Aaeon COM-BYTC2 User manual

Category
Server barebones
Type
User manual
Last Updated: June 26, 2019
COM-BYTC2
COM Express Module
Users Manual 2
nd
Ed
Preface II
COM Express Module
COM
-
BYTC2
Copyright Notice
This document is copyrighted, 2019. All rights are reserved. The original manufacturer
reserves the right to make improvements to the products described in this manual at
any time without notice.
No part of this manual may be reproduced, copied, translated, or transmitted in any
form or by any means without the prior written permission of the original
manufacturer. Information provided in this manual is intended to be accurate and
reliable. However, the original manufacturer assumes no responsibility for its use, or for
any infringements upon the rights of third parties that may result from its use.
The material in this document is for product information only and is subject to change
without notice. While reasonable efforts have been made in the preparation of this
document to assure its accuracy, AAEON assumes no liabilities resulting from errors or
omissions in this document, or from the use of the information contained herein.
AAEON reserves the right to make changes in the product design without notice to its
users.
Preface III
COM Express Module
COM
-
BYTC2
Acknowledgement
All other products’ name or trademarks are properties of their respective owners.
Microsoft Windows is a registered trademark of Microsoft Corp.
Intel, Pentium, Celeron, and Xeon
are registered trademarks of Intel Corporation
Core, Atom are trademarks of Intel Corporation
ITE is a trademark of Integrated Technology Express, Inc.
IBM, PC/AT, PS/2, and VGA are trademarks of International Business Machines
Corporation.
All other product names or trademarks are properties of their respective owners.
Preface IV
COM Express Module
COM
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BYTC2
Packing List
Before setting up your product, please make sure the following items have been
shipped:
Item
Quantity
COM-BYTC2
1
If any of these items are missing or damaged, please contact your distributor or sales
representative immediately.
Preface V
COM Express Module
COM
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BYTC2
About this Document
This User’s Manual contains all the essential information, such as detailed descriptions
and explanations on the product’s hardware and software features (if any), its
specifications, dimensions, jumper/connector settings/definitions, and driver installation
instructions (if any), to facilitate users in setting up their product.
Users may refer to the AAEON.com for the latest version of this document.
Preface VI
COM Express Module
COM
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BYTC2
Safety Precautions
Please read the following safety instructions carefully. It is advised that you keep this
manual for future references
1. All cautions and warnings on the device should be noted.
2. Make sure the power source matches the power rating of the device.
3. Position the power cord so that people cannot step on it. Do not place anything
over the power cord.
4. Always completely disconnect the power before working on the systems
hardware.
5. No connections should be made when the system is powered as a sudden rush
of power may damage sensitive electronic components.
6. If the device is not to be used for a long time, disconnect it from the power
supply to avoid damage by transient over-voltage.
7. Always disconnect this device from any AC supply before cleaning.
8. While cleaning, use a damp cloth instead of liquid or spray detergents.
9. Make sure the device is installed near a power outlet and is easily accessible.
10. Keep this device away from humidity.
11. Place the device on a solid surface during installation to prevent falls
12. Do not cover the openings on the device to ensure optimal heat dissipation.
13. Watch out for high temperatures when the system is running.
14. Do not touch the heat sink or heat spreader when the system is running
15. Never pour any liquid into the openings. This could cause fire or electric shock.
16. As most electronic components are sensitive to static electrical charge, be sure to
ground yourself to prevent static charge when installing the internal components.
Use a grounding wrist strap and contain all electronic components in any
static-shielded containers.
Preface VII
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17. If any of the following situations arises, please the contact our service personnel:
i. Damaged power cord or plug
ii. Liquid intrusion to the device
iii. Exposure to moisture
iv. Device is not working as expected or in a manner as described in
this manual
v. The device is dropped or damaged
vi. Any obvious signs of damage displayed on the device
18. DO NOT LEAVE THIS DEVICE IN AN UNCONTROLLED ENVIRONMENT WITH
TEMPERATURES BEYOND THE DEVICES PERMITTED STORAGE TEMPERATURES
(SEE CHAPTER 1) TO PREVENT DAMAGE.
Preface VIII
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BYTC2
FCC Statement
This device complies with Part 15 FCC Rules. Operation is
subject to the following two conditions: (1) this device may not
cause harmful interference, and (2) this device must accept any
interference received including interference that may cause
undesired operation.
