Themis CoolShell 3U G2 Installation guide

Brand: Themis

Model: CoolShell 3U G2

Type: Installation guide

This manual is also suitable for

CoolShell 3U

User Manual

Multiple-CPU, Multiple-Core 64-bit Scalable Server / Rugged 3U-High Subrack

Removable 1U-High Components, CPU & I/O Blades, Media Module, 2 Power Supplies

PCI-Express / SATA / Multiple Gigabit Ethernet, SFP Optical Transceiver, & USB Ports

Ve rs i o n 1.1

P a r t Num b e r : 121286- 024

CoolShell 3U

Generation 2

CoolShell 3U

Generation 2

Installation

Manual

Installation

Manual

™

High-Performance Scalable 64-bit Blade System

CoolShell-3U Gen 2

High-Performance Scalable 64-bit Blade System

CoolShell-3U Gen 2

High-Performance Scalable 64-bit Blade System

CoolShell-3U Gen 2

High-Performance Scalable 64-bit Blade System

CoolShell-3U Gen 2

High-Performance Scalable 64-bit Blade System

CoolShell-3U Gen 2

High-Performance Scalable 64-bit Blade System

CoolShell-3U Gen 2

High-Performance Scalable 64-bit Blade System

CoolShell-3U Gen 2

High-Performance Scalable 64-bit Blade System

CoolShell-3U Gen 2

version

1.1

version

1.1

version

1.1

version

1.1

version

1.1

version

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version

1.1

version

1.1

Themis Computer—Rest of World

5 Rue Irene Joliot-Curie

38320 Eybens, France

Phone +33 476 14 77 80

Fax +33 476 14 77 89

Themis Computer—Americas and Pacific Rim

47200 Bayside Parkway

Fremont, CA 94538

Phone (510) 252-0870

Fax (510) 490-5529

World Wide Web http://www.themis.com

CoolShell 3U Generation 2 Installation Manual

Version 1.1— June 2014

photocopy, microfilm, retrieval system, or by any other means now known or hereafter invented without

the prior written permission of Themis Computer.

The information in this publication has been carefully checked and is believed to be accurate. However,

Themis Computer assumes no responsibility for inaccuracies. Themis Computer retains the right to

make changes to this publication at any time without prior notice. Themis Computer does not assume

any liability arising from the application or use of this publication or the product(s) described herein.

RESTRICTED RIGHTS LEGEND: Use, duplication, or disclosure by the United States Government

is subject to the restrictions set forth in DFARS 252.227-7013 (c)(1)(ii) and FAR 52.227-19.

TRADEMARKS and SERVICEMARKS

Themis® is a registered trademark of Themis Computer, Inc.

Supermicro and SuperDoctor are trademarks or registered trademarks of Super Micro Computer, Inc.

Intel® and Xeon™ are registered trademarks of the Intel Corporation.

Red Hat® is a registered trademark of Red Hat, Inc.

Linux® is a registered trademark of Linus Torvalds.

All other trademarks, servicemarks, or registered trademarks used in this publication are the property of

their respective owners.

CE Marking

This product complies with the European EMC Directive (2004/108/EC) and the European Low Voltage

Safety Directive (2006/95/EC)/.

Safety Precautions

Instructions regarding safety precautions during installation, operation, or maintenance of the equipment

are given in the section entitled “Safety Instructions” on page iv.

WARNINGS and CAUTIONS

The definitions of WARNINGS and CAUTIONS as used in this document are given in the Preface in

the section entitled “Notes, Cautions, Warnings, and Sidebars”.

CoolShell 3U Generation 2 Installation Manual, Version 1.1

June 2014

Part Number: 121286-024

Themis Customer Support

North America, South America, and Pacific Rim

Telephone: 510-252-0870

Fax: 510-490-5529

E-mail: support@themis.com

Web Site: http://www.themis.com

iii

Themis Computer

CoolShell 3U Generation 2 Installation Manual

Version Revision History

Version 1.1 ....................................................................................... June 2014

• Added instructions for battery removal and replacement

• Assorted minor changes and edits throughout this manual

Version 1.0 ....................................................................................... May 2014

• Initial release

iv Themis Computer

CoolShell 3U Generation 2 Installation Manual Version 1.1

Safety Instructions

To maximize user safety and ensure correct device operation, all instructions con-

tained in this section should be read carefully.

