Intel BLKD945GSEJT?KIT Datasheet

April 2009

Order Number: E62862-001US

The Intel

®

Desktop Board D945GSEJT may contain design defects or errors known as errata that may cause the product to deviate from published specifications. Current

characterized errata are documented in the Intel Desktop Board D945GSEJT Specification Update.

Intel® Desktop Board

D945GSEJT

Technical Product Specification

Revision History

Revision Revision History Date

-001 First release of the Intel

®

Desktop Board D945GSEJT Technical Product

Specification.

April 2009

This product specification applies to only the standard Intel

®

Desktop Board D945GSEJT with

BIOS identifier JT94510H.86A.

Changes to this specification will be published in the Intel Desktop Board D945GSEJT

Specification Update before being incorporated into a revision of this document.

INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL

®

PRODUCTS. NO LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS

GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL’S TERMS AND CONDITIONS OF SALE FOR

SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR

IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR

WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT

OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS OTHERWISE AGREED IN

WRITING BY INTEL, THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN

WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR

DEATH MAY OCCUR.

Intel Corporation may have patents or pending patent applications, trademarks, copyrights, or other

intellectual property rights that relate to the presented subject matter. The furnishing of documents and

other materials and information does not provide any license, express or implied, by estoppel or otherwise,

to any such patents, trademarks, copyrights, or other intellectual property rights.

Intel may make changes to specifications and product descriptions at any time, without notice.

Designers must not rely on the absence or characteristics of any features or instructions marked “reserved”

or “undefined.” Intel reserves these for future definition and shall have no responsibility whatsoever for

conflicts or incompatibilities arising from future changes to them.

Intel

®

Desktop Boards may contain design defects or errors known as errata, which may cause the product

to deviate from published specifications. Current characterized errata are available on request.

Contact your local Intel sales office or your distributor to obtain the latest specifications before placing your

product order.

Copies of documents which have an ordering number and are referenced in this document, or other Intel

literature, may be obtained from:

Intel Corporation

P.O. Box 5937

Denver, CO 80217-9808

or call in North America 1-800-548-4725, Europe 44-0-1793-431-155, France 44-0-1793-421-777,

Germany 44-0-1793-421-333, other Countries 708-296-9333.

Intel, the Intel logo, and Intel Atom are trademarks of Intel Corporation in the United States and other

countries.

* Other names and brands may be claimed as the property of others.

iii

Preface

This Technical Product Specification (TPS) specifies the board layout, components,

connectors, power and environmental requirements, and the BIOS for the Intel

®

Desktop Board D945GSEJT. It describes the standard product and available

manufacturing options.

Intended Audience

The TPS is intended to provide detailed, technical information about the Intel Desktop

Board D945GSEJT and its components to the vendors, system integrators, and other

engineers and technicians who need this level of information. It is specifically not

intended for general audiences.

What This Document Contains

Chapter Description

1 A description of the hardware used on the board

2 A map of the resources of the board

3 The features supported by the BIOS Setup program

4 A description of the BIOS error messages, beep codes, and POST codes

5 Regulatory compliance and battery disposal information

Typographical Conventions

This section contains information about the conventions used in this specification. Not

all of these symbols and abbreviations appear in all specifications of this type.

Notes, Cautions, and Warnings



NOTE

Notes call attention to important information.

#

INTEGRATOR’S NOTES

Integrator’s notes are used to call attention to information that may be useful to

system integrators.

CAUTION

Cautions are included to help you avoid damaging hardware or losing data.

Intel Desktop Board D945GSEJT Technical Product Specification

iv

Other Common Notation

# Used after a signal name to identify an active-low signal (such as USBP0#)

GB Gigabyte (1,073,741,824 bytes)

GB/sec Gigabytes per second

Gbit Gigabit (1,073,741,824 bits)

KB Kilobyte (1024 bytes)

Kbit Kilobit (1024 bits)

kbits/sec 1000 bits per second

MB Megabyte (1,048,576 bytes)

MB/sec Megabytes per second

Mbit Megabit (1,048,576 bits)

Mbit/sec Megabits per second

xxh An address or data value ending with a lowercase h indicates a hexadecimal value.

x.x V Volts. Voltages are DC unless otherwise specified.

