Gigabyte R270-R3C User manual

R270-R3C

Dual LGA2011 sockets R3 motherboard for Intel® E5-2600 V3/V4 series processors

Service Guide

Rev. 1.1

Copyright

The trademarks mentioned in this manual are legally registered to their respective owners.

Disclaimer

Information in this manual is protected by copyright laws and is the property of GIGABYTE.

Changes to the specifications and features in this manual may be made by GIGABYTE

without prior notice. No part of this manual may be reproduced, copied, translated, transmitted, or

published in any form or by any means without GIGABYTE's prior written permission.

Documentation Classications

In order to assist in the use of this product, GIGABYTE provides the following types of documentations:

 For detailed product information, carefully read the User's Manual.

For more information, visit our website at:

http://b2b.gigabyte.com

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Get an access to our complete source of sales, marketing & technical materials at:

http://reseller.b2b.gigabyte.com

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Preface

Before using this information and the product it supports, please read the following general infor-

mation.

1. This Service Guide provides you with all technical information relating to the BASIC CON-

FIGURATION decided for GIGABYTE’s “global” product offering. To better t local market-

requirements and enhance product competitiveness, your regional ofce MAY have decided

toextend the functionality of a machine (e.g. add-on card, modem, or extra memory capabil-

ity).These LOCALIZED FEATURES will NOT be covered in this generic service guide. In

suchcases, please contact your regional ofces or the responsible personnel/channel to

provide youwith further technical details.

2. Please note WHEN ORDERING SPARE PARTS, you should check the most up-to-date

informationavailable on your regional web or channel. For whatever reason, if a part num-

ber change is made,it will not be noted in the printed Service Guide. For GIGABYTE-AU-

THORIZED SERVICEPROVIDERS, your GIGABYTE ofce may have a DIFFERENT part

number code to thosegiven in the FRU list of this printed Service Guide. You MUST use the

list provided by yourregional GIGABYTE ofce to order FRU parts for repair and service of

customer machines.

- 4 -

Table of Contents

Box Contents ...................................................................................................................7

Safety, Care and Regulatory Information ........................................................................8

Chapter 1 Hardware Installation ...................................................................................11

1-1 Installation Precautions .................................................................................. 11

1-2 Product Specications .................................................................................... 12

1-3 System Block Diagram ................................................................................... 14

Chapter 2 System Hardware Installation ......................................................................15

2-1 Removing Chassis Cover ............................................................................... 16

2-2 Removing and Installing the Fan Duct ........................................................... 17

2-3 Installing the CPU ......................................................................................... 18

2-4 Installing the Heat Sink ................................................................................. 19

2-5 Installing the Memory ..................................................................................... 20

2-5-1 Four Channel Memory Conguration .....................................................................20

2-5-2 Installing a Memory ...............................................................................................21

2-5-3 DIMM Population Table ..........................................................................................22

2-5 Installing the PCI Expansion Card ................................................................. 23

2-6 Installing the Hard Disk Drive ......................................................................... 24

2-7 Replacing the FAN Assemblly ........................................................................ 25

2-8 Replacing and Installing the Power Supply .................................................... 26

2-9 Installing Rail Into A Rack ............................................................................... 27

Chapter 3 System Appearance .....................................................................................28

3-1 Front View ...................................................................................................... 28

3-2 Rear View ....................................................................................................... 28

3-3 Front Panel LED and Buttons ........................................................................ 29

3-4 Rear System LAN LEDs ................................................................................. 31

3-5 Hard Disk Drive LEDs .................................................................................... 32

3-6 Cable Routing ................................................................................................ 33

Chapter 4 Motherboard Components ...........................................................................34

4-1 MD70-HB0 Motherboard Components ........................................................... 34

4-2 Jumper Setting ............................................................................................... 37

Chapter 5 BIOS Setup ..................................................................................................39

5-1 The Main Menu .............................................................................................. 41

- 5 -

5-2 Advanced Menu ............................................................................................. 44

5-2-1 Serial Port Console Redirection .............................................................................45

5-2-2 PCI Subsystem Settings .........................................................................................49