WARNING: All equipment connected to the product must conform to their standards

WARNING: This Themis PRODUCT must be used in sheltered environments only, and

at an altitude of less than 3048 meters (10,000 ft).

• The device must be used in accordance with the instructions for use.

• Electrical installations in the room must correspond to the requirements of

respective regulations.

• Take care that there are no cables, particularly mains cables, in areas where

persons can trip over them.

• Do not use a mains connection in sockets shared by a number of other power

consumers. Do not use an extension cable.

• Only use the mains cable supplied.

• Power cord requirements:

Europe: A power supply unit operating at a nominal voltage of 240V must use

a power cord rated for a minimum operating voltage of 200V and is not to be

used with an operational voltage below 200V

USA: A power supply unit operating at a nominal voltage of 120V must use a

power cord rated for a minimum operating voltage of 100V and is not to be

used with an operational voltage below 100V

Caution: It is important that the user observe all warnings and instructions

that are on the device and contained in this manual.

Caution: The protection of the building serves as protection for the equip-

ment.

Caution: When rack mounted, never lean on the server. It is prohibited to lean

on the server while it is pulled on slide rails (telescopic rails) outside of the

rack (bay). Personal injury and equipment damage can occur.

Themis Computer

CoolShell 3U Generation 2 Installation Manual

• The AC input rating for the CS-3U, 850W (max) power supply units are as fol-

lows: 100-240VAC, 12 A max, 50/60 Hz.

• The unit is completely disconnected from the power source only when all

power cords are disconnected from the power source. Therefore the power

cords and its connectors must always remain easily accessible.

• Do not set up the device in the proximity of heat sources or in a damp location.

Make sure the device has adequate ventilation.

• Manufacturer recommended ambient temperature is 21°C

• All connection cables must be screwed or locked to the chassis housing.

• The device is designed to be used in horizontal position only.

• The device is no longer safe to operate when

— the device has visible damage or

— the device no longer functions.

• In these cases, the device must be shut down and secured against unintentional

operation.

• Repairs/service may only be carried out by a Themis Computer qualified ser-

vice technician.

• Do not open the chassis, or perform services/repairs when the equipment is

powered on, due to electrical shock hazard.

• The device may only be opened for the installation and removal of extension

(PCI) cards, memory modules, storage drives, fan housings, power supplies,

and the lithium battery—all in accordance with the instructions given in this

manual.

• If extensions are made to the device, the legal stipulations and the device spec-

ifications must be observed.

• The device must be switched off when removing the top cover; for example,

before installing extension (PCI) cards.

Operation of Laser Source Devices

DVD/CD-ROM drives contain laser light-emitting diodes (classified in accordance

with IEC 825-1:1993: LASER CLASS 1) and, therefore, must not be opened.

If the enclosure of such a drive is opened, invisible laser radiation is emitted. Do

vi Themis Computer

CoolShell 3U Generation 2 Installation Manual Version 1.1

not allow yourself to be exposed to this radiation.

The laser system meets the code of Federal Regulations 21 CFR,1040 for the USA

and Canadian Radiation Emitting Devices Act, REDR C 1370.

Electrostatic Discharge (ESD)

A sudden discharge of electrostatic electricity can destroy static-sensitive devices

or micro-circuitry. Proper packaging and grounding techniques are necessary pre-

cautions to prevent damage. Always take the following precautions:

1. Transport boards in static-safe containers such as boxes or bags.

2. Keep electrostatic-sensitive parts in their containers until they arrive at static-

free stations.

3. Always be properly grounded when touching a sensitive board, component, or

assembly.

4. Store electrostatic-sensitive boards in protective packaging or on conductive

foam.

Grounding Methods

Finnish: laite on liitettävä suoja maadoituskoskettimilla varustettuun pistorasiaan

Norwegian: Apparatet må tilkoples jordet stikkontakt

Swedish: Apparaten skall anslutas till jordat uttag

Guard against electrostatic damage at workstations by following these steps:

1. Cover workstations with approved anti-static material. Provide a wrist strap

connected to a work surface and properly grounded tools and equipment.

2. Use anti-static mats, heel straps, or air ionizers to give added protection.

3. Provide a wrist strap connected to a work surface and properly ground tools and

equipment.

