Supermicro A2SAP-L User manual

USER’S MANUAL

Revision 1.0

A2SAP-H/-E/-L

The information in this user’s manual has been carefully reviewed and is believed to be accurate. The vendor assumes

no responsibility for any inaccuracies that may be contained in this document, and makes no commitment to update

or to keep current the information in this manual, or to notify any person or organization of the updates. Please Note:

For the most up-to-date version of this manual, please see our website at www.supermicro.com.

Super Micro Computer, Inc. ("Supermicro") reserves the right to make changes to the product described in this manual

at any time and without notice. This product, including software and documentation, is the property of Supermicro and/

or its licensors, and is supplied only under a license. Any use or reproduction of this product is not allowed, except

as expressly permitted by the terms of said license.

IN NO EVENT WILL Super Micro Computer, Inc. BE LIABLE FOR DIRECT, INDIRECT, SPECIAL, INCIDENTAL,

SPECULATIVE OR CONSEQUENTIAL DAMAGES ARISING FROM THE USE OR INABILITY TO USE THIS PRODUCT

OR DOCUMENTATION, EVEN IF ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. IN PARTICULAR, SUPER

MICRO COMPUTER, INC. SHALL NOT HAVE LIABILITY FOR ANY HARDWARE, SOFTWARE, OR DATA STORED

OR USED WITH THE PRODUCT, INCLUDING THE COSTS OF REPAIRING, REPLACING, INTEGRATING,

INSTALLING OR RECOVERING SUCH HARDWARE, SOFTWARE, OR DATA.

Any disputes arising between manufacturer and customer shall be governed by the laws of Santa Clara County in the

State of California, USA. The State of California, County of Santa Clara shall be the exclusive venue for the resolution

of any such disputes. Supermicro's total liability for all claims will not exceed the price paid for the hardware product.

FCC Statement: This equipment has been tested and found to comply with the limits for a Class A digital device

pursuant to Part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful

interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can

radiate radio frequency energy and, if not installed and used in accordance with the manufacturer’s instruction manual,

may cause harmful interference with radio communications. Operation of this equipment in a residential area is likely

to cause harmful interference, in which case you will be required to correct the interference at your own expense.

California Best Management Practices Regulations for Perchlorate Materials: This Perchlorate warning applies only

to products containing CR (Manganese Dioxide) Lithium coin cells. “Perchlorate Material-special handling may apply.

See www.dtsc.ca.gov/hazardouswaste/perchlorate”.

WARNING: Handling of lead solder materials used in this product may expose you to lead, a

chemical known to the State of California to cause birth defects and other reproductive harm.

The products sold by Supermicro are not intended for and will not be used in life support systems, medical equipment,

nuclear facilities or systems, aircraft, aircraft devices, aircraft/emergency communication devices or other critical

systems whose failure to perform be reasonably expected to result in signicant injury or loss of life or catastrophic

property damage. Accordingly, Supermicro disclaims any and all liability, and should buyer use or sell such products

for use in such ultra-hazardous applications, it does so entirely at its own risk. Furthermore, buyer agrees to fully

indemnify, defend and hold Supermicro harmless for and against any and all claims, demands, actions, litigation, and

proceedings of any kind arising out of or related to such ultra-hazardous use or sale.

Manual Revision---Draft 4---

Release Date: September 28, 2017

Unless you request and receive written permission from Super Micro Computer, Inc., you may not copy any part of this

document. Information in this document is subject to change without notice. Other products and companies referred

to herein are trademarks or registered trademarks of their respective companies or mark holders.

Printed in the United States of America

3

Preface

About This Manual

This manual is written for system integrators, IT technicians and knowledgeable end users.

It provides information for the installation and use of the A2SAP-H/-E/-L motherboard.

About This Motherboard

The A2SAP-H/-E/-L motherboard provides powerful graphics and increased media processing

performance with multi-frame technology. Paired with the Intel® Atom SoC (System-on-a-

Chip) processor, the A2SAP-H/-E/-L delivers more computing power for faster memory speeds

and bandwidth while maintaining energy efciency. Utilizing Intel® TCC (Time Coordinated

Computing) Technology, the A2SAP-H/-E/-L resolves latency issues in applications and

improves determinism across connected devices. The motherboard features advanced

technologies such as Intel® Virtualization to improve security and reliabity of systems, and

Thermal Monitoring to reduce power consumption. It also comes with more I/O ports and

high-speed connectivity.

