© Semiconductor Components Industries, LLC, 2021
June, 2021 − Rev. 1
1Publication Order Number:
EVBUM2798/D
NCL31000ASGEVB User
Guide
EVBUM2798/D
Introduction
This guide explains how to use the NCL31000ASGEVB
with an USB to I2C interface or with an arduino
microcontroller board of choice to evaluate the product.
Board Connections
The NCL31000ASGEVB (Figure 1) is an arduino shield
form factor containing a single NCL31000MNITWG LED
driver. These few steps are required to get started.
1. Connect a lab power supply from 24 V to 57 V to
the DC IN connector. A reverse polarity protection
circuit is in place to protect the system against
faulty connections.
2. Connect a LED string rated for 16 V to 42 V to the
LED connector.
3. Optionally, connect an NTC from the LED module
to the TLED connector to measure the LED board
temperature. If doing so, remove R24 and short
R33, see section LED Power.
4. Connect a microcontroller to the arduino interface
connectors and develop firmware to evaluate the
product.
5. An alternative for step 4 is to use an USB to I2C
interface to send commands from the PC to
NCL31000ASGEVB.
Micro−Controller Interface
The NCL31000 hardware requires at least a GND
connection and an I2C or SPI connection to control the main
functions of the chip. The SCL/SDA and connections are
designated to Arduino pins D15 and D14. All Nucleo boards
can be programmed to route an I2C peripheral to these pins.
The default I2C address is 0x52. This is configurable
with zero−ohm resistors.
The NCL310xx devices are internally hardwired to use
either SPI or I2C. For now, NCL31000ASGEVB is only
available with the I2C version populated. Note that the SPI
slave in NCL310xx only supports Mode 2.
For Visual Light Communication, preferably a DAC
connection or alternatively 2 x PWM connections are
needed. See section Dimming and VLC − YellowDot.
The DAC connection is not specified by the Arduino
hardware interface and different microcontroller boards
connect the DAC to different pins. By default,
the NCL31000ASGEVB assumes the DAC can be
connected to A2 or D13 (see Schematic). This is compatible
with the ST Nucleo boards.
Figure 1. NCL31000ASGEVB
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EVAL BOARD USER’S MANUAL
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DC−DCs
Two DC−DC supplies are available to supply different
parts of the application. VDD1 is a fixed 3.3 V supply rated
to deliver up to 150 mA and VDD2 is configurable, but on
the EVB it is set for 5 V. It can source up to 500 mA. VDD1
and VDD2 are not connected to the arduino interface so
VDD1 does not by default supply the arduino board because
the arduino interface standard does not provide a 3V3 supply
connection. Some arduino micro−controller boards can be
adjusted so that they can be supplied with 3V3. For example,
the nucleo boards normally need one or more solder bridge
configuration changes to be able to get powered from a 3V3
supply. See the VDD1_EXT connection in the schematic.
The VDD2 cannot be used to supply the micro−controller
since it has to be enabled first in a register after startup. Thus,
by default, without making any changes to the hardware, the
micro−controller board has to be supplied by the USB
connection or another supply.
LED Power
This EVB has a significant copper cooling plane for the
top fet of the LED driver. It is therefore possible to drive
LED loads up to 100 W with this EVB. 2 NTC’s are placed
onto the cooling plane to measure the plane’s temperature to
estimate the top fet junction temperature. One NTC is
connected to the TLED metrology measurement pin so that
the temperature can be monitored over I2C. The second
NTC is electrically connected on one side to the copper
plane and one side floating so that a multimeter can measure
the voltage over the NTC. This is an alternative NTC sensing
method. To measure the NTC voltage from the LED board,
make the connection to the TLED connector and solder R24
and remove R33 to disable the top fet measurement.
It is best to replace the sense resistor with 50 m or place
a second resistor in parallel to reduce the temperature of the
sense resistor and the dissipation when going above 1.6 A
LED current or so. See the Thermal section for more info.
Dimming
To make dimming possible, enable the LED driver by
setting the LED_EN bit in the CTRL register and close the
PWM_EN jumper on the EVB.