4. Handle electrostatic-sensitive components, boards, and assemblies by the case

or the PCB edge.

5. Avoid contact with pins, leads, or circuitry.

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Themis Computer

CoolShell 3U Generation 2 Installation Manual

6. Turn off power and input signals before inserting and removing connectors or

test equipment. Power is not considered off until all power supplies have been

disconnected.

7. Keep the work area free of non-conductive materials such as ordinary plastic as-

sembly aids and Styrofoam.

8. Use field service tools, such as cutters, screwdrivers, and vacuums that are con-

ductive.

9. Always place drives and boards PCB-assembly-side down on the foam.

10. Grounding wire size shall be no less than 16 AWG.

11. Overcurrent Protection relies on proper building installation and Earth connec-

tion (ground).

12. High Voltage; Earth connection is essential before connecting the power supply

units.

viii Themis Computer

CoolShell 3U Generation 2 Installation Manual Version 1.1

Instructions for the Lithium Battery

Systems are equipped with a lithium battery installed on the motherboard. To

replace this battery, please observe the instructions that are described in this man-

ual.

Follow all local guidelines and regulations for disposing of used batteries .

European Union Waste Disposal

This section is for waste disposal by users in private households in the European Union.

For all others, please follow all local and government guidelines in accordance with waste disposal and

the symbol seen below.

This symbol on the product or on its packaging indicates that this product must not

be disposed of with your other household waste. Instead, it is your responsibility to

dispose of your waste equipment by handing it to a designated collection point for

the recycling of electrical and electronic equipment. The separate collection and

recycling of your waste equipment at the time of disposal help to conserve natural

resources and ensure recycling respectful of the environment and human health. For

more information on the recycling center nearest your home, contact the town hall,

the household waste disposal service or the shop where you purchased the product.

Warning: There is a danger of explosion when the wrong type of battery is used

as a replacement.

Warning: There is a danger of explosion if attempting to recharge the lithium

battery installed on the motherboard.

Note: Switzerland: Annex 4.10 of SR 814.013 applies to standard batteries.

Themis Computer

Table of Contents

Version Revision History....................................................................................................... iii

Safety Instructions................................................................................................................. iv

Preface.....................................................................................................................................xv

1. Overview and Specifications ........................................................................................ 1-1

1.1 Overview—CoolShell 3U ...................................................................................... 1-1

1.2 CPU Blade ............................................................................................................. 1-5

1.2.1 DOM (Disk on Module) ............................................................................ 1-6

1.2.2 IPMI ...........................................................................................................1-6

1.2.2.1 Remote On/Off ........................................................................... 1-7

1.2.2.2 COM Ports .................................................................................. 1-7

1.2.3 Lithium Battery .......................................................................................... 1-7

1.2.3.1 Removing the Lithium Battery ...................................................1-7

1.2.3.2 Installing a Lithium Battery ........................................................ 1-9

1.3 I/O Blade .............................................................................................................. 1-10

1.3.1 Graphics ................................................................................................... 1-10

1.4 Storage Expansion Subsystem ............................................................................. 1-11

1.5 Specifications ....................................................................................................... 1-12

1.5.1 General .....................................................................................................1-12

1.5.2 Environmental .......................................................................................... 1-12

1.5.2.1 Shock ........................................................................................1-13

1.5.2.2 Electrostatic Discharge .............................................................1-13

1.5.2.3 Noise Level ............................................................................... 1-13

1.5.3 Regulatory Compliance ........................................................................... 1-13

1.5.4 RoHS Compliance ................................................................................... 1-14

1.5.5 Hazardous Materials ................................................................................ 1-14

1.5.6 CPU Blade ............................................................................................... 1-14

1.5.7 I/O Blade .................................................................................................. 1-14

1.6 Packaging and Shipping .......................................................................................1-16

2. Installation and Operation ........................................................................................... 2-1

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CoolShell 3U Generation 2 Installation Manual Version 1.1

2.1 Installation Procedures ........................................................................................... 2-1

2.1.1 Subrack Installation ................................................................................... 2-1

2.1.2 CoolShell 3U Installation ........................................................................... 2-3

2.1.3 Multiple Video Displays ............................................................................ 2-5

2.1.4 Audio Connection ...................................................................................... 2-6

2.2 Operation ...............................................................................................................2-7

