ICP uPAC-5001D User manual

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μPAC5000UserManual
(CLanguageBased)
Version1.0.2,Jan.2012
Serviceandusageinformationfor
μPAC500x(D)Series
μPAC510x(D)Series
μPAC520x(D)Series
μPAC530x(D)Series
μPAC54xx(D)Series
μPAC560x(D)Series
μPAC570x(D)Series
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 2
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
Warranty
AllproductsmanufacturedbyICPDASareunderwarrantyregardingdefective
materialsforaperiodofoneyear,beginningfromthedateofdeliverytothe
originalpurchaser.
Warning
ICPDASassumesnoliabilityforanydamageresultingfromtheuseofthis
product.ICPDASreservestherighttochangethismanualatanytimewithout
notice.TheinformationfurnishedbyICPDASisbelievedtobeaccurateand
reliable.However,noresponsibilityisassumedbyICPDASforitsuse,notforany
infringementsofpatentsorotherrightsofthirdpartiesresultingfromitsuse.
Copyright
Copyright@2011byICPDASCo.,Ltd.Allrightsarereserved.
Trademark
Thenamesusedforidentificationonlymayberegisteredtrademarksoftheir
respectivecompanies.
ContactUS
Ifyouhaveanyproblem,pleasefeelfreetocontactus.
Youcancountonusforquickresponse.
Email:[email protected]
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 3
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
TableofContents
TableofContents ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐3
1.Introduction‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐6
1.1.μPAC5000(CLanguageBased) ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 7
1.1.1.μPAC5000ModuleNamingConvention‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 7
1.1.2.μPAC5000Comparison ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 8
1.2.Features ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 16
1.3.Specifications ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 20
1.3.1.CommonSpecifications ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 20
1.3.2.GPSSpecifications ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 21
1.3.3.2G(GPRS)Specifications‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 22
1.3.4.3G(WCDMA)Specifications‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 23
1.3.5.ZigBeeSpecifications ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 24
1.3.6.WiFiSpecifications ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 25
1.4.Overview‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 26
1.5.Dimensions‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 30
1.6.CompanionCD‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 31
2.GettingStarted ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 32
2.1.HardwareInstallation‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 33
2.2.GSMSeriesInstallation‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 35
2.2.1.Ins
tallingtheSIMcard‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 35
2.2.2.InstallingtheGSMantenna ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 36
2.3.Software Installation‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 37
2.4.BootConfiguration ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 39
2.5.UploadingμPAC5000Programs ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 40
2.5.1.EstablishingaconnectionbetweenPCandµPAC5000 ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 41
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 4
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
(a) RS232connection‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 42
(b) EthernetConnection ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 45
2.5.2.Uploadingandex ecutingµPAC5000programs‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 50
2.5.3.Makingprogramsstartautomatically ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 51
2.6.UpdatingμPAC5000OSImage ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 53
3.“HelloWorld‐YourFirstProgram‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 56
3.1.CCompilerInstallation ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 57
3.1.1.InstallingtheCcompiler ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 58
3.1.2.Settinguptheenvironmentvariables ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 62
3.2.μPAC5000APIs ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 65
3.3.FirstPrograminμPAC5000 ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 66
4.APIsandDemoReferences ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 76
4.1.APIforCOMPort‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 80
4.1.1.TypesofCOMportfunctions ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 81
4.1.2.APIforMiniOS7COMport ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 82
4.1.3.APIforstandardCOMport ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 85
4.1.4.PortfunctionsComparison‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 87
4.1.5.Request/ResponseprotocoldefineonCOMport‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 88
4.2.APIforI/OModules ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 89
4.3.APIforEEPROM ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 91
4.4.APIforFlashMemory‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 93
4.5.APIforNVRAM ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 95
4.6.APIfor5DigitalLED‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 97
4.7.APIforTimer‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 98
4.8.APIforWatchDogTimer(WDT)‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐100
4.9.APIforMFS(ForµPAC5000FDseriesonly) ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐101
4.10.APIformicroSD‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐105
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 5
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
4.11.GSMAPIFuncti on‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐109
AppendixA.WhatisMiniOS7? ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 117
AppendixB.WhatisMiniOS7Utility?‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 118
AppendixD.MoreCCompilerSettings‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐ 122
D.1.TurboC2.01 ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐123
D.2.BorlandC++3.1 ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐126
D.3.MSC6.00 ‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐130
D.4.MSVC1.50‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐‐132
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 6
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
1. Introduction
μPAC5000familyisapalmsizePAC.Itcaninstallinnarrowspaceandsurviveinharshenvironment.