There are 5 ways to dim the LEDs. The selection for the
first three methods is made with the DIMSEL jumpers. See
Figure 2.
Figure 2. Dimsel
•MDAC: DAC in MCU connected to DIM pin (Arduino:
A2 or D13)
•ADIM: Analog dimming. A low−pass filtered DC
signal converted from a PWM signal from MCU
(Arduino: D5)
•ADIMP: potmeter on the EVB connected to DIM pin
The others are (DIMSEL does not matter):
•PWMDIM: PWM dimming. PWM from MCU directly
to PWM pin (Arduino: D9)
•INTDIM: The internal 7−bit DAC
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INTDIM
The internal 7−bit DAC can be used to DIM the LEDs.
With 128 dimming steps in the entire range this method
provides a coarse method to dim the LEDs. The lowest
current value is about 10 mA if a 100 m sense resistor is
used. If deep dimming or VLC is not needed this method
may suffice. No extra hardware is needed, only the I2C or
SPI interface.
ADIM
The ADIM signal can dim the LEDs with a higher
accuracy and precision compared to the other methods. It is
possible to accurately dim down to about 0.1% of the
maximum range. The accuracy at these low dimming values
is dominated by the relative offset error, which is no more
than a few mV’s or approximately 0.1% of VREF. The
precision or resolution is defined by the amount of steps the
duty−cycle has in the PWM period. For example, if an 8−bit
timer is used, 256 steps are available. PWM oversampling
can increase this number.
The ADIM method is an alternative to the INTDIM
method. Switching between these methods is possible by
controlling the INTDIMEN bit. To use the ADIM method,
the micro−controller must provide a PWM signal with a
frequency preferably between 1 to 10 kHz. The duty−cycle
defines the dim value. This PWM signal is filtered heavily
and the resulting average value is presented to the DIM
input. The resulting LED current is thus a constant current,
not a PWM’ed current. This ADIM or the MDAC method
can use VLC. Next to low pass filtering the PWM signal, the
filtering circuit also couples the VLC signal on the DIM
signal. To make use of this method configure the DIMSEL
jumper for ADIM and pull the PWM pin high by closing the
PWM jumper.
PWMDIM
The PWMDIM does not provide the widest dim range or
best accuracy and should not be used as the primary dim
method, but it can be used on top of the ADIM method to
achieve hybrid dimming and dim to even lower LED
currents. For example, set ADIM to 220 mV and apply a
PWM signal of 1 kHz and 25% duty−cycle to achieve an
average internal DIM voltage of:
200 mV + 0.25 * 20 mV = 205 mV
Important to note is that the measured LED current from
the ILED metrology register is not valid when using
PWMDIM. This is because the ADC sampling is in the range
of 100 ms and the PWMDIM frequency is the range of
400 Hz and higher and thus oversampling is not possible and
no averaging can be done.
MDAC
This method uses the DAC in the micro−controller, if
available. This method can dim the LEDs and still have the
possibility to use VLC. To use the DAC, route it to A2 or D13
on the Arduino interface (possible for Nucleo−64 or
Nucleo−144 connections) and configure DIMSEL jumper
for ’MDAC’. When using the DAC you cannot use the
SPI_CLK and thus only I2C is an option. One exception is
the Nucleo−64 boards, which connect the DAC to A2 on the
Arduino interface. Also pull the PWM pin high by closing
the PWM jumper.
ADIMP
The potmeter on the EVB can be used to apply a voltage
on the dim pin and manually control the LED current. To
make use of this method configure the DIMSEL jumper for
ADIMP and pull the PWM pin high by closing the PWM
jumper.
Status Indication
The boards have four LEDs. Two green LEDs to indicate
the 3V3 (VDD1) and 5 V (VDD2) supplies are active. Note
that VDD1 must be active on power up. This is a good check
to see if the board (supplies) is operational. VDD2 is
disabled at startup and can be enabled in a register. The
orange INTB LED is active if the INTB line is low. This is
the case when a fault bit is active or became active since the
last read. The red FAULT LED can be used by the
micro−controller.