2.2.1 Power .........................................................................................................2-7

2.2.1.1 Power Sequence .......................................................................... 2-7

2.2.1.2 Remote On/Off ........................................................................... 2-8

2.2.2 Operation with Factory-Installed Linux .................................................... 2-8

Appendix A. Connector Pinouts ...................................................................................... A-1

A.1 CPU Blade ............................................................................................................ A-1

A.1.1 Power & Reset Connector ......................................................................... A-1

A.1.2 PCI-Express Connector ............................................................................. A-3

A.1.3 Clock & I2C Bus Connector (Firewire 1394) ........................................... A-4

A.1.4 DVI Power Connector (DVI Transceiver) ................................................ A-5

A.1.5 Optical SFP Ports ...................................................................................... A-6

A.1.6 Stereo Audio Connectors .......................................................................... A-6

A.1.7 IPMI LAN Port ......................................................................................... A-7

A.2 I/O Blade ............................................................................................................... A-8

A.2.1 USB 2.0 Connectors ................................................................................. A-8

A.2.2 DVI Video Output Connector ................................................................... A-8

A.3 Media Module ..................................................................................................... A-10

A.3.1 Copper Gigabit Ethernet Ports ................................................................ A-10

A.3.2 Optical Gigabit Ethernet Ports ................................................................ A-11

A.3.3 USB 2.0 Connectors ............................................................................... A-12

A.4 Storage Expansion Subsystem ............................................................................ A-13

A.4.1 Power & Reset Connector ....................................................................... A-13

A.4.2 PCI-Express Connector ........................................................................... A-13

A.4.3 Clock & I2C Bus Connector (Firewire 1394) ......................................... A-13

B. BIOS Setup Utility ........................................................................................................B-1

B.1 Introduction ............................................................................................................B-1

B.1.1 Starting BIOS Setup Utility .......................................................................B-1

B.1.2 How To Change the Configuration Data ...................................................B-2

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Table of Contents

B.1.3 Starting the Setup Utility ...........................................................................B-2

B.2 Main Setup .............................................................................................................B-3

B.2.1 System Overview .......................................................................................B-3

B.2.1.1 System Time/System Date ..........................................................B-3

B.2.1.2 Supermicro X9DRi .....................................................................B-4

B.3 Advanced Setup Configurations ............................................................................B-5

B.3.1 BOOT Features ..........................................................................................B-5

B.3.1.1 Quiet Boot ...................................................................................B-5

B.3.1.2 AddOn ROM Display Mode .......................................................B-6

B.3.1.3 Bootup Num-Lock ......................................................................B-6

B.3.1.4 Wait For 'F1' If Error ..................................................................B-6

B.3.1.5 Interrupt 19 Capture ....................................................................B-6

B.3.2 Power Configuration ..................................................................................B-6

B.3.2.1 Power Button Function ...............................................................B-6

B.3.2.2 Restore on AC Power Loss .........................................................B-6

B.3.3 CPU Configuration ....................................................................................B-7

B.3.3.1 Socket 1 CPU Information/Socket 2 CPU Information .............B-7

B.3.3.2 CPU Speed ..................................................................................B-7

B.3.3.3 64-bit ...........................................................................................B-7

B.3.3.4 Clock Spread Spectrum ..............................................................B-7

B.3.3.5 Hyper-threading ..........................................................................B-8

B.3.3.6 Active Processor Cores ...............................................................B-8

B.3.3.7 Limit CPIUID Maximum ............................................................B-8

B.3.3.8 Execute-Disable Bit Capability ..................................................B-8

B.3.3.9 Hardware Prefetcher ...................................................................B-8

B.3.3.10 Adjacent Cache Line Prefetch ....................................................B-8

B.3.3.11 DCU Streamer Prefetcher ...........................................................B-9

B.3.3.12 DCU IP Prefetcher ......................................................................B-9

B.3.3.13 Intel® Virtualization Technology ...............................................B-9

B.3.4 CPU Power Management Configuration ...................................................B-9

B.3.4.1 Power Technology ......................................................................B-9

B.3.4.2 Energy/Performance Bias .........................................................B-11

