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NBLB2
Service Manual
CHAPTER 1 SYSTEM DESCRIPTION SPECIFICATION .................................................... 1
SPECIFICATIONS........................................................................................................................ 3
CHAPTER 2 SOFTWARE SPECIFICATION .......................................................................... 6
1. SYSTEM COMPONENTS SUMMARY ...........................................................................................7
2. SYSTEM CONTROLS .................................................................................................................9
2.2 System status indicators .................................................................................................................. 9
2.1 Buttons ............................................................................................................................................ 9
3. CORE BIOS FEATURES ............................................................................................................9
3.1 Multi Boot ....................................................................................................................................... 9
3.2 Quiet Boot ....................................................................................................................................... 9
3.3 Boot Block .................................................................................................................................... 10
4. THERMAL MANAGEMENT .......................................................................................................10
5. POWER MANAGEMENT FOR ACPI MODE ................................................................................10
5.1 Introduction................................................................................................................................... 10
5.2 System Time-outs ......................................................................................................................... 10
5.3 System Power Management.......................................................................................................... 10
5.4 Device Power Management .......................................................................................................... 11
5.5 Hibernation ................................................................................................................................... 12
6. ACPI (ADVANCED CONFIGURATION AND POWER INTERFACE) ..............................................13
6.1 Introduction................................................................................................................................... 13
6.2 ACPI Sleep Status ......................................................................................................................... 13
6.3 Fast Resume .................................................................................................................................. 13
6.4 Power State Transition Diagram ................................................................................................... 13
6.5 Storage Devices and Batteries ...................................................................................................... 14
6.6 Bootable Device ............................................................................................................................ 14
6.7 Embedded controller ..................................................................................................................... 14
7. PC2001 ..................................................................................................................................15
8. MISCELLANEOUS FEATURES ..................................................................................................15
8.1 Single BIOS ROM ........................................................................................................................ 15
8.2 USB Support ................................................................................................................................. 15
8.3 Flash utility – one BIOS ROM only ............................................................................................. 15
8.4 Crisis Recovery ............................................................................................................................. 15
8.5 VGA Support ................................................................................................................................ 15
9. CUSTOMER SPECIFIC FEATURES .............................................................................................16
9.1 Display of System Type and BIOS Version Number on Boot ..................................................... 16
9.2 CMOS RAM management ........................................................................................................... 16
9.3 System Management BIOS(SM BIOS) version 2.4 (DMI 2.0) .................................................... 16
9.4 EEPROM ...................................................................................................................................... 16
10. SYSTEM SETUP .......................................................................................................................18
10.1 Invoking setup .............................................................................................................................. 18
10.2 Setup screens ................................................................................................................................ 18
10.2.1 Main Menu .................................................................................................................................... 18
10.2.2 Security Menu ............................................................................................................................... 19
10.2.3 Boot Menu ..................................................................................................................................... 21
10.2.4 Exit Menu ...................................................................................................................................... 22