VLC − YellowDot
The YellowDot program is a luminaire certification
program that allows manufacturers to test and certify that
their LED luminaires are interoperable with Signify’s indoor
positioning technology. A key aspect of YellowDot ready
LED drivers is that data can be transmitted by modulating
data onto the LED current and thus in the light output. The
NCL310xx products are Yellow−dot compatible. This
means that it is possible to modulate the LED current
conform to the Yellow–dot specification. Contact Signify
for more information about this program and the technical
requirements. Modulating the data on the DIM pin can be
done either by using the MDAC (preferred) method or by
using the ADIM method together with the PWMVLC signal.
VLC with MDAC
The DAC voltage controls the DIM voltage directly.
When no data is transmitted, it should regulate a stable DC
value to provide a stable LED current. When transmitting
data, the DAC voltage swings between the 3 voltage levels
at the symbol rate.
VLC with ADIM + PWMVLC
An alternative for the DAC is to use 2 PWM signals. One
is for setting the DC dim value using the ADIM method and
the other PWM signal is connected to the PWMVLC signal.
The PWMVLC data is coupled onto the DIM signal. The
frequency must be about 200 kHz or more. A digital one is
represented by a duty−cycle of 50% + k. A digital zero is
represented by a duty−cycle of 50% − k. The resulting signal
is a 200 kHz PWM signal for which the duty−cycle varies
between 2 values (0.5 − k and 0.5 + k). The symbol rate of
the VLC signal (typ: 4 kHz) is defined by the rate at which
the duty−cycles alternate. The ’k’ value defines the
amplitude of the VLC signal. After filtering the resulting
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signal is a 4 kHz AC signal with a given amplitude. This
signal is capacitively coupled on the DIM signal so for this
to work the ADIM dimming method must be used to define
the DC DIM level.
Thermal
The highest temperatures on the board are to be expected
in the top fet of the LED driver and in the sense resistor of
the LED driver.
LED Sense Resistor
It is best to keep the sense resistor value as small as
possible without impacting the dynamic dimming range too
much. Keep the power dissipation in the 6430 package
below 400 mW. Ideally 200 mW. It is possible to add a sense
resistor in parallel to spread the dissipation (1% or better).
For example, a 120 m 6430 package with a 0.62 3216
package in parallel gives 100 m and a better spreading of
heat.
Thermal Plane
The power dissipation in the top fet is dominated by
switching and conduction losses. The device used on the
board is carefully selected to achieve the lowest power
dissipation. Still, mainly depending on the input voltage,
switching frequency and during highest current, the power
dissipation (Pt) can reach up to about 1.2 W in this device.
A copper cooling plane is required to transfer enough heat
to the environment to keep the temperature of the fet in 4
check. The cooling plane is about 3 x 2 cm. It is present on
3 layers: top, bottom, and one internal layer. The remaining
internal layer is reserved for a ground plane. The copper
extends to the edges of the board. The layers are
interconnected by via’s. See Figure 3. The red area is the
copper plane on the top copper. This copper plane is a bit
overkill for applications that do not require 90 W or more.
Figure 3. Copper Plane
Erratum
Boards with version «ncl31000as» and date
«25/03/2021» had a mistake in the arduino pinout. Headers
J6 and J7 are swapped in the layout and do not correspond
with the correct arduino placement. Modifications have
been made to these connectors so that the board can still be
plugged on top of an arduino mcu. 5 pins have been cut and 3
connections rewired.
Because of this patch the arduino shield fits an arduino
microcontroller board and it can be used as expected except
for the PWM1 pin which is not available due to this patch.