B.3.4.3 Factory Long Duration Power Limit ........................................B-11

B.3.4.4 Long Duration Maintained ........................................................B-11

B.3.4.5 Recommended Short Duration Power ......................................B-11

B.3.4.6 Short Duration Power Limit .....................................................B-11

B.3.5 Chipset Configuration ..............................................................................B-12

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CoolShell 3U Generation 2 Installation Manual Version 1.1

B.3.5.1 Intel VT-d .................................................................................B-12

B.3.5.2 Intel® I/OAT ............................................................................B-12

B.3.5.3 DCA Support ............................................................................B-12

B.3.5.4 IIOH 0 PCIe Port Bifurcation Control ......................................B-12

B.3.5.5 IOU1-PCIe Port ........................................................................B-12

B.3.5.6 Port 1A Link Speed ...................................................................B-13

B.3.5.7 Port 1B Link Speed ...................................................................B-13

B.3.5.8 IOU2-PCIe Port ........................................................................B-13

B.3.5.9 Port 2A Link Speed ...................................................................B-13

B.3.5.10 IOU3-PCIe Port ........................................................................B-13

B.3.5.11 Port 3A Link Speed ...................................................................B-13

B.3.5.12 Port 3C Link Speed ...................................................................B-14

B.3.5.13 IOH 1 PCIe Port Bifurcation Control .......................................B-14

B.3.5.14 IOU1-PCIe Port ........................................................................B-14

B.3.5.15 Port 1A Link Speed ...................................................................B-14

B.3.5.16 IOU2-PCIe Port ........................................................................B-14

B.3.5.17 Port 2A Link Speed ...................................................................B-14

B.3.5.18 IOU3-PCIe Port ........................................................................B-14

B.3.5.19 Port 3A Link Speed ...................................................................B-15

B.3.5.20 Current QPI Link ......................................................................B-15

B.3.5.21 Current QPI Frequency .............................................................B-15

B.3.5.22 QPI (Quick Path Interconnect) Link Speed Mode ....................B-15

B.3.5.23 QPI Link Frequency Select .......................................................B-15

B.3.5.24 Total Memory ...........................................................................B-15

B.3.5.25 Current Memory Mode .............................................................B-15

B.3.5.26 Current Memory Speed .............................................................B-15

B.3.5.27 Mirroring ...................................................................................B-16

B.3.5.28 Sparing ......................................................................................B-16

B.3.5.29 CPU Socket 1 DIMM Information / CPU Socket 2 DIMM

Information ...............................................................................B-16

B.3.5.30 Memory Mode ..........................................................................B-16

B.3.5.31 DRAM RAPL BWLIMIT .........................................................B-16

B.3.5.32 Perfmom and DFX Devices ......................................................B-16

B.3.5.33 DRAM RAPL Mode .................................................................B-17

B.3.5.34 MPST Support ..........................................................................B-17

B.3.5.35 DDR Speed ...............................................................................B-17

B.3.5.36 Channel Interleaving .................................................................B-17

B.3.5.37 Rank Interleaving ......................................................................B-17

B.3.5.38 Patrol Scrub ...............................................................................B-17

Themis Computer

Table of Contents

B.3.5.39 Demand Scrub ...........................................................................B-17

B.3.5.40 Data Scrambling .......................................................................B-18

B.3.5.41 DRAM RAPL ...........................................................................B-18

B.3.5.42 Device Tagging .........................................................................B-18

B.3.5.43 Thermal Throttling ....................................................................B-18

B.3.5.44 OLTT Peak BW % ....................................................................B-18

B.3.5.45 PCH Information .......................................................................B-18

B.3.5.46 All USB Devices .......................................................................B-19

B.3.5.47 Legacy USB Support ................................................................B-19

B.3.5.48 Port 60/64 Emulation ................................................................B-19

B.3.5.49 EHCI Hand-Off .........................................................................B-19

B.3.6 SATA Configuration ................................................................................B-19

B.3.6.1 SATA Port0~SATA Port5 ........................................................B-19

B.3.6.2 SATA Mode ..............................................................................B-20

B.3.7 SCU (Storage Control Unit) Configuration .............................................B-21

B.3.7.1 Storage Controller Unit Devices ...............................................B-21

B.3.7.2 OnChip SCU Option ROM .......................................................B-21