Please note that this motherboard is intended to be installed and serviced by professional

technicians only. For processor/memory updates, please refer to our website at http://www.

supermicro.com/products/.

Conventions Used in the Manual

Special attention should be given to the following symbols for proper installation and to prevent

damage done to the components or injury to yourself:

Warning! Indicates high voltage may be encountered when performing a procedure.

Warning! Indicates important information given to prevent equipment/property damage

or personal injury.

Important: Important information given to ensure proper system installation or to

relay safety precautions.

Note: Additional Information given to differentiate various models or provides infor-

mation for correct system setup.

4

Contacting Supermicro

Headquarters

Address: Super Micro Computer, Inc.

980 Rock Ave.

San Jose, CA 95131 U.S.A.

Tel: +1 (408) 503-8000

Fax: +1 (408) 503-8008

Email: [email protected] (General Information)

[email protected] (Technical Support)

Website: www.supermicro.com

Europe

Address: Super Micro Computer B.V.

Het Sterrenbeeld 28, 5215 ML

's-Hertogenbosch, The Netherlands

Tel: +31 (0) 73-6400390

Fax: +31 (0) 73-6416525

Email: [email protected] (General Information)

[email protected] (Technical Support)

[email protected] (Customer Support)

Website: www.supermicro.nl

Asia-Pacic

Address: Super Micro Computer, Inc.

3F, No. 150, Jian 1st Rd.

Zhonghe Dist., New Taipei City 235

Taiwan (R.O.C)

Tel: +886-(2) 8226-3990

Fax: +886-(2) 8226-3992

Email: [email protected]

Website: www.supermicro.com.tw

A2SAP-H/-E/-L User's Manual

5

Table of Contents

Chapter 1 Introduction

1.1 Checklist ...............................................................................................................................7

Quick Reference ...............................................................................................................12

Quick Reference Table ......................................................................................................13

Motherboard Features .......................................................................................................14

1.2 Processor Overview ...........................................................................................................17

1.3 Special Features ................................................................................................................17

Recovery from AC Power Loss .........................................................................................17

1.4 ACPI Features ....................................................................................................................18

1.5 Power Supply .....................................................................................................................18

1.6 Super I/O ............................................................................................................................18

1.7 Advanced Power Management ..........................................................................................19

Management Engine (ME) ................................................................................................19

Chapter 2 Installation

2.1 Static-Sensitive Devices .....................................................................................................20

Precautions .......................................................................................................................20

Unpacking .........................................................................................................................20

2.2 Motherboard Installation .....................................................................................................21

Tools Needed ....................................................................................................................21

Location of Mounting Holes ..............................................................................................21

Installing the Motherboard.................................................................................................22

2.3 Memory Support and Installation .......................................................................................23

Memory Support ................................................................................................................23

SO-DIMM Installation ........................................................................................................24

SO-DIMM Removal ...........................................................................................................24

2.4 Rear I/O Ports ....................................................................................................................25

2.5 Front Control Panel ............................................................................................................28

2.6 Connectors .........................................................................................................................31

Power Connections ...........................................................................................................31

Headers .............................................................................................................................32

2.7 Jumper Settings .................................................................................................................39

Preface

6

How Jumpers Work ...........................................................................................................39

2.8 LED Indicators ....................................................................................................................40

Chapter 3 Troubleshooting

3.1 Troubleshooting Procedures ..............................................................................................41

Before Power On ..............................................................................................................41

No Power ..........................................................................................................................41

No Video ...........................................................................................................................42

System Boot Failure .......................................................................................................42

Memory Errors ..................................................................................................................42

Losing the System's Setup Conguration .........................................................................43

When the System Becomes Unstable ..............................................................................43

3.2 Technical Support Procedures ...........................................................................................45

3.3 Frequently Asked Questions ..............................................................................................46

3.4 Battery Removal and Installation .......................................................................................47

3.5 Returning Merchandise for Service ....................................................................................48

Chapter 4 BIOS

4.1 Introduction .........................................................................................................................49

Starting the Setup Utility ...................................................................................................49

4.2 Main Setup .........................................................................................................................50

4.3 Advanced ............................................................................................................................52

4.4 Security ...............................................................................................................................73

4.5 Boot ....................................................................................................................................76

4.6 Save & Exit .........................................................................................................................78

Appendix A BIOS Codes

Appendix B Software Installation

B.1 Installing Software Programs .............................................................................................82

B.2 SuperDoctor

®

5 ...................................................................................................................83

Appendix C Standardized Warning Statements

Battery Handling ................................................................................................................84