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SCHEMATIC
100 k
R2
100 k
R1
VBB
M2G
TP6
VBB
100 n
100 V
C8
GND
VBB1
100 n
100 V
C9
22 F
100 V
C6
VINP 280 @ 100 MHz
L 1
TP4
VINP
100 m 1% 3 W
R11
12
D1
SVSS SGND
PSNSN_CH1
PSNSP_CH1
TP7
L 2 VBB_LED
A1
A2
J5
DC IN
Q1
56 F
80 V
C7
i
HV
i
HV
i
HV
i
HV
i
HV
VSS
8 @ 100 MHz VBB_LED
IORE F
NR ST
VI N
A 1
A 3
A 4
A 5
1
2
3
4
5
6
7
8
J1
Power
1
2
3
4
5
6
J2
Analog in
SCL
SDA
AVDD
GND
SCK/DAC
MISO
MOSI
D4
1
2
3
4
5
6
7
8
9
10
J6
1
2
3
4
5
6
7
8
J7
GND
T P3 NC
T P2 NC
T P1 NC
VDD 2
A 0
A2/D A C
D1
D0
INTB
VDD1_ E X T
D9
D5
D10
D6
D7
D4
D3
D2
D1
D0
D8
D11
D12
D13
D14
D15
PWM2
PWM1
PWMVLC
CS1
CS2
ADIM1
ADIM2
*SB 2
TP57
GND
TP58
GND
GND
TP59
GND
SCL
SDA
ADI M1
Reverse polarity protection + overvoltage protection
Arduino headers Board pin−out Arduino pin−out
GND
5VOUT
3V3OUT
RST
100 k
R3
33 k
R4
VDD1
LED_FAULT L ED_POE
DEVDET
DEVDET
ADIM1
INTB
INT#
DIO13
DIO14
DIO12
DIO3
DIO3
DIO2
DIO1
DIO0
DIO6
DIO5 SCL
SDA
GND
3
1
4
2
56
78
910
1112
1314
1516
J4
RSL10
VDD2
*SB1
PWMVLC
ADIM2
PWM1
RSL10 headers
VDD1
39 k
R16
VDD1VDD2
LED4
/INT
390 E
R1 5
L E D1
3V3
L E D3
FAULT
LED_FAULT
2.2 k
R1 2
1 k
R1 3
2.2 k
R1 4
L E D2
5V
Status
GND GND GND
INTB
GND GND
R44
1
2 3
Q4
2N7002W T1G
1
2 3
Q5
2N7002WT1G
C3
100 k
R 9
10 k
R1 0
VDD1
INT#
33 k
R 8
VCC
8
A0
1
A1
2
A2
3
SCL
6
SDA 5
WP
7VSS 4
U1
CAT24C512WI−GT3
GND
16V
C5
GND
VDD 1
VDD 1
GND
SCL
SD A
GND GND GND
1
16 V
1
Strata EEPROM & HOT PLUG Detection
Pulse INT# on plug event
34 k, 1 F = 50 ms negative pulse
System can also mask INT# for level based interrupt.
Pull gate of first FET low to disable pulse INT# events.
Headers J6 and J7 are swapped in the layout
and do not correspond with the correct arduino
placement. Modifications have been made to
these connectors so that the board can still be
plugged on top of an arduino mcu. The PWM1
pin is not available due to this patch.
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ADIM + VLC
UVLO
4
CADC
30
VREF
28
P9V
18
PWM
24
AD1/CSB
31
SDA/MOSI
32
SCL/CLK
33
INTB
34
DIM
27
AD2/MISO
35
P9V
45
U4B
10 n
C20
GNDGNDGND
16 V
C17
GND
100 n
25 V
C18
10 V
C19
TP23
VREF
TP22
P9V TP24
CADC
VRE
F
DIM
P9V
PWM _PIN
UVLO
CADC
INT_PIN
SDA/MOSI
SCL/CLK
ADDR1/ CSB
ADDR2/MISO
2
3
1
D6
BAT54ALT1G
2
3
1
D5
BAT54ALT1G
GND GND
SCL
SDA
MOSI
2
3
1
D7
BAT54ALT1G
GND
R26 100E
100E
R25
4k7
R22
4k7
R21
VDD1
SCK/DAC
CS1
JP2
PWMEN
VDD1
MISO
INTB
PWM1
100ER28
100E
R29
100E