B.3.7.3 SCU Port 0~SCU Port 7 ...........................................................B-21

B.3.8 Thermal Configuration ............................................................................B-21

B.3.8.1 Thermal Management ...............................................................B-21

B.3.8.2 ME SMBus Thermal Reporting ................................................B-21

B.3.9 PCIe/PCI/PnP Configuration ...................................................................B-22

B.3.9.1 PCI ROM Priority .....................................................................B-22

B.3.9.2 PCI Latency Timer ....................................................................B-22

B.3.9.3 Above 4G Decoding .................................................................B-22

B.3.9.4 PERR# Generation ....................................................................B-22

B.3.9.5 SERR# Generation ....................................................................B-23

B.3.9.6 Maximum Payload ....................................................................B-23

B.3.9.7 Maximum Read Request ...........................................................B-23

B.3.9.8 ASPM Support ..........................................................................B-23

B.3.9.9 Onboard LAN Options ROM Select .........................................B-23

B.3.9.10 Load Onboard LAN 1 Option ROM/Load Onboard LAN 2

Option ROM .............................................................................B-23

B.3.9.11 VGA Priority .............................................................................B-24

B.3.9.12 Network Stack ...........................................................................B-24

B.3.10 Super IO Configuration (WPCM450) ......................................................B-24

B.3.10.1 Serial Port .................................................................................B-24

B.3.10.2 Serial Port Mode .......................................................................B-24

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CoolShell 3U Generation 2 Installation Manual Version 1.1

B.3.10.3 Device Settings .........................................................................B-24

B.3.10.4 Change Settings ........................................................................B-24

B.3.11 Serial Port Console Redirection ...............................................................B-25

B.3.11.1 COM 0/COM 1 .........................................................................B-25

B.3.11.2 Console Redirection ..................................................................B-25

B.3.11.3 Terminal Type ...........................................................................B-25

B.3.11.4 Bits Per second ..........................................................................B-25

B.3.11.5 Data Bits ...................................................................................B-25

B.3.11.6 Parity .........................................................................................B-26

0.0.0.1 Stop Bits ....................................................................................B-26

B.3.11.7 Flow Control .............................................................................B-26

B.3.11.8 VT-UTF8 Combo Key Support ................................................B-26

B.3.11.9 Recorder Mode .........................................................................B-26

B.3.11.10Resolution 100x31 ...................................................................B-26

B.3.11.11Legacy OS Redirection Resolution ..........................................B-26

B.3.11.12Putty KeyPad ............................................................................B-27

B.3.11.13Serial Port for Out-of-Band Management/Windows

Emergency Management Services (EMS) ................................B-27

B.3.11.14Console Redirection .................................................................B-27

B.3.11.15Out-of-Band Management Port ................................................B-27

B.3.11.16Terminal Type ..........................................................................B-27

B.3.11.17Bits Per Second ........................................................................B-27

B.3.11.18Flow Control ............................................................................B-28

B.3.12 ACPI Settings ..........................................................................................B-28

B.3.12.1 ACPI Sleep State ......................................................................B-28

B.3.12.2 NUMA ......................................................................................B-28

B.3.12.3 High Precision Event Timer .....................................................B-28

B.3.12.4 TPM Support .............................................................................B-29

B.3.12.5 Current Status Information .......................................................B-29

B.3.12.6 Intel TXT (LT-SX) Hardware Support .....................................B-29

B.3.13 ME (Management Engine) Subsystem ....................................................B-30

B.3.13.1 ME Subsystem ..........................................................................B-30

B.4 Event Logs ...........................................................................................................B-31

B.4.1 Change SMBIOS Event Log Settings ......................................................B-31

B.4.1.1 SMBIOS Event Log ..................................................................B-31

B.4.1.2 Erase Event Log ........................................................................B-32

B.4.1.3 When Log is Full ......................................................................B-32

B.4.1.4 Log System Boot Event ............................................................B-32

Themis Computer

Table of Contents

B.4.1.5 MECI ........................................................................................B-32

B.4.1.6 METW ......................................................................................B-32

B.4.1.7 View SMBIOS Event Log ........................................................B-32

B.4.1.8 View System Event Log ...........................................................B-32

B.5 IPMI .....................................................................................................................B-33