Caution:
There is a danger of explosion if the battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by the manufacturer. Dispose of used batteries
according to the manufacturers instructions and your local government’s recycling or
disposal directives.
Attention:
Il y a un risque d’explosion si la batterie est remplacée de façon incorrecte.
Ne la remplacer qu’avec le même modèle ou équivalent recommandé par le constructeur.
Recycler les batteries usées en accord avec les instructions du fabricant et les directives
gouvernementales de recyclage.
Preface IX
COM Express Module
COM
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BYTC2
China RoHS Requirements (CN)
产品中有毒有害物质或元素名称及含量
AAEON Main Board/ Daughter Board/ Backplane
部件名称
有毒有害物质或元素
(Hg)
(Cd)
六价铬
(Cr(VI))
多溴联苯
(PBB)
多溴二苯醚
(PBDE)
印刷电路板
及其电子组件
外部信号
连接器及线材
O:表示该有毒有害物质在该部件所有均质材料中的含量均在
SJ/T 11363-2006 标准规定的限量要求以下。
X:表示该有毒有害物质至少在该部件的某一均质材料中的含量超出
SJ/T 11363-2006 标准规定的限量要求。
备注:此产品所标示之环保使用期限,系指在一般正常使用状况下。
Preface X
COM Express Module
COM
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BYTC2
China RoHS Requirement (EN)
Poisonous or Hazardous Substances or Elements in Products
AAEON Main Board/ Daughter Board/ Backplane
Component
Poisonous or Hazardous Substances or Elements
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chromium
(Cr(VI))
Polybrominated
Biphenyls
(PBB)
Polybrominated
Diphenyl Ethers
(PBDE)
PCB & Other
Components
O
O
O
O
O
Wires &
Connectors
for External
Connections
O
O
O
O
O
O
OThe quantity of poisonous or hazardous substances or elements found in each of the
component's parts is below the SJ/T 11363-2006-stipulated requirement.
X: The quantity of poisonous or hazardous substances or elements found in at least one of the
component's parts is beyond the SJ/T 11363-2006-stipulated requirement.
Note: The Environment Friendly Use Period as labeled on this product is applicable under normal
usage only
Preface XI
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Table of Contents
Chapter 1 - Product Specifications.......................................................................................... 1
1.1 Specifications ............................................................................................................ 2
Chapter 2 Hardware Information ....................................................................................... 4
2.1 Dimensions, Jumpers and Connectors ............................................................... 5
2.2 List of Jumpers ......................................................................................................... 7
2.2.1 Auto Power Button Switch (SW1) ......................................................... 7
2.3 List of Connectors .................................................................................................... 8
2.3.1 TYPE2 Row A/B Connector (CN1) ........................................................ 9
2.3.2 TYPE2 Row C/D Connector (CN2) ...................................................... 13
2.3.3 EDP Function from DDI to EDP (CN3) ............................................... 17
2.3.4 Backlight (CN4) ....................................................................................... 18
2.3.5 SPI FLASH tool (CN5) ............................................................................ 19
2.3.6 LPC (CN6) ................................................................................................ 19
2.3.7 RTC Battery (BAT1) .................................................................................. 19
2.4 List of LEDs ............................................................................................................... 21
Chapter 3 - AMI BIOS Setup ................................................................................................ 22
3.1 System Test and Initialization .............................................................................. 23
3.2 AMI BIOS Setup ..................................................................................................... 24
3.3 Setup submenu: Main .......................................................................................... 25
3.4 Setup submenu: Advanced ................................................................................. 26
3.4.1 Advanced: CPU Configuration ........................................................... 27
3.4.2 Advanced: IDE Configuration (IDE) ................................................... 28
3.4.3 Advanced: USB Configuration ............................................................ 29
3.4.4 Advanced: On-Module H/W Monitor ............................................... 30
3.4.5 Advanced: Power Management .......................................................... 31
3.4.6 Advanced: CSM Configuration ........................................................... 32
Preface XII
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3.4.7 Advanced: SIO Configuration ............................................................. 33
3.4.8 Advanced: Serial Port Configuration ................................................. 34
3.5 Setup submenu: Chipset ...................................................................................... 35
