Huawei ME909 User manual

HUAWEI ME909 Series Mini PCIe Module

Hardware Guide

Issue

0.1

Date

2013-06-09

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HUAWEI ME909 Series Mini PCIe Module

Hardware Guide

About This Document

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About This Document

Revision History

Document

Version

Date

Chapter

Descriptions

0.1

2013-06-09

Creation

This is a draft version, and some chapters

are still with "TBD".

HUAWEI ME909 Series Mini PCIe Module

Hardware Guide

Contents

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4

Contents

1 Introduction.................................................................................................................................... 7

2 Overall Description ...................................................................................................................... 8

2.1 About This Chapter ........................................................................................................................... 8

2.2 Function Overview............................................................................................................................ 8

2.3 Circuit Block Diagram ....................................................................................................................... 9

3 Description of the Application Interfaces .............................................................................. 10

3.1 About This Chapter ......................................................................................................................... 10

3.2 Mini PCIe Interface ......................................................................................................................... 10

3.3 Power Sources and Grounds ......................................................................................................... 14

3.4 Power Supply Time Sequence ....................................................................................................... 15

3.5 WAKE# Signal ................................................................................................................................ 16

3.6 RESIN_N Signal ............................................................................................................................. 16

3.7 W_DISABLE# Signal ...................................................................................................................... 18

3.8 LED_WWAN# Signal ...................................................................................................................... 18

3.9 USB Interface ................................................................................................................................. 18

3.10 USIM Card Interface .................................................................................................................... 19

3.10.1 Overview .............................................................................................................................. 19

3.10.2 Circuit Recommended for the USIM Card Interface ............................................................ 20

3.11 Audio Interface .............................................................................................................................. 21

3.12 RF Antenna Connector ................................................................................................................. 22

3.13 Reserved Pins .............................................................................................................................. 23

3.14 NC Pins ........................................................................................................................................ 23

4 RF Specifications ......................................................................................................................... 25

4.1 About This Chapter ......................................................................................................................... 25

4.2 Operating Frequencies ................................................................................................................... 25

4.3 Conducted RF Measurement ......................................................................................................... 26

4.3.1 Test Environment ................................................................................................................... 26

4.3.2 Test Standards ....................................................................................................................... 26

4.4 Conducted Rx Sensitivity and Tx Power ........................................................................................ 26

4.4.1 Conducted Receive Sensitivity .............................................................................................. 26

4.4.2 Conducted Transmit Power ................................................................................................... 28

4.5 Antenna Design Requirements ...................................................................................................... 29

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4.5.1 Antenna Design Indicators..................................................................................................... 29

4.5.2 Interference ........................................................................................................................... 31

4.5.3 GSM/WCDMA/GPS Antenna Requirements ......................................................................... 31

4.5.4 Radio Test Environment ........................................................................................................ 32

5 Electrical and Reliability Features ........................................................................................... 34

5.1 About This Chapter ......................................................................................................................... 34

5.2 Absolute Ratings ............................................................................................................................ 34

5.3 Operating and Storage Temperatures and Humidity ...................................................................... 35

5.4 Electrical Features of USIM ........................................................................................................... 35

5.5 Electrical Features of Application Interfaces .................................................................................. 35

5.6 Power Supply Features .................................................................................................................. 36

5.6.1 Input Power Supply ............................................................................................................... 36

5.6.2 Power Consumption .............................................................................................................. 37

5.7 Reliability Features ......................................................................................................................... 42

5.8 EMC and ESD Features ................................................................................................................. 43

6 Mechanical Specifications ......................................................................................................... 45

6.1 About This Chapter ......................................................................................................................... 45

6.2 Dimensions and Interfaces ............................................................................................................. 45

6.3 Dimensions of the Mini PCI Express Connector ............................................................................ 46

6.4 Specification Selection for Fasteners ............................................................................................. 47

6.4.1 Installing the Mini PCIe Adapter on the Main Board .............................................................. 47

6.4.2 Removing the Mini PCIe Adapter from the Main Board ........................................................ 49

7 Certifications ................................................................................................................................ 51

7.1 About This Chapter ......................................................................................................................... 51

7.2 Certifications ................................................................................................................................... 51

8 Safety Information ...................................................................................................................... 52

8.1 Interference .................................................................................................................................... 52

8.2 Medical Device ............................................................................................................................... 52

8.3 Area with Inflammables and Explosives ......................................................................................... 52

8.4 Traffic Security ................................................................................................................................ 53

8.5 Airline Security ................................................................................................................................ 53

8.6 Safety of Children ........................................................................................................................... 53

8.7 Environment Protection .................................................................................................................. 53