5-2-2-1 PCI Express Settings ..............................................................................................51

5-2-3 Network Stack ........................................................................................................53

5-2-4 CSM Conguration .................................................................................................54

5-2-5 Post Report Conguration ......................................................................................56

5-2-6 Trusted Computing .................................................................................................57

5-2-7 USB Conguration ..................................................................................................58

5-2-8 Chipset Conguration .............................................................................................59

5-9 SIO Conguration ...................................................................................................60

5-2-10 iSCSI Conguration ................................................................................................63

5-3 Intel RC Setup Menu ...................................................................................... 64

5-3-1 Processor Conguration .........................................................................................65

5-3-1-1 Pre-Socket Conguration .......................................................................................68

5-3-2 Advanced Power Management Conguration ........................................................70

2-3-2-1 CPU P State Control ...............................................................................................71

5-3-2-2 CPU C State Control ..............................................................................................72

5-3-2-3 CPU T State Control ...............................................................................................73

5-3-3 Common RefCode Conguration ...........................................................................74

5-3-4 QPI Conguration ...................................................................................................75

5-3-5 Memory Conguration ............................................................................................77

5-3-5-1 Memory Topology ...................................................................................................79

5-3-5-2 Memory Thermal ....................................................................................................80

5-3-5-3 Memory Map ...........................................................................................................81

5-3-5-4 Memory RAS Conguration ....................................................................................82

5-3-6 IIO Conguration ....................................................................................................83

5-3-6-1 IOAT Conguration .................................................................................................84

5-3-6-2 Intel VT for Directed I/O (VT-d) ..............................................................................85

5-3-7 PCH Conguration .................................................................................................86

5-3-7-1 PCH Devices ..........................................................................................................87

5-3-7-2 PCH sSATA Conguration ......................................................................................88

5-3-7-2-1 SATA Mode Options .............................................................................................. 91

5-3-7-3 PCH SATA Conguration ........................................................................................93

5-3-7-3-1 SATA Mode Options .............................................................................................. 96

5-3-7-4 USB Conguration ..................................................................................................98

5-3-8 Miscellaneous Conguration ..................................................................................99

5-3-9 Server ME Conguration ......................................................................................100

5-3-10 Runtime Error Logging .........................................................................................101

5-3-10-1 Whea Setting ........................................................................................................102

5-3-10-2 Memory Error Enabling .........................................................................................103

5-3-10-3 PCI/PCI Error Enabling .........................................................................................104

- 6 -

5-4 Server Management Menu ........................................................................... 105

5-4-1 System Event Log ................................................................................................107

5-4-2 View FRU Information ..........................................................................................108

5-4-3 BMC network conguration ..................................................................................109

5-5 Security Menu .............................................................................................. 110

5-5-1 Secure Boot menu ............................................................................................... 111

5-5-1-1 Key Management ...............................................................................................112

5-6 Boot Menu .................................................................................................... 114

5-7 Save & Exit Menu ......................................................................................... 116

5-8 BIOS POST Codes ...................................................................................... 118

5-9 BIOS POST Beep code ................................................................................ 122

5-9-1 PEI Beep Codes ...................................................................................................122

5-9-2 DEX Beep Codes .................................................................................................122

5-10 BIOS Recovery Instruction ........................................................................... 123

- 7 -

Box Contents

R270-R3C System

Driver CD

Two CPU Heat Sinks

Rai Kit

• The box contents above are for reference only and the actual items shall depend on the product package you obtain.

The box contents are subject to change without notice.

• The motherboard image is for reference only.

- 8 -

Safety, Care and Regulatory Information

Important safety information

Read and follow all instructions marked on the product and in the documentation before you operateyour sys-

tem. Retain all safety and operating instructions for future use.

• The product should be operated only from the type of power source indicated on the rating label.* If your

computer has a voltage selector switch, make sure that the switch is in the proper position foryour area.

The voltage selector switch is set at the factory to the correct voltage.

• The plug-socket combination must be accessible at all times because it serves as the main disconnect-

ing device.