* This symbol is used to indicate third-party brands and names that are the property of their

respective owners.

v

Contents

1 Product Description

1.1 Overview.......................................................................................... 9

1.1.1 Feature Summary .................................................................. 9

1.1.2 Board Layout ....................................................................... 11

1.1.3 Block Diagram ..................................................................... 13

1.2 Online Support................................................................................ 14

1.3 Processor ....................................................................................... 14

1.4 System Memory .............................................................................. 15

1.5 Mobile Intel

®

945GSE Chipset ........................................................... 16

1.5.1 Intel 945GSE Graphics Subsystem .......................................... 16

1.5.2 USB ................................................................................... 18

1.5.3 ATA Support ........................................................................ 18

1.6 Real-Time Clock Subsystem .............................................................. 20

1.7 Legacy I/O Controller....................................................................... 20

1.7.1 Serial Ports.......................................................................... 20

1.7.2 Parallel Port......................................................................... 21

1.7.3 PS/2 Keyboard Interface ....................................................... 21

1.8 Audio Subsystem............................................................................. 21

1.8.1 Audio Subsystem Drivers....................................................... 22

1.8.2 Audio Connectors and Headers ............................................... 22

1.9 LAN Subsystem............................................................................... 23

1.9.1 LAN Subsystem Drivers......................................................... 23

1.9.2 RJ-45 LAN Connector with Integrated LEDs .............................. 24

1.10 Hardware Management Subsystem .................................................... 24

1.10.1 Hardware Monitoring............................................................. 24

1.10.2 Thermal Monitoring .............................................................. 25

1.11 Power Management ......................................................................... 26

1.11.1 ACPI................................................................................... 26

1.11.2 Hardware Support ................................................................ 29

1.11.3 ENERGY STAR*, E-Standby, and EuP Compliance...................... 32

2 Technical Reference

2.1 Memory Map................................................................................... 33

2.1.1 Addressable Memory............................................................. 33

2.2 Connectors and Headers................................................................... 36

2.2.1 Back Panel .......................................................................... 37

2.2.2 Component-side Connectors and Headers ................................ 39

2.3 BIOS Configuration Jumper Block....................................................... 49

2.4 Mechanical Considerations ................................................................ 51

2.4.1 Form Factor......................................................................... 51

Intel Desktop Board D945GSEJT Technical Product Specification

vi

2.5 Electrical Considerations................................................................... 52

2.5.1 Power Supply Considerations ................................................. 52

2.5.2 Fan Header Current Capability................................................ 52

2.5.3 Add-in Board Considerations .................................................. 52

2.6 Thermal Considerations.................................................................... 53

2.7 Power Consumption ......................................................................... 55

2.7.1 Minimum Load Configuration.................................................. 55

2.7.2 Maximum Load Configuration ................................................. 55

2.8 Reliability ....................................................................................... 56

2.9 Environmental ................................................................................ 57

3 Overview of BIOS Features

3.1 Introduction ................................................................................... 59

3.2 BIOS Flash Memory Organization....................................................... 60

3.3 Resource Configuration .................................................................... 60

3.3.1 PCI* Autoconfiguration.......................................................... 60

3.4 System Management BIOS (SMBIOS)................................................. 61

3.5 Legacy USB Support ........................................................................ 62

3.6 BIOS Updates ................................................................................. 63

3.6.1 BIOS Recovery..................................................................... 63

3.6.2 Custom Splash Screen .......................................................... 64

3.7 Boot Options................................................................................... 64

3.7.1 CD-ROM Boot ...................................................................... 64

3.7.2 Network Boot....................................................................... 64

3.7.3 Booting Without Attached Devices........................................... 65

3.7.4 Changing the Default Boot Device During POST ........................ 65

3.8 BIOS Security Features .................................................................... 66

4 Board Status and Error Messages

4.1 Front-panel Power LED Blink and Internal Speaker Beep Codes .............. 67

4.2 BIOS Error Messages ....................................................................... 67

4.3 Port 80h POST Codes ....................................................................... 68

5 Regulatory Compliance and Battery Disposal Information

5.1 Regulatory Compliance..................................................................... 73

5.1.1 Safety Standards.................................................................. 73

5.1.2 European Union Declaration of Conformity Statement................ 74

5.1.3 Product Ecology Statements................................................... 75

5.1.4 EMC Regulations .................................................................. 79

5.1.5 Product Certification Markings (Board Level)............................. 80

5.2 Battery Disposal Information............................................................. 81

Contents

vii

Figures

1-1. Major Board Components ............................................................... 11

1-2. Block Diagram .............................................................................. 13

1-3. LAN Connector LED Locations.......................................................... 24

1-4. Thermal Sensors and Fan Headers ................................................... 25

1-5. Location of the Standby Power Indicator LED..................................... 31

2-1. Detailed System Memory Address Map ............................................. 34