Product Disposal ...............................................................................................................86

Appendix D UEFI BIOS Recovery

A2SAP-H/-E/-L User's Manual

7

Chapter 1: Introduction

Main Parts List (Retail Single Package)

Description Part Number Quantity

Supermicro Motherboard A2SAP-H/-E/-L 1

Heatsink (A2SAP-H/-E) SNK-C0115L 1

Heatsink (A2SAP-L) SNK-C0116L 1

Audio cable (20cm) (A2SAP-E/-L) CBL-OTHR-0986 1

SATA power cable (20cm) (A2SAP-E/-L) CBL-PWEX-1030 1

USB 2.0 cable (20cm) (A2SAP-E/-L) CBL-CUSB-0983 1

COM cable (20cm) (A2SAP-E/-L) CBL-CUSB-0984 1

SATA data cables (29cm) (A2SAP-E/-L) CBL-SAST-0538 1

Power input cable (15cm) (A2SAP-E/-L) RWHHW-9963 1

Standoffs (A2SAP-H) MCP-110-00096-0N 4

Main Parts List (Bulk Package)

Description Part Number Quantity

Supermicro Motherboard A2SAP-H/-E/-L 1

Heatsink (A2SAP-E) SNK-C0115L 1

Heatsink (A2SAP-L) SNK-C0116L 1

SATA power cable (20cm) (A2SAP-E/-L) CBL-PWEX-1030 1

SATA data cables (29cm) (A2SAP-E/-L) CBL-SAST-0538 1

Power input cable (15cm) (A2SAP-E/-L) RWHHW-9963 1

Standoffs (A2SAP-H) MCP-110-00096-0N 4

Chapter 1

Introduction

Congratulations on purchasing your computer motherboard from an industry leader. Supermicro

boards are designed to provide you with the highest standards in quality and performance.

In additon to the motherboard, several important parts that are included with the system are

listed below. If anything listed is damaged or missing, please contact your retailer.

1.1 Checklist

8

A2SAP-H/-E/-L User's Manual

Important Links

For your system to work properly, please follow the links below to download all necessary

drivers/utilities and the user’s manual for your server.

• Supermicro product manuals: http://www.supermicro.com/support/manuals/

• Product drivers and utilities: ftp://ftp.supermicro.com

• Product safety info: http://www.supermicro.com/about/policies/safety_information.cfm

• If you have any questions, please contact our support team at: [email protected]m

This manual may be periodically updated without notice. Please check the Supermicro website

for possible updates to the manual revision level.

9

Chapter 1: Introduction

Motherboard Bottom Side

Motherboard Top Side

Figure 1-1. A2SAP-H Motherboard Image

Note: All graphics shown in this manual were based upon the latest PCB revision

available at the time of publication of the manual. The motherboard you received may

or may not look exactly the same as the graphics shown in this manual.

10

A2SAP-H/-E/-L User's Manual

Motherboard Bottom Side

Motherboard Top Side

Figure 1-2. A2SAP-E/-L Motherboard Image

11

Chapter 1: Introduction

JDC

JCOM1

J3

JF1

J6

1

Rev:1.00

DESIGNED IN USA

A2SAP-L

BT1

JLCDPWR1

SRW2

SRW1

JPWR1

JLAN2

JLAN1

JEIO1

JUSB1

JHDMI1

LVDS1

I-SATA1

JGP1

JMP1

JMD1

JSMBUS1

PEC1

J5

CPU1

A2SAP-H/-E Top Layout

A2SAP-L Bottom Layout

A2SAP-H/-E Back Panel I/O with Heatsink

A2SAP-L Back Panel I/O with Heatsink

Figure 1-3. Motherboard Layout

(not drawn to scale)

12

A2SAP-H/-E/-L User's Manual

JSMBUS1

PEC1

J5

CPU1

Bottom Layout

Top Layout

Quick Reference

Notes:

• See Chapter 2 for detailed information on jumpers, I/O ports, and JF1 front panel connec-

tions. Jumpers and LED indicators not indicated are used for testing only.

• " " indicates the location of Pin 1.