11. OS COMPATIBILITY ...............................................................................................................24
12. SOFTWARE SPECIFICATION FOR EC-FW ................................................................................24
12.1 General purpose ............................................................................................................................ 24
12.2 Features ......................................................................................................................................... 24
12.3 Types of EC-FW provided ............................................................................................................ 24
12.3.1 Command set 40h-4Fh for OEM defined through Port60/64, Port62/66 and Port68/6C ............. 25
3
12.3.2 Command set 50h-5Fh for OEM defined through Port60/64, Port62/66 and Port68/6C ............. 29
12.4 Hot keys for system control (TBD) .............................................................................................. 35
12.5 Audio volume output control ........................................................................................................ 36
12.6 External Buttons status report and control .................................................................................... 36
12.6.1 Power Switch (Push button) ......................................................................................................... 36
12.6.2 Wireless Device button ................................................................................................................. 36
12.6.3 Touch pad on/off Button ............................................................................................................... 36
12.6.4 Lid Switch ..................................................................................................................................... 36
12.6.5 General Button 1 (Not supported) ................................................................................................ 36
12.6.6 General Button 2 (Not supported) ................................................................................................ 37
12.6.7 USB Charge Button ...................................................................................................................... 37
12.6.8 Play/Pause ( )(Not supported) ................................................................................................ 37
12.6.9 Stop/Eject ( )(Not supported) ................................................................................................. 37
12.6.10 Next/FF ( )(Not supported) ................................................................................................... 37
12.6.11 Prev/RR ( )(Not supported) .................................................................................................. 37
12.6.12 Mute Button (Not supported) ...................................................................................................... 37
12.6.13 Volume Up Button (Not supported) ............................................................................................ 37
12.6.14 Volume Down Button (Not supported) ....................................................................................... 37
12.6.15 WOW Video Button .................................................................................................................... 37
12.6.16 WOW Audio Button ................................................................................................................... 37
12.6.17 Program DJ ................................................................................................................................. 37
12.7 External LEDs status report and control ....................................................................................... 38
12.7.1 Definitions of Lock LEDs ............................................................................................................ 38
12.7.2 Definitions of System state LED .................................................................................................. 38
12.7.3 Definitions of AC LED ( ) .................................................................................................. 38
12.7.4 Definitions of HDD accessing state Green LED ( ) ........................................................... 38
12.7.5 Definitions of SWDJ state Green LED (Not supported) .............................................................. 38
12.7.6 Definitions of Wireless State LED ............................................................................................... 38
12.7.7 Definition of touch pad on/off state LED ..................................................................................... 38
12.7.8 Definition of mute on/off state LED (Not supported) .................................................................. 38
12.7.9 Definitions of Power button backlight LEDs ............................................................................... 38
12.7.10 Definitions of Easy Access Button LEDs (Not supproted) ......................................................... 38
12.7.11 Definitions of Battery state LED ( ) ................................................................................... 39
12.7.12 Definitions of RJ-45 LEDs ......................................................................................................... 39
12.7.13 Definitions of Flash Media LEDs ............................................................................................... 39
12.8 Battery status report and control ................................................................................................... 39
12.8.1 Battery status (TBD) ..................................................................................................................... 39
12.8.2 Battery type ................................................................................................................................... 41
12.8.3 Adaptor loading Protection (TBD) ............................................................................................... 41
