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Overview.
The new Telguard GSM Multi Layer board combines the Hy-Can PCB and the RGB keypad into one PCB allowing
for ultimate Low Profile. The PCB connects via a supplied ribbon cable back to the I/O PCB (Input/Output) that is
housed inside the back box, this is where you will find all the usual Telguard connections. The Multi Layer board
features a built in GSM module where the SIM and antenna both connect.
There is also an option to house the I/O board outside the back box - this is an I/O extension which means that you
can keep the install as safe as possible by having the relays separate from the unit, the back box then has a ‘Pass
Thru’ PCB housed inside.
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