APPLICATION NOTE
©2022 TRINAMIC Motion Control GmbH & Co. KG, Hamburg, Germany
Download newest version at: www.trinamic.com
AN005x: IC Package / PCB Footprint Guidelines - HTSSOP28
Document Revision V1.0 •2021-Feb-11
This application note is meant to be a practical guideline for a specific TRINAMIC IC package and
its PCB footprint. The document covers package dimensions, example footprint and general infor-
mation on PCB footprints.
Contents
1 Figures Index 1
2 Tables Index 1
3 Overview 2
4 HTSSOP28 Package Details 2
4.1 HTSSOP28 ................................................. 2
4.2 Dimensions ................................................ 3
5 General PCB Footprint and Packaging Information Resources 5
5.1 Tape & reel ................................................. 5
5.2 Reel Box .................................................. 6
5.3 Tray ..................................................... 7
5.4 Tray Box .................................................. 7
6 Disclaimer 8
7 Revision History 8
1 Figures Index
1 HTSSOP28 3D example ......... 2
2 HTSSOP28 package outline drawings 3
3 Quadrant assignment within the tape 5
4 Tape diagram .............. 5
5 Reel diagram ............... 5
6 Box for reel with dimensions ..... 6
7 Tray with dimensions .......... 7
8 Box for trays with dimensions .... 7
2 Tables Index
1 HTSSOP28 dimensions ......... 4
2 Dimensions and properties of Tape
and Reel ................. 6
3 Document Revision ........... 8