2-2. Back Panel Connectors ................................................................... 37

2-3. Back Panel Connectors ................................................................... 38

2-4. Component-side Connectors and Headers ......................................... 39

2-5. Connection Diagram for Front Panel Header ...................................... 46

2-6. Connection Diagram for Front Panel USB Header................................ 48

2-7. Connection Diagram for Front Panel USB Header (with Intel Z-U130

USB Solid-State Drive, or Compatible Device, Support)....................... 48

2-8. Location of the BIOS Configuration Jumper Block ............................... 49

2-9. Board Dimensions ......................................................................... 51

2-10. Localized High Temperature Zones................................................... 54

Tables

1. Feature Summary.............................................................................. 9

2. Board Components Shown in Figure 1-1 ............................................. 12

3. Supported Memory Configurations ..................................................... 15

4. Audio Jack Retasking Support ........................................................... 21

5. LAN Connector LED States ................................................................ 24

6. Effects of Pressing the Power Switch .................................................. 26

7. Power States and Targeted System Power........................................... 27

8. Wake-up Devices and Events ............................................................ 28

9. ENERGY STAR Requirements............................................................. 32

10. System Memory Map ....................................................................... 35

11. Component-side Connectors and Headers Shown in Figure 2-4............... 40

12. Serial Port Header (COM 1 and COM 2)............................................... 41

13. PS/2 Keyboard Port Header............................................................... 41

14. PATA Connector (44-Pin) .................................................................. 41

15. Chassis Fan Header ......................................................................... 42

16. Chassis Intrusion Header.................................................................. 42

17. SATA Connectors............................................................................. 42

18. SATA Power Connector..................................................................... 42

19. Parallel Port Header ......................................................................... 43

20. Front Panel Wireless Activity LED Header ............................................ 43

21. S/PDIF Header ................................................................................ 43

22. Internal Mono Speaker Header .......................................................... 44

23. Front Panel Audio Header for Intel HD Audio........................................ 44

24. Front Panel Audio Header for AC ’97 Audio .......................................... 44

25. ATX12V Power Connector ................................................................. 45

26. Front Panel Header .......................................................................... 46

Intel Desktop Board D945GSEJT Technical Product Specification

viii

27. States for a One-Color Power LED...................................................... 47

28. BIOS Configuration Jumper Settings................................................... 50

29. Fan Header Current Capability........................................................... 52

30. Thermal Considerations for Components ............................................. 55

31. Minimum Load Configuration Current and Power Results ....................... 55

32. Maximum Load Configuration Current and Power Results....................... 56

33. Intel Desktop Board D945GSEJT Environmental Specifications ............... 57

34. BIOS Setup Program Menu Bar.......................................................... 60

35. BIOS Setup Program Function Keys.................................................... 60

36. Acceptable Drives/Media Types for BIOS Recovery ............................... 63

37. Boot Device Menu Options ................................................................ 65

38. Supervisor and User Password Functions............................................. 66

39. Front-panel Power LED Blink and Internal Speaker Beep Codes .............. 67

40. BIOS Error Messages ....................................................................... 67

41. Port 80h POST Code Ranges.............................................................. 68

42. Port 80h POST Codes ....................................................................... 69

43. Typical Port 80h POST Sequence........................................................ 72

44. Safety Standards............................................................................. 73

45. Lead-Free Board Markings ................................................................ 78

46. EMC Regulations ............................................................................. 79

47. Product Certification Markings ........................................................... 80

9

1 Product Description

1.1 Overview

1.1.1 Feature Summary

Table 1 summarizes the major features of Intel Desktop Board D945GSEJT.

Table 1. Feature Summary

Form Factor 20 mm-thin mini-ITX, (6.7 inches by 6.7 inches [170 millimeters by

170 millimeters]) compatible with microATX

Processor Passively-cooled, soldered-down Single-Core Intel

®

Atom™ processor N270

Memory

• One 200-pin Double Data Rate 2 (DDR2) Small Outline Dual Inline Memory

Module (SO-DIMM) socket with gold-plated contacts

• Support for DDR2 533 MHz SO-DIMMs (DDR2 800 MHz and DDR2 667 MHz

validated to run at 533 MHz only)

• Support for up to 2 GB of system memory

Chipset

Passively cooled, mobile Intel

®

945GSE Express Chipset, consisting of:

• Intel

®

82945GSE Graphics and Memory Controller Hub (GMCH)

• Intel

®

82801GBM I/O Controller Hub (ICH7-M)