8.8 WEEE Approval .............................................................................................................................. 53

8.9 RoHS Approval ............................................................................................................................... 53

8.10 Laws and Regulations Observance ............................................................................................. 54

8.11 Care and Maintenance ................................................................................................................. 54

8.12 Emergency Call ............................................................................................................................ 54

8.13 Regulatory Information ................................................................................................................. 54

8.13.1 CE Approval (European Union) ........................................................................................... 54

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Contents

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8.13.2 FCC Statement .................................................................................................................... 55

9 Appendix A Circuit of Typical Interface ................................................................................ 56

10 Appendix B Acronyms and Abbreviations .......................................................................... 57

HUAWEI ME909 Series Mini PCIe Module

Hardware Guide

Introduction

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1 Introduction

This document describes the hardware application interfaces and air interfaces

provided by HUAWEI ME909 Series Mini PCIe Module, including ME909u-521,

ME909u-121 and ME909u-721 (hereinafter referred to as the ME909 module).

This document helps hardware engineer to understand the interface specifications,

electrical features and related product information of the ME909 module.

Table 1-1 ME909 series product name

Product name

Description

State

ME909u-521

LTE Module for Europe.

Under development

ME909u-121

LTE Module for North America.

Planning

ME909u-721

LTE Module for Japan.

Planning

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Hardware Guide

Overall Description

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2 Overall Description

2.1 About This Chapter

This chapter gives a general description of the ME909 module and provides:



Function Overview



Circuit Block Diagram

2.2 Function Overview

Table 2-1 Features

Feature

Description

Physical

Dimensions



Dimensions (L × W × H): 51 mm × 30.4 mm × 3.35 mm



Weight: about 12 g

Operating

Temperature

–20°C to +60°C

Storage

Temperature

–40°C to +85°C

Power

Voltage

DC 3.0 V–3.6 V (typical value is 3.3 V)

Application

Interface

(52-pin Mini

PCIe interface

One standard USIM

(Universal Subscriber Identity Module) card

(Class B and Class C)

Audio interface: PCM interface

USB 2.0 (High Speed)

RESIN_N: Reset module

WAKE#: Wake up signal

W_DISABLE# Signal (the software version is planning.)

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Overall Description

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Feature

Description

LED_WWAN#: Active-low LED signal indicating the state of the

module (the software is under development)

Antenna

connector

WWAN MAIN antenna connector x1

WWAN AUX antenna connector x1

GPS antenna connector x1

2.3 Circuit Block Diagram

Figure 2-1 shows the circuit block diagram of the ME909 Mini PCIe Adapter. The

major functional unit of the Mini PCIe Adapter contains the following parts:



DCDC Circuit



LGA Module



Control signals



Antenna Connectors

Figure 2-1 Circuit block diagram of the ME909 module

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Hardware Guide

Description of the Application Interfaces

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3 Description of the Application Interfaces

3.1 About This Chapter

This chapter mainly describes the external application interfaces of the ME909

module, including:



Mini PCIe Interface



Power Sources and Grounds



Power Supply Time Sequence



WAKE# Signal



RESIN_N Signal



W_DISABLE# Signal



LED_WWAN# Signal



USB Interface



USIM Card Interface



Audio Interface



RF Antenna Connector



Reserved Pins



NC Pins

3.2 Mini PCIe Interface

The ME909 module uses a Mini-PCIe interface as its external interface. For details

about the module and dimensions, see “ 6.2 Dimensions and Interfaces”.

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Hardware Guide

Description of the Application Interfaces

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Figure 3-1 shows the sequence of pins on the interface of the Mini PCIe Adapter.

Figure 3-1 Sequence of Mini-PCIe interface

Table 3-1 shows the pin definitions of the Mini PCIe Interface.

Table 3-1 Pin definitions of the Mini PCIe interface

No.

Pin Name

I/O

Description

DC Characteristics (V)

Mini PCI

Express

Standard

Description

HUAWEI Pin

Description

Min.

Typ.

Max.

1

WAKE#

O

Open collector

active low signal.

This signal is used

to wake up the host.

–0.3

-

2

3.3Vaux

VCC_3V3

P

3.3 V DC supply

rails from the PC

side.

3.0

3.3

3.6

3

COEX1

NC

-

Not connected

-

4

GND

-

Ground

-

5

COEX2

NC

-

Not connected

-

6

1.5 V

NC

-

Not connected

-

7

CLKREQ#

NC

-

Not connected

-

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Description of the Application Interfaces

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No.

Pin Name

I/O

Description

DC Characteristics (V)

Mini PCI

Express

Standard

Description

HUAWEI Pin

Description

Min.