12.9 EC-FW Power management support ............................................................................................ 41
12.9.1 Power states .................................................................................................................................. 41
12.9.2 SMI/SCI/SWI/SBS/SPB events .................................................................................................... 41
12.9.3 Deep Sleep .................................................................................................................................... 43
12.10 Thermal Status Report and Fan Control ....................................................................................... 43
12.10.1 Fan control by Voltage ................................................................................................................ 44
12.10.2 Fan control by PWM. (Not supported) ....................................................................................... 45
12.11 Software DJ (Not supported) ........................................................................................................ 45
12.11.1 Function Selected by Push switch ............................................................................................... 45
12.11.2 Software DJ ................................................................................................................................. 45
12.11.3 CD/DVD and Digital mode LED status ...................................................................................... 46
12.12 Three host interface channels support .......................................................................................... 46
12.12.1 Keyboard and mouse interface transfer port ............................................................................... 46
12.12.2 Power management interface transfer port.................................................................................. 46
12.12.3 Extra transfer port ....................................................................................................................... 46
12.13 Support three independent devices through PS/2 channel simultaneously ................................... 46
12.14 Devices PnP configuration ........................................................................................................... 46
12.14.1 Hot Plug-and-Play ....................................................................................................................... 46
12.14.2 Hot swapping control .................................................................................................................. 47
12.15 ACPI EC interface Specification support ..................................................................................... 47
12.15.1 ACPI interface support ................................................................................................................ 47
12.15.2 EC command support .................................................................................................................. 47
12.16 Internal keyboard change Configuration ...................................................................................... 47
12.16.1 US/UK/PA/JP country option ..................................................................................................... 47
12.16.2 Sticky key support ....................................................................................................................... 47
12.16.3 Internal Keyboard can support wake-up system to resume S3. .................................................. 47
12.16.4 Internal Key-Pad mode control ................................................................................................... 47
12.16.5 Special combine key for customer .............................................................................................. 48
12.17 EC name space Configuration ...................................................................................................... 48
12.17.1 Customer EC name space definition ........................................................................................... 48
12.17.2 Project EC name space definition ............................................................................................... 48
12.17.3 SMBus EC interface ACPI RAM definition ............................................................................... 48
12.17.4 External name space definition ................................................................................................... 49
12.17.5 Word registers to Emulate smart selector RAM definition ......................................................... 49
12.17.6 EC interface OEM common RAM definition ............................................................................. 50
12.17.7 Control method for 1st battery pack RAM definition ................................................................. 54
12.17.8 Control method for 2nd battery pack RAM definition ................................................................ 56
12.17.9 Battery information reading ........................................................................................................ 58
12.18 SMBus device address .................................................................................................................. 58
12.19 Embedded Controller chipset........................................................................................................ 59
12.19.1 ENE KB926 ................................................................................................................................ 59
12.19.2 Force to let EC to enter crisis mode ............................................................................................ 59
CHAPTER 3 HARDWARE ........................................................................................................ 60
1. TOP VIEW ..............................................................................................................................61
2. BOTTOM VIEW........................................................................................................................62
CHAPTER 4 DC-DC CONVERTER......................................................................................... 63