3.5.1 Chipset: North Bridge Configuration ................................................ 36
3.5.1.1 North Bridge Configuration: Display Control
Configuration .............................................................................................. 37
3.5.2 Chipset: South Bridge Configuration ................................................ 40
3.6 Setup submenu: Security ......................................................................................41
3.7 Setup submenu: Boot ........................................................................................... 42
3.7.1 Boot: Hard Drive BBS Priorities ........................................................... 44
3.8 Setup submenu: Save & Exit ............................................................................... 45
Chapter 4 Drivers Installation ............................................................................................ 46
4.1 Driver Download/Installation .............................................................................. 47
Appendix A - Watchdog Timer Programming ................................................................... 49
A.1 Watchdog Timer Initial Program ........................................................................ 50
Appendix B - I/O Information .............................................................................................. 55
B.1 I/O Address Map ................................................................................................... 56
B.2 Memory Address Map ......................................................................................... 58
B.3 IRQ Mapping Chart ............................................................................................... 59
Appendix C Programming Digital I/O............................................................................... 71
C.1 Digital I/O Register ................................................................................................ 72
C.2 Digital I/O Sample Program ................................................................................ 73
Appendix D Notes for Users .............................................................................................. 77
D.1 Notes for Users ...................................................................................................... 78
COM
Express Module
COM
-
BYTC2
Chapter 1
Chapter 1 - Product Specifications
Chapter 1 Product Specifications 2
COM Express Module
COM
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BYTC2
Express Module
COM
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SKHB6
1.1 Specifications
System
Form Factor
COM Express Compact Size
CPU
Onboard Intel® Atom™ Processor SoC
CPU Frequency
Up to J1900 1.91 GHz, Quad core
Chipset
Intel® Atom™ SoC
Memory Type
DDR3L 1066/1333, SODIMM x 1
Max. Memory Capacity
8GB
BIOS
AMI BIOS, Legacy Free
Wake on LAN
Yes
Watchdog Timer
255 levels
Power Requirement
Standard: +12V
Power Supply Type
AT/ATX Selection
Power Consumption (Typical)
1A@ 12V with J1900, full load
Dimension (L x W)
3.75" x 3.75" (95mm x 95mm)
Operating Temperature
32˚F ~ 140˚F (0˚C ~ 60˚C)
Storage Temperature
-4˚F ~ 158˚F (-20˚C ~ 70˚C)
Operating Humidity
10% ~90% relative humidity, non-condensing
MTBF (Hours)
80,000
Certification
CE/FCC Class A
Chapter 1 Product Specifications 3
COM Express Module
COM
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BYTC2
Express Module
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SKHB6
Display
VGA/LCD Controller
Intel® Atom™ SoC
Video Output
VGA, LVDS, eDP
I/O
Ethernet
Intel® I210IT, Gigabit Ethernet
Audio
HD Audio
USB Port
USB 2.0 x 7
Serial Port
HDD Interface
SATA x 1, PATA x 1
Onboard SSD
Expansion Slot
PCIe[x1] x 2
PCI x 4
I2C
LPC
SMBus
GPIO
GPIO 8-bit
TPM
Optional
COM Express Module
COM
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BYTC2
Chapter 2
Chapter 2 Hardware Information
Chapter 2 Hardware Information 5
COM Express Module
COM
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BYTC2
2.1 Dimensions, Jumpers and Connectors
Component Side
Chapter 2 Hardware Information 6
COM Express Module
COM
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BYTC2
Solder Side
Chapter 2 Hardware Information 7
COM Express Module
COM
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BYTC2
2.2 List of Jumpers
Please refer to the table below for all of the boards jumpers that you can configure for
your application
Label
Function
SW1
Auto Power Button Selection and clear CMOS
2.2.1 Auto Power Button Switch (SW1)
1
2
Auto Power Button Disable
(Default)
OFF
OFF
Auto Power Button Enable
ON
OFF
Clear CMOS
OFF
ON
Chapter 2 Hardware Information 8
COM Express Module
COM
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BYTC2
2.3 List of Connectors
Please refer to the table below for all of the boards jumpers that you can configure for
your application
Label
Function
CN1
TYPE2 ROW A/B Connector
CN2
TYPE2 ROW C/D Connector
CN3
eDP Connector
CN4
Backlight
CN5
SPI FLASH tool
CN6
LPC
BAT1
RTC Battery connector
DIMM1
DDR3L SO-DIMM
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Aaeon COM-BYTC2 User manual

Category
Server barebones
Type
User manual

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