Kingston Technology KHX3200AK2/512 Datasheet

Kingston Technology
Brand
Kingston Technology
Model
KHX3200AK2/512
Category
Memory modules
Type
Datasheet

Kingston Technology KHX3200AK2/512 is a kit of two 256MB DDR400 SDRAM (Synchronous DRAM) CL2 memory modules. Total kit capacity is 512MB. The components on each module include eight 8M x 8-bit DDR400 SDRAM in TSOP packages. Each 184-pin DIMM uses gold contact fingers and requires +2.6V. The electrical and mechanical specifications are as follows:

  • Power supply : Vdd: 2.6V ± 0.1V, Vddq: 2.6V ± 0.1V
  • Double-data-rate architecture; two data transfers per clock cycle
  • Bidirectional data strobe(DQS)
  • Differential clock inputs(CK and CK)
  • DLL aligns DQ and DQS transition with CK transition
  • Programmable Read latency 2 (clock)

Kingston Technology KHX3200AK2/512 is a kit of two 256MB DDR400 SDRAM (Synchronous DRAM) CL2 memory modules. Total kit capacity is 512MB. The components on each module include eight 8M x 8-bit DDR400 SDRAM in TSOP packages. Each 184-pin DIMM uses gold contact fingers and requires +2.6V. The electrical and mechanical specifications are as follows:

  • Power supply : Vdd: 2.6V ± 0.1V, Vddq: 2.6V ± 0.1V
  • Double-data-rate architecture; two data transfers per clock cycle
  • Bidirectional data strobe(DQS)
  • Differential clock inputs(CK and CK)
  • DLL aligns DQ and DQS transition with CK transition
  • Programmable Read latency 2 (clock)
Memory Module Specification
Document No. 4803622-001.A00
07/03/03
KHX3200AK2/512
512MB (256MB 32M x 64-Bit x 2 pcs.)
PC3200 CL2 184-Pin DIMM Kit
KEYED
Page 1
DESCRIPTION:
Kingston's KHX3200AK2/512 is a kit of two 32M x 64-bit (256MB) DDR400 SDRAM (Synchro-
nous DRAM) CL2 memory modules. Total kit capacity is 512MB. The components on each module
include eight 32M x 8-bit (8M x 8-bit x 4 Bank / 200MHz, 5ns) DDR400 SDRAM in TSOP
packages. Each 184-pin DIMM uses gold contact fingers and requires +2.6V. The electrical and
mechanical specifications are as follows:
FEATURES:
Power supply : Vdd: 2.6V ± 0.1V, Vddq: 2.6V ± 0.1V
Double-data-rate architecture; two data transfers per clock cycle
Bidirectional data strobe(DQS)
Differential clock inputs(CK and CK)
DLL aligns DQ and DQS transition with CK transition
Programmable Read latency 2 (clock)
Programmable Burst length (2, 4, 8)
Programmable Burst type (sequential & interleave)
Timing Reference: 2-3-2-6-1 at +2.6V
Edge aligned data output, center aligned data input
Auto & Self refresh, 7.8us refresh interval(8K/64ms refresh)
Serial presence detect with EEPROM
High Performance Heat Spreader
PCB : Height 1.250” (34.75mm), single sided component
PERFORMANCE:
Clock Cycle Time (tCK) 5ns (min.) / 10ns (max.)
Row Cycle Time (tRC) 55ns (min.)
Refresh Row Cycle Time (tRFC) 65ns (min.)
Row Active Time (tRAS) 40ns (min.) / 100,000ns (max.)
Power (IDD0) 2.200 W (operating)
UL Rating 94 V - 0
Operating Temperature 0
o
C to 70
o
C
Storage Temperature -55
o
C to +150
o
C
Kingston Technology
Document No. 4803622-001.A00 Page 2
MODULE DIMENSIONS:
0.050
0.0078 ±0.006
(0.20 ±0.15)
(1.270)
0.100
(2.50 )
0.250
(6.350)
0.157
(4.00)
0.071
(1.80)
0.039 ± 0.002
(1.000 ± 0.050)
(3.80)
2.175
(6.62)
0.26
0.1496
(3.00)
0.118
(2.00)
0.0787
(4.00)
0.1575
1.200
0.700
0.393
0.000
0.000
2.886
5.250
(30.48)
(17.80)
(10.00)
(00.00)
(73.30)
(133.35)
Units : Inches (Millimeters)
1
(00.00)
All Kingston products are tested to meet our published specifications. Some motherboards or system configurations may not
operate at the published HyperX memory speeds and timing settings. Kingston does not recommend that any user attempt to
run their computers faster than the published speed. Overclocking or modifying your system timing may result in damage to
computer components.
For more information, go to www.kingston.com
1.250"
(34.75)
  • Page 1 1
  • Page 2 2

Kingston Technology KHX3200AK2/512 Datasheet

Kingston Technology
Brand
Kingston Technology
Model
KHX3200AK2/512
Category
Memory modules
Type
Datasheet

Kingston Technology KHX3200AK2/512 is a kit of two 256MB DDR400 SDRAM (Synchronous DRAM) CL2 memory modules. Total kit capacity is 512MB. The components on each module include eight 8M x 8-bit DDR400 SDRAM in TSOP packages. Each 184-pin DIMM uses gold contact fingers and requires +2.6V. The electrical and mechanical specifications are as follows:

  • Power supply : Vdd: 2.6V ± 0.1V, Vddq: 2.6V ± 0.1V
  • Double-data-rate architecture; two data transfers per clock cycle
  • Bidirectional data strobe(DQS)
  • Differential clock inputs(CK and CK)
  • DLL aligns DQ and DQS transition with CK transition
  • Programmable Read latency 2 (clock)
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