Storage Temperature
•-20°Cto+70°C
REGULATIONS AND SAFETY STANDARDS
United States and Canada
UL1950,Thirdedition—CAN/CSAC22.2
No.950-95withrecognizedU.S.andCanadian
componentmarks
Europe
NemkocertifiedtoEN60950International
NemkocertifiedtoIEC60950
(CBreportwithCBcertificate)
EMC regulations (tested in representative chassis)
United States
FCCPart15,ClassB
FCCPart15,ClassBopen-chassis(coveroff)testing
Canada
ICES-003,ClassB
Europe
EMCdirective89/336/EEC;EN55022:1998
ClassB;EN55024:1998
Australia/New Zealand
AS/NZS3548,ClassB
Taiwan
CNS13438,ClassBInternational
CISPR22:1997,ClassB
Powerrequirementsvary.ComplieswithUSCRFvia
EN55022+6dbinsystemconfigurationswithan
openchassisandEUDirective89/336/EECanduse
viaEN55022andEN50082-1inarepresentative
chassis.
Lead-Free: Thesymbolisusedtoidentify
electricalandelectronicassembliesandcom-
ponentsinwhichthelead(Pb)concentration
levelinanyoftherawmaterialsandtheendprod-
uctisnotgreaterthan0.1%byweight(1000ppm).
Thissymbolisalsousedtoindicateconformance
tolead-freerequirementsanddefinitionsadopted
undertheEuropeanUnion’sRestrictiononHazardous
Substances(RoHS)directive,2002/95/EC.
PROCESSOR
Processor Support
•Intel®Core™i7processorsintheLGA1366package
•Intel®TurboBoostTechnology
4
•Intel®Hyper-ThreadingTechnology
5
•IntegratedMemoryControllerwithsupportforup
to48GB
7
ofsystemmemoryDDR3+1600
6
/
1333/1066MHzSDRAM
•Intel®FastMemoryAccess
•SupportsIntel®64architecture
9
CHIPSET
Intel® X58 Express Chipset
•Intel®82X58IOHwithICH10R
•Intel®MatrixStorageManager(RAID0,1,5,10)
•TwoSATA(6.0Gb/s)portsand6SATA(3.0Gb/s)ports
•TwoeSATA(3.0Gb/s)portsonthebackpanel
USB PORTS
Integrated Intel® ICH10R controller
•SixHi-SpeedUSB2.0portsviabackpanel
•SixadditionalHi-SpeedUSB2.0portsviathree
internalheaders
•TwoSuperSpeedUSB3.0portsviaNECcontroller
System BIOS
•32MbFlashEEPROMwithIntel®Platform
InnovationFrameworkforEFIPlugandPlay,IDE
driveauto-configure
•Advancedconfigurationandpowerinterface
V3.0b,DMI2.5
Intel® Rapid BIOS Boot
•Intel®RapidBIOSBoot
•Intel®ExpressBIOSupdatesupport:BIOSupdate
vianewF7functionkey
1
Warning: Altering clock frequency and/or voltage may (i) reduce
system stability and useful life of the system and processor; (ii)
cause the processor and other system components to fail; (iii)
cause reductions in system performance; (iv) cause additional
heat or other damage; and (v) affect system data integrity. Intel
has not tested, and does not warranty, the operation of the
processor beyond its specications.
2
The Intel® Core Utilities Bundle includes Intel® Integrator Assis-
tant, Intel® Integrator Toolkit, Intel® Express Installer, and Intel®
Express BIOS Update.
3
Intel® Extreme Tuning Utility is only compatible with Intel® Desk-
top Boards based on the Intel® X38 Express Chipset and newer.
Auto-tuning capabilities may not be available for all Extreme
Series motherboards.
4
Intel® Turbo Boost Technology requires a PC with a processor with
Intel Turbo Boost Technology capability. Intel Turbo Boost Technol-
ogy performance varies depending on hardware, software, and
overall system conguration. Check with your PC manufacturer on
whether your system delivers Intel Turbo Boost Technology. See
www.intel.com/technology/turboboost for more information.
5
Intel® Hyper-Threading Technology requires a computer system
with a processor supporting HT Technology and an HT Technol-
ogy-enabled chipset, BIOS, and operating system. Performance
will vary depending on the specic hardware and software you
use. For more information including details on which processors
support HT Technology, see www.intel.com/info/hyperthreading.