1. POWER .....................................................................................................................................64
2. DC-DC CONVERTER............................................................................................................64
2.1 NBLB2 ADAPTER DESCRIPTION ............................................................................................64
2.2 FEATURE ................................................................................................................................64
2.3 ADAPTER ELECTRICAL SPECIFICATION ..................................................................................65
3. DC-DC CONVERTER............................................................................................................66
3.1 DESCRIPTION ..........................................................................................................................66
3.2 FEATURES ..............................................................................................................................66
3.3 ELECTRICAL SPECIFICATION ...................................................................................................66
3.4 TEMPERATURE RANGE: ..........................................................................................................66
3.5 CHARGER ...............................................................................................................................71
3.6 CHARGER ...............................................................................................................................71
3.7 OVER VOLTAGE PROTECTION: ..............................................................................................71
3.8 UNDER VOLTAGE PROTECTION: ..............................................................................................72
3.9 SHORT CIRCUIT PROTECTION: .................................................................................................72
3.10 I/O .......................................................................................................................................72
3.10.1 DC-Jack ......................................................................................................................................... 72
3.10.2 Battery Connector ......................................................................................................................... 72
5
3.10.3 Interface between Power with M/B ............................................................................................... 72
3.11 BATTERY ..........................................................................................................................73
3.11.1 Li-Ion smart ................................................................................................................................... 73
3.11.2 On board RTC battery ................................................................................................................... 74
4. POWER INTERFACE ...................................................................................................................75
4.1 POWER REQUIREMENT ...........................................................................................................75
4.2 POWER/EE INTERFACE DEFINITION: .......................................................................................75
5. RESET MAP ..............................................................................................................................76
CHAPTER 5 DISASSEMBLY GUIDE ..................................................................................... 77
DISASSEMBLING THE BASE UNIT .................................................................................................78
1. REMOVING THE BATTERY PACK ............................................................................................79
2. REMOVING THE HDD MODULE .............................................................................................80
3. REMOVING THE DDR RAM ...................................................................................................82
4. DISASSEMBLING THE ODD (CD-ROM/DVD-ROM/CD-RW…) ..........................................84
5. REMOVING THE KEYBOARD ...................................................................................................85
6. REMOVING THE SYSTEM FAN .................................................................................................87
7. REMOVING THE THERMAL MODULE ......................................................................................88
8. REMOVING THE CPU .............................................................................................................89
9. REMOVING THE LCD MODULE ..............................................................................................90
10. DISASSEMBLING THE DISPLAY ...............................................................................................92
11. REMOVING THE CAMERA MODULE ........................................................................................95
12. REMOVING THE LOGIC UPPER ................................................................................................96
13. REMOVING THE MOTHERBOARD ............................................................................................98
14. REMOVING THE USB BOARD .................................................................................................99
15. REMOVING THE POWER BOARD ...........................................................................................100
16. REMOVING THE FUNCTION BOARD ......................................................................................101
17. REMOVING THE BLUETOOTH MODULE.................................................................................102
18. REMOVING THE TOUCH PAD ................................................................................................103
CHAPTER 6 TESTING AND TROUBLESHOOTING ........................................................ 104
TESTING AND TROUBLESHOOTING .............................................................................................105
