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Last Updated: March 13, 2019
PICO-APL1
PICO-ITX Board
User’s Manual 6
th
Ed
Preface II
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Copyright Notice
This document is copyrighted, 2018. All rights are reserved. The original manufacturer
reserves the right to make improvements to the products described in this manual at
any time without notice.
No part of this manual may be reproduced, copied, translated, or transmitted in any
form or by any means without the prior written permission of the original
manufacturer. Information provided in this manual is intended to be accurate and
reliable. However, the original manufacturer assumes no responsibility for its use, or for
any infringements upon the rights of third parties that may result from its use.
The material in this document is for product information only and is subject to change
without notice. While reasonable efforts have been made in the preparation of this
document to assure its accuracy, AAEON assumes no liabilities resulting from errors or
omissions in this document, or from the use of the information contained herein.
AAEON reserves the right to make changes in the product design without notice to its
users.
Preface III
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Acknowledgement
All other products’ name or trademarks are properties of their respective owners.
Microsoft Windows
®
is a registered trademark of Microsoft Corp.
ITE is a trademark of Integrated Technology Express, Inc.
IBM, PC/AT, PS/2, and VGA are trademarks of International Business Machines
Corporation.
All other product names or trademarks are properties of their respective owners.
Preface IV
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Packing List
Before setting up your product, please make sure the following items have been
shipped:
Item
Quantity
PICO-APL1
1
COM + Line-out Cable (optional)
1
If any of these items are missing or damaged, please contact your distributor or sales
representative immediately.
Preface V
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About this Document
This User’s Manual contains all the essential information, such as detailed descriptions
and explanations on the product’s hardware and software features (if any), its
specifications, dimensions, jumper/connector settings/definitions, and driver installation
instructions (if any), to facilitate users in setting up their product.
Users may refer to the AAEON.com for the latest version of this document.
Preface VI
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Safety Precautions
Please read the following safety instructions carefully. It is advised that you keep this
manual for future references
1. All cautions and warnings on the device should be noted.
2. Make sure the power source matches the power rating of the device.
3. Position the power cord so that people cannot step on it. Do not place anything
over the power cord.
4. Always completely disconnect the power before working on the system’s
hardware.
5. No connections should be made when the system is powered as a sudden rush
of power may damage sensitive electronic components.
6. If the device is not to be used for a long time, disconnect it from the power
supply to avoid damage by transient over-voltage.
7. Always disconnect this device from any AC supply before cleaning.
8. While cleaning, use a damp cloth instead of liquid or spray detergents.
9. Make sure the device is installed near a power outlet and is easily accessible.
10. Keep this device away from humidity.
11. Place the device on a solid surface during installation to prevent falls
12. Do not cover the openings on the device to ensure optimal heat dissipation.
13. Watch out for high temperatures when the system is running.
14. Do not touch the heat sink or heat spreader when the system is running
15. Never pour any liquid into the openings. This could cause fire or electric shock.
16. As most electronic components are sensitive to static electrical charge, be sure to
ground yourself to prevent static charge when installing the internal components.
Use a grounding wrist strap and contain all electronic components in any
static-shielded containers.
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17. If any of the following situations arises, please the contact our service personnel:
i. Damaged power cord or plug
ii. Liquid intrusion to the device
iii. Exposure to moisture
iv. Device is not working as expected or in a manner as described in
this manual
v. The device is dropped or damaged
vi. Any obvious signs of damage displayed on the device
18. DO NOT LEAVE THIS DEVICE IN AN UNCONTROLLED ENVIRONMENT WHERE
THE STORAGE TEMPERATURE IS BELOW -20° C (-4°F) OR ABOVE 60°C (140°F)
TO PREVENT DAMAGE.
Preface VIII
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FCC Statement
This device complies with Part 15 FCC Rules. Operation is
subject to the following two conditions: (1) this device may not
cause harmful interference, and (2) this device must accept any
interference received including interference that may cause
undesired operation.