B.5.1 System Event Log ....................................................................................B-34

B.5.1.1 SEL Components ......................................................................B-34

B.5.1.2 Erase SEL .................................................................................B-34

B.5.1.3 When SEL is Full ......................................................................B-34

B.5.1.4 Log EFI Status Codes ...............................................................B-34

B.5.2 BMC Network Configuration ..................................................................B-34

B.5.2.1 LAN Channel 1 .........................................................................B-34

B.5.2.2 Update IPMI LAN Configuration .............................................B-35

B.5.2.3 Configuration Address Source ..................................................B-35

B.5.2.4 Station IP Address ....................................................................B-35

B.5.2.5 Subnet Mask .............................................................................B-35

B.5.2.6 Station MAC Address ...............................................................B-35

B.5.2.7 Router IP Address .....................................................................B-35

B.5.2.8 Router MAC Address ...............................................................B-35

B.6 Boot Configuration ..............................................................................................B-36

B.6.1 Boot Option Priorities ..............................................................................B-36

B.6.1.1 Boot Option #1/ Boot Option #2/ Boot Options #3, etc. ..........B-36

B.6.1.2 Network Device BBS Priorities, Hard Drive BBS Priorities ....B-36

B.6.2 Delete Boot Option ..................................................................................B-37

B.6.3 Boot Option #1, Boot option #2, Boot Option #3 ....................................B-37

B.7 Security Settings ..................................................................................................B-38

B.7.1 Administrator Password ...........................................................................B-38

B.7.2 User Password ..........................................................................................B-38

B.8 Exit Options .........................................................................................................B-39

B.8.1 Discard Changes and Exit ........................................................................B-39

B.8.2 Save Changes and Reset ..........................................................................B-40

B.8.3 Save Changes ...........................................................................................B-40

B.8.4 Discard Changes ......................................................................................B-40

B.8.5 Restore Optimized Defaults .....................................................................B-40

B.8.6 Save as User Defaults ..............................................................................B-40

B.8.7 Restore User Defaults ..............................................................................B-41

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B.8.8 Boot Override ..........................................................................................B-41

B.9 BIOS Error Beep Codes .......................................................................................B-42

B.10 BIOS Recovery ....................................................................................................B-43

B.10.1 How to Recover the AMIBIOS Image (the Main BIOS Block) ..............B-43

B.10.2 Boot Sector Recovery from a USB Device .............................................B-43

B.10.3 Boot Sector Recovery from an IDE CD-ROM ........................................B-44

B.10.4 Boot Sector Recovery from a Serial Port (“Serial Flash”) ......................B-44

B.10.5 Requirements ...........................................................................................B-44

Appendix C. X9DRi-F Motherboard ...............................................................................C-1

C.1 Overview ................................................................................................................C-1

C.2 Chipset Overview ..................................................................................................C-6

C.2.1 Main Features of the E5-2600 V2 Series Processor and C602 Chipset .....C-6

C.3 Special Features .....................................................................................................C-8

C.3.1 Recovery from AC Power Loss .................................................................C-8

C.3.2 PC Health Monitoring ................................................................................C-8

C.3.2.1 Fan Status Monitor ......................................................................C-8

C.3.2.2 Environmental Temperature Control ..........................................C-8

C.3.2.3 System Resource Alert ................................................................C-9

C.3.3 ACPI Features ............................................................................................C-9

C.3.4 Slow Blinking LED for Suspend-State Indicator ......................................C-9

C.3.5 Super I/O ..................................................................................................C-10

C.3.6 Overview of the Nuvoton WPCM450 Controller ....................................C-10

C.3.6.1 Additional Supported features of the WPCM450 .....................C-10

Appendix D. Red Hat Enterprise Linux 5 Installation ................................................. D-1

D.1 Introduction ........................................................................................................... D-1

D.2 Installation ............................................................................................................ D-1

Index ..............................................................................................................................Index-1

Reader Comment Card

Themis Computer

Table of Contents

List of Figures

Figure 1-1 CoolShell 3U within Rugged 3RU Subrack .................................................... 1-2

Figure 1-2 CPU Blade Front Panel.................................................................................... 1-2

Figure 1-3 I/O Blade Front Panel ...................................................................................... 1-3