Audio Multi-streaming 2+2 channel audio subsystem with S/PDIF and internal mono

speaker support based on the Realtek* ALC662 high definition audio codec

Internal Graphics Intel

®

GMA950 onboard graphics subsystem with support for:

• Analog displays (VGA)

• Digital displays (DVI-D)

Legacy I/O Control Winbond W83627DHG-A based Legacy I/O controller for hardware management,

serial, parallel, and PS/2* ports

Peripheral

Interfaces

• Seven USB 2.0 ports:

― Three back panel ports

― Four front panel ports (via two internal headers; one header supports an

Intel

®

Z-U130 USB Solid-State Drive (or compatible device)

• Two Serial ATA (SATA) 3.0 Gb/s connectors (supporting IDE and AHCI)

• One SATA device power connector

• One Parallel ATA (PATA) 44-pin connector with ATA-100/66 support

• One parallel port header

• Two serial port headers

• One PS/2* keyboard header

LAN Support 10/100/1000 Mbits/sec LAN subsystem using a Realtek 8111DL Gigabit Ethernet

Controller

continued

Intel Desktop Board D945GSEJT Technical Product Specification

10

Table 1. Feature Summary (continued)

BIOS

• Intel

®

BIOS (resident in the SPI Flash device)

• Support for Advanced Configuration and Power Interface (ACPI), Plug and Play,

and SMBIOS

Instantly Available

PC Technology

• Support for PCI* Local Bus Specification Revision 2.3

• Suspend to RAM support

• Wake on PCI, PCI Express*, PS/2, serial, front panel, USB ports, and LAN

Expansion

Capabilities

• One PCI Conventional bus connector

• PCI Express Full-Mini Card slot

Hardware Monitor

Subsystem

• Hardware monitoring through the Windbond I/O controller

• Voltage sense to detect out of range power supply voltages

• Thermal sense to detect out of range thermal values

• One fan header

• One fan sense input used to monitor fan activity

• Fan speed control

Power

• Integrated DC-to-DC circuitry

• 12 VDC jack on back panel for external power supply

• ATX12V 2 x 2 power connector for alternate internal power supply

Product Description

11

1.1.2 Board Layout

Figure 1-1 shows the location of the major components.

Figure 1-1. Major Board Components

Table 2 lists the components identified in Figure 1-1.

Intel Desktop Board D945GSEJT Technical Product Specification

12

Table 2. Board Components Shown in Figure 1-1

Item/callout

from Figure 1-1

Descri

ption

A

Back panel connectors

B

+12 V internal power connector (ATX12V)

C

SO-DIMM socket

D

Intel 82945GSE GMCH

E

Intel Atom processor

F

Serial port header (COM 2)

G

Serial port header (COM 1)

H

PS/2 keyboard port header

I

Reserved

J

PATA connector (44-pin)

K

Reserved

L

Chassis fan header

M

Chassis intrusion header

N

SATA connector 0

O

Intel 82801GBM I/O Controller Hub (ICH7-M)

P

SATA power connector

Q

SATA connector 1

R

Parallel port header

S

Battery

T

Reserved

U

Reserved

V

Front panel header

W

Front panel wireless activity LED header

X

PCI Express Mini Card connector

Y

BIOS Setup configuration jumper block

Z

PCI Conventional bus add-in card connector

AA

S/PDIF header

BB

Front panel USB header

CC

Internal mono speaker header

DD

Front panel audio header

EE

Front panel USB header (with Intel Z-U130 USB Solid-State

Drive, or compatible device, support)

Product Description

13

1.1.3 Block Diagram

Figure 1-2 is a block diagram of the major functional areas.

Figure 1-2. Block Diagram

Intel Desktop Board D945GSEJT Technical Product Specification

14

1.2 Online Support

To find information about… Visit this World Wide Web site:

Intel Desktop Board D945GSEJT http://www.intel.com/products/motherboard/D945GSEJT/index.htm

Desktop Board Support http://support.intel.com/support/motherboards/desktop

Available configurations for the Intel

Desktop Board D945GSEJT

http://www.intel.com/products/motherboard/D945GSEJT/index.htm

Chipset information http://www.intel.com/design/chipsets/embedded/945gse/

BIOS and driver updates http://downloadcenter.intel.com

Integration information http://www.intel.com/support/go/buildit

1.3 Processor

The board is designed to support a single-core Intel Atom processor N270 soldered

down.



NOTE

The board is designed to be passively cooled in a properly ventilated chassis. Chassis

venting locations are recommended above the processor heatsink area for maximum

heat dissipