SERVICE MANUAL
Contents
1. OUTLINE OF CIRCUIT DESCRIPTION ............................... 3
2. DISASSEMBLY ................................................................... 12
3. ELECTRICAL ADJUSTMENT ............................................. 16
4. USB STORAGE INFORMATION REGISTRATION ............ 22
5. TROUBLESHOOTING GUIDE............................................ 23
6. PARTS LIST........................................................................ 24
CIRCUIT DIAGRAMS & PRINTED WIRING BOARDS........... C1
CAUTION : Danger of explosion if battery is incorrectly replaced.
Replace only with the same or equivalent type recommended by the
manufacturer.
Discard used batteries according to the manufacturer’s instructions.
NOTE : 1. Parts order must contain model number, part number, and description.
2. Substitute parts may be supplied as the service parts.
3. N. S. P. : Not available as service parts.
Design and specification are subject to change without notice.
SG216/U, EX, GX, U2, EX2, GX2 (R)
REFERENCE No. SM5310741
FILE NO.
Digital Camera
VPC-E10
(Product Code : 168 143 01)
(U.S.A.) (Canada)
VPC-E10EX
(Product Code : 168 143 02)
(Europe) (U.K.) (South America)
(China) (Australia) (Hong Kong)
(Russia) (Middle East) (Africa)
(General) (Korea) (Taiwan)
RoHS
•This product does not contain any hazardous substances prohibited by the RoHS
Directive.
WARNING
•You are requested to use RoHS compliant parts for maintenance or repair.
•You are requested to use lead-free solder.
(This product has been manufactured using lead-free solder. Be sure to follow the
warning given on page 2 when carrying out repair work.)
VPC-E10GX
(Product Code : 168 143 03)
(South America) (China)
(Australia) (Hong Kong)
(General) (Korea) (Taiwan)
VPC-E10BK
(Product Code : 168 143 04)
(U.S.A.) (Canada)
VPC-E10EXBK
(Product Code : 168 143 05)
(Europe) (U.K.) (South America)
(China) (Australia) (Hong Kong)
(Russia) (Middle East) (Africa)
(General) (Korea) (Taiwan)
VPC-E10GXBK
(Product Code : 168 143 06)
(South America) (China)
(Australia) (Hong Kong)
(General) (Korea) (Taiwan)
– 2 –
WARNING
Do not use solder containing lead.
This product has been manufactured using lead-free solder in
order to help preserve the environment.
Because of this, be sure to use lead-free solder when carrying
out repair work, and never use solder containing lead.
Lead-free solder has a melting point that is 30 - 40°C (86 -
104°F) higher than solder containing lead, and moreover it does
not contain lead which attaches easily to other metals. As a
result, it does not melt as easily as solder containing lead, and
soldering will be more difficult even if the temperature of the
soldering iron is increased.
The extra difficulty in soldering means that soldering time will
increase and damage to the components or the circuit board
may easily occur.
Because of this, you should use a soldering iron and solder
that satisfy the following conditions when carrying out repair
work.
Soldering iron
Use a soldering iron which is 70 W or equivalent, and which
lets you adjust the tip temperature up to 450°C (842°F). It
should also have as good temperature recovery characteris-
tics as possible.
Set the temperature to 350°C (662°F) or less for chip compo-
nents, to 380°C (716°F) for lead wires and similar, and to 420°C
(788°F) when installing and removing shield plates.
The tip of the soldering iron should have a C-cut shape or a
driver shape so that it can contact the circuit board as flat or in
a line as much as possible.
Solder
Use solder with the metal content and composition ratio by
weight given in the table below. Do not use solders which do
not meet these conditions.
Lead-free solder is available for purchase as a service tool.
Use the following part number when ordering:
Part name: Lead-free solder with resin (0.5 mm dia., 500 g)
Part number: VJ8-0270
Metal content
Tin (Sn) Silver (Ag)
Copper (Cu)
Composition
ratio by weight
96.5 %
3.0 %
0.5 %
Note:
If replacing existing solder containing lead with lead-free sol-
der in the soldered parts of products that have been manufac-
tured up until now, remove all of the existing solder at those
parts before applying the lead-free solder.
The components designated by a symbol ( ! ) in this schematic diagram designates components whose value are of
special significance to product safety. Should any component designated by a symbol need to be replaced, use only the part
designated in the Parts List. Do not deviate from the resistance, wattage, and voltage ratings shown.
PRODUCT SAFETY NOTICE
– 3 –
1. OUTLINE OF CIRCUIT DESCRIPTION
1-1. CCD CIRCUIT DESCRIPTION
1. IC Configuration
The CCD peripheral circuit block basically consists of the fol-
lowing ICs.
IC914 (ICX665SQC) CCD imager
IC905 (ADDI7000BCPZRL) CDS, AGC, A/D converter,
H driver
IC901 (LR366877) V driver
2. IC914 (CCD)
Interline type CCD image sensor
Optical size 1/2.3 type
Effective pixels 3264 (H) x 2448 (V)
Pixels in total 3336 (H) x 2484 (V)
Optical black
Horizontal (H) direction: Front 6 pixels, Rear 39 pixels
Vertical (V) direction: Front 12 pixels, Rear 2 pixels
Dummy bit number Horizontal : 14
Fig. 1-1.Optical Black Location (Top View)
Fig. 1-2. CCD Block Diagram
Table 1-1. CCD Pin Description
Pin No.
1
Symbol
2
3
4
5
6
7
8
9
10
øSUB
V
L
øVOG
øLV
VGND
Vø
1A
Vø1B
Vø3A
Vø3B
Pin Description
Substrate clock
Protection transistor bias
Vertical register end stage control clock
Vertical register transfer clock
Vertical - holizontal shift clock
Pixel area GND
Vertical register transfer clock
Vertical register transfer clock
Vertical register transfer clock
Vø2
Vertical register transfer clock
Pin No.
15
Symbol
16
17
20
21
22
23
24
25
26
Vø
5C
Vø6S1
Vø6S2
VOUT
VDD
NC
øRG
AGND
AGND
Pin Description
Vertical register transfer clock
Vertical register transfer clock
Vertical storage control clock 2
Circuit GND
Signal output
Circuit power
NC
Reset gate clock
Circuit GND
NC NC
11
Vø
3C
Vertical register transfer clock
12
Vø4
Vertical register transfer clock
13
Vø5A
Vertical register transfer clock
14
Vø5B
Vertical register transfer clock
27
HGND
Horizontal transfer register GND
28
CSUB
Substrate bias
29
SUB_CONT
Substrate bias control
30 NC
NC
31 NC NC
32
NC
NC
33 øLH1
Horizontal register end stage transfer clock
34 øH1 Horizontal register transfer clock
35 øH2 Horizontal register transfer clock
36
øH3
Horizontal register transfer clock
2
12
39
6
H
V
Pin 1
Pin 20
18
Vø
ST2 Vertical storage control clock 2
19
Vø
ST1 Vertical storage control clock 1
37
Vø
HLD1
Vertical signal hold clock 1
38
VøHLD2
Vertical signal hold clock 2
– 4 –
Fig. 1-3. IC901 Block Diagram
3. IC905 (H Driver) and IC901 (V Driver)
An H driver and V driver are necessary in order to generate
the clocks (vertical transfer clock, horizontal transfer clock and
electronic shutter clock) which driver the CCD. IC901 is a V
driver, and the XV1-XV15 signals which are output from IC101
are the vertical transfer clocks, and the XSG signal which are
output is superimposed at IC901 in order to generate a ter-
nary pulse. In addition, the XSUB signal which is output from
IC101 is used as the sweep pulse for the electronic shutter. H
driver has inside IC905 and generate H1, H2, H3 and RG
clock at IC905.
4. IC905 (CDS, AGC Circuit and A/D Converter)
The video signal which is output from the CCD is input to pins
(25) of IC905. There are inside the sampling hold block, AGC
block and A/D converter block. Settings of sampling phase
and AGC amplifier is carried out by serial data of pins (32),
(33) and (34). The video signal is converted A/D converter,
and output to LVDS.
Fig. 1-4. IC905 Block Diagram
V11A-V15A,
V18A
V16A-V17A
V16B-V17B
POFD
VH16AX-
VH17AX
V1X-10X
V11X-V15X,
V18X
VH11AX-
VH15AX,
V18AX
V16X-V17X
VH16BX-
VH17BX
V1-V10
MIX
VL
GND
VL
GND
VH
MIX
VL
GND
VH
MIX
VL
GND
VH
VL
VH
OFDX
VH
VL VDD
GND
CCDINP
HL
H1 TO H4
HD
SDATA
SCK
SL
REFB
REFT
PRECISION
TIMING
GENERATOR
TG CORE
VGA
12-BIT
ADC
6~42 dB
VREF
CLAMP
INTERNAL
REGISTERS
INTERNAL
CLOCKS
CDS
HORIZONTAL
DRIVERS
4
ADDI7000
-3, 0, +3, +6dB
VD
CLI
RG
GP01
3V INPUT
1.8V OUTPUT
LDO
REG
GP02
TCLKP
REDUCED
RANGE
LVDS
OUTPUT
TCLKN
DOUT0P
DOUT0N
DOUT1P
DOUT1N
CCDINM
– 5 –
1-2. CP1 CIRCUIT DESCRIPTION
1. Circuit Description
1-1. Signal processor
1. γ correction circuit
This circuit performs (gamma) correction in order to maintain
a linear relationship between the light input to the camera
and the light output from the picture screen.
2. Color generation circuit
This circuit converts the CCD data into RGB signals.
3. Matrix circuit
This circuit generates the Y signals, R-Y signals and B-Y sig-
nals from the RGB signals.
4. Horizontal and vertical aperture circuit
This circuit is used gemerate the aperture signal.
1-2. AE/AWB and AF computing circuit
The AE/AWB carries out computation based on a 64-seg-
ment screen, and the AF carries out computations based on
a 6-segment screen.
1-3. SDRAM controller
This circuit outputs address, RAS, CAS and AS data for con-
trolling the SDRAM. It also refreshes the SDRAM.
1-4. SIO
This is the interface for the 8-bit microprocessor.
1-5. PIO/PWM/SIO for LCD
8-bit parallel input and output makes it possible to switch be-
tween individual input/output and PWM input/output.
1-6. TG/SG
Timing generated for 10 million pixel CCD control.
1-7. Digital encorder
It generates chroma signal from color difference signal.
2. Outline of Operation
When the shutter opens, the serial signals (“take a picture”
commands) from the 8-bit microprocessor are input and op-
eration starts. When the TG/SG drives the CCD, picture data
passes through the A/D and CDS, and is then input to the
ASIC as 12-bit data.
The AF, AE, AWB, shutter, and AGC value are computed from
this data, and three exposures are made to obtain the opti-
mum picture. The data which has already been stored in the
SDRAM is read by the CPU and color generation is carried
out. At this time, correction of the lens distortion which is a
characteristic of wide-angle lenses is carried out.
After AWB and γ processing are carried out, a matrix is gen-
erated and aperture correction is carried out for the Y signal,
and the data is then compressed by JPEG and is then written
to card memory (SD card).
When the data is to be output to an external device, it is taken
data from the memory and output via the USB. When played
back on the LCD and monitor, data is transferred from memery
to the SDRAM, and the image is then elongated so that it is
displayed over the SDRAM display area.
3. LCD Block
The LCD display circuit is located on the CP1 board, and
consists of components such as a power circuit and VCOM
control circuit.
The signals from the ASIC are 8-bit digital signals, that is
input to the LCD directly. The 8-bit digital signals are con-
verted to RGB signals inside the LCD driver circuit. The LCD
is input signals from ASIC directly to the LCD, and function
such as image quality are controlled.
In addition, the timing pulses for signals other than the video
signals are also input from the ASIC directory to the LCD.
– 6 –
4. Lens drive block
4-1. Zoom drive
The parallel signals (ZIN1 and ZIN2) which are output from
the ASIC (IC101) are used to drive (ZOUT1 and ZOUT2) by
the motor driver IC (IC951), and then used to drive the zoom
DC motor. Detection of the standard zooming positions is car-
ried out by means of signal (ZPROUT) from the photoreflector
by ASIC is detecting inside the lens block. Also, getting of the
zooming positions is carried out by the ASIC (IC101) counting
the signal (ZPIOUT) from the photointerruptor.
4-2. Focus drive
The serial data signals (L_DATA, L_SCLK, L_STB and FCLK)
which are output from the ASIC (IC101) are used to drive
(FOUT1, FOUT2, FOUT3 and FOUT4) by the motor driver IC
(IC951), and are then used to drive the stepping motor for fo-
cusing operation. Detection of the standard focusing positions
is carried out by the ASIC (IC101) detecting the signal (FPIOUT)
from the photointerruptor inside the lens block.
4-3. Iris drive
The serial data signals (L_DATA, L_SCLK and L_STB) which
are output from the ASIC (IC101) are used to drive the shutter
constant (IOUT1 and IOUT2/SOUT1) by the motor driver IC
(IC951), and are then used to drive the iris steps.
4-4. Shutter drive
The shutter drive signals (SIN1/SIN2) which is output from the
ASIC (IC101) is used to drive the shutter constant (IOUT2/
SOUT1 and SOUT2) by the motor driver IC (IC951), and then
mecha shutter is opened and closed.
– 7 –
1-3. PWA POWER CIRCUIT DESCRIPTION
1. Outline
This is the main power circuit, and is comprised of the follow-
ing blocks.
Switching power controller (IC501)
Digital VDD3 output system (L5004)
Digital VDD1.2 output system (L5003)
Digital VDD1.8 output system (IC501-LD0)
Analog +13.0 V (A) output system (L5007)
Analog -7.5 V (A) output system (L5008, Q5008)
Analog +3.5 V (A) output system (IC502)
LCD backlight output system (L5006, Q5006)
Motor system BOOST 4.2 V output system
(L5301, D5301, Q5301)
2. Switching Controller (IC501)
This is the basic circuit which is necessary for controlling the
power supply for a PWM-type switching regulator, and is pro-
vided with seven built-in channels and one built-in channel
(LD0).
Only CH1 (motor system), CH2, CH3 and CH4 (digital sys-
tem), CH7 and CH8 (analog system) and CH6 (LCD back-
light system) are used.
Feedback from motor system (CH1), digital system (CH2, CH3
and CH4), analog system (CH7 and CH8) are received, and
the PWM duty is varied so that each one is maintained at the
correct voltage setting level. (CH2 is output by LD0.)
Feedback for the LCD backlight power output (CH6) is so that
regular current can be controlled to be current that was set-
ting.
2-1. Short-circuit protection circuit
If CH3-CH8 output are short-circuited, CH2-CH8 are turned
off. To reset output, it is necessary to reset the contrller IC to
reset the power.
3. (CH1) Motor System 4.2 V Output
4.2 V is output. Feedback for the BOOST 4.2 V output is pro-
vided to (Pin (C5) of IC501) so that PWM control can be car-
ried out.
4. (CH2) Digital 1.8 V Output
+1.8 V is output. Feedback for the VDD1.8 output is provided
to (Pin (B3) of IC501) so that PWM control to be carried out.
5. (CH3) Digital 1.2 V Output
+1.26 V is output. Feedback for the VDD1.2 output is pro-
vided to (Pin (E2) of IC501) so that PWM control can be car-
ried out.
6. (CH4) Digital 3.25 V Output
+3.25 V is output. Feedback for the VDD3 output is provided
to (Pin (F2) of IC501) so that PWM control can be carried out.
7. (CH6) LCD Backlight Output
Regular current is being transmitted to LED for LCD back-
light. Feedback for the voltage to step-down LED is provided
to (Pin (B5) of IC501) so that PWM control to be carried out.
8. (CH7) Analog 13.0 V Output
+13.0 V is output. Feedback for the +13.0 V (A) output is pro-
vided to (Pin (E7) of IC501) so that PWM control can be car-
ried out.
9. (CH8) Analog -7.5 V Output
-7.5 V is output. Feedback for the -7.5 V (A) output is provided
to (Pin (C7) of IC501) so that PWM control can be carried
out.
– 8 –
1-4. ST1 STROBE CIRCUIT DESCRIPTION
1. Charging Circuit
When UNREG power is supplied to the charge circuit and the
CHG signal from microprocessor becomes High (3.3 V), the
charging circuit starts operating and the main electorolytic
capacitor is charged with high-voltage direct current.
However, when the CHG signal is Low (0 V), the charging
circuit does not operate.
1-1. Charge switch
When the CHG signal switches to Hi, IC541 starts charging
operation.
1-2. Power supply filter
C5401 constitutes the power supply filter. They smooth out
ripples in the current which accompany the switching of the
oscillation transformer.
1-3. Oscillation circuit
This circuit generates an AC voltage (pulse) in order to in-
crease the UNREG power supply voltage when drops in cur-
rent occur. This circuit generates a drive pulse with a frequency
of approximately 200-300 kHz, and drive the oscillation trans-
former.
1-4. Oscillation transformer
The low-voltage alternating current which is generated by the
oscillation control circuit is converted to a high-voltage alter-
nating current by the oscillation transformer.
1-5. Rectifier circuit
The high-voltage alternating current which is generated at
the secondary side of T5401 is rectified to produce a high-
voltage direct current and is accumulated at electrolytic ca-
pacitor C5412.
1-6. Charge monitoring circuit
The functions programmed in the IC541 monitor oscillations
and estimate the charging voltage. If the voltage exceeds the
rated value, charging automatically stops. Then, the
ZCHG_DONE signal is changed to Lo output and a "charging
stopped" signal is sent to the microcomputer.
2. Light Emission Circuit
When FLCLT signal is input from the ASIC, the stroboscope
emits light.
2-1. Emission control circuit
When the FLCLT signal is input to the emission control cir-
cuit, Q5402 switches on and preparation is made to the light
emitting. Moreover, when a FLCLT signal becomes Lo, the
stroboscope stops emitting light.
2-2. Trigger circuit
The Q5402 is turned ON by the FLCLT signal and light emis-
sion preparation is preformed. Simultaneously, high voltage
pulses of several kV are emitted from the trigger coil and ap-
plied to the light emitter.
2-3. Light emitting element
When the high-voltage pulse form the trigger circuit is ap-
plied to the light emitting part, currnet flows to the light emit-
ting element and light is emitted.
Beware of electric shocks.
– 9 –
1-5. SYA CIRCUIT DESCRIPTION
1. Configuration and Functions
For the overall configuration of the SYA block, refer to the block diagram. The configuration of the SYA block centers around a 8-
bit microprocessor (IC301).
The 8-bit microprocessor handles the following functions.
1. Operation key input, 2. Clock control, 3. Power ON/OFF, 4. Storobe charge control
Pin
Signal
1
2
3
4
5
6
7
8
9
11
12
13
14
15
16
17
18
19
20
24
26
27
28
29
30
31
32
33
34
35
36
37
39
41
38
40
SCK
BACKUPCTL
NAND RESET
BAT_T_V
NOT USED
TSEN_PULSE
NOT USED
LCD_PWM
VDD
SELF_LED
CARD ON
NOT USED
MRST
NOT USED
NOT USED
NOT USED
UTX
SCAN IN2
NOT USED
KEY_2nd
P ON
BL ON
NOT USED
NOT USED
NOT USED
NOT USED
NOT USED
NOT USED
VSS3
RDSEL
CLK
DATA0
I/O
O
O
O
O
-
O
-
O
I
O
O
-
O
-
-
-
O
I
-
I
O
O
-
-
-
-
-
-
-
I
I
I
Outline
Serial clock output
Backup battery charge control (L= charge)
OneNAND flash memory reset
T terminal power
-
Touch sensor pulse output
-
LCD PWM
Power
Self timer LED (L= lighting)
Card detection pull-up output
-
System reset
-
-
-
UART sending (for debugger)
Keymatrix input (using built-in pull-up)
-
2nd switch (using built-in pull-up)
Digital system power on control
LCD backlight power on signal
-
-
-
-
-
-
GND
Microprocessor rewrite port
Microprocessor rewrite port
Microprocessor rewrite port
10
VSS
-
GND
21
USB_CONNECT
I
USB power detection terminal (L= detection, using built-in pull-up)
22
SCAN IN0
I
Keymatrix input (using built-in pull-up)
23
SCAN IN1
I
Keymatrix input (using built-in pull-up)
25
SCAN IN3
I
Keymatrix input (using built-in pull-up)
43
SCAN OUT3
O
Keymatrix output
42
CHG
O Strobo charge control (H= charge)
PLLEN
O
PLL oscillation control signal
VDD3 I
Power
SCAN OUT2
O Keymatrix output
SCAN OUT1
O
Keymatrix output
– 10 –
Table 5-1. 8-bit Microprocessor Port Specification
54
I
Keymatrix output
44
SCAN OUT0 O
51
SREQ
RESET I
Reset input
52
53
KEY_POWER
I
KEY_1st
I
1st switch input (using built-in pull-up)
45
ZBOOT_COMREQ O
BOOT input or COMREQ output
47
CARD
I
Card detection (L= card detection)
48
AV JACK
I
AV jack detection (L= detection)
Power key detection (using built-in pull-up)
50
BAT_OFF
I
Battery OFF detection signal input
Serial communication request signal
46
CHG_DONE
I
Strobo condensor charge done (L= done)
55
XCIN
I
Clock oscillation terminal for clock (32.768 kHz)
56
XCOUT
O
Clock oscillation terminal for clock
57
VSS
-
GND
58
XIN I
Clock oscillation terminal (connect to BACKUP 3.2 V)
59
XOUT O
Clock oscillation terminal (NOT USED)
60
VDD1
I
Power
61
UNREG_SY I
Battery voltage detection
62
TOUCH_IN
I
Touch sensor voltage input
63
BAT_T I
T terminal voltage input
64
ASIC_SDI O
Serial data output
ASIC_SDO I
Serial data input
49
Fig. 5-1 Internal Bus Communication System
2. Internal Communication Bus
The SYA block carries out overall control of camera operation by detecting the input from the keyboard and the condition of the
camera circuits. The 8-bit microprocessor reads the signals from each sensor element as input data and outputs this data to the
camera circuits (ASIC) or to the LCD display device as operation mode setting data. Fig. 5-1 shows the internal communication
between the 8-bit microprocessor and ASIC.
8-bit micro processor ASIC
MRST
PLLEN
ASIC_SDI
ASIC_SDO
SCK
SREQ
communi-
cation
COMREQ
setting of
external port
– 11 –
3. Key Operaiton
For details of the key operation, refer to the instruction manual.
Table 5-2. Key Operation
0
1
2
0
123
SCAN
OUT
SCAN
IN
MENU
TELE
UP
-
OK
DOWN
-
PLAY
WIDE
SCENE
RIGHT
LEFT
ASIC,
memory
CCD
8bit
CPU
LCD
MONITOR
Power supply voltage
Power OFF
Playback mode
Shooting
USB connection
1.26 V, 3.25 V
1.8 V
12 V, -6 V
3.4 V
3.2 V
3.0 V
OFF
OFF
32KHz
OFF
ON
OFF
4MHz
ON
ON
OFF
4MHz
ON
ON
ON
4MHz
ON
ON
OFF
4MHz
OFF
Table 5-3. Power supply control
Shooting mode (LCD)
4. Power Supply Control
The 8-bit microprocessor controls the power supply for the overall system.
The following is a description of how the power supply is turned on and off. When the battery is attached, IC501 is operating and
creating 4.2 V, a regulated 3.2 V voltage is normally input to the 8-bit microprocessor (IC301) by IC302, clock counting and key
scanning is carried out even when the power switch is turned off, so that the camera can start up again.
When the power switch is off, the 8-bit microprocessor halts the high speed built-in oscillation clock (8MHz oscillation, 4MHz
operation), and operates 32.768 kHz of subclock.
When the battery is removed, the 8-bit microprocessor power switches the battery for memory backup by IC302, and operates at
low consumption. At this condition, the 8-bit microprocessor halts the high speed built-in oscillation clock, and operates clock
counting by sub clock.
Also, the battery for backup is charged 16 hours from it to be attached.
When the power switch is on, the 8-bit microprocessor starts processing. The 8-bit microprocessor first sets both the PON signal
at pin (27) to High, and then turn on the power circuit. After PON signal is to High, sets external port of ASIC after approximately
100 ms. According to setting of this external port, carry out setting of the operating frequency, oscillation control and PAON and
PAON3 control (analog system power) from ASIC. Also, it starts communication with ASIC, and confirms the system is operative.
When LCD panel turns on, set BL ON signal at pin (28) to High, and turn on the backlight power.
When the power switch is off, the lens will be stowed, and PON and BL ON signals to Low and the power supply to the whole
system is halted. The 8-bit microprocessor halts the high speed built-in oscillation clock, and set operation mode of clock ocillation.
3
-
PW_TEST
TEST
-
– 12 –
2. DISASSEMBLY
2-1. REMOVAL OF CABI BACK, LCD AND CABI FRONT
1. Two screws 1.7 x 4
2. Screw 1.4 x 3
3. Screw 1.4 x 4
4. Two screws 1.4 x 5
5. Cabi back
6. Spacer speaker
7. Dec left
8. Cover USB
9. LCD
10. FPC
11. Screw 1.4 x 2
NOTE: Discharge a strobe capacitor
with the discharge jig (VJ8-0188) for
electric shock prevention.
When assembling,
tighten the screws order.
A → B → C → D
12. Screw 1.4 x 5
13. Three screws 1.4 x 3.5
14. FPC
15. Holder monitor
16. Plate earth spk
17. Screw 1.4 x 3.5
18. Assy, cabi top
19. Screw 1.7 x 4
20. Dec right
21. Stand
22. Cabi front
1
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
D
A
B
C
– 13 –
2-2. REMOVAL OF CP1 BOARD AND LENS
1. Remove the solder. (speaker)
2. Remove the solder. (microphone)
3. Speaker, 8
4. Remove the solder.
5. FPC
6. Connector
7. Two screws 1.4 x 2
When assembling,
tighten the screws order.
A → B
When assembling,
tighten the screws order.
A → B → C
When assembling,
tighten the screws order.
a → b → c
8. Holder strap
9. Two screws 1.4 x 3
10. CP1 board
11. Three screws 1.6 x 5
12. Lens
13. Three screws 1.6 x 3
14. Assy, flexible pwb comp 3
1
2
3
4
5
6
7
8
9
9
10
11
11
11
12
13
14
A
B
C
a
b
c
7
A
B
4
– 14 –
2-3. REMOVAL OF ST1 BOARD
1. Microphone
2. Two screws 1.4 x 3
3. ST1 board
4. Cover triger
5. Remove the solder.
6. Assy, lamp
1
2
3
4
5
6
– 15 –
2-4. BOARD LOCATION
CP1 board
ST1 board
– 16 –
3. ELECTRICAL ADJUSTMENT
3-1. Table for Servicing Tools
Download the calibration software and the firmware
from the following URL.
http://www.digital-sanyo.com/overseas/service/
Place the DscCalDi.exe file, camapi32.dll file and
QrCodeInfo.dll file together into a folder of your
choice.
3-2. Equipment
1. PC (IBM R -compatible PC, Windows 2000 or XP or Vista)
3-3. Adjustment Items and Order
1. Lens Adjustment (60 cm)
2. Lens Adjustment (Infinity)
3. AWB Adjustment
4. CCD White Point Defect Detect Adjustment
5. CCD Black Point And White Point Defect Detect Adjust-
ment In Lighted
Note: If the lens, CCD and board and changing the part, it is
necessary to adjust again. Item 1-5 adjustments should be
carried out in sequence.
3-4. Setup
1. System requirements
Windows 2000 or XP or Vista
IBM R -compatible PC with pentium processor
USB port
40 MB RAM
Hard disk drive with at least 15 MB available
VGA or SVGA monitor with at least 256-color display
2. Installing USB driver
Install the USB driver with camera or connection kit for PC.
3. Pattern box
Turn on the switch and wait for 30 minutes for aging to take
place before using Color Pure. It is used after adjusting the
chroma meter (VJ8-0192) adjust color temperature to 3100 ±
20 K and luminosity to 900 ± 20 cd/m
2
. Be careful of handling
the lump and its circumference are high temperature during
use and after power off for a while.
4. Computer screen during adjustment
3-5. Connecting the camera to the computer
1. Line up the arrow on the cable connector with the notch on
the camera's USB port. Insert the connector.
2. Locate a USB port on your computer.
3. Choose the “COMPUTER”, and press the SET button.
Next, choose the “CARD READER”, and press the SET
button.
Ref. No.
Name
Part code
J-1
J-2
J-3
VJ8-0190
Pattern box
Calibration software
J-4
Number
1
1
1
Chroma meter
VJ8-0192
1
Spare lump
VJ8-0191
J-5
J-1 J-3
J-4
J-5
1
Discharge jig
VJ8-0188
J-6
1
Collimator
VJ8-0260
J-7
1
Spare lump (collimator)
VJ8-0282
J-8
1
Siemens star chart
J-8
Firmware
Data
AWB
Focus
UV Matrix
R Bright
RGB Offset
Tint
B Bright
Gain
Phase
LCD
Calibration
Upload
PAF Cal.
LCD Type
H AFC Test
VCOMDC
VCOMPP
Cal Data
Cal Mode
OK
OK
EVF
USB storage
Get
Set
VID
Set
PID
Set
Serial
Set
Rev.
Set
Setting
Language
Video Mode
VCO
Factory Code
Hall Cal.
Backrush pulse :
Set
Get
– 17 –
3-7. Adjust Specifications
1. Lens Adjustment (60 cm)
Preparation:
POWER switch: ON
The tester should be used to adjust the voltage between the
terminals of the power connector that is being supplied from
the power supply (voltage between the battery socket termi-
nals of the camera) to 4.1 ± 0.1 V.
Adjustment condition:
Siemens star chart (A3)
Fluorescent light illumination with no flicker (incandescent light
cannot be used.)
Illumination above the subject should be 700 lux ± 10%.
Note:
Do not vibrate during the adjustment.
Adjustment method:
1. Set the siemens star chart 60 ± 0.5 cm from lens surface
(zoom wide position) so that it becomes center of the
screen (zoom wide and tele).
2. Double-click on the DscCalDi.exe.
3. Click the “Focus”, and Click the “Ye s”.
4. Lens adjustment value will appear on the screen.
5. Click the OK.
Adjustment value determination is effectuated using below val-
ues.
The adjustment values fulfill the conditions below, they are de-
termined as within specifications.
Adjustment value determination
PZ_SW_A_B: PZ1
PZ1: adjustment value of zoom PR switch position 1
(892<=(PZ1+PBR)<=992)
PZ_SW_B_C: PZ2
PZ2: adjustment value of zoom PR switch position 2
(962<=(PZ2+PBR)<=1072)
PZ_BR: PBR
PBR: adjustment value of zoom backrush pulse
(10<=PBR<=45)
AF_SW: ASW
ASW: adjustment value of focus PI switch position
(733<=ASW<=823)
AF_BR: ABR
ABR: adjustment value of focus backrush pulse
(0<=ABR<=5)
3-6. The adjustment item which in necessary in part exchange
COMPL PWB CP-1
Factory
Cord
Setting
Language
Setting
COMPL PWB ST-1
ASSY, FLEXIBLE PWB COMP3
LENS ASSY
Reset
Setting
Lens
Adjust-
ment
(Infinity)
AWB
Adjust-
ment
USB
storage
information
registration
CCD White
Point
Defect
Detect
Adjustment
CCD Black
Point And
White Point
Defect Detect
Adjustment
In Lighted
: Be sure to carry out the necessary adjustments after replacing the unit.
: Adjustment is possible from the menu setting screen of the camera and by using the calibration software.
Lens
Adjust-
ment
(60 cm)
Camera
60 cm 0.5 cm
Siemens
star chart
DscCalDi
x
OK
Focus Result
PZ_SW_A_B: 906
PZ_SW_B_C: 980
PZ_BR: 23
AF_SW: 804
AF_BR: 3
AF_WIDE: 9
AF_MID1: 11
AF_MID2: 15
AF_MID3: 25
AF_MID4: 26
AF_MID5: 24
AF_MID6: 19
AF_MID7: 22
AF_TELE: 17
!
– 18 –
AF_WIDE: ZW
ZW: adjustment value of focus at zoom position wide
(–88<=ZW<=50)
AF_MID1: ZM1
ZM1: adjustment value of focus at zoom position middle1
(–109<=ZM1<=61)
AF_MID2: ZM2
ZM2: adjustment value of focus at zoom position middle2
(–132<=ZM2<=69)
AF_MID3: ZM3
ZM3: adjustment value of focus at zoom position middle3
(–153<=ZM3<=74)
AF_MID4: ZM4
ZM4: adjustment value of focus at zoom position middle4
(–159<=ZM4<=78)
AF_MID5: ZM5
ZM5: adjustment value of focus at zoom position middle5
(–164<=ZM5<=89)
AF_MID6: ZM6
ZM6: adjustment value of focus at zoom position middle6
(–174<=ZM6<=92)
AF_MID7: ZM7
ZM7: adjustment value of focus at zoom position middle7
(–174<=ZM7<=97)
AF_TELE: ZT
ZT: adjustment value of focus at zoom position tele
(–167<=ZT<=83)
2. Lens Adjustment (Infinity)
Preparation:
POWER switch: ON
If using a ready-made collimator, set to infinity.
The tester should be used to adjust the voltage between the
terminals of the power connector that is being supplied from
the power supply (voltage between the battery socket termi-
nals of the camera) to 4.1 ± 0.1 V.
Note:
Do not vibrate during the adjustment.
Adjustment method:
1. Set the camera so that it becomes center of the siemens
star chart in the collimator. (zoom wide and tele)
(Set a distance of 0.5-1.0 cm between camera lens and
collimator lens when zoom tele edge. Do not touch the
each lens.)
2. Double-click on the DscCalDi.exe.
3. Select “Infinity Cal.” on the LCD “Test”, and click the “Ye s”.
4. Lens infinity adjustment value will appear on the screen.
5. Click the OK.
Adjustment value determination is effectuated using below val-
ues.
The adjustment values fulfill the conditions below, they are de-
termined as within specifications.
Adjustment value determination
AF_TEMP_AD: ATAD
ATAD: adjustment value of AD value of temperature in
focus lens (326<=ATAD<=897)
AF_I_WIDE: ZIW
ZIW: infinity adjustment value of focus at zoom position
wide (–89<=ZIW<=43)
AF_I_MID1: ZIM1
ZIM1: infinity adjustment value of focus at zoom position
middle1 (–111<=ZIM1<=56)
AF_I_MID2: ZIM2
ZIM2: infinity adjustment value of focus at zoom position
middle2 (–137<=ZIM2<=65)
AF_I_MID3: ZIM3
ZIM3: infinity adjustment value of focus at zoom position
middle3 (–159<=ZIM3<=61)
AF_I_MID4: ZIM4
ZIM4: infinity adjustment value of focus at zoom position
middle4 (–167<=ZIM4<=77)
AF_I_MID5: ZIM5
ZIM5: infinity adjustment value of focus at zoom position
middle5 (–176<=ZIM5<=92)
AF_I_MID6: ZIM6
ZIM6: infinity adjustment value of focus at zoom position
middle6 (–192<=ZIM6<=101)
Camera
Collimator
Dsc Calibration x
OK
Infinity calibration :
AF_TEMP_AD: 458
AF_I_WIDE: 9
AF_I_MID1: 11
AF_I_MID2: 15
AF_I_MID3: 18
AF_I_MID4: 13
AF_I_MID5: 7
AF_I_MID6: -2
AF_I_MID7: -10
AF_I_TELE: -7
Copy
– 19 –
Camera
Pattern box
AF_I_MID7: ZIM7
ZIM7: infinity adjustment value of focus at zoom position
middle7 (–197<=ZIM7<=112)
AF_I_TELE: ZIT
ZIT: infinity adjustment value of focus at zoom position
tele (–196<=ZIT<=89)
3. AWB Adjustment
Preparation:
POWER switch: ON
Setting of pattern box:
Color temperature: 3100 ± 20 (K)
Luminance: 900 ± 20 (cd/m
2
)
The tester should be used to adjust the voltage between the
terminals of the power connector that is being supplied from
the power supply (voltage between the battery socket termi-
nals of the camera) to 4.1 ± 0.1 V.
Adjusting method:
1. When setting the camera in place, set it to an angle so that
nothing appears in any part of the color viewer except the
white section. (Do not enter any light.)
2. Double-click on the DscCalDi.exe.
3. Click the AWB, and click the Yes.
4. AWB adjustment value will appear on the screen.
5. Click the OK.
Adjustment value determination is effectuated using the "AGC",
“6F_AGC”, “CHECK" and "MS" values. If
AGC= a1, a2, a3, a4, a5, a6, a7
6F_AGC= fd1, fd2, fd3, fd4, fd5
CHECK= wc0, wc1, wc2
MS= ms1, ms2
the adjustment values fulfill the conditions below, they are de-
termined as within specifications.
Adjustment value determination
100<a1<300, 250<a2<500, 450<a3<650, 600<a4<850,
750<a5<1023, 600<a6<850, 750<a7<1023
fd1<=10, fd2<=10, fd3<=10, fd4<=10, fd5<=10
wc0=128 ± 2, wc1=128 ± 2, wc2=130 ± 40
2700<=ms1<=4100, 2900<=ms2<=4300
Adjustment values other than the above are irrelevant.
4. CCD White Point Defect Detect Adjustment
Preparation:
POWER switch: ON
Adjustment method:
1. Double-click on the DscCalDi.exe.
2. Select “CCD Defect” on the LCD “Test”, and click the “Ye s”.
3. After the adjustment is completed, OK will display.
4. Click the OK.
Dsc Calibration x
OK
AWB Results:
1:
AGC=173,342,508,677,845
687,855
6F_AGC=0,0,0,0,0
MONIT_X1=173,173,173,173
WB=282,514,800
CHECK=128,128,145
MS=3055,3239
Fno_FOR_ISO=56
SS_FOR_ISO=2450
YLEVEL_FOR_ISO=9597
Copy
– 20 –
5. CCD Black Point And White Point Defect Detect
Adjustment In Lighted
Preparation:
POWER switch: ON
Setting of pattern box:
Color temperature: 3100 ± 20 (K)
Luminance: 900 ± 20 (cd/m
2
)
Adjusting method:
1. Set the camera 0 cm from the pattern box. (Do not enter
any light.)
2. Double-click on the DscCalDi.exe.
3. Select “CCD Black” on the LCD “Test”, and click the “Ye s ”.
4. After the adjustment is completed, the number of defect
will appear.
5. Click the OK.
Camera
Pattern box
3-8. Factory Code Setting
1. Check the "Factory Code" display within the Setting group.
2. For U.S.A., Canada and NTSC general area
If "FC_SANYO_U" does not appear, click on the " " mark
located on the right of the "Factory Code" display BOX and
select "FC_SANYO_U".
3. For Europe and PAL general area
If "FC_SANYO_EX" does not appear, click on the " " mark
located on the right of the "Factory Code" display BOX and
select "FC_SANYO_EX".
3-9. Language Setting
1. Click on the " " mark located on the right of the
"Language" display BOX.
2. Select language. (Default is English.)
3. End "DscCal" and remove the camera before turning the
camera power OFF.
3-10. Program data writing to NAND-Memory
Carry out program data writing to NAND-memory
after replacing CP1 board.
Preparation:
SD card: SD card with data written into the root directory
Data: S216Nxxx.BIN (xxx: version)
Overwriting method:
1. Insert the above SD card.
2. Turn on the camera.
3. Press the playback button.
4. Press the MENU button. The playback menu appears.
5. Press the down button to select the option tab.
6. Press the left button for 2 seconds.
FIRMWARE UPDATE will display.
7. Choose YES.
8. Press the SET button. Update is starting.
Note:
Do not turn off the camera’s power or remove the SD card
while the firmware is being updated.
Firmware
QrCode
AWB
Focus
UV Matrix
R Bright
RGB Offset
Tint
B Bright
Gain
Phase
LCD
Calibration
Upload
PAF Cal.
LCD Type
H AFC Test
VCOMDC
VCOMPP
Cal Data
Cal Mode
OK
OK
EVF
USB storage
Get
Set
VID
Set
PID
Set
Serial
Set
Rev.
Set
Setting
Language
Video Mode
VCO
Factory Code
Hall Cal.
Backrush pulse :
Set
Get
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