• All product shipped with a three-wire electrical grounding-type plug only fits into a grounding-type

poweroutlet. This is a safety feature. The equipment grounding should be in accordance with local and

nationalelectrical codes. The equipment operates safely when it is used in accordance with its marked

electricalratings and product usage instructions

• Do not use this product near water or a heat source.* Set up the product on a stable work surface or so

as to ensure stability of the system.

• Openings in the case are provided for ventilation. Do not block or cover these openings. Make sure

youprovide adequate space around the system for ventilation when you set up your work area. Never

insertobjects of any kind into the ventilation openings.

• To avoid electrical shock, always unplug all power cables and modem cables from the wall outletsbefore

removing covers.

• Allow the product to cool before removing covers or touching internal components.

Precaution for Product with Laser Devices

Observe the following precautions for laser devices:

• Do not open the CD-ROM drive, make adjustments, or perform procedures on a laser device other than

those specied in the product's documentation.

• Only authorized service technicians should repair laser devices.

Precaution for Product with Modems, Telecommunications, ot Local AreaNetwork Options

Observe the following precautions for laser devices:

• Do not connect or use a modem or telephone during a lightning storm. There may be a risk of electri-

calshock from lightning.

• To reduce the risk of re, use only No. 26 AWG or larger telecommunications line cord.

• Do not plug a modem or telephone cable into the network interface controller (NIC) receptacle.

• Disconnect the modem cable before opening a product enclosure, touching or installing internalcompo-

nents, or touching an uninsulated modem cable or jack.

• Do not use a telephone line to report a gas leak while you are in the vicinity of the leak.

- 9 -

Federal Communications Commission (FCC) Statement

Warning

This is a class A product. In a domestic environment this product may cause radiointerfer-

enceIn which case the user may be required to take adequate measures.

This equipment has been tested and found to comply with the limits for a Class A digital device,pursuant to

Part 15 of the FCC Rules. These limits are designed to provide reasonable protection againstharmful interfer-

ence when the equipment is operated in a commercial environment. This equipmentgenerates, uses, and can

radiate radio frequency energy and, if not installed and used in accordance withthe instruction manual, may

cause harmful interference to radio communications. Operation of thisequipment in a residential area is likely

to cause harmful interference in which case the user will berequired to correct the interference at his own ex-

pense.Properly shielded and grounded cables and connectors must be used in order to meet FCC emission-

limits. Neither the provider nor the manufacturer are responsible for any radio or television interferencecaused

by using other than recommended cables and connectors or by unauthorized changes ormodications to this

equipment. Unauthorized changes or modications could void the user's authority tooperate the equipment.

This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions:

(1) this device may not cause harmful interference, and

(2) this device must accept any interference received, including interference that may cause undesired opera-

tion.

Canadian Department of Communications Compliance Statement

This digital apparatus does not exceed the Class A limits for radio noise emissions from digitalapparatus as

set out in the radio interference regulations of Industry Canada.Le present appareil numerique n'emet pas

de bruits radioelectriques depassant les limites applicables auxappareils numeriques de Classe A prescrites

dans le reglement sur le brouillage radioelectrique edicte parIndustrie Canada.

Class A equipment

This device has been tested and found to comply with the limits for a class A digital device pursuantPart 15 of

the FCC Rules. These limits are designed to provide reasonable protection againstharmful interference when

the equipment is operated in a commercial environment. This equipmentgenerate, uses, and can radiate

radio frequency energy, and if not installed and used in accordancewith the instructions, may cause harmful

interference to radio communication. Operation of thisequipment in a residential area is likely to cause harm-

ful interference, in which case the user will berequired to correct the interference at personal expence.

However, there is no guarantee that interference will not occur in a particular installation. If thisdevice does

cause harmful interference to radio or television reception, which can be determined bytuning the device off

and on, the user is encouraged to try to correct the interference by on or more ofthe following measures:

• Reorient or relocate the receiving antenna

• Increase the separation between the device and receiver

• Connect the device into an outlet on a circuit different from that to which the receiver isconnected'Consult

the dealer or an experienced radio/television technician for help.