Intel® Desktop Board DX58SO2 Extreme Series
Technical Specications
Hardware Management Features
•Processorfanspeedcontrol
•Systemchassisfanspeedcontrol
•Voltageandtemperaturesensing
•Fansensorinputsusedtomonitorfanactivity
•PowermanagementsupportforACPI3.0b
Intel® PRO 10/100/1000 Network Connection
•DualLANonthebackpanel
•Newlow-powerdesigncanmeetEnergyStar*5.0
specifications
Expansion Capabilities
•ThreePCIExpress*2.0x16connectors(configured
asx16/x8/x8intriple-graphicsmode)
•TwoPCIExpress2.0x1connectors
•OnePCIconnector
Audio
•10-channelIntel®HighDefinitionAudio
8
codec
•8-channelviathebackpanel
•2-channelviathefrontpanel
•Backpanelsupportforoutputviaopticalcable
•OneinternalheaderforS/PDIFoutputforHDMI*
support
SYSTEM MEMORY
Memory Capacity
•Six240-pinDIMMconnectorssupportingtriple-
channelmemory.Twodouble-sidedDIMMsper
channel.
•Maximumsystemmemoryupto48GB
7
using8GB
double-sidedDIMMs
Memory Types
•DDR3+1600/1333/1066SDRAMmemorysupport
•Non-ECCMemory
Memory Modes
•Triple-,dual-,orsingle-channeloperationsupport
Memory Voltage
•1.35Vlowvoltage
•1.5VstandardJEDECvoltage
•SupportforIntel®XMPextendedvoltageprofiles
JUMPERS AND FRONT-PANEL CONNECTORS
Jumpers
•Singleconfigurationjumperdesign
•JumperaccessforBIOSmaintenancemode
Front-Panel Connectors
•Reset,HDLED,PowerLEDs,poweron/off
•Threefront-panelHi-SpeedUSB2.0headers
•Front-panelaudioheader
•OneIEEE1394aheader
MECHANICAL
Board Style
•ATX
Board Size
•9.6”x11.6”(24.38cmx29.46cm)
Baseboard Power Requirements
•ATX12V
ENVIRONMENT
Operating Temperature
•0°Cto+55°C
For ordering information, visit www.intel.com
For the most current product information, visit www.intel.com/go/idb
or http://ark.intel.com
For specific CPU compatibility, visit http://processormatch.intel.com
6
Maximum peak memory bandwidth requires three DDR3 modules
to be populated in each of the blue memory slots. DDR3 1600
memory support on this motherboard requires advanced knowl-
edge of BIOS and memory tuning; individual results may vary.
For specic supported memory for this motherboard, please visit
www.intel.com/products/motherboard/ for more details.
7
System resources and hardware (such as PCI and PCI Express*)
require physical memory address locations that can reduce avail-
able addressable system memory. This could result in a reduction
of as much as 1 GB or more of physical addressable memory being
available to the operating system and applications, depending on
the system conguration and operating system.
8
Intel® High Denition Audio requires a system with an appropriate
Intel® chipset and a motherboard with an appropriate codec and
the necessary drivers installed. System sound quality will vary
depending on actual implementation, controller, codec, drivers,
and speakers. For more information about Intel® HD Audio, refer
to www.intel.com/design/chipsets/hdaudio.htm
9
64-bit computing on Intel® architecture requires a computer
system with a processor, chipset, BIOS, operating system, device
drivers, and applications enabled for Intel® 64 architecture.
Processors will not operate (including 32-bit operation) without
an Intel 64 architecture-enabled BIOS. Performance will vary
depending on your hardware and software congurations. See
http://developer.intel.com/technology/intel64/index.htm for
more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION
WITH INTEL® PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DIS-
CLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO
SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY
OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR
PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PAT-
ENT, COPYRIGHT, OR OTHER INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving,
or life-sustaining applications. Intel may make changes to speci-
cations and product descriptions at any time, without notice.
All products, dates, and gures specied are preliminary based
on current expectations, and are subject to change without
notice. Availability in different channels may vary.
Actual Intel® Desktop Board may differ from the image shown.
Intel, the Intel logo, and Intel Core are trademarks of Intel
Corporation in the U.S. and other countries.
* Other names and brands may be claimed as the property of others.
Copyright © 2010 Intel Corporation. All rights reserved.
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