R30
100E
R27
47 k
R35
130k
R34
VSS
13
2
100 k
P1
ANADIM
GND
VRE
F
VBB
i
SN
GND
GND
GND
100 n
25 V
C11
GND
10 V
C12
VCC
5
OE
1
A
2
Y4
GND 3
U2
NL 17SZ 125DFT 2G
10 k
R17
10 k
R19
50 V
4 n7n
C14
16 V
C13
GNDGND
TP9
PWM_VLC
4k7
R18
2 k
R20
TP11
D2
TP10
D1
TP15
CL
VRE
F
TP8
PWM_DIM
UVLO:VBB < 20 V
i
SN
PWMVLC
ADIM1
TP19
UVLO
MCUDAC
ADIM _POT M
ADIM
MCUDAC
ADI M POTM
ADI M
GND
1 k
R31
MCUDAC SEL
iSN
iSN
SCK/DAC
A2/DAC
TP21 DIM
GND
VDD1
10 k
R32
*
SB3
*
SB4
1 n
100 V
C15
12
J8A
3 4
J8B
56
J8C
DIMSEL
T P14 A D1/C S
T P12 SDA /M OSI
T P13 SC L /C L K
T P16 A D2/M ISO
T P17 INT
T P18 PW M
0ER45
0E
R46
0E
R47
0E
R48
620k
R49
100 V
1 n C10
VSS
0E
R6
0E
R5
0E
R7
0E
R23
2.2
1
2.2
1
2
L 6
100 μH
VDD2GB
VDD2 SW
IVDD 2
VDD2 sns
GND
6V3
C39
6V3
C41
GND
GND
TP35
VDD2
GND
0.75 E
R41
12
L5
390 μH
IVDD1
3V3 inp NCL31001
VDDsns
FDC86 02
Q8A
GND
VDD1SW
VDD1GB
GND
6V3
C38
6V3
C40
TP34
VDD1
VDD1
VDD2
VBB
3
VSS
8
PSNSN
10
PSNSP
11
GND
40
GND
43
GND
17
GND
20
GND
13
GND
29
N3V3
2
VBB
41
EP
49
U4A
NC
5
NC
6
NC
7
NC
9
NC
12
NC
1
U4E
16 V
C25
VSS
GND
N3V3
PSNSP_CH1
PSNSN_CH1
VDD1_ EXT
*SB9
VBB_LED
470 n
10 V
C16
i
HV
i
HV
1
22 22
47 F47 F
D10
NSPM0051MUT5G
DCDC
VBB_L
E D
10 n
25 V
C23
GND
GND
43
12
L 9
TP30
LDSNSP
TP31
LDSNSN
TP27
VG T
TP26
VGB
160E
R3 6
GND GND
T P33
VL E D+
50 V
10 n
C21
LDSW VL E D+
VL E D−
LDGT
LDGB
100 m
1%
1 W
R40
TP28
VSW
GND
33E
R38
L 7
L 8
12
L 4
74479876124C
4.7 n
100 V
C37
150 p
100 V
C29
GND
L DC M P
LDSNSN
LDSNSP
TEMP
VLED
iSN
i SN
470n
100V
C3 1
470n
100V
C3 2
470n
100V
C2 4
470n
100V
C3 4
FDM A037N0 8L C
Q7
VBB_L
E D
GND
470 p
100 V
C36
GND
470 p
100 V
C35
i
SN
i
SN
TP25
LDCMP
TP36
LED+
TP37
LED−
10 k
R39
20 k
R37
GND
BST
50 V
10 n
C22
12
D9
BAS21AHT1G
G
DS
Q6
NVT FS6H8 88N
12
D8
BAS21AH
T 1G
i
HV
GND
GND GND
100 n
100 V
C28
1 2
Rt1
NCP18WF104F12RB
Measure temperature top fet copper plane − Multimeter
TP32
Tfet
TP29
TEMP
100 k
R43
VREF
Measure temperature top fet copper plane
100 n
100 V
C33
i
HV
iHV
i
HV
i
HV
i
HV
i
HV
i
HV
i
HV
1 2
L 3
7447709470
400 n
100 V
C26
470 n
100 V
C27
A1
A2 J3
LED
A1
A2 J9
TLED
GND
1
2
Rt2
NCP18WF104F12RB
i
TN
GND
0E
R24
0E
R33
LDGT
BST
LDSW
LDGB
VLED
LDSNSP
LDSNSN
TLED
LDCMP
110 @ 100 MHz
110 @ 100 MHz
LED Driver
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Table 1. BILL OF MATERIAL
Qty Designator Manufacturer Part No. Value Footprint Description
1 D1 ON Semiconductor MMSZ5245BT1G ONSC−SOD−123−2−42
5−04_V
Zener Voltage Regulator, 500 mW,