- 10 -

Battery Warning: Incorrectly installing a battery or using incompatible battery may increase

the risk of ifre explosion. Replace the battery only with the same or equivalent type.

• Do not disassemble, crush, punchture batteries.

• Do not store or place your battery pack next to or in a heat source such as a re, heatgenerating

appliance, can or exhaust vent. Heating battery cells to temperatures above 65oC (149oF) can

cause explosion or re.

• Do not attempt to open or service batteries. Do not dispose of batteries in a re or with house-

hold waste.

WEEE Symbol Statement

The symbol shown below is on the product or on its packaging, which indicates that this product

must not be disposed of with other waste. Instead, the device should be taken to the waste

collection centers for activation of the treatment, collection, recycling and disposal procedure.

The separate collection and recycling of your waste equipment at the time of disposal will help to

conserve natural resources and ensure that it is recycled in a manner that protects human health

and the environment. For more information about where you can drop off your waste equipment for recycling,

please contact your local government ofce, your household waste disposal service or where you purchased

the product for details of environmentally safe recycling.

w When your electrical or electronic equipment is no longer useful to you, "take it back" to your local or

regional waste collection administration for recycling.

w If you need further assistance in recycling, reusing in your "end of life" product, you may contact us at the

Customer Care number listed in your product's user's manual and we will be glad to help you with your

effort.

California Proposition 65

Warning:

This product contains a chemical, including lead , known to the State of California to cause cancer

http://www.p65warnings.ca.gov/

Warning:

This product contains a chemical, including lead , known to the State of California to cause birth defects or

other reproductive harm.

http://www.p65warnings.ca.gov/

Hardware Installation - 11 -

1-1 Installation Precautions

The motherboard/system contain numerous delicate electronic circuits and components which

can become damaged as a result of electrostatic discharge (ESD). Prior to installation, carefully

read the service guide and follow these procedures:

• Prior to installation, do not remove or break motherboard S/N (Serial Number) sticker or

warranty sticker provided by your dealer. These stickers are required for warranty validation.

• Always remove the AC power by unplugging the power cord from the power outlet before

installing or removing the motherboard or other hardware components.

• When connecting hardware components to the internal connectors on the motherboard,

make sure they are connected tightly and securely.

• When handling the motherboard, avoid touching any metal leads or connectors.

• It is best to wear an electrostatic discharge (ESD) wrist strap when handling electronic

components such as a motherboard, CPU or memory. If you do not have an ESD wrist

strap, keep your hands dry and rst touch a metal object to eliminate static electricity.

•

Prior to installing the motherboard, please have it on top of an antistatic pad or within an

electrostatic shielding container.

• Before unplugging the power supply cable from the motherboard, make sure the power

supply has been turned off.

• Before turning on the power, make sure the power supply voltage has been set according to

the local voltage standard.

• Before using the product, please verify that all cables and power connectors of your

hardware components are connected.

• To prevent damage to the motherboard, do not allow screws to come in contact with the

motherboard circuit or its components.

• Make sure there are no leftover screws or metal components placed on the motherboard or

within the computer casing.

• Do not place the computer system on an uneven surface

.

• Do not place the computer system in a high-temperature environment.

• Turning on the computer power during the installation process can lead to damage to

system components as well as physical harm to the user.

• If you are uncertain about any installation steps or have a problem related to the use of the

product, please consult a certied computer technician.

Chapter 1 Hardware Installation

- 12 - Hardware Installation

1-2 Product Specications

CPU wSupport for Intel® Xeon® E5-2600 V3/V4 series processors in the LGA2011

package

wL3 cache varies with CPU

wSupports Dual QuickPath Interconnect up to 9.6GT/s

wEnhanced Intel SpeedStep Technology (EIST)

wSupport Intel Virtualization Technology (VT)

