SERVICE MANUAL
Sony Corporation
Connect Business Division
Published by Sony Techno Create Corporation
US Model
Canadian Model
ICD-SX46
AEP Model
UK Model
E Model
ICD-SX46/SX56
Chinese Model
Korean Model
ICD-SX46/SX56/SX66
Tourist Model
ICD-SX56
IC RECORDER
9-879-953-04
2006F16-1
© 2006.06
Ver. 1.3 2006.06
SPECIFICATIONS
ICD-SX46/SX56/SX66
Maximum recording time
The maximum recording time of all
the folders is as follows. You can
record messages for the maximum
recording time in a single folder.
Recording modes
ICD-SX46
ST 5 hr. 50 min.
STLP 11 hr. 15 min.
SP 17 hr. 50 min.
LP 47 hr. 35 min.
ICD-SX56
ST 11 hr. 45 min.
STLP 22 hr. 40 min.
SP 35 hr. 55 min.
LP 95 hr. 50 min.
ICD-SX66
ST 23 hr. 40 min.
STLP 45 hr. 30 min.
SP 72 hr. 5 min.
LP 192 hr. 20 min.
(hr.: hours/min.: minutes)
ST: Standard play stereo recording
mode
STLP: Long play stereo recording
mode
SP: Standard play monaural
recording mode
LP: Long play monaural recording
mode
Recording media
Built-in flash memory 128 MB (ICD-SX46) /
256 MB (ICD-SX56) / 512 MB (ICD-SX66),
Stereo/Monaural recording
Recording time
Frequency range
• ST: 60 Hz - 13,500 Hz
• STLP: 60 Hz - 6,900 Hz
• SP: 60 Hz - 7,000 Hz
• LP: 80 Hz - 3,500 Hz
Speaker Approx. 16 mm (
21
/
32
in.) dia.
Power output
150 mW
Input/Output
• Microphone jack (minijack, stereo)
– input for plug in power, minimum input
level: 0.6 mV, 3 kilohms or lower
impedance microphone
• Headphones jack (minijack, stereo)
– output for 8 - 300 ohms headphones
• USB connector
• DC IN 3V jack (
For Korean and the People’s
Republic of China models, this jack does not
exist.)
Playback speed control
+100% to –50% (DPC)
Power requirements
Two LR03 (size AAA) alkaline batteries: 3 V DC
Dimensions (w/h/d) (not incl. projecting parts and
controls)
28.0 × 120.0 × 13.8 mm (1
1
/
8
× 4
3
/
4
×
9
/
16
in.)
Mass (incl. batteries)
64 g (2.26 oz)
Supplied accessories
Stereo headphones × 1
USB connecting cable × 1
Application Software (CD-ROM) × 1
LR03 (size AAA) alkaline batteries x 2
Carrying pouch x 1
Your dealer may not handle some of the above listed
optional accessories. Please ask the dealer for detailed
information.
Design and specifications are subject to change without
notice.
Photo: ICD-SX56
2
ICD-SX46/SX56/SX66
TABLE OF CONTENTS
1. GENERAL ................................................................... 3
2. DISASSEMBLY
2-1. Disassembly Flow ........................................................... 5
2-2. Cover (Jack)..................................................................... 5
2-3. Case Block Assy .............................................................. 6
2-4. AUDIO Board, Microphone Unit (Mic2/3)..................... 6
2-5. Ornament Belt Assy, SW Board ...................................... 7
2-6. Cover (Chassis) Block Assy ............................................ 7
2-7. MAIN Board, Liquid Crystal Display Panel ................... 8
3. TEST MODE ............................................................... 9
4. DIAGRAMS
4-1. Block Diagram – MAIN Section-1 – ............................. 13
4-2. Block Diagram – MAIN Section-2 – ............................. 14
4-3. Block Diagram – PANEL Section – ............................... 15
4-4. Printed Wiring Board – AUDIO Board (Side A) – ......... 16
4-5. Schematic Diagram – AUDIO Board (Side B) –............ 17
4-6. Schematic Diagram – AUDIO Board (1/2) – ................. 18
4-7. Schematic Diagram – AUDIO Board (2/2) – ................. 19
4-8. Printed Wiring Board – MAIN Board (Side A) –........... 20
4-9. Printed Wiring Board – MAIN Board (Side B) –........... 21
4-10. Schematic Diagram – MAIN Board (1/2) – ................... 22
4-11. Schematic Diagram – MAIN Board (2/2) – ................... 23
4-12. Printed Wiring Board – SW Board – .............................. 24
4-13. Schematic Diagram – SW Board –................................. 25
5. EXPLODED VIEWS
5-1. Case Block Assy .............................................................. 33
5-2. Chassis Block Assy ......................................................... 34
6. ELECTRICAL PARTS LIST .................................. 35
Flexible Circuit Board Repairing
• Keep the temperature of the soldering iron around 270 °C
during repairing.