Caution:
There is a danger of explosion if the battery is incorrectly replaced. Replace only with the
same or equivalent type recommended by the manufacturer. Dispose of used batteries
according to the manufacturer’s instructions and your local government’s recycling or
disposal directives.
Attention:
Il y a un risque d’explosion si la batterie est remplacée de façon incorrecte.
Ne la remplacer qu’avec le même modèle ou équivalent recommandé par le constructeur.
Recycler les batteries usées en accord avec les instructions du fabricant et les directives
gouvernementales de recyclage.
Preface IX
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China RoHS Requirements (CN)
产品中有毒有害物质或元素名称及含量
AAEON Main Board/ Daughter Board/ Backplane
部件名称
有毒有害物质或元素
铅
(Pb)
汞
(Hg)
镉
(Cd)
六价铬
(Cr(VI))
多溴联苯
(PBB)
多溴二苯醚
(PBDE)
印刷电路板
及其电子组件
○
○
○
○
○
○
外部信号
连接器及线材
○
○
○
○
○
○
O：表示该有毒有害物质在该部件所有均质材料中的含量均在
SJ/T 11363-2006 标准规定的限量要求以下。
X：表示该有毒有害物质至少在该部件的某一均质材料中的含量超出
SJ/T 11363-2006 标准规定的限量要求。
备注：此产品所标示之环保使用期限，系指在一般正常使用状况下。
Preface X
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China RoHS Requirement (EN)
Poisonous or Hazardous Substances or Elements in Products
AAEON Main Board/ Daughter Board/ Backplane
Component
Poisonous or Hazardous Substances or Elements
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chromium
(Cr(VI))
Polybrominated
Biphenyls
(PBB)
Polybrominated
Diphenyl Ethers
(PBDE)
PCB & Other
Components
O
O
O
O
O
○
Wires &
Connectors
for External
Connections
O
O
O
O
O
O
O：The quantity of poisonous or hazardous substances or elements found in each of the
component's parts is below the SJ/T 11363-2006-stipulated requirement.
X: The quantity of poisonous or hazardous substances or elements found in at least one of the
component's parts is beyond the SJ/T 11363-2006-stipulated requirement.
Note: The Environment Friendly Use Period as labeled on this product is applicable under normal
usage only
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Table of Contents
Chapter 1 - Product Specifications ......................................................................................... 1
1.1 Specifications ................................................................................................................... 2
Chapter 2 – Hardware Information ........................................................................................5
2.1 Dimensions ...................................................................................................................... 6
2.2 Jumpers and Connectors ............................................................................................ 9
2.3 List of Jumpers ............................................................................................................... 11
2.3.1 Clear CMOS Jumper (JP1 1, 3, 5) .............................................................. 12
2.3.2 Auto Power Button Enable/Disable Selection (JP1 2, 4, 6) ............... 12
2.3.3 LVDS Port Operating Voltage Selection (JP2 1,3,5) ............................ 12
2.3.4 LVDS Port Backlight Inverter Voltage Selection Selection (JP2 2,4,6)
............................................................................................................................ 12
2.3.5 LVDS Port Backlight Lightness Control Mode (JP3)............................ 13
2.4 List of Connectors ........................................................................................................ 14
2.4.1 Digital IO Port (CN1) ..................................................................................... 15
2.4.2 LVDS Port Inverter / Backlight Connector (CN2) ................................ 15
2.4.3 Front Panel (CN3) .......................................................................................... 16
2.4.4 Mini-Card Slot (Half-Mini Card) (CN4) ....................................................17
2.4.5 Mini-Card Slot (Full Mini-Card)/mSATA (by BOM) (CN6) ................. 20
2.4.6 BIO connector (CN7) ................................................................................... 23
2.4.7 SATA Port (CN8) ............................................................................................. 25
2.4.8 Battery (CN9) .................................................................................................. 25
2.4.9 LAN (RJ-45) Port (CN10) ............................................................................. 26
2.4.10 USB3.0 Ports 0 and 1 (CN11) ...................................................................... 27
2.4.11 +5V Output for SATA HDD (CN12) .......................................................... 27