Figure 1-4 AC Power Supply Front Panel......................................................................... 1-3

Figure 1-5 Media Module Front Panel .............................................................................. 1-4

Figure 1-6 CoolShell 3U PCIe Topology.......................................................................... 1-5

Figure 1-7 X9DRi-F BMC Block Diagram....................................................................... 1-6

Figure 1-8 CPU Blade Lithium Battery............................................................................. 1-8

Figure 1-9 Storage Expansion Subsystem....................................................................... 1-11

Figure 2-1 Empty CoolShell 3U (3RU) Subrack (Front View)......................................... 2-1

Figure 2-2 Install Subrack Alignment Guide-Pins onto the 19” Rack .............................. 2-2

Figure 2-3 Mate Subrack Alignment Holes with Alignment Guide-Pins ......................... 2-2

Figure 2-4 CoolShell 3U 3RU Subrack Secured to the 19” Rack..................................... 2-3

Figure 2-5 I/O Blade Ports................................................................................................. 2-4

Figure 2-6 Cable the Storage Expansion Subsystem to the CPU Blade............................ 2-5

Figure 2-7 Connect the Power Cords to the AC Power Supplies...................................... 2-5

Figure 2-8 Connect the Audio Cable Adapter to Channel A or Channel B ...................... 2-6

Figure A-1 Power & Reset Connector Pinout................................................................... A-1

Figure A-2 PCI-Express Connector Pinout....................................................................... A-3

Figure A-3 Clock & I2C Connector Pinout....................................................................... A-4

Figure A-4 Power & Reset Connector Pinout................................................................... A-5

Figure A-5 Optical SFP Port–CPU Blade ......................................................................... A-6

Figure A-6 Stereo Audio Connector Pinout...................................................................... A-6

Figure A-7 Ethernet Connector, Type RJ45...................................................................... A-7

Figure A-8 USB 2.0 Connector Pinout.............................................................................. A-8

Figure A-9 Video Connector Pinout.................................................................................. A-9

Figure A-10 Copper Gigabit Ethernet Connector Pinout.................................................. A-10

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Figure A-11 Optical Gigabit Ethernet Connector Pinout.................................................. A-12

Figure A-12 USB 2.0 Connector Pinout............................................................................ A-12

Figure A-13 Power & Reset Connector Pinout................................................................. A-13

Figure B-1 Main BIOS Setup Screen................................................................................. B-3

Figure B-2 Advanced Settings Screen ............................................................................... B-5

Figure B-3 Event Logs..................................................................................................... B-31

Figure B-4 IPMI Settings................................................................................................. B-33

Figure B-5 Boot Settings.................................................................................................. B-36

Figure B-6 Security Settings ............................................................................................ B-38

Figure B-7 Exit Options................................................................................................... B-39

Figure B-8 AMI_FLSH Hyperterminal............................................................................ B-46

Figure B-9 ROM File Extraction ..................................................................................... B-46

Figure B-10 FLASH Recovery .......................................................................................... B-47

Figure C-1 X9DRi-F Motherboard .................................................................................... C-2

Figure C-2 X9DRi-F Block Diagram................................................................................. C-4

Figure C-3 X9DRi-F Motherboard .................................................................................... C-5

Figure D-1 Power On after Linux DVD is Inserted into Drive......................................... D-2

Figure D-2 Skip Key ......................................................................................................... D-2

Figure D-3 Welcome Screen ............................................................................................. D-3

Figure D-4 Language Selection......................................................................................... D-4

Figure D-5 Selecting Layout Type.................................................................................... D-5

Figure D-6 Enter Installation Number............................................................................... D-6

Figure D-7 Partitioning...................................................................................................... D-7

Figure D-8 Reviewing Option........................................................................................... D-8

Figure D-9 Creating a Custom Layout.............................................................................. D-9

Figure D-10 Setting Up Boot Loader................................................................................ D-10

Figure D-11 Master Boot Record (MBR) ......................................................................... D-11

Figure D-12 Network Devices List ................................................................................... D-12

Figure D-13 Edit Interface Pop-Up Screen ....................................................................... D-13

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Themis CoolShell 3U G2 Installation guide

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Model: CoolShell 3U G2

Type: Installation guide

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Themis CoolShell 3U G2 Installation guide

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