Chipset wIntel® C612 Express (Wellsburg) Chipset

Memory w16 x DIMM slots

wDDR4 memory supported only

wQuad channel memory architecture

wECC RDIMM / LRDIMM modules supported

wSingle and dual rank RDIMM modules up to 32GB supported

w3DS LRDIMM modules up to 128GB supported

w1.2V modules: 1600/1866/2133/2400 MHz

LAN wIntel® X540 supports 10GbE LAN ports

w1 x Management LAN 10/100/1000Mpbs LAN port

Expansion Slot w1 x PCI Express x16 (Gen3 x16 bus) slot

w2 x PCI Express x16 (Gen3 x8 bus) slot

w2 x PCI Express x8 (Gen3 x8 bus) slot

w1 x PCI Express x8 (Gen2 x4 bus) slot

Onboard

Graphics

wASPEED® AST2400 supports 16MB DDR3 VRAM

Mass Storage w12 x 3.5” Hot-Swap SATA/SAS HDD/SSD bays

w 2.5" HDD/SSD supported

wDefault conguration supports:

w4 x SATA 6Gb/s drives (From Intel C612)

w8 x SAS 12Gb/s drives (From LSI SAS 3008 controller)

System Fans w4 x 80x80x38mm/149000rpm

USB w2 x USB 3.0 ports (back panel)

Hardware Installation - 13 -

Internal

Connectors

w1 x 24-pin ATX main power connector

w2 x 8-pin ATX 12V power connector

w2 x Mini-SAS HD connectors

w10 x SATA3 6Gb/s connectors

w1 x PMBus header

w2 x CPU fan headers

w5 x System fan headers

w1 x Front panel header

w1 x HDD Back plane borad header

w1 x USB 3.0 header

w1 x TPM module connector

w1 x Serial port connector

w2 x SATA SPGIO headers

w1 x IPMB connector

w1 x Software RAID key connector

w1 x LSI RAID key connector

w2 x LAN LED connectors

Rear Panel I/O w2 x USB 3.0 ports

w3 x RJ-45 ports (1 x 10/100/1000 dedicated management LAN port)

w1 x COM port

w1 x VGA port

w1 x ID Button/LED

Front Panel

LED/Buttons

w1 x Power button/LED

w1 x System status LED

w1 x ID Switch button/LED

w1 x Reset button

w2 x LAN LEDs

w1 x HDD status LED

I/O Controller wASPEED® AST2400 BMC chip

Hardware

Monitor

wSystem voltage detection

wCPU/System temperature detection

BIOS w1 x 128 Mbit ash

wAMI BIOS

Environment

Ambient

Temperature

Relative

Humidity

wOperating Temperature: 10oC to 35oC

wNon-operating Temperature: -40oC to 60oC

wOperating Humidity: 8-80% operating Humidity (non-condensing)

wNon-operating Humidity: 20-95% operating Humidity (non-condensing)

System

Dimension

w430Wx87Hx712.4D (mm)

Electrical

Power Supply

w2 x Redundant PSU 750W 100-240VAC at 80 plus gold level

* GIGABYTE reserves the right to make any changes to the product specications and product-related information without

prior notice.

Hardware Installation - 14 -

1-3 System Block Diagram

- 15 - Hardware Installation

Chapter 2 System Hardware Installation

Pre-installation Instructions

Perform the steps below before you open the server or before you remove or replaceany

component.

• Back up all important system and data les before performing any hardwareconguration.

• Turn off the system and all the peripherals connected to it.

• Locate the pin one of the CPU. The CPU cannot be inserted if oriented incorrectly. (Or you may

locate the notches on both sides of the CPU and alignment keys on the CPU socket.)

• Apply an even and thin layer of thermal grease on the surface of the CPU.

• Do not turn on the computer if the CPU cooler is not installed, otherwise overheating and damage

of the CPU may occur.

• Set the CPU host frequency in accordance with the CPU specications. It is not recommended

that the system bus frequency be set beyond hardware specications since it does not meet the

standard requirements for the peripherals. If you wish to set the frequency beyond the standard

specifications, please do so according to your hardware specifications including the CPU,

graphics card, memory, hard drive, etc.

Hardware Installation - 16 -

2-1 Removing Chassis Cover

Before you remove or install the system cover

• Make sure the system is not turned on or connected to AC power.