JDC

JCOM1

J3

JF1

J6

1

Rev:1.00

DESIGNED IN USA

A2SAP-L

BT1

JLCDPWR1

SRW2

SRW1

JPWR1

JLAN2

JLAN1

JEIO1

JUSB1

JHDMI1

LVDS1

I-SATA1

JGP1

JMP1

JMD1

JLAN2

JUSB1

JEIO1

JLAN1

CPU

JMD1

I-SATA1

JF1

J6

BT1

J3

JGP1

JHDMI1

JPWR1

JSMBUS1

JLCDPWR1

JCOM1

SRW2

JMP1

SODIMM

LVDS1

SRW1

JDC

13

Chapter 1: Introduction

Quick Reference Table

Jumper Description Jumper Setting (Default *)

JLCDPWR1

FORCE POWER ON

Pins 2-4* (FORCE POWER ON)

Pins 4-6 (POWER BUTTON ON)

LVDS Panel Power Source Selection

Pins 1-3* (3.3V)

Pins 3-5 (5V)

Connector Description

BT1

Battery Connector

(To Clear CMOS, remove the battery, short pins 1-2 and install the battery.)

I-SATA1 Intel® PCH SATA 3.0 Port

J3 Front Panel Audio Header (Mic-In/Line-out)

J6 Two USB 2.0 Headers

JCOM1 Two COM Headers (two RS232/422/485)

JDC 12V DC Jack Power Connector (for A2SAP-H)

JEIO1

Supermicro Extension I/O

(HDMI/DP, two PCI-E x1, two USB 2.0, LPC, SATA, SMBus, Power)

JF1 Front Control Panel Header (Power/HDD LED, Reset, Power button)

JGP1 8-bit General Purpose I/O Header

JHDMI1 High Denition Multimedia Interface (HDMI) Port

JLAN1/JLAN2 LAN1/LAN2 (RJ45 LAN) Ports

JMD1 M.2 Slot (B-KEY 2242/3042) (SATA 3.0 / PCI-E / USB 2.0)

JMP1 Mini PCI-E Slot (supports two PCIe Gen2 / one USB 2.0)

JPWR1 Two 4-pin 12V Power Connectors (for A2SAP-E/-L)

JSMBUS1 SMBus and 5V SATA Power Box Header

JUSB1 Two Back Panel USB 3.0 Ports

LVDS1 Dual Channel 48-bit LVDS Connector

SRW1 ~ SRW2 M.2 and Mini PCI-E Mounting Holes

Note: Components not documented are for internal testing only.

14

A2SAP-H/-E/-L User's Manual

Note: The table above is continued on the next page.

Motherboard Features

CPU

• A2SAP-H/-E: Intel® Atom™ x5-E3940 Processor, Quad Core, 2M Cache, 1.6GHz-1.8GHz, 9.5W

• A2SAP-L: Intel® Atom™ x5-E3930 Processor, Dual Core, 2M Cache, 1.3GHz-1.8GHz, 6.5W

Memory

• Integrated memory controller supports up to 8GB of DDR3L 1867MHz Non-ECC 204-pin SO-DIMM

DIMM Size

• Up to 8GB at 1.35V

Expansion Slots

• One (1) Half Size Mini PCI-Express slot (PCI-E/USB 2.0)

• One (1) M.2 B-Key 3042/2242 (PCI-E/SATA/USB 2.0)

Network

• Dual Intel I210 controller

Graphics

• Intel® HD Graphics GT Series

• Features: OpenGL 5.0, DirectX 12, OpenCL 2.1

• Hardware Decode: AVC/H.264, MPEG2, VC1/WMV9, JPEG/MJPEG,

HEVC/H.265, VP8, VP9, MVC

• Hardware Encode: AVC/H.264, JPEG/MJPEG, HEVC/H.265, VP8, VP9, MVC

• Display: HDMI 1.4 (resolution up to 3840x2160 at 30Hz), LVDS (dual channel

48-bit, resolution up to 1920x1200 at 60Hz)

I/O Devices

• COM Header • Two (2) front accessible ports (JCOM1 supports two RS232/RS422/RS485)

• SATA Port • One (1) SATA 3.0 port (I-SATA1)

• Audio Port

• One (1) HD Audio header with Mic-in/Line-out (Realtek ALC888S) (Audio on

A2SAP-H/-E/-L only supports 0-60ºC)

• SMBus Header

• SMCI EI/O

• One (1) SMBus box header

• One (1) Supermicro I/O Header (HDMI, Two PCI-E x1, Two USB 2.0, LPC,

SATA, SMBus, Power)

Peripheral Devices

• One (1) USB 3.0 port on the rear I/O panel (JUSB1)

• One (1) USB 2.0 header (J6)

BIOS

• 128Mb SPI AMI BIOS

®

• ACPI 3.0, SMBIOS 2.7, PCI F/W 3.0, BIOS rescue hot-key, RTC (Real Time Clock) wakeup