2.4.12 HDMI Port (CN13) ......................................................................................... 28
2.4.13 External +12V Input (CN14) ........................................................................ 30
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2.4.14 DDR3L SO-DIMM Slot (CN15) ................................................................... 30
2.4.15 LVDS Port (CN16)........................................................................................... 30
2.4.16 COM Port 1/2 & line out connector (CN17) .......................................... 32
2.4.17 COM port2 RS-485 ...................................................................................... 33
2.4.18 COM port2 RS-422 ...................................................................................... 33
2.4.19 LPC port2 (CN18) .......................................................................................... 35
2.4.20 USB 2.0 Port 1 (CN19)................................................................................... 36
2.4.21 Specifications for I/O Port .......................................................................... 36
2.4.22 Function Block ................................................................................................ 38
Chapter 3 - AMI BIOS Setup ................................................................................................ 39
3.1 System Test and Initialization.................................................................................... 40
3.2 AMI BIOS Setup ............................................................................................................ 41
3.3 Setup Submenu: Main ................................................................................................ 42
3.4 Setup Submenu: Advanced ...................................................................................... 43
3.4.1 CPU configuration ........................................................................................ 45
3.4.2 SATA Configuration....................................................................................... 47
3.4.3 Hardware Monitor ........................................................................................ 48
3.4.4 SIO Configuration ......................................................................................... 49
3.4.4.1 Serial Port Configuration ................................................................ 50
3.4.5 Dio Configuration ......................................................................................... 51
3.4.6 Power Management ..................................................................................... 52
3.4.7 Setup submenu: Chipset............................................................................. 53
3.4.8 North Bridge ................................................................................................... 54
3.5 LVDS Panel Configuration ......................................................................................... 55
3.5.1 South Bridge ................................................................................................... 58
3.5.1.1 Setup submenu: Security ................................................................ 59
3.5.2 Setup submenu: Boot .................................................................................. 60
3.6 Setup submenu: Exit ................................................................................................... 61
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Chapter 4 – Drivers Installation ............................................................................................ 62
4.1 Driver Download/Installation.................................................................................... 63
Appendix A - Watchdog Timer Programming ................................................................... 65
A.1 Watchdog Timer Registers ........................................................................................ 66
A.2 Watchdog Sample Program ..................................................................................... 67
Appendix B - I/O Information .............................................................................................. 70
B.1 I/O Address Map ...........................................................................................................71
B.2 Memory Address Map ............................................................................................... 72
B.3 IRQ Mapping Chart ..................................................................................................... 73