1. PERFORM VISUAL INSPECTION ..................................................................................106
2. TROUBLESHOOTING FLOWCHART ........................................................................................106
3. POWER SUPPLY TROUBLESHOOTING ....................................................................................110
4. DISPLAY TROUBLESHOOTING ..............................................................................................115
5. KEYBOARD TROUBLESHOOTING ..........................................................................................118
6. EXTERNAL USB DEVICES TROUBLESHOOTING ....................................................................120
7. CRT TROUBLESHOOTING .....................................................................................................122
8. HDMI TROUBLESHOOTING ..................................................................................................124
9. TOUCH PAD TROUBLESHOOTING .........................................................................................126
10. SPEAKER TROUBLESHOOTING ..............................................................................................128
11. CD-ROM/DVD TROUBLESHOOTING ...................................................................................130
12. WIRELESS LAN TROUBLESHOOTING ...................................................................................132
13. CAMERA FUNCTION TROUBLESHOOTING..............................................................................135
14. BLUE TOOTH FUNCTION TROUBLESHOOTING .......................................................................137
1
Chapter 1
System Description
Specification
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IMPORTANT SAFETY INSTRUCTIONS
When using your telephone equipment, basic safety precautions should always be
followed to reduce the risk of fire, electric shock and injury to persons, including the
following:
Do not use this product near water, for example, near a bathtub, washbowl, and
kitchen sink or laundry tub, in a wet basement or near a swimming pool.
Avoid using a telephone (other than a cordless type) during an electrical storm.
There may be a remote risk of electric shock from lightning.
Do not use the telephone to report a gas leak in the vicinity of the leak.
Use only the power cord indicated in this manual.
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Specifications
CPU
Intel Clarksfiled (1.73G/1.6G 45nm 45W)
Chipset
Intel Ibex-Peak (PM55)
Memory
Clarksfiled Support DDR-3 1066/1333MHz
1GB/2GB/4GB modules
Easy upgrade from bottom side for two SODIMM, Max.8GB
Display
15.6” 16:9 W W/LED HD Glare 1366x768
15.6"W W/LED Full HD 1920*1080
LED Backlight
Hard Disk Drive (HDD)
9.5mm, 2.5" SATA HDD (5400rpm/7200rpm )
Optical Disc Drive (ODD)
Fixed 12.7mm height (SATA)
DVD Super-Multi (DVD-RAM/-R/-RW/+R/+RW), 8X write
CD-R/CD-RW/DVD-RAM/-R/-RW/+R/+RW writable
Support Double Layer Recording is required
High Definition Disc
Blue-ray Combo DVD
Graphics Chip
ATI Madison 128 bits, DDR3 64Mx16*8 (1G)
Audio
HD Audio
2 x Speakers, Microphone-in and headphone-out
2 x Internal Microphone support
Communication
LAN: 10/100, 1000 LAN
Wireless LAN: 802.11 a/b/g/n via Mini-Card (option)
Bluetooth: with USB2.0 interface (option)
Keyboard
86/87 keys support with 101/102 key emulation without stick-point
Windows key, Application key
Standard pitch, 2.5+/-0.2 mm travel length
Multi-Language support
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Pointing Device
Touchpad with up/down scroll zone and two buttons
Flash card reader
3-in-1 Card Reader (SD, MMC, MS), don‟t support XD card
I/O Ports
USB 2.0 x 4, Power USB x 4, HDMIx1
RGB: VGA port x 1
Microphone-in x 1, Headphone-out × 1, CIR, DC-in jack
Kensington lock x 1
3-in-1 Flash Card Reader (SD/MMC/MS) x 1
Internal microphone x 2
TV Tuner RF Antenna (Option)
Camera
2.0M Pixel CMOS Camera w/ USB2.0 interface
TV tuner
Analog/Digital TV in Mini Card (option)
Remote controller
System Status Indicators
2 K/B indicators: Caps Lock, and Num Lock
1 Power Button LED
1 LED for IDE HDD activity
1 LED for System status (Power On / Suspend) (Blue)
1 LED for Battery status (Charging / Full / L1 / L2)
1 LED for Blue tooth/Wireless Card
1 LED for TP Button Disable (Blue/Enabled)
1 LED for Power USB (Blue)
1 LED for WoW Audio (Blue)
1 LED for WoW Video (Blue)
1 LED for Smart Key (Blue)
Control buttons
Power button (support software off, 4 sec) x 1
Magnetic lid switch control for system standby/wakeup
One Switch to On/Off Wireless Device for wireless control
Control buttons for Power USB (Workable in system off mode)
Touchpad Disable Button / Touch Pad Button
User keys
1x button for Program DJ to Launch AP
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2x buttons for WoW AV to change mode
Wow Video -- 5 modes
Wow Audio -- 5 modes
AC Adapter
Universal AC adapter. (90W with 19V DC/3 pin 240V AC cable)
Battery
6-cell Li-On, 18650 type, 4800/5200mAh.
Life Cycle: 70% Design Capacity after 300 Cycles in 25degreeC
Software
Insyde BIOS
Suspend to DRAM/HDD
Security: Power-On Password, Supervisor Password
HDD password
USB memory Boot support
Support SMBIOS 2.4, PCI2.2
Support PXE
Wake on LAN from S3
Wake on LAN from S4 /S5 in AC mode
OS
Windows 7 Ultimate (64bit)
Ready for Windows 7 Premium (64bit)/Windows 7 Ultimate (32bit)
Mini Card
Two mini-card (WLAN x1, TV-Tuner x1 ) (Option)
Security
BIOS Password / Fingerprint / Kensington lock
Trusted Platform Module: TPM 1.2
Regulatory
EMI: FCC-B, CE,C-Tick, BSMI
Safety: Compliant to UL/CSA, TUV, and CB
Energy Star /WHQL LOGO
Environment
Temperature: Operating: 5 - 35°C / Storage: -20 - 65°C
Humidity: 10 - 90% without condensation.
Altitude: Operating sea level up to 10,000 ft
Storage sea level up to 40,000 ft
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Chapter 2
Software Specification
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1. System Components Summary
Processor
- Intel Clarsfield Quad Processors, 4 core, Max IMC up to 1333MHz,
- on die, up to 8MB L3 cache.
Core Logic
- Intel Calpella platform:
- Ibex-Peak Platform Controller Hub (PCH), PM55.
System
Memory
- No on board memory
- Support DDR-III 1066/1333 MHz
- Two SODIMM with 1GB/2GB/4GB modules
- Easy upgrade from bottom side for two SODIMM.