Motherboard Features

15

Chapter 1: Introduction

Motherboard Features

Power Management

• ACPI power management

• S3, S4, S5

• Power button override mechanism

• Power-on mode for AC power recovery

• Wake-On-LAN

• TXE Management Engine

• Force Power On by Jumper

• RTC Battery (typical voltage: 3.0V, normal discharge capacity: 210mAh)

System Health Monitoring

• Onboard voltage monitoring for +3.3V, +5V, +3.3V standby, VBAT, Vcore, system temperature, and memory temperature

• CPU switching phase voltage regulator

• CPU thermal trip support

System Management

• Trusted Platform Module (TPM) 1.2/2.0 support (supported by the Supermicro E I/O, JEIO1, header)

• SuperDoctor® 5, Watch Dog, NMI, RoHs

LED Indicators

• Power LED

• HDD Activity LED

• LAN Activity LED

Dimensions

• 2.83" (L) x 3.93" (W) (72mm x 100mm) SBCs

• Height: A2SAP-H/-E 42.93mm, A2SAP-L 32.94mm

Environment

• Operating Temperature Range: A2SAP-H/-E/-L support -30°C ~ 75°C (-22°F - 167°F)

• Non-Operating Temperature Range: -40°C - 85°C (-40°F - 185°F)

• Operating Relative Humidity Range: 8% - 90% (non-condensing)

• Non-Operating Relative Humidity Range: 10% - 95% (non-condensing)

Note 1: The CPU maximum thermal design power (TDP) is subject to chassis and

heatsink cooling restrictions. For proper thermal management, please check the chas-

sis and heatsink specications for proper CPU TDP sizing.

16

A2SAP-H/-E/-L User's Manual

Note: This is a general block diagram and may not exactly represent the features on

your motherboard. See the previous pages for the actual specications of your moth-

erboard.

Figure 1-3.

System Block Diagram

21

USB 3.0

HDMI

Mini-PCIe Slot

DUAL CHANNEL

DDR3L 1866 MHz

MAX. 8G SO-DIMM SUPPORTED

HDMI connector

DDI0

COM 1 / 2 (RS232 / 422/ 485)

FLASH

SPI 128Mb

SPI

FST_SPI

SATA

6Gb/s

M.2 SLOT (B KEY)

USB2.0[7]

LPC

SIO

GPIO

NCT5523

SATA 6Gb/s

I-SATA0

LVDS Connector

DP to LVDSBridge

PTN3460

5.0GT/s

PCIe Gen2 x 1

PCIE[0]

2.5GT/s

GBE

GLAN2 (LAN2)

INTEL I210

PCIE[2]

GLAN2 (LAN1)

INTEL I210

RJ45 (JLAN2)

PCIE[1]

PCIe Gen2 x 1

5.0GT/s

PCIe Gen2 x 1

PCIE[3]

5.0GT/s

DDI1

PCIe Gen2 x 2

(HDMI / DP)

PCIE[4/5]

EIO (PCIE / USB2.0 / LPC (PORT80) / SATA/SMB

480Mb/s

Audio

eDP

High Definition

ALC888S-VD2-GR

REALTEK

FRONT AUDIO Header

Non-ECC-SODIMM0

Rear USB3.0 connector (USB 2)

Rear USB3.0 connector (USB 3)

480Mb/s

SMBUS

SMBUS_HEADER

USB 3.0 [3]

USB 2.0 [2]

USB 2.0 [1]

USB 3.0 [1]

USB 2.0 [0]

USB 3.0 [0]

Rear USB3.0 connector (USB 0)

5.0Gb/s

SATA[1]

SATA[0]

Intel

I/O Panel Layout

LAN1 LAN2

5.0Gb/s

Rear USB3.0 connector (USB 1)

DDR3L non ECC SKU

USB 3.0

DC_IN

RJ45 (JLAN1)

USB2.0[6]

480Mb/s

17

Chapter 1: Introduction

1.2 Processor Overview

Built upon the functionality and capability of the Intel® Atom SoC series processor, the

A2SAP-H/-E/-L motherboard offers maximum I/O expandability, energy efciency, and data

reliability in a 14-nm process architecture, and is optimized for embedded storage solutions,

networking applications, or cloud-computing platforms. The A2SAP-H/-E/-L drastically

increases system performance for a multitude of server applications.