Appendix C – Mating Connectors ....................................................................................... 74
C.1 List of Mating Connectors and Cables .................................................................. 75
Appendix D – DIO ..................................................................................................................77
D.1 DIO ................................................................................................................................... 78
Appendix E – PICO-APL1-SEMI Quick Installation Guide .................................................. 83
E.1 Packing List..................................................................................................................... 84
E.2 Assembly procedure ................................................................................................... 86
Appendix F – PICO-APL1 AI Core Kit Installation Guide ................................................... 92
F.1 Product Brief .................................................................................................................. 93
F.2 Update Ubuntu and Kernel ....................................................................................... 94
F.3 Install NCSDK................................................................................................................. 97
F.4 Download Movidius Ncappzoo............................................................................. 100
F.5 Example in Movidius Ncappzoo ........................................................................... 104
F.6 Appendix ...................................................................................................................... 106
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Chapter 1
Chapter 1 - Product Specifications
Chapter 1 – Product Specifications 2
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1.1 Specifications
System
Form Factor
Pico-ITX
CPU
Intel® Atom™ E3900/ Pentium® N4200/
Celeron® N3350 Processor SoC
CPU Frequency
Up to 2.0GHz
Chipset
Intel® Atom™ E3900/ Pentium® N4200/
Celeron® N3350 Processor SoC
Memory Type
204-pin DDR3L SODIMM x 1, DDR3L 1867MHz,
Max. 8GB
Max. Memory Capacity
Up to 8GB
BIOS
AMI/SPI
Wake On LAN
Yes
Watchdog Timer
255 Levels
Power Requirement
+12V AT/ATX (default)
Power Supply Type
AT/ATX (default)
Power Consumption (Typical)
Intel® N3350 Processor, DDR3L 8GB
0.91A@+12V
System Cooling
Heat-spreader/ heatsink optional
Dimension
3.94" x 2.84" (100mm x 72mm)
Gross Weight
0.55 lb (0.25 kg)
Operating Temperature
32 °F~ 140 °F (0°C ~ 60°C),
Chapter 1 – Product Specifications 3
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System
Storage Temperature
-40 °F ~ 176 °F (-40°C ~ 80°C)
Operating Humidity
0% ~ 90% relative humidity, non-condensing
MTBF (Hours)
170,000
Certification
CE,FCC
Display
Chipset
Intel® Atom™ E3900/ Pentium® N4200/
Celeron® N3350 Processor SoC
Resolution
LVDS (18/24bit 2CH) 1920 x 1200 (optional)
HDMI 1.4b up to 3840 x 2160
DDI (BIO)
LCD Interface
18/24bit 2CH LVDS
I/O
Storage/SSD
SATA 6.0Gb/s x 1, mSATA or Mini-PCIe by BOM
(Full size) x 1
Ethernet
Intel® Gigabit Ethernet i210AT,
10/100/1000Base-TX, RJ-45 x 1
USB Port
USB 3.0 x 2, Rear IO, USB 2.0 x 1
Serial Port
COM1: RS-232 x 1,
COM2: RS-232/422/485 x 1 (Ring/ +5V/ +12V)
Audio
Line-out x1
DIO
4-bit (2-in, 2-out)
Chapter 1 – Product Specifications 4
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I/O
Expansion Slot
Mini Card (Half-size) x 1, BIO (optional) x 1, I2C
or SMBus x 1
SIM
—
TPM
—
Touch
—
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Chapter 2
Chapter 2 – Hardware Information
Chapter 2 – Hardware Information 6
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2.1 Dimensions
Component Side
REV.
NAME
MATERIAL:
SPEC.:
SCALE:
UNIT: MM
FINISH: APPROVED
>0 ¡ Ó0.1
>10 ¡ Ó0.2
>50 ¡ Ó0.3
>200 ¡ Ó0.5
>500 ¡ Ó0.8
¡ Ó0.5¢X
ANGLE TOL.
CHECKED DESIGNED
DWG No.
ITEM DATE REMARK
SHEET: /
MODEL No.
PART No.
1
1
A A3
2
3
4
5
6
7
8
9
10
11
B C D E F G H I J
2
3
NA
t=1.6mm
PCB
11
A0.3
PICO-APL1
PCB drawing
Kevin Willie
1907APL102
1907APL102
Component Side
Solder Side
Chapter 2 – Hardware Information 7
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Solder Side
REV.
NAME
MATERIAL:
SPEC.:
SCALE:
UNIT: MM
FINISH: APPROVED
>0 ¡ Ó0.1
>10 ¡ Ó0.2
>50 ¡ Ó0.3
>200 ¡ Ó0.5
>500 ¡ Ó0.8
¡ Ó0.5¢X
ANGLE TOL.
CHECKED DESIGNED
DWG No.
ITEM DATE REMARK
SHEET: /
MODEL No.
PART No.
1
1
A A3
2
3
4
5
6
7
8
9
10
11
B C D E F G H I J
2
3
NA
t=1.6mm
PCB
11
A0.3
PICO-APL1
PCB drawing
Kevin Willie
1907APL102
1907APL102
Component Side
Solder Side
/