2−Pin SOD−123, Pb−Free,
Tape and Reel
1 J1 Samtec SSQ−108−03−F−SSSQ−108−03−X−SBoard−To−Board Connector,
2.54 mm, 8 Contacts, Receptacle,
Through Hole, 1 Rows
1 J2 Samtec SSQ−106−03−G−SSSQ−106−03−X−SBoard−To−Board Connector,
2.54 mm, 6 Contacts, Receptacle,
Through Hole, 1 Rows
1 J3 Weidmueller 1862960000 SC_SMT_3_81_90G_0
2
OMNIMATE Signal − series
BC/SC 3.81
1 J4 61201621721 61201621721 Male Box Header WR−BHD, THT,
Angled, pitch 2.54 mm, 16 pins
1 J5 Weidmueller 1862960000 SC_SMT_3_81_90G_0
2
OMNIMATE Signal − series
BC/SC 3.81
1 J6 Samtec SSQ−110−03−G−SSSQ−110−03−X−SBoard−To−Board Connector,
2.54 mm, 10 Contacts,
Receptacle, Through Hole,
1 Rows
1 J7 Samtec SSQ−108−03−G−SSSQ−108−03−X−SBoard−To−Board Connector,
2.54 mm, 8 Contacts, Receptacle,
Through Hole, 1 Rows
1 J9 Weidmueller 1862960000 SC_SMT_3_81_90G_0
2
OMNIMATE Signal − series
BC/SC 3.81
1 L3 7447709470 WE−PD−XXL SMD−Shielded Power Inductor
WE−PD, L = 47.0 H
1 L4 Wurth Electronics 74479876124C SMD 0806 Power Multilayer Inductor
WE−PMI, L = 0.24 H
1 L5 Wurth Electronics 744777239 WE−PD 7345 SMD−Shielded Power Inductor
WE−PD, L = 390 H
1 L6 Wurth Electronics 7447714101 WE−PD 1050 SMD−Shielded Power Inductor
WE−PD, L = 100 H
1 U1 CAT24C512WI−GT3 FP−751BD−01−IPC_C IC EEPROM 512K I2C 1 MHZ
8SOIC
1 U2 ON Semiconductor NL17SZ125DFT2G FP−419A−02−MFG IC BUFFER NON−INVERT 5.5 V
SC88A
1 U4 ON Semiconductor NCL31000 485EP
2D8, D9 ON Semiconductor BAS21AHT1G ONSC−SOD−323−2−47
7−02_V
Low Leakage Switching Diode,
2−Pin SOD−323, Pb−Free,
Tape and Reel
2Q4, Q5 ON Semiconductor 2N7002WT1G ONSC−SC−70−3−419−
04_V
Small Signal MOSFET, 60 V,
340 mA, Single, N−Channel, 3−Pin
SC70, Pb−Free, Tape and Reel
2Rt1, Rt2 NCP18WF104F12RB FP−NCP18−0_15−IPC_
C
NTC Thermistor for Temperature
Sensor, 0603, 100 kO, 1%,
0.032 mA, 5 V
3D5, D6, D7 ON Semiconductor BAT54ALT1G ONSC−SOT−23−3−318
−08_V
Schottky Barrier Diodes, 3−Pin
SOT−23, Pb−Free, Tape and Reel
5SB1, SB2,
SB3, SB4,
SB9
1005−SB−2Solder bridge
5R5, R7,
R33, R46,
R47
CRG0603ZR OE RESC1608L Resistor
1 R42 RL1220S−R20−F 0.2E RESC2012N Resistor
EVBUM2798/D
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8
Table 1. BILL OF MATERIAL (continued)
1R41 RCWE0603R750FKE
A
0.75E RESC1608N Resistor
2R13, R31 CRGCQ0603F1K0 1 k RESC1608L Resistor
1 C10 TDK CGA3E2X7R2A102M
080AA
1 n CAPC1608L Capacitor
1 C15 TDK CGA3E2X7R2A102M
080AA
1 n CAPC1608L Capacitor
5C3, C5,
C13, C17,