Fordifferentapplications,μPAC5000familyoffers3series,μPAC5000,LP5000andWP5000.
CustomerswhoneedsMiniOS7,Linux,orWinCE,allcanfindaproducttofittheirrequirement.
μPAC5000familyofferstwoCPUtypes(80186,PXA270),3OSsolutions(WinCE5.0,Linux,MiniOS7)
andseveralsoftwaredevelopmenttoolkits(C,VS.NET,ISaGRAF,InduSoft)forchosen,andallofthem
arefeaturedsamestabilityandflexibilityasICPDASsPACfamily.ThismakesμPAC5000haveagood
potentialtoapplytofactoryautomation,buildingautomation,machineautomation,manufacturing
management,environmentmonitoring,etc.
Besides,combiningoneoftheoptionalexpansionboards(XWboards)forμPACs,suchasDI,DO,A/D,
D/A,Timer/Counter,communicationinterface(RS232/422/485,CAN,FRnet),etc.,customerscan
customizethehardwarespecificationoftheirμPAC5000fordifferentsituations.
1.1. μPAC5000(CLanguageBased)
1.1.1. μPAC5000ModuleNamingConvention
Asyouexaminethismanual,you’llnoticetherearemanydifferentproductsavailable.Sometimesitis
difficulttorememberthespecificationsforanygivenproduct.However,ifyoutakeafewminutesto
understandthemodulenamingconventions,itmaysaveyousometimeandconfusion.Thefigure
belowshowshowthemodulenamingconventionsworkforeachμPAC5000product.
TheμPAC5000seriesaredividedintoeightseries‐theGeneral,GPS,2G(GPRS),3G(WCDMA),Zigbee,
WiFi,2G+GPSand3G+GPSseries.
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 7
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
1.1.2. μPAC5000Comparison
μPAC5000canbedividedintoeighttypes,accordingtotheirfeatures.
(1) GeneralSeries
ThefollowingtableprovidesacomparisonofμPAC5000GeneralSeriesspecifications:
Model CPU Flash SRAM
Memory
Expansion
Ethernet
Wiress
Communication
RS232/
RS485
μPAC5001(D) microSD
μPAC5001(D)FD
microSD+
256MBFlash
μPAC5001(D)SM
80MHz 512KB 512KB
MicroSD+
512KBBattery
BackupSRAM
10/100
BaseTX
‐ 1/1
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 9
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
(2) GPSSeries
ThefollowingtableprovidesacomparisonofμPAC5000GPSSeriesspecifications:
Model CPU Flash SRAM
Memory
Expansion
Ethernet
Wiress
Communication
RS232/
RS485
μPAC5101(D) microSD
μPAC5101(D)FD
microSD+
256MBFlash
μPAC5101(D)SM
80MHz 512KB 512KB
microSD+
512KBBattery
BackupSRAM
10/100
BaseTX
GPS 1/1
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 10
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
(3) 2G(GPRS)Series
ThefollowingtableprovidesacomparisonofμPAC50002G(GPRS)Seriesspecifications:
Model CPU Flash SRAM
Memory
Expansion
Ethernet
Wiress
Communication
RS232/
RS485
μPAC5201(D) microSD
μPAC5201(D)FD
microSD+
256MBFlash
μPAC5201(D)SM
80MHz 512KB 512KB
microSD+
512KBBattery
BackupSRAM
10/100
BaseTX
2G(GPRS) 1/1
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 11
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
(4) 3G(WCDMA)Series
ThefollowingtableprovidesacomparisonofμPAC50003G(WCDMA)Seriesspecifications:
Model CPU Flash SRAM
Memory
Expansion
Ethernet
Wiress
Communication
RS232/
RS485
μPAC5301(D) microSD
μPAC5301(D)FD
microSD+
256MBFlash
μPAC5301(D)SM
80MHz 512KB 512KB
microSD+
512KBBattery
BackupSRAM
10/100
BaseTX
3G(WCDMA) 1/1
(5) ZigBeeSeries
ThefollowingtableprovidesacomparisonofμPAC5000ZigBeeSeriesspecifications:
Model CPU Flash SRAM
Memory
Expansion
Ethernet
Wiress
Communication
RS232/
RS485
μPAC5401(D) ZigBee(Host)
μPAC5411(D)
microSD
ZigBee(Slave)
μPAC5401(D)FD ZigBee(Host)
μPAC5411(D)FD
microSD+
256MBFlash
ZigBee(Slave)
μPAC5401(D)SM ZigBee(Host)
μPAC5411(D)SM
80MHz 512KB 512KB
microSD+
512KBBattery
BackupSRAM
10/100
BaseTX
ZigBee(Slave)
1/1
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 13
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
(6) WiFiSeries
ThefollowingtableprovidesacomparisonofμPAC5000WiFiSeriesspecifications:
Model CPU Flash SRAM
Memory
Expansion
Ethernet
Wiress
Communication
RS232/
RS485
μPAC5501(D) microSD
μPAC5501(D)FD
microSD+
256MBFlash
μPAC5501(D)SM
80MHz 512KB 512KB
microSD+
512KBBattery
BackupSRAM
10/100
BaseTX
WiFi
(802.11b/g)
1/1
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 14
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
(7) 2G(GPRS)+GPSSeries
ThefollowingtableprovidesacomparisonofμPAC50002G(GPRS)+GPSSeriesspecifications:
Model CPU Flash SRAM
Memory
Expansion
Ethernet
Wiress
Communication
RS232/
RS485
μPAC5601(D) microSD
μPAC5601(D)FD
microSD+
256MBFlash
μPAC5601(D)SM
80MHz 512KB 512KB
microSD+
512KBBattery
BackupSRAM
10/100
BaseTX
2G(GPRS)+GPS
1/1
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 15
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
(8) 3G(WCDMA)+GPSSeries
ThefollowingtableprovidesacomparisonofμPAC50003G(WCDMA)+GPSSeriesspecifications:
Model CPU Flash SRAM
Memory
Expansion
Ethernet
Wiress
Communication
RS232/
RS485
μPAC5701(D) microSD
μPAC5701(D)FD
microSD+
256MBFlash
μPAC5701(D)SM
80MHz 512KB 512KB
microSD+
512KBBattery
BackupSRAM
10/100
BaseTX
3G(WCDMA)+
GPS
1/1
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 16
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
1.2. Features
Various CPU and OS for Choosing
MiniOS7
80186CPU
μPAC5000Series
DOSlike
Bootupin0.4~0.8second
Buildinhardwarediagnostic
StandardversionforClanguageprogramming
ISaGRAFversionforIEC611313programming
Local I/O and Communication Expansion Board
TheμPAC5000seriesequipanI/Oexpansionbustosupportoneoptionalexpansionboard,called
XWboard.ItcanbeusedtoimplementvariousI/OfunctionssuchasDI,DO,A/D,D/A,Timer/Counter
andvariouscommunicationinterface,suchasRS232/422/485,CAN,FRnet,etc.
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 17
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
Remote I/O Module and Expansion Unit
WiththebuiltinRS485andEthernetport,the
μPAC5000seriescanconnectRS485/Ethernet
remoteI/OUnits(RU87Pn/ET87Pn)ormodules
(I7000/M7000/ET7000).WithanXWboard,the
μPAC5000seriescanhavemorecommunication
portsordifferentinterfacetoconnecttoothertype
ofdevices,forexample:CANOpendevices,
DeviceNetdevices,orFRnetI/Omodules.
Multi-Communication Interface
ThereareseveralcommunicationinterfacestoexpandI/Oandconnectexternaldevices:
Ethernet
RS232/485
CANbus
FRnet
GPS
2G/3G
ZigBee
WiFi
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 18
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
Various Memory Expansions
μPAC5000providesvariousmemorystorageoptions,suchas
EEPROM,Flash,batterybackupSRAMormicroSD.Userscanchoose
thememorybasedontheircharacteristics.