Typ.

Max.

8

UIM_PWR

P

Power source for

the external USIM

card

-

1.8/2.85

-

9

GND

-

Ground

-

10

UIM_DATA

I/O

External USIM data

signal

-

1.8/2.85

-

11

REFCLK-

NC

-

Not connected

-

12

UIM_CLK

O

External USIM clock

signal

-

1.8/2.85

-

13

REFCLK+

NC

-

Not connected

-

14

UIM_RESET

O

External USIM reset

signal

-

1.8/2.85

-

15

GND

-

Ground

-

16

UIM_Vpp

NC

-

Not connected

-

17

Reserved

-

Reserved

-

18

GND

-

Ground

-

19

Reserved

-

Reserved

-

20

W_DISABLE#

-

The W_DISABLE#

signal is an active

low signal that when

asserted (driven

low) by the system

shall disable radio

operation.

The software

version is planning.

-

21

GND

-

Ground

-

22

PERST#

RESIN_N

-

Reset module

Active-low

-

23

PERn0

NC

-

Not connected

-

24

3.3Vaux

VCC_3V3

P

3.3 V DC supply

rails from the PC

side.

3.0

3.3

3.6

25

PERp0

NC

-

Not connected

-

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Description of the Application Interfaces

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No.

Pin Name

I/O

Description

DC Characteristics (V)

Mini PCI

Express

Standard

Description

HUAWEI Pin

Description

Min.

Typ.

Max.

26

GND

-

Ground

-

27

GND

-

Ground

-

28

1.5 V

NC

-

Not connected

-

29

GND

-

Ground

-

30

SMB_CLK

NC

-

Not connected

-

31

PETn0

NC

-

Not connected

-

32

SMB_DATA

NC

-

Not connected

-

33

PETp0

NC

-

Not connected

-

34

GND

-

Ground

-

35

GND

-

Ground

-

36

USB_D-

USB_DM

I/O

USB signal D-

-

37

GND

-

Ground

-

38

USB_D+

USB_DP

I/O

USB signal D+

-

39

3.3Vaux

VCC_3V3

P

3.3 V DC supply

rails from the PC

side.

3.0

3.3

3.6

40

GND

-

Ground

-

41

3.3Vaux

VCC_3V3

P

3.3 V DC supply

rails from the PC

side

3.0

3.3

3.6

42

LED_WWAN#

O

Active-low LED

signal indicating the

state of the card.

The software

feature is under

development and

don't support this

function now.

Drive strength: 10

mA

-

43

GND

-

Ground

-

44

LED_WLAN#

NC

-

Not connected

-

45

Reserved

PCM_CLK

O

PCM interface clock

–0.3

1.8

2.1

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Description of the Application Interfaces

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No.

Pin Name

I/O

Description

DC Characteristics (V)

Mini PCI

Express

Standard

Description

HUAWEI Pin

Description

Min.

Typ.

Max.

46

LED_WPAN#

NC

-

Not connected

-

47

Reserved

PCM_DOUT

O

PCM I/F data out

–0.3

1.8

2.1

48

1.5 V

NC

-

Not connected

-

49

Reserved

PCM_DIN

I

PCM I/F data in

–0.3

1.8

2.1

50

GND

-

Ground

-

51

Reserved

PCM_SYNC

O

PCM interface sync

–0.3

1.8

2.1

52

3.3Vaux

VCC_3V3

P

3.3 V DC supply rail

from the PC side.

3.0

3.3

3.6



P indicates power pins; I indicates pins for digital signal input; O indicates pins for digital

signal output. AI indicates pins for analog signal input.



The Reserved pins are internally connected to the module. Therefore, these pins should not

be used, otherwise they may cause problems. Please contact with us for more details about

this information.



The NC (Not Connected) pins are floating and there are no signal connected to these pins.

Therefore, these pins should not be used.

3.3 Power Sources and Grounds

For the Mini PCIe Adapter, +3.3 Vaux is the only voltage supply that is available. The

input voltage is 3.3 V±9%, as specified by PCI Express Mini CEM Specifications 1.2.

Table 3-2 Power and ground specifications

Pin No.

Pin Name

Minimum

Typical

Maximum

2, 24, 39, 41 and 52

VCC_3V3

3.0 V

3.3 V

3.6 V

4, 9, 15, 18, 21, 26, 27,

29, 34, 35, 37, 40, 43,

and 50

GND

-

To minimize the RF radiation through the power lines, it is suggested to add ceramic capacitors

of 10 pF and 100 nF in the power lines beside the Mini PCIe connector on the host side.