• Do not touch the soldering iron on the same conductor of the
circuit board (within 3 times).
• Be careful not to apply force on the conductor when soldering
or unsoldering.
Notes on chip component replacement
• Never reuse a disconnected chip component.
• Notice that the minus side of a tantalum capacitor may be
damaged by heat.
*
Replacement of IC6001 and IC7003 used in this set requires
a special tool.
•The voltage and waveform of CSP (chip size package) cannot
be measured, because its lead layout is different from that of
conventional IC.
• Lead layouts
surface
Lead layout of
conventional IC
CSP (chip size package)
UNLEADED SOLDER
Boards requiring use of unleaded solder are printed with the lead-
free mark (LF) indicating the solder contains no lead.
(Caution: Some printed circuit boards may not come printed with
the lead free mark due to their particular size)
: LEAD FREE MARK
Unleaded solder has the following characteristics.
• Unleaded solder melts at a temperature about 40 °C higher
than ordinary solder.
Ordinary soldering irons can be used but the iron tip has to be
applied to the solder joint for a slightly longer time.
Soldering irons using a temperature regulator should be set to
about 350 °C.
Caution: The printed pattern (copper foil) may peel away if
the heated tip is applied for too long, so be careful!
• Strong viscosity
Unleaded solder is more viscou-s (sticky, less prone to flow)
than ordinary solder so use caution not to let solder bridges
occur such as on IC pins, etc.
• Usable with ordinary solder
It is best to use only unleaded solder but unleaded solder may
also be added to ordinary solder. Operating instructiondd
Using on house current (excluding the Korean and the
People’s Republic of China models)
Connect the AC power adaptor AC-E30HG (not
supplied) to the DC IN 3V jack of the unit and to the
wall outlet. Do not use any other AC power
adaptor.
Polarity of the plug
3
ICD-SX46/SX56/SX66
SECTION 1
GENERAL
This section is extracted
from instruction manual.
Identifying the front and rear panels of the unit
1 i (headphones) jack
2 Built-in microphone
3 DIRECTNL (directional) switch
4 VOICE UP (Digital Voice Up) switch
5 DPC ON/OFF switch
6 Display window
7 ERASE button
8 DIVIDE/
(bookmark) button
9 A-B
(repeat)/PRIORITY button
0 OPR (operation) indicator
qa zREC (record) /REC PAUSE button
qs xSTOP button
qd Jog lever
FOLDER/MENU/.(review/fast backward)/
> (cue/fast forward)/x• B (play/stop•enter)
qf VOL (volume) +/– buttons
qg Base
qh HOLD switch
qj Speaker
qk Battery compartment
ql Clip*
w; m (microphone) jack
wa USB connector
ws DC IN 3V jack
(For Korean and the People’s Republic of China
models, this jack does not exist.)
wd Slit for a handstrap
*Notes
• To prevent the clip from breaking, avoid hooking it on thick
fabric, such as a pocket of a heavy coat.
•When bending down or running with the unit clipped on
your pocket, be careful not to drop the unit.
Using the display window
1 Folder indication
Displays the current folder (A, B, C, D or E).
2 Recording mode indication
Displays the current recording mode:
•ST: Standard play stereo recording mode
•STLP: Long play stereo recording mode
•SP: Standard play monaural recording mode
• LP: Long play monaural recording mode
3 REC (Recording) indicator
4 Remaining battery indicator
When the AC power adaptor (not supplied) is
connected, the indicator does not appear (excluding
the Korean and the People’s Republic of China
models).
5 Remaining memory indicator
6 Priority marks
7 Selected message number /Total message
number in the folder
8 Alarm indicator
Appears when the alarm is set for a message.
9 Repeat play indicator
Appears while a message or a specific portion (A-B)
of the message is played back repeatedly.
0 Bookmark indicator
Appears when the bookmark is set for a message.
qa Counter /Remaining time indication /
Recording date and time indication /Current
time indication
The display selected with the DISP in the menu
appears.
qs SENS (microphone sensitivity) indication
Displays the current microphone sensitivity:
•H (high): To record at a meeting or in a quiet/
spacious place.