The A2SAP-H/-E/-L supports the following features:

• Intel Virtualization Technology for Directed I/O (Intel VT-d)

• Enhanced Intel SpeedStep® Technology

• Video Connectors: HDMI and LVDS

• Adaptive Thermal Management/Monitoring

• Mini-PCI-E slot with PCI-E Gen2 X1 with transfer rates of up to 5Gb/s

• SATA port with SATA Gen3 with transfer rates of up to 6Gb/s

• System Management Bus (SMBus) Specication, Version 2.0

• M.2 slot with B-key 2242/3042 module is supported by an extender bracket

• Integrated Sensor Hub (ISH)

• Intel® Identity Protection Technology

1.3 Special Features

This section describes the health monitoring features of the A2SAP-H/-E/-L motherboard.

The motherboard has an onboard System Hardware Monitor chip that supports system health

monitoring.

Recovery from AC Power Loss

The Basic I/O System (BIOS) provides a setting that determines how the system will respond

when AC power is lost and then restored to the system. You can choose for the system to

remain powered off (in which case you must press the power switch to turn it back on), or

for it to automatically return to the power-on state. See the Advanced BIOS Setup section

for this setting. The default setting is Last State.

18

A2SAP-H/-E/-L User's Manual

1.4 ACPI Features

ACPI stands for Advanced Conguration and Power Interface. The ACPI specication denes

a exible and abstract hardware interface that provides a standard way to integrate power

management features throughout a computer system including its hardware, operating system

and application software. This enables the system to automatically turn on and off peripherals

such as network cards, hard disk drives and printers.

In addition to enabling operating system-directed power management, ACPI also provides a

generic system event mechanism for Plug and Play and an operating system-independent

interface for conguration control. ACPI leverages the Plug and Play BIOS data structures

while providing a processor architecture-independent implementation that is compatible with

Windows® 10.

1.5 Power Supply

As with all computer products, a stable power source is necessary for proper and reliable

operation. It is even more important for processors that have high CPU clock rates. In areas

where noisy power transmission is present, you may choose to install a line lter to shield

the computer from noise. It is recommended that you also install a power surge protector to

help avoid problems caused by power surges.

1.6 Super I/O

The Super I/O (NCT5523 chip) includes a data separator, write pre-compensation circuitry,

decode logic, data rate selection, a clock generator, drive interface control logic and interrupt

and DMA logic. The wide range of functions integrated onto the Super I/O greatly reduces

the number of components required for interfacing with oppy disk drives.

The Super I/O provides two high-speed, 16550 compatible serial communication ports

(UARTs), one of which supports serial infrared communication. Each UART includes a 16-byte

send/receive FIFO, a programmable baud rate generator, complete modem control capability

and a processor interrupt system. Both UARTs provide legacy speed with baud rate of up to

115.2 Kbps as well as an advanced speed with baud rates of 250 K, 500 K, or 1 Mb/s, which

support higher speed modems.

The Super I/O provides functions that comply with ACPI (Advanced Conguration and Power

Interface), which includes support of legacy and ACPI power management through a SMI

or SCI function pin. It also features auto power management to reduce power consumption.

The IRQs, DMAs and I/O space resources of the Super I/O can be exibly adjusted to meet

ISA PnP requirements, which support ACPI and APM (Advanced Power Management).

19

Chapter 1: Introduction

1.7 Advanced Power Management

The following new advanced power management features are supported by the motherboard.

Management Engine (ME)

Intel Atom SoC only supports the TXE function, also called CSE (Converged Security Engine),

which is the lite ME function.

20

A2SAP-H/-E/-L User's Manual

Chapter 2

Installation

2.1 Static-Sensitive Devices

Electrostatic Discharge (ESD) can damage electronic com ponents. To prevent damage to your

motherboard, it is important to handle it very carefully. The following measures are generally

sufcient to protect your equipment from ESD.

Precautions

• Use a grounded wrist strap designed to prevent static discharge.

• Touch a grounded metal object before removing the board from the antistatic bag.

• Handle the board by its edges only; do not touch its components, peripheral chips, memory

modules or gold contacts.

• When handling chips or modules, avoid touching their pins.

• Put the motherboard and peripherals back into their antistatic bags when not in use.

• For grounding purposes, make sure that your chassis provides excellent conductivity be-

tween the power supply, the case, the mounting fasteners and the motherboard.

• Use only the correct type of CMOS onboard battery as specied by the manufacturer. Do

not install the CMOS battery upside down, which may result in a possible explosion.

Unpacking

The motherboard is shipped in antistatic packaging to avoid static damage. When unpacking

the motherboard, make sure that the person handling it is static protected.

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