- Max. 8GB
Display
- 15.6"W W/LED HD Glare 1366x768(HD)
- 15.6"W HD Glare CMO N156B6-L04 1366x768(HD)
- 15.6"W HD Glare CPT CLAA156WA11A 1366x768(HD)
- 15.6"W HD Glare LG LP156WH2-TLA1 1366x769(HD)
- 15.6"W W/LED Full HD 1920*1080
- 15.6" AU0 LCD_LED_M B156HW01 V3 15.6" FHD
- 15.6" LCD LG _LED_M LP156WF1-TLC1 15.6" FHD G
HDD
- 9.5mm, 2.5" S-ATA HDD
- support with 160/250/320GB ( 5400rpm ) capacity
- support with 160/320GB ( 7200rpm ) capacity
- Easily removable no more than two screws
Optical
Drives
- Fixed 12.7mm height SATA ODD:
- DVD Super-Multi (DVD-RAM/-R/-RW/+R/+RW Super Multi )
DVD-RAM/-R/-RW writable
Support Double-Layer Recording is required
High Definition Disc (BD-Multi ROM)
- Blue-Ray/Combo
Video Chip
- GPU On board, ATI Madison Pro 128bits, GDDR3 64Mx16 8pcs
(1024M)
- Hynix-H5TQ1G63BFR-12C or Samsung -K4W1G1646E-HC12
Audio
- Realtek ALC272
- HD Audio
- Microphone-in and headphone-out
- Two speakers
- Two analog & omni microphones, Microphone Array support.
On-board
Comms
- LAN, Atheros AR8131-AL1E, 10/100/1000Mbps.
- Wireless LAN, 802.11a/g/n, Intel Shirley Peak (option).
- 802.11a/b/g/n, Shirley Peak(option).
- Antenna: WiMAX x 2.
- Bluetooth USB type, ver 2.1, Foxconn (Broadcom) (Option).
- Card Reader: Realtek RTS5159.
- TV Tuner: Hybrid TV in mini-Card, YUAN & Askey (option).
Keyboard
- 85/86 keys support with 101/102 key emulation without stick-point.
- Windows key, Application key
- Standard pitch, 300mm travel length.
- Multi-Langue support.
- The plate of K/B for Intel is different with the plate for A30 customers
- The printing of K/B is same for both Intel and A30
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Pointing
Device
- Touch pad with two buttons ( up & down)
Web Cam
- 2.0M pixel CMOS via USB 2.0 interface.
Auto-focus (ME dimension).
Face detect function (Compal SW).
Business card scanner.
A4 scanner.
I/O Ports
- USB V2.0, x 4, all are with Power USB feature
- RGB; VGA port x 1, 15pins
- Microphone-in x 1
- Headphone-out jack x 1
- DC-in jack x 1
- Mini Card x2
- Media Card Reader(SD/MMC/MS) x 1
- RJ-45 jack x 1
- Kensington lock x 1
- HDMI x 1
- RF-in x 1(option)
- CIR
User keys
- Power Button. x 1
- Magnetic Lid Switch. x 1
- Wireless switch x 1
- Power USB Button x 1
- Smart Key (Program DJ )x 1
- Wow Video. Four modes: Movie, Photo, Office, Nature. x 1
- Wow Audio.
Security
- Fingerprint
TPM 1.2 by Infineon
Design ready for Windows Vista32 & Windows 7.
- Kensington lock
Controls
- Power button x 1
- Magnetic lid switch control for system standby or suspend
AC adapter
- Universal AC Adapter, 19V DC, 3 pins 240V
90W.
Battery
- Life Cycle: 70% Design Capacity after 300 Cycles in 25 degrees C.
6-cell Li-On, 18650 type, 4800/5200mAh, CBB-look A30.
Software
- Insyde BIOS
- 2048KB Flash BIOS ROM
- Suspend to RAM/Disk
- No support APM
- USB memory Boot support
- Support SMBIOS 2.4, PCI2.2.
- ACPI 2.0 compliance with Intel Speed-step Support C-State and S3, S4
for mobile CPU
Operating
System
- Windows 7 / Windows Vista 32-bit Premium.