•L (low): To record for dictation or in a noisy place.
4
ICD-SX46/SX56/SX66
Step 2: Setting the Clock
You need to set the clock to use the alarm function or record the date and time.
Clock setting display appears when you insert batteries for the first time, or
when you insert batteries after the unit has been without batteries for a certain
period of time. In this case, proceed from step 4.
Jog lever
Press the center
(x•B).
Press up (>).
Press down (.).
Turn toward MENU.
Note on setting the clock
Set the clock while the unit is in the
stop mode.
1 Turn the jog lever toward MENU.
The menu mode will be displayed in
the display window
2 Press the jog lever up or down
(>/.) to select “SET DATE”.
3 Press the jog lever (x•B).
The date and time setting window is
displayed. The year digits will flash.
4 Set the date.
1 Press the jog lever up or down
(>/.) to select the digits of
the year.
2 Press the jog lever (x•B).
The month digits will flash.
3 Set the month and day in sequence,
then press the jog lever (x•B).
The hour digits will flash.
v
5 Set the time.
1 Press the jog lever up or down
(>/.) to select the digits of
the hour.
2 Press the jog lever (x•B).
The minute digits will flash.
3 Set the minute.
4 Press the jog lever (x•B).
The menu mode will be displayed
again.
Note
If you do not press the jog lever (x•B) for more than one minute, the clock
setting mode is cancelled and the window will return to normal display.
6 Turn the jog lever toward MENU.
The window will return to normal
display.
1 If the unit is left unused for more than 3
seconds in the stop mode after the clock
is set, the display will show the current
time.
5
ICD-SX46/SX56/SX66
Note: Follow the disassembly procedure in the numerical order given.
2-2. COVER (JACK)
SECTION 2
DISASSEMBLY
2-1. DISASSEMBLY FLOW
Note: Disassemble the unit in the order as shown below.
2-3.CASE BLOCK ASSY
(Page 6)
2-4.AUDIO BOARD,
MICROPHONE UNIT(MIC2/3)
(Page 6)
2-5.ORNAMENT BELT ASSY,
SW BOARD
(Page 7)
2-6.COVER (CHASSIS)
BLOCK ASSY
(Page 7)
2-7.MAIN BOARD,
LIQUID CRYSTAL DISPLAY
PANEL (Page 8)
2-2.COVER (JACK)
(Page 5)
SET
4
screw
6
screw
5
cover (jack)
3
lid (connecter)
2
screw (M1.4)
1
battery lid
6
ICD-SX46/SX56/SX66
2-3. CASE BLOCK ASSY
2-4. AUDIO BOARD, MICROPHONE UNIT (MIC2/3)
Pass the flexible board through
the hole during assembling.
3
Slide the chassis from the case completely and remove it.
1
Slide the chassis from the case until the connector becomes visible.
2
connector
11pin (CN7005)
9
Remove the microphone unit (MIC2/3)
from the groove.
8
cushion
6
Remove soldering at two positions of the speaker cable.
2
1
connector
40pin (CN7003)
4
LCD holder
5
liquid crystal
display panel
3
three claws
7
connector
4pin (CN3001)
q;
AUDIO board
7
ICD-SX46/SX56/SX66
2-5. ORNAMENT BELT ASSY, SW BOARD
2-6. COVER (CHASSIS) BLOCK ASSY
6
SW board
2
knob (HOLD)
1
peel off the three
adherent areas
3
ornamental belt assy
4
six claws
6
ornamental
belt
5
three sheets
(ornamental belt
)
1
claw
1
claw
1
claw
1
claw
2
cover (CHASSIS
)
3
speaker (1.6cm)
SP3001
chassis block assy
8
ICD-SX46/SX56/SX66
2-7. MAIN BOARD, LIQUID CRYSTAL DISPLAY PANEL
2
1
Remove the two battery terminals
from the groove of the chassis.
chassis block assy
8
MAIN board
5
battery (–) terminal
4
battery (+) terminal
3
Remove soldering from the two points.
7
liquid crystal
display panel
6
sheet, insulating
9
ICD-SX46/SX56/SX66
SECTION 3
TEST MODE
[Setting Method of the Test Mode]
To enter the test mode, turn on the HOLD . switch while press-
ing the x key and VOL+ key at the same time with the power on.
