GS3470 IBIS-AMI Model
User Guide Rev.1
PDS-061128 October 2017
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Revision History
Contents
1. GS3470 IBIS Model ..........................................................................................................................................3
1.1 GS3470 Input IBIS Model .................................................................................................................3
1.2 GS3470 Output IBIS-AMI Model ....................................................................................................4
1.3 S-Parameter Package Models .........................................................................................................5
1.4 Supporting Files ..................................................................................................................................6
Version ECO PCN Date Changes and/or Modifications
1 36494 — October 2017
Changed all instances of DDOP/N and DDIxP/N to DDO/DDO
and DDI/DDI
respectively.
0 028001 — November 2015 New document.
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Introduction
The GS3470 is a multi-rate SDI Receiver which includes complete SMPTE processing, as
per SMPTE ST 425, SMPTE ST 292, and SMPTE ST 259-C.
This document describes the use of the IBIS models for the GS3470. The models facilitate
simulation in EDA platforms compliant with the IBIS 5.0 standard.
1. GS3470 IBIS Model
The GS3470 IBIS models are provided for the high-speed serial inputs (DDIx/DDIx) and
outputs (DDO/
DDO). The high-speed input model is IBIS only, while the high-speed
output is an IBIS-AMI model with swing control.
1.1 GS3470 Input IBIS Model
The GS3470 input model consists of two parts:
• Package model
• Input IBIS model
The block diagram in Figure 1-1 shows the sequence of signal flow and the individual
parts of the model. The external S-parameter data for the package model increases the
accuracy of the package effects compared to using discrete R, L, and C components as
specified in the IBIS 5.0 standard. The external S-parameter data is processed as part of
the channel by the EDA platform.
Figure 1-1: GS3470 Input Model
The GS3470 DDIx/DDIx IBIS model is extracted from device simulation results. The input
IBIS model contains the GS3470 device input termination circuitry, and is used by the
EDA platform to determine the time-domain impulse response for the channel. The
current revision of the input IBIS model contains typical (Typ), minimum (Min), and
maximum (Max) corners. The desired corner can be selected from the EDA user
interface.
From Channel
Package
Model
(S-parameter)
Input
IIBIS
Model
GS3470 IBIS-AMI Model
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1.2 GS3470 Output IBIS-AMI Model
The GS3470 output IBIS-AMI model consists of three parts:
• Output IBIS model
• Output AMI model
• Package model
The block diagram in Figure 1-2 shows the sequence of signal flow and the individual
parts of the model. The external S-parameter data for the package model increases the
accuracy of the package effects compared to using discrete R, L, and C components as
specified in the IBIS 5.0 standard. The external S-parameter data is processed as part of
the channel by the EDA platform.
Figure 1-2: GS3470 Output Model
The GS3470 DDO/DDO IBIS-AMI model is extracted from device simulation results. Two
models are included in the output IBIS model file for 1.2 and 1.8 V supply voltages. The
AMI model includes swing controls.
Table 1-1 lists the swing values corresponding to
the model settings. The current revision of the output IBIS model contains typical (Typ),
minimum (Min), and maximum (Max) corners. The desired termination model and
corner can be selected from the EDA user interface.
Table 1-1: GS3470 DDO AMI Model Swing Controls
Swing Model Specific Parameter
Setting
Output Swing (mV
ppd
)
0250
1300
2350
3400
4450
5500
6550
7600
8650
9700
Transmitter IBIS-AMI Model
To Channel
Algorithmic
Model
Output
IBIS
Model
Package
Model
(S-parameter)
GS3470 IBIS-AMI Model
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1.3 S-Parameter Package Models
Package models for the GS3470 are provided in standard touchstone format. Table 1-2
lists the touchstone file port mappings between die pads and package balls for the
DDIx/
DDIx pins. Table 1-3 lists the touchstone file port mappings between die pads and
package balls for the DDO/DDO pins.
Note: During simulation, any unused ports should be terminated to 50Ω.
10 750
11 800
12 850
13 900
14 950
15 1000
Table 1-1: GS3470 DDO AMI Model Swing Controls (Continued)
Swing Model Specific Parameter
Setting
Output Swing (mV
ppd
)
Table 1-2: DDIx/DDIx Touchstone Port Mapping
Signal Die Pad Side Package Ball Side
DDIx 1 2
DDIx
34
Table 1-3: DDO/DDO Touchstone Port Mapping
Signal Die Pad Side Package Ball Side
DDO 1 2
DDO
34
IMPORTANT NOTICE
Information relating to this product and the application or design described herein is believed to be reliable, however such information is
provided as a guide only and Semtech assumes no liability for any errors in this document, or for the application or design described herein.
Semtech reserves the right to make changes to the product or this document at any time without notice. Buyers should obtain the latest relevant
information before placing orders and should verify that such information is current and complete. Semtech warrants performance of its
products to the specifications applicable at the time of sale, and all sales are made in accordance with Semtech’s standard terms and conditions
of sale.
SEMTECH PRODUCTS ARE NOT DESIGNED, INTENDED, AUTHORIZED OR WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT APPLICATIONS,
DEVICES OR SYSTEMS, OR IN NUCLEAR APPLICATIONS IN WHICH THE FAILURE COULD BE REASONABLY EXPECTED TO RESULT IN PERSONAL
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described in this document without further notice. Semtech makes no warranty, representation or guarantee, express or implied, regarding the
suitability of its products for any particular purpose. All rights reserved.
© Semtech 2017
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Contact Information
Semtech Corporation
200 Flynn Road, Camarillo, CA 93012
Phone: (805) 498-2111, Fax: (805) 498-3804
www.semtech.com
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