature is available when used with SuperDoctor 5

®

. SuperDoctor 5 is used to notify the

user of certain system events. For example, you can congure SuperDoctor 5 to provide you

with warnings when the system temperature, CPU temperatures, voltages and fan speeds

go beyond a predened range.

1.5 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes

a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system including its hardware, operating system

and application software. This enables the system to automatically turn on and o peripherals

such as network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a

generic system event mechanism for Plug and Play and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures

while providing a processor architecture-independent implementation that is compatible with

Windows 10 and Windows 2012 operating systems.

1.6 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable

operation. It is even more important for processors that have high CPU clock rates. In areas

where noisy power transmission is present, you may choose to install a line lter to shield

the computer from noise. It is recommended that you also install a power surge protector to

help avoid problems caused by power surges.

1.7 Super I/O

The Super I/O (ASpeed AST2500 chip) provides a high-speed, 16550 compatible serial

communication port (UART), which supports serial infrared communication. The UART

includes send/receive FIFO, a programmable baud rate generator, complete modem control

capability, and a processor interrupt system. The UART provides legacy speed with baud

rate of up to 115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or

1 Mb/s, supporting higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power

Interface), which includes support of legacy and ACPI power management through a SMI

or SCI function pin. It also features auto power management to reduce power consumption.

18

Super X11SPD-F User's Manual

1.8 Advanced Power Management

The following new advanced power management features are supported by the motherboard.

Intel

®

Intelligent Power Node Manager (IPNM)

Available when the Supermicro Power Manager (SPM) is installed, Intel's Intelligent Power

Node Manager (IPNM) provides your system with real-time thermal control and power

management for maximum energy eciency. Although IPNM Specication Version 2.0/3.0

is supported by the BMC (Baseboard Management Controller), your system must also have

IPNM-compatible Management Engine (ME) rmware installed to use this feature.

Note: Support for IPNM 2.0/3.0 support is dependent on the power supply used in

the system.

Management Engine (ME)

The Management Engine, which is an ARC controller embedded in the IOH (I/O Hub), provides

Server Platform Services (SPS) to your system. The services provided by SPS are dierent

from those provided by the ME on client platforms.

19

Chapter 2: Installation

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To avoid damaging

your motherboard and your system, it is important to handle it very carefully. The following

measures are generally sucient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the board by its edges only; do not touch its components, peripheral chips, memory

modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do

not install the CMOS battery upside down, which may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking

the motherboard, make sure that the person handling it is static protected.

20

Super X11SPD-F User's Manual

2.2 Processor and Heatsink Installation

The processor (CPU) and processor carrier should be assembled together rst to form

the processor carrier assembly. This will be attached to the heatsink to form the processor

heatsink module (PHM) before being installed onto the CPU socket.

Notes:

• Use ESD protection.

• Unplug the AC power cord from all power supplies after shutting down the system.

• Check that the plastic protective cover is on the CPU socket and none of the socket pins

are bent. If they are, contact your retailer.

• When handling the processor, avoid touching or placing direct pressure on the LGA lands

(gold contacts). Improper installation or socket misalignment can cause serious damage

to the processor or CPU socket, which may require manufacturer repairs.

• Thermal grease is pre-applied on a new heatsink. No additional thermal grease is needed.

• Refer to the Supermicro website for updates on processor support.

• All graphics in this manual are for illustrations only. Your components may look dierent.

The Intel Xeon 81xx/61xx/51xx/41xx/31xx and the

82xx/62xx/52xx/42xx/32xx Series Processors

Non-Fabric Model

Page is loading ...

Supermicro X11SPD-F User manual

Related papers

Other documents