[Exiting Method of the Test Mode]
Exit the test mode by turning off the power.
[Initial Status of the Test Mode]
When the test mode is set, the LCD display appears as shown below.
LCD display (Example)
[Flow Chart of the Test Mode]
START
>
.
.
.
>
>
.
Initial status of test mode
Model code, LPEC ST,
F/W version display
TEST MODE
END
TEST MODE
Turn off the power
(Extract the batteries or DC jack)
>
USB
KEY COUNT
RESET MENU
LED
B A T TKEY
LCD
AUDIO
SLEEP
BEEP
RTC
>
>
>
>
.
.
.
.
>
>
>
>
.
.
.
.
[Operation in the Test Mode]
After entering the test mode, you can move within the test menu by
pressing the . / > key. You can move to the submenu by
pressing the x•B key. Then each test mode can be executed.
1. LCD test
• LCD is tested of all light-on and all light-off.
2. Audio test
Perform the through-playback and sine wave output.
• Contents of the submenu
DSP ST: DSP STEREO through mode
DSP MO: DSP MONO through mode
SIN: 1 kHz sine wave output mode
• Select the microphone sensitivity with the A-B switch.
HtMtLtHtMt ...
•The VOR detection operation can be checked by the LED.
Sound : The red LED is turned on. No sound: The red LED
is turned off.
• MUTE can be set to “ON” or “OFF” with the ERASE key.
•The sound volume can be adjusted with the VOL+ key or VOL–
key during the audio test except the MUTE mode.
• In the directional microphone selection, ON/OFF of the DI-
RECTNL switch is performed with the DIVIDE key.
DIRECTNL switch ON : The green LED is turned on.
OFF : The green LED is turned off.
• In the audio test mode the operation is performed according to
JACK detection.
•The microphone sensitivity, sound volume and MUTE (on/off)
are displayed on the LCD.
•The microphone sensitivity selection and the VOR test are ef-
fective in the through-playback mode.
•The directional microphone selection is effective in the DSP
MONO through mode.
6d
01
b110
-56
6d
01 b110-56
Iris(DSP) version : 6d
LPEC ST version : 01
SakuraR(CPU) version : 1.10
(In α version or β version, A or B is displayed)
Model code : SX56
x•B
.
>
LCD OFF
LCD CHK
LCD ALL
:
:
LCD ALL
CHK START
CHK END
LCD
x
x
x x
BA DC E
REC
STLP
SP
LH
YH
88
8888
888888
MM DS
m
(LCD off)
.
>
(select), (set)
x•B
x•B
:
:
DSP MONO
SIN WAVE
DSP ST
AUDIO DSP ST
oFDSP ST12 oFSIN WAV06
x x x
H
m
oFDSP M 23
L
m
DSP STEREO through mode / MIC : M / MUTE : ON / VOL-LEVEL : 12
t "M / on / 12 / DSP ST"
DSP MONO through mode / MIC : H / MUTE : OFF / VOL-LEVEL : 23
t "H / oF / 23 / DSP MO"
1k sine wave output mode / MUTE : ON / VOL-LEVEL : 06 t "on / 06 / SIN"
.
>
(select), (set)
x•B
10
ICD-SX46/SX56/SX66
3. Sleep test
•Pressing the x•B key causes the set to enter the sleep state.
•When the HOLD . switch is ON, the LCD is turned off.
When OFF, the LCD is turned on.
•Press any keys to exit the sleep state.
4. Beep test
• Beep sound of 1.3 kHz or 2 kHz is output.
5. RTC test
•Perform the function test of the RTC and EEPROM.
(1) RTC EEPROM test
Confirmation of writing, reading (verifying) and erasing of
arbitrary data with the specified registers.
(2) RTC clock function test
Confirmation that RTC updates the time to the microcomputer
at one second interval.
• OK, NG judgement is performed to the test result.
When NG, it is displayed which device RTC or EEPROM
becomes NG.
(All OK : “RTC OK” / RTC NG : “RTC BAD” / EEPROM NG
: “EEP BAD”)
6. Key entry test
•When the any key is pressed, the entry key and the A/D con-
verted value (hexadecimal) of the two channel keys are dis-
played.
•When the x key is pressed, the A/D value of the key is dis-
played while the key is depressed. When the key is released, the
screen returns to the test menu.
7. Battery remaining power and DC IN test
•The detected A/D value (hexadecimal) of the battery remaining
power is displayed. When DC jack is inserted, the battery mark
on the LCD is turned off.
any keys any keys
(LCD OFF)
(with HOLD .