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3.4 Power Supply Time Sequence

Power on sequence

Do not toggle RESIN_N pin during the power on sequence. Pulling RESIN_N pin low

will extend time for module startup.

Figure 3-2 Power on timing sequence

Parameter Remarks Time (Nominal value) Unit

T

PD+

Power Valid to USB

D+ high

14 s

Power off Sequence

Cutting off 3.3 V will power off the module.

Figure 3-3 Power off timing sequence

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3.5 WAKE# Signal

WAKE# pin (the signal that the module uses to wake up the PC) supports software

control.

This signal is used for module to wake up the host. It is designed as an OC gate, so it

should be pulled up by the host and it is active-low.

When the module wakes up the host, the BB Chip hold 1s high-level-voltage pulse

and then module output low-level-voltage to wake the host.

Figure 3-4 Connections of the WAKE# pin

3.6 RESIN_N Signal

The RESIN_N pin is used to reset the module's system. When the module software

stops responding, the RESIN_N pin can be pulled down to reset the module

hardware.

The RESIN_N signal is internally pulled up to 1.8 V, which is automatically on when

3.3 V is applied and it is active-low.

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Figure 3-5 Connections of the RESIN_N pin

As the RESIN_N signal are relatively sensitive, it is recommended that you install a 10

nF to 0.1 µF capacitor near the RESIN_N pin of the interface for filtering. In addition,

when you design a circuit on the PCB of the interface board, it is recommended that

the circuit length should not exceed 20 mm and that the circuit should be kept at a

distance of 2.54 mm (100 mil) at least from the PCB edge. Furthermore, you need to

wrap the area adjacent to the signal wire with a ground wire. Otherwise, the module

may be reset due to interference.

The ME909 module supports hardware reset function. If the software of the ME909

module stops responding, you can reset the hardware through the RESIN_N signal as

shown inFigure 3-6 . When a low-level pulse is supplied through the RESIN_N pin, the

hardware will be reset. After the hardware is reset, the software starts powering on the

module and reports relevant information according to the actual settings. For example,

the AT command automatically reports ^SYSSTART.

Figure 3-6 Reset pulse timing



The RESIN_N pin must not be pulled down for more than 1s.



The RESIN_N pin is optional, which can be not connected.



The maximum Forward Voltage Drop of the diode used in the module is 0.6 V.

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3.7 W_DISABLE# Signal

The W_DISABLE# signal is provided to allow users to disable wireless

communications of the module.

The software version is planning.

3.8 LED_WWAN# Signal

ME909 provides a LED_WWAN# signal to indicate the RF status.

The ME909 module does not support this function because the software feature is

under development. The planning drive strength is10 mA.

External Circuits

Figure 3-7 shows the recommended circuits of the LED_WWAN# pin. According to

LED feature, you can adjust the LED brightness by adjusting the resistance of resistor

R.

Figure 3-7 Driving circuit

3.9 USB Interface

The ME909 module is compliant with USB 2.0 protocol. The USB interface is powered

directly from the VBAT supply. The USB input/output lines are compatible with the

USB 2.0 signal specifications. Figure 3-8 shows the circuit of the USB interface.

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Description of the Application Interfaces

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Table 3-3 Definition of the USB interface

Pin No.

Pin Name

I/O

Description

DC Characteristics (V)

Min.

Typ.

Max.

36

USB_DM

I/O

USB signal D-

-

38

USB_DP

I/O

USB signal D+

-

According to USB protocol, for bus timing or electrical characteristics of ME909 USB

signal, please refer to the chapter 7.3.2 of Universal Serial Bus Specification 2.0.

Figure 3-8 Recommended circuit of USB interface

3.10 USIM Card Interface

3.10.1 Overview

The ME909 module provides a USIM card interface complying with the ISO 7816-3

standard and supports both Class B and Class C USIM cards.

Table 3-4 USIM card interface signals

No.

Pin Name

I/O

Description

DC Characteristics (V)

Min.

Typ.

Max.

14

UIM_RESET

O

External USIM

reset signal.

-

1.8/2.85

-

12

UIM_CLK

O

External USIM

clock signal

-

1.8/2.85

-

10

UIM_DATA

I/O

External USIM

data signal

-

1.8/2.85

-

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No.

Pin Name

I/O

Description

DC Characteristics (V)

Min.

Typ.

Max.

8

UIM_PWR

P

Power source for

the external

USIM card

-

1.8/2.85

-

3.10.2 Circuit Recommended for the USIM Card Interface

As the Mini PCIe Adapter is not equipped with an USIM socket, you need to place an

USIM socket on the user interface board.

Figure 3-9 shows the circuit of the USIM card interface.

Figure 3-9 Circuit of the USIM card interface

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