16KBEEPROM:tostorenotfrequentlychanged
parameters.
microSD:toimplementportabledataloggingapplications.
max.of2GBontheMiniOS7platform
max.of32GBonLinuxandWinCEplatforms
256MBNANDFlash:ruggeddatastoragetoresistshock
andvibration.
512KBbatterybackupSRAM:toretaindatawhilepowerlostfor5years;nowritecycle
limitation.
Unique 64-bit Hardware Serial Number to Protect Your Program
Aunique64bitserialnumberisassignedtoeachhardwaredeviceto
protectyoursoftwareagainstpiracy.
Small and Easy Installation
μPAC‐5000serieshaveaslendershape(91mmx
132mmx52mm)tobeinstallinginanarrowspace
withDINRail.
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 19
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
Plastic and Metal Housing
Thedefaultcaseisplasticmaterial.Metalcasingisalsoofferedtoprovideextrasecurity.
Redundant Power Inputs
TopreventtheμPAC5000fromfailingbythepowerloss,thepowermoduleisdesignedwithtwoinput
connectors.Onceapowerinputfails,thepowermoduleswitchestotheotherpowerinput.Andthere
isarelayoutputforinformingthepowerfailure.
Highly Reliable Under Harsh Environment
TheμPAC5000operatesinawiderangeoftemperatureandhumidity.
OperatingTemperature:
25°C~+75°C
StorageTemperature:
40°C~+80°C
Humidity:
10~95%RH(noncondensing)
µPAC-5000 Series (C Language Based) User Manual, Version 1.0.2 Page: 20
Copyright © 2010 ICP DAS Co., Ltd. All Rights Reserved. E-mail: [email protected]
1.3. Specifications
1.3.1. CommonSpecifications
Models μPAC5000Series μPAC5000FDSeries μPAC5000SMSeries
SystemSoftware
OS MiniOS7(DOSlikeembeddedoperatingsystem)
ProgramUploadInterface RS232(COM1)orEthernet
ProgrammingLanguage Clanguage
CompilerstoCreate.exeFiles
TC++1.01
TC2.01
BC++3.1~5.2x
MSC6.0
MSVC++(Priortoversion1.5.2)
CPUModule
CPU 80186orcompatible(16bitand80MHz)
SRAM 512KB
Flash 512KB;eraseunitisonsector(64Kbytes);100,000erase/writecycles
microSDExpansion Yes,cansupport1or2GBmicroSD
NANDFlashDisk‐ 256MB‐
BatteryBackupSRAM‐ 512KB
EEPROM 16KB
NVRAM 31Bytes(batterybackup,datavalidupto5year)
RTC(RealTimeClock) Providesecond,minute,hour,dateofweek,monthandyear,validfrom1980to2079
64bitHardwareSerialNumber Yes,forSoftwareCopyProtection
WatchdogTimers Yes(0.8second)
CommunicationPorts
Ethernet RJ45x1,10/100BaseTX(Autonegotiating,AutoMDI/MDIX,LEDindicators)
COM1 RS232(TxD,RxD,RTS,CTS,GND),nonisolated,speed:115200bpsmax.
COM2 RS485(D2+,D2),selftunerASICinside,nonisolated,speed:115200bpsmax.
LEDIndicator
ProgrammableLEDIndicators 2
LEDDisplay 5digit7segnmentLEDdisplayfor(D)versions
HardwareExpansion
I/OExpansionBus Yes(foronlyXWBoardonly)
Mechanical
Dimension(WxHxD) 91mmx123mmx52mm
Installation DINRail
Environmental
OperatingTemperature‐25~+75˚C
StorageTemperature‐30~+80˚C
AmbientRelativeHumidity 10~90%RH(noncondensing)
Power
Protection Powerreversepolarityprotection
FrameGround Yes(forESDprotection)
InputRange +12~+48VDC
Isolation‐
RedundantPowerInputs Yes
PowerConsumption 2W;2.5Wfor(D)version
/