OFF status)
x•B
(with HOLD .
ON status)
x•B
SLEEP SOON
SLEEP IN
SLEEP
x•B
RTC RTC OK
x
bATT FF bATT C2
x•B
DC jack
is inserted
DC jack
is extracted
B A T T
bATT FF
x
x•B
KEY oFFiFFKEY
x
8. LED test
• LEDs (OPR: red and green) are all turned on.
9. USB test
• When the menu starts the USB self-check, either presence or
absence of the Vbus is judged.
(Vbus is present: “ON VBUS”, Vbus is absent: “OFF VBUS”)
•The USB driver always works regardless of presence or ab-
sence of the USB signal only when Vbus is available during the
USB test. At this time, turning on HOLD . causes the set
to move to the suspend state. Turning off the Vbus causes the
set to return to the test menu.
• In the menumode if the Vbus is supplied, any key will not work.
Therefore the Vbus will be supplied after surely pressing the
x•B key.
10. Key durable test
•Pressing the x•B key makes the count to “------” and sets test
standby status.
Once more pressing the x•B key makes the count to “000000”
and sets the key durable test.
In this mode any key input and slide switch operation are counted
and the number is displayed.
Turn off the power to exit this mode.
11. Menu reset
•Pressing the x•B key causes the set to enter the menu initial-
ization standby state.
•When the following keys are all entered, the EEPROM initial-
ization (returning setting in the menu and user name to default
value) and formatting process (deleting all message files in the
flash memory) are executed. At the same time, the WakeUp
signal is checked, too.
Check keys: VOL– , VOL+ , A-B
, ERASE ,
DIVIDE , DPC ON, DPC OFF, . ,
x•B , > , FOLDER , MENU , x ,
z REC , HOLD
.
ON, HOLD
.
OFF,
DIRECTNL ON
, and DIRECTNL OFF,
VOICE UP ON
, and
VOICE UP
OFF
x•B
LED ONLED
x
LED ON (orange)LED OFF
x•B
ON
cut Vbus
Vbus
on
cut Vbus
Suspend
mode
HOLD .
SUSPENDVBUS ONVBUS OFFUSB
x
x•B x•B
any keys or slide
switches operation
KEY 000001KEY 000000KEY-----KEY COUNT
x
Key durable
test
x•B
BEEP 2.0K
BEEP 1.3K
:
:
BEEP1.3K
BEEP1.3K BEEP 2.0K
BEEP
x
x
x
.
>
(select), (set)
x•B
11
ICD-SX46/SX56/SX66
x•B
In the case that
the initialization
and reset operation
end correctly.
(0.5 sec. blinking)
All keys
are entered
ALL OK INITKEY PUSH RESET MENU
x
• If all tests end in success, “ALL OK” is displayed. If initializa-
tion in the EEPROM is NG, “INIT. NG” appears.
•Turn off the power to exit the test mode.
12
ICD-SX46/SX56/SX66
SECTION 4
DIAGRAMS
•Waveform
Note on Schematic Diagrams:
• All capacitors are in µF unless otherwise noted. (p: pF) 50 WV or
less are not indicated except for electrolytics and tantalums.
• All resistors are in Ω and
1
/
4
W or less unless otherwise specified.
• f : internal tolerance.
• C : panel designation.
• A : B+ Line.
•Power voltage is dc 3V and fed with regulated dc power supply
from DC IN jack (J5001).
•Voltages and waveforms are dc with respect to ground under no-
signal (detuned) conditions.
no mark : PLAY
[ ] : REC
∗ : Impossible to measure
•Voltages are taken with a VOM (Input impedance 10 MΩ).
Voltage variations may be noted due to normal production toler-
ances.
•Waveforms are taken with a oscilloscope.
Voltage variations may be noted due to normal production toler-
ances.
• Circled numbers refer to waveforms.
• Signal path.
F : PB
L : REC
* Replacement of IC6001 and IC7003 used in this set requires a
special tool.
• The voltage and waveform of CSP (chip size package) cannot be
measured, because its lead layout is different from that of conven-
tional IC.
Note on Printed Wiring Boards:
• Y : parts extracted from the conductor side.
• : Pattern from the side which enables seeing.
(The other layers' patterns are not indicated.)
* Replacement of IC6001 and IC7003 used in this set requires a
special tool.