Keyboard
Controller
- ENE KB926 K/B Controller
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2. System Controls
2.1 Buttons
2.1.1 Power Button
The activity of the power button is as follows:
If system is Off/Hibernate: System will be turned on while Power switch is
depressed by more than 100 ms
If system is in Standby state: System will resume while Power switch is
depressed by more than 100 ms.
If system on with legacy mode: depress this button will turn off power.
If system is running in ACPI OS, the power button acts as the sleep button, and let
OS controls the policy of power button which is defined in Power Option under the
OS.
2.1.2 Power Button Over-ride
Holding down the Power Button for 4 seconds will cause an unconditional transfer
to the off state without notifying the operating system.
2.1.3 Lid switch
If the system is running under legacy mode:
Closing the lid will turn off LCD backlight.
If the system is running under ACPI mode:
The operating system will determine what action to take when the lid is opened
and closed.
The function of lid switch will follow the OS setting in power management (Nothing,
Standby or Hibernate). If nothing, the backlight must turn off when the lid is closed.
2.2 System status indicators
Please refer to Keyboard BIOS specification.
3. Core BIOS Features
3.1 Multi Boot
The notebook can support Multi-Boot for selecting the boot sequence of Hard Drive,
Removable Devices, CD-ROM/DVD Drive and Network in Setup.
3.2 Quiet Boot
Quiet Boot replaces the customary technical messages during POST with a more
visually pleasing and comfortable display (OEM screen). During POST, right after
the initialization of VGA, The notebook displays an illustration called the OEM
screen during system boot instead of the traditional POST screen that displays the
normal diagnostic messages.
The OEM screen stays up until just before the operating system loads unless:
Pressing <Esc> to switch to the POST screen and the boot process will
continue until the end of POST.
Pressing <F2> to enter Setup.
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Pressing<F12>to enter Boot Menu
Whenever POST detects a non-terminal error, it switches to the POST screen
near the end of POST, just prior to prompting for a password.
If the BIOS or an option ROM request keyboard input, the system switches over
to the POST screen with prompts for entering the information. POST continues
from there with the regular POST screen.
3.3 Boot Block
The Flash ROM used in many systems today offer the customer the advantage of
electronically reprogramming the BIOS without physically replacing the BIOS ROM.
This advantage, however, does create a possible hazard: power failures or
fluctuations that occur during updating the Flash ROM can damage the BIOS code,
making the system unbootable. To prevent this possible hazard, many Flash
ROM include a special non-volatile region that can never be erased. This region,
called the boot block, contains a fail-safe recovery routine. If the boot block finds
corrupted BIOS, it prompts the end user to insert a diskette, from which it loads
several files that replace the corrupted BIOS on the Flash ROM with an
uncorrupted one.
4. Thermal management
Please refer to Keyboard BIOS specification.
5. Power Management for ACPI mode
5.1 Introduction
The notebook supports ACPI. The system will dynamically switch to ACPI mode for
configuration and power management when an ACPI OS is loaded.
When ACPI is not loaded and enabled, the power management function will be
disabled.
5.2 System Time-outs
If the system is running in ACPI mode, system Time-outs is handled by the
operating system. BIOS time-outs are disabled. System time-outs are set using
the control panel power applet.
5.3 System Power Management
The overall system can be in one of the system power states as described below:
ACPI mode
Power Management
Mech. Off (G3)
All devices in the system are turned off completely.
Soft Off (G2/S5)
OS initiated shutdown. All devices in the system are turned off
completely.
Working (G0/S0)
Individual devices such as the CPU and hard disk may be
power managed in this state.
S3 Sleeping State
CPU set power down
VGA Suspend
New Card Suspend
Audio Suspend
Hard Disk Power Down
ODD Power Down
Super I/O Power Down
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S4 Sleeping State
System Saves all system states and data onto disk prior to
power off the whole system.
5.4 Device Power Management
Under ACPI mode, the device specific power management supported by this
notebook includes the CPU throttling, monitor power management and the hard
disk.