Follow these instructions to remove the system cover:

1. Loosen and remove the screws securing the back cover.

2. Loosen and remove the screws securing the front cover.

3. Remove the front cover.

4. Slide the back cover toward the rear of the chassis to disengage it.

1

2

3

4

5

Hardware Installation - 17 -

2-2 Removing and Installing the Fan Duct

Follow these instructions to remove/install the fan duct:

1. Loosen and remove the screws securing the screw.

2. Lift up to remove the fan duct

3. To install the fan duct, align the fan duct with the guiding groove. Push down the fan duct into

chassis until its rmly seats

1

2

- 18 - Hardware Installation

2-3 Installing the CPU

Follow these instructions to install the CPU:

1. Raise the metal locking lever on the socket.

2. Remove the plastic covering on the CPU socket.Insert the CPU with the correct orientation. The

CPU only ts in one orientation.

3. Replace the metal cover.

4. Push the metal lever back into locked position.

Read the following guidelines before you begin to install the CPU:

• Make sure that the motherboard supports the CPU.

• Always turn off the computer and unplug the power cord from the power outlet before installing

the CPU to prevent hardware damage.

• Unplug all cables from the power outlets.

• Disconnect all telecommunication cables from their ports.

• Place the system unit on a at and stable surface.

• Open the system according to the instructions.

WARNING!

Failure to properly turn off the server before you start installing components may cause serious

damage. Do not attempt the procedures described in the following sections unless you are a

qualied service technician.

1

2

3

4

Hardware Installation - 19 -

Follow these instructions to install the heat sinks:

1. Apply thermal compound evenly on the top of the CPU.

2. Remove the protective cover from the underside of the heat sink.

3. Place the heat sink(s) on top of the CPU and tighten the four positioning screws.

2-4 Installing the Heat Sink

WARNING!

• When you are installing the heat sink on the CPU, ensure the cooling fan is facing the rear I/O of

the system.

• Improper installation could cause system overheating and damage to equipment.

- 20 - Hardware Installation

2-5-1 Four Channel Memory Conguration

This motherboard provides sixteen DDR4 memory sockets and supports Four Channel Technology. After

the memory is installed, the BIOS will automatically detect the specications and capacity of the memory.

Enabling Four Channel memory mode will be four times of the original memory bandwidth.

The four DDR4 memory sockets are divided into four channels each channel has two memory sockets as

following:

Channel 1: DIMM_P0_A0/DIMM_P0_A1 (For pimary CPU)/

DIMM_P1_E0/DIMM_P1_E1 (For secondary CPU)

Channel 2: DIMM_P0_B0/DIMM_P0_B1 (For pimary CPU)

DIMM_P1_F0/DIMM_P1_F1 (For secondary CPU)

Channel 3: DIMM_P0_C0/DIMM_P0_C1 (For pimary CPU)

DIMM_P1_G0/DIMM_P1_G1 (For secondary CPU)

Channel 4: DIMM_P0_D0/DIMM_P0_D1 (For pimary CPU)

DIMM_P1_H0/DIMM_P1_H1 (For secondary CPU)

2-5 Installing the Memory

Read the following guidelines before you begin to install the memory:

• Make sure that the motherboard supports the memory. It is recommended that memory of the

same capacity, brand, speed, and chips be used.

• Always turn off the computer and unplug the power cord from the power outlet before installing

the memory to prevent hardware damage.

• Memory modules have a foolproof design. A memory module can be installed in only one

direction. If you are unable to insert the memory, switch the direction.

DIMM_P0_D1

DIMM_P0_C1

DIMM_P0_D0

DIMM_P0_C0 DIMM_P1_E0

DIMM_P1_E1

DIMM_P1_F0

DIMM_P1_F1

DIMM_P1_G1

DIMM_P1_G0

DIMM_P1_H1

DIMM_P1_H0

DIMM_P0_A0

DIMM_P0_B0

DIMM_P0_A1

DIMM_P0_B1

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Gigabyte R270-R3C User manual

Gigabyte R270-R3C User manual

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