• Lead layouts
Lead layout of
conventional IC
CSP (chip size package)
Caution:
Pattern face side: Parts on the pattern face side seen from
(Side B) the pattern face are indicated.
Parts face side: Parts on the parts face side seen from
(Side A) the parts face are indicated.
surface
1 IC7003 <z/, (XTAL)
1 V/DIV, 100 ns/DIV
3.2 Vp-p
244 ns
1313
ICD-SX46/SX56/SX66
ICD-SX46/SX56/SX66
4-1. BLOCK DIAGRAM – MAIN SECTION-1 –
+2.5V
REG
Signal path
: REC
: PB
10112116
46
25
26
14
15
9
8
7
5
4
3
2
6
15
11
2
3
9
8
6
12
5
IC7001
SI/PO DRIVER
DATA
CLK
HPMUTE
XADAPDN
SPAMP
10
EXTMIC
XREDLED
IDSPRST
XBATTEN
XGRLED
XBATTEN
D7001
RED(REC)
GREEN(PB)
1
4
IC6003
CLOCK GEN.
IC7003 (1/3)
CPU
XCONT
FOUT
Q3003
MUTE
J3002
(SPEAKER)
3
9
7
8
10
IC7004
REAL TIME CLOCK
CLK
DI
DO
CE
XIRQ
5
FOUT
14
MONOIN
IC3004
ADC, DAC, HEADPHONE AMP
AINR2
AINL2
HPR
HPL
17
MOUT
1
PDN
28
27
AINL1
AINR1
STDO
STDO
MAIN-2
SECTION
(Page 14)
BICK
LRCK
SDTI
CDTI
CCLK
CSN
18
MIN
MCLK
BCLK
LRCK
SO
XRST
MCLK
HPJACK
SPICLK
115
SPIDATA
45
MICJACK
DSPSYSCLK
RTCCS
111
XRTCINTR
98
AUSIN
13
X0A32K
99
AUSOT
100
AUSCK
102
XADACS
18
BEEP
SP3001
B
A
MIC301
MIC2
MIC3
R
IC3003
POWER AMP
VO1
AVDD
VO2
-IN
XSHUT-
DOWN
5
8
4
1
J3001
5
3
XT
XXT
X6001
11.2896MHz
L
STEREO
1
4
6
3
IC3005
SELECTOR
A
1
3
5
IC3001
PANEL
SECTION
(Page 15)
MIC
(DIRECTNL)
OPR
1414
ICD-SX46/SX56/SX66
ICD-SX46/SX56/SX66
4-2. BLOCK DIAGRAM – MAIN SECTION-2 –
Signal path
: REC
: PB
40,
17-22
31
109
XUSBCS
USBADR0 - USBADR6
XINTUSB
29-32,
41-44
DATA0-DATA7
34
XUSBLWR
32
XUSBRD
IC6002
FLASH MEMORY
45
35
47
40
138
150
46
48
52
159
49
160
157
50
55
158
11
12
5
2
6
3
1
119
120
1
118
104
107
108
I/O1-I/O8
1923
WPXFLMWP
1035
NC_XCE2XFLMCS1
IC7002
FLASH MEMORY
IC6001
DSP
ADASI
BCLK
LRCLK
SO
XRST
MCLK
TSO
TSCK
TSOEN
TSIEN
TSIOEN
TSI
REQ
CLKIN
FMSDIO
FMSCK
DSPCVDD
XFMWP
XFMCS
SDI
SDO
SCK
XWP
XCS
DSPSIN
DSPSCK
DSPSIOEN
DSPSOT
DSPIFREQ
XTALIN
XTAL
X7001
4.096MHz
14
13
XIN
5
VBUS
3
D-
4
D+
6
TRON
XOUT
X8001
12MHz
E
A
IC7003 (2/3)
CPU
D8002
Q7002
SWITCH
45
42
44
43
23-30
24-30
3-10
CS
33
XUSBRST
95
RX
96
TX
87
MOD2
103
WAKEUP
46
RST
INT0
110
XUSBVBUS
11
INT1
LWR
RD
D0 - D7
A0 - A6
1
2
3
VBUS
D-
D+
4IN
IC8001
USB CONTROLLER
CN7001
(USB)
VBUS
D
F
DDCOUT
WAKEUP
STDO
BCLK
LRCK
MAIN-1
SECTION
(Page 13)
SO
XRST
MCLK
R/B
7
FLMRB
22
CLE
16
FLMCLE
2
17
ALE
XFLMALE
21
9
XCE
XFLMCS0
11
8
RE
XFLMRE
20
18
WEXFLMWE
19
12
IC5005
IC6004
Q7005
Q7003
Q7004
VOLTAGE
DETECT
2
4
23
IC8003
+3.5V
REG
C
KEYINH
PANEL SECTION
(Page 15)
PANEL SECTION
(Page 15)
PANEL SECTION
(Page 15)
PANEL SECTION
(Page 15)
1515
ICD-SX46/SX56/SX66
ICD-SX46/SX56/SX66
4-3. BLOCK DIAGRAM – PANEL SECTION –
40
41
112
90
97
39
DDCOUT
DDCOUT
(3.1V)
XBATTEN
Q5001
SWITCH
Q5010, 5011
SWITCH
SEG0 - SEG31
COM0 - COM3
KEYIN0
KEYIN1
HOLDSW
44
XDPCSW
IC7003(3/3)
CPU
D
F
C
WAKEUP
MAIN-2
SECTION
(Page 14)
MAIN-2
SECTION
(Page 14)
S7001
1
3
Q5002
SWITCH
Q5003
SWITCH
Q5012
SWITCH
Q5005
DC DET
VBUS
E
B
L5001
L5002
D5003
D5004
IC5003
DC/DC CONV.