5.4.1 CPU power management
ACPI mode
The operating system detects when the system is idle and places the CPU in one
of the 3 CPU low power states (C1, C2, C3 up to C6) depending on how much
latency it believes the system can afford.
The C1 state is simply the CPU halt instruction. The C2 state is the CPU stop
grant state. The C3 state is the CPU stops clock state. The CPU stays in this
state until an interrupt occurs.
5.4.2 Hard Disk
The operating system uses the spin down timer of the hard drive to set time-outs.
The BIOS time-out of the hard disk must be disabled in ACPI mode. The user can
sets the hard disk spin down time-out in the control panel power applet.
5.4.3 Display Device
The monitor can be turned off after a period of no activity based on the settings of
the OS.
5.4.4 System Wake Up Sources
The table below lists the wake up events for all low power states:
Events
S3
S4
S5
Process required
Any key
O
X
X
X
Power button
O
O
O
X
LAN (On board)
O
O
X
O
RTC
O
O
X
O
Critical low battery
O
X
X
O
Field „Process required‟ identifies that further process for the occurred events must be
processed during wake up or resumes procedure.
5.4.4.1 LAN
LAN (On board)
The function of waking up the system from standby (DC/AC)/hibernation (AC mode) is
supported.
5.4.4.2 Real Time Clock Alarm
The Real Time Clock alarm interrupt will wake the system from Standby (DC/AC) /
Hibernation (AC mode)
5.4.4.3 Critical Low Battery
Critical low battery event can wake the system from Standby (DC mode) in ACPI mode.
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5.5 Hibernation
To support the hibernate state, the save to disk partition or file will be created by the
operating system if the user select to enable the hibernation.
It is the responsibility of the operating system to save the system state to a disk file and
restore the system state when it is turned back on.
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6. ACPI (Advanced Configuration and Power Interface)
6.1 Introduction
The Advanced Configuration and Power Interface (ACPI) is a well-specified power
management and configuration mechanism. It evolves the existing collection of
power management codes, APM, PnP BIOS, and Etc.
6.2 ACPI Sleep Status
BIOS must support the following sleep states – S3, S4 and S5.
6.3 Fast Resume
BIOS must hands off the control to the operating system within the following time
limits:
Required
S3->S0
2seconds
*Measured using the Microsoft BootVis tool.
In addition, total resume time from S3 must be completed within 5 seconds.
6.4 Power State Transition Diagram
The state transition diagram in ACPI mode is as follows:
From (State)
Leave By Condition
Enter (State)
S3
Power Button
S0
On board LAN
Any key
Alarm
Critical low battery(Only in DC mode)
S4
Power Button
S0
On board LAN (Only in AC mode)
RTC(Only in AC mode)
S5
Power Button
S0
S0
Press Lid switch (depends on ACPI
OS setting)
S3
Standby icon in shutdown menu in
Windows.
ACPI OS timer expired
Critical low battery (depends on
ACPI OS setting)
S0
Press Lid switch (depends on ACPI
OS setting)
S4
Press Power Button (depends on
ACPI OS setting)
S0
Press Lid switch (depends on ACPI
OS setting)
S5
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Press Power Button (depends on
ACPI OS setting)
6.5 Storage Devices and Batteries
Possible storage devices are FDD, HDD, CD-ROM and DVD-ROM
Floppy Disk and Hard Disk, CD-ROM and DVD-ROM
The BIOS must report the correct types of these devices if the drive is installed in
the system during POST. Two devices, which belong to the same category, are
not supported in this notebook.
Batteries
The BIOS must follow ACPI specification and report the correct number of the
installed battery and status.
6.6 Bootable Device
The system is capable of booting from onboard HDD, CD ROM, DVD-ROM,
external USB Floppy and USB ATA Flash device.
6.7 Embedded controller
The keyboard controller will act as the ACPI embedded controller and support the
ACPI EC protocol and interface.
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