C25
TDK C1608X7R1C105K08
0AC
1 CAPC1608L Capacitor
1 R44 Harwin D3082−05 2 pins Groundbar D3082−05 2 (1 x 2) Position Shunt Connector
Non−Insulated 0.400 (10.16 mm)
Gold
1 R20 CPF0603F2K0C1 2 k RESC1608L Resistor
2R12, R14 CRGCQ0603F2K2 2.2 k RESC1608L Resistor
1 C12 TDK C2012X7R1C225K12
5AB
2.2 CAPC2012N Capacitor
1 C19 TDK C2012X7R1C225K12
5AB
2.2 CAPC2012N Capacitor
1 J8 Wurth Electronics 61300621121 2.54 mm THT
Dual Pin
Header, 6p
61300621121 Board−To −Board Connector,
Vertical, 2.54 mm, 6 Contacts,
Header, WR−PHD Series,
Through Hole
3R18, R21,
R22
CRG0603F4K7 4k7 RESC1608L Resistor
1 C14 TDK CGA3E2X7R1H472
M080AA
4.7 n CAPC1608L Capacitor
1 C37 TDK C1608X7R2A472K08
0AA
4.7 n CAPC1608L Capacitor
1 L2 Wurth Electronics 7427922808 8 @
100 MHz
WE−MPSB_0603 WE−MPSB EMI Multilayer Power
Suppression Bead, size 0603,
8 @ 100MHz
5R10, R17,
R19, R32,
R39
CRGCQ0603F10K 10 k RESC1608L Resistor
3C20, C21,
C22
TDK CGA3E2X7R1H103K
080AA
10 n CAPC1608L Capacitor
1 R37 CPF0603F20KC1 20 k RESC1608L Resistor
2C38, C40 KEMET C1206C226K9PACT
U
22 CAPC3216N Capacitor
1 C6 Nichicon UVR2A220MED 22 FCAPPR2.5−6.3x11 Capacitor
1 D10 ON Semiconductor NSPM0051MUT5G 30 kV ESD
70 A 8/20 s
Surge
Case 517CZ Transient Voltage Suppressors
1 R38 CRGCQ0603F33R 33E RESC2012L Resistor
2R4, R8 CRGCQ0603F33K 33 k RESC1608L Resistor
1 R16 CRGH0603F39K 39 k RESC1608L Resistor
1 R35 CRGCQ0603F47K 47 k RESC1608L Resistor
2C39, C41 KEMET C1210C476M9PAC 47 FCAPC3225N Capacitor
1 C7 KEMET A759MS566M1KAAE
045
56 FCAPPR5−10x12.5 Capacitor
1 Q6 ON Semiconductor NVTFS6H888N 80 V, 13 A,
55 m
MKT−MLP08T Power MOSFET 80 V, 55 m, 13 A,
Single N−Channel
1 Q7 FDMA037N08LC 80 V, 6 A,
36.5 m
Case 511DB MOSFET FET 80 V 3.7 M
MLP33
EVBUM2798/D
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9
Table 1. BILL OF MATERIAL (continued)
4R25, R26,
R29, R30
CRGCQ0603F100R 100 E RESC1608L Resistor
1 P1 Vishay TS53YJ103MR10 100 k TS53YJ 5 mm Square Surface Mount
Miniature Trimmers Single−Turn
Cermet Sealed 5 K 250 mW
35.4 V 20%
5R1, R2, R3,
R9, R43
CRGCQ0603F100K 100 k RESC1608L Resistor
1 R40 LVM25FVR100E−TR 100 m RESC6332N Resistor
1 R11 CRA2512−FZ−R100
ELF
100 m 1%
3W
RESC6332N Resistor
3C11, C18,
C23
AVX 06033C104KAT4A 100 n CAPC1608L Capacitor
4C8, C9,
C28, C33
TDK C2012X7R2A104K12
5AA
100 n CAPC2012L Capacitor
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1
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