31
IC5002
D5005
Q5009
VOLTAGE
DETECT
FLMVCC
(IC7002)
RESET
32
IC7005
15
IC5001
+2.9V
REG
AVDD(2.9V)
DDCOUT(3.1V)
FB1
EXT1
108
FB2
4
PWM1
6
EN2
EXT2
DSPCVDD(1.6V)
DRY BATTERY
SIZE "AAA"
(IEC DESIGNATION LR03)
2PCS. 3V
4
B+
SWITCH
Q5006,5007
B+
SWITCH
Q7001
B+
SWITCH
Q5013
DSPEVDD
(IC6001, 6002, 6003)
VBATT
IC3003 VDD
LIQUID
CRYSTAL
DISPLAY
MODULE
S901,902,
7002,7004
FUNCTION
KEY
S903,904
7003
FUNCTION
KEY
S905
SEESAW
KEY
XCPURST
XFLMPWR
BATT
117
DSPPWR
113
XDCINDET
S907
S908
DPC
KEYINH
J5001
DC IN 3V
42
MICSEL
S906
43
VUPSW
83-86
49-74,
77-82
MAIN-2
SECTION
(Page 14)
MAIN-1
SECTION
(Page 13)
ON
OFF
VOICE UP
HOLD
MAIN-2
SECTION
(Page 14)
DIRECTNL
ON
OFF
ON
OFF
ON
OFF
1616
ICD-SX46/SX56/SX66
ICD-SX46/SX56/SX66
4-4. PRINTED WIRING BOARD – AUDIO BOARD (SIDE A) –
• :Uses unleaded solder.
• Semiconductor
Location
Ref. No.
Location
IC3001 F-11
IC3003 F-13
IC3004 C-12
IC3005 D-14
IC6001 C-3
IC6003 C-6
IC6004 D-6
Q3003 E-13
IC6001
IC6003
IC6004
IC3001
IC3004
IC3003
IC3005
AUDIO BOARD (SIDE A)
3
3
1
1
34
5
1
6
5
4
4
39 1
40 2
4
6
3
1
1-867-746-
(11)
11
MIC
PLUG IN POWER
J3001
A
MAIN BOARD
CN7004
(Page 21)
MIC301
CSP (Chip size package)
*
1818
ICD-SX46/SX56/SX66
ICD-SX46/SX56/SX66
4-6. SCHEMATIC DIAGRAM – AUDIO BOARD (1/2) –
IC3001
R3002
R3004
R3032
R3022
R1001
R1015
R2001
R3031
R3003
R3023
R2015
R2007
R1007
R1013
R2013
R3001
R1008R2008
R3025
R2014
R1014
R2011 R1011
R1009
R2009 R1012
R2012
R1010
R2010
R3013
R3015 R3027
R3014
R3030
R3029
R3026
R3011
R3016
R3017
R3020
R3018
MIC3
MIC2
MIC301
(DIRECTNL)
TP3005
TP3003
TP1001
TP2001
TP3004
TP3002
TP3001
R3021
Q3003
IC3003
IC3004
IC3005
C3008
C3004
C3002
C3005
C1004
C2004
C1003
C1001
C2003
C2001
C2007
C1007
C3001C1008
C2008
C3009
C1009 C2009
C3010
FB3001
FB1001
FB2001
C2011 C1011
FB1002
FB2002
FB3002
FB3006
C1012
C2012
FB3005
FB3004
C3011
C3015
C3013
C3016
C3014
C3021
C3022
C3023
C3024
C3025
C3026
C2010
C1010
C3017
C3018
C3020
C3019
SP3001
J3002
J3001
PLUG IN POWER
CN3001
C3027
C3028
XC6204B252MR
0
100
100
0
100
0
100
0
100k
470k
0
100
100
2.2k
2.2k
2.2k
4.7k4.7k
4.7k
0
0
2.2 2.2
1k
1k 1k
1k
4.7
4.7
150k
22k 10k
100k
100k
47k
2.2k
100k
220
100k
10
100k
220k
NTHD4508NTIG
MM3111AWLE
AK4569VN-L
TC7PA53FU(TE85L
0
1
0.1
10
6.3V
10
6.3V
10
6.3V
1
0.1
1
0.1
0
0
11
1
0.01
0.01 0.01
nm
0.22 0.22
47
6.3V
47 6.3V
0H
0H
0.1
0.47
220p
0.022
0.022
0.1
0.1
0.01
0.1
0.1
1000p
0.1
0.1
0.1
2.2
6.3V
10
6.3V
0.1
(SPEAKER)
HP JACK
MIC JACK
FPC MIC 4P
nFm18pS105
nFm18pS105
• See page 26 for IC Block Diagrams.
1919
ICD-SX46/SX56/SX66
ICD-SX46/SX56/SX66
4-7. SCHEMATIC DIAGRAM – AUDIO BOARD (2/2) –
IC6004
R6004
R6009
R6026 R6027
R6025
R6022
R6023
R6013 R6014
R
6
01
7
R
60
1
6
R6018
R6019
R6015
R6021
R6020
R7051
R7052
R
60
1
2
R6011R6010R6008
R6002
R3028
R6001
R6007
R6005
R6006
R7002
OPR
R7003
S7002
ERASE
DIVIDE/PRIORITY
S7004 S7003
TP6013
TP6012
TP6011
TP6001
T
P
6
002
TP6003 TP6004 TP6005 TP6006
TP6007
TP6008
TP6009
TP6010
IC6002
IC6003
CN7003
CN7005
R
60
03
C6003
C6006
C6007
C6010
C6014
C6002
C6001
D
70
0
1
X
6
00
1
RB6001
RB6002
IC6001
TC7S04FU(TE85R)
470k
100k
100k 100k
0
47
47
100k 100k
10
0k
100
k
100k
100k
100k
100k
100k
4.7k
0.5%
3.3k
0.5%
47
0
k
470k470k470k
470k
220
470k
100k
100k
100k
470
2.2k
M25P10-AVMN6TP
NJU6366AF1(TE1)
B TO B
FPC SW 11P
470
k
0.1
0.1
1000p
100p
0.1
1
1
L
C
-3
75
H
R
1
Y
G
-D
-T
S
11
.2
89
6
M
H
z
100k
100k
-DA2
• See page 26 for IC Block Diagrams. • See page 19 for IC Pin Function Description.
2020
ICD-SX46/SX56/SX66
ICD-SX46/SX56/SX66
4-8. PRINTED WIRING BOARD – MAIN BOARD (SIDE A) –
• :Uses unleaded solder.
• Semiconductor
Location
Ref. No.
Location
D5002 A-4
D5003 C-8
D5004 D-7
D5005 D-5
D5007 D-3
D5009 C-3
IC5001 D-10
IC5002 E-6
IC5003 D-9
IC5005 F-11
IC7001 B-16
IC7003 C-13
IC7005 E-15
Q5002 D-8
Q5003 E-8
Q5006 C-11
Q5007 B-11
Q5009 D-4
Q5012 E-7
IC7001
IC7003
IC5001
IC5005
IC5003
IC5002
IC7005
MAIN BOARD (SIDE A)
1
45
8
1
4
5
8
J5001
3
3
1
1
2
4
4
5
1
2
1-867-745-
(11)
11
HOLD.
ON
40
1
DC IN 3V
DRY BATTERY
SIZE "AAA"
(IEC DEESINATION LR03)
2PCS 3V
LCD MODULE
CSP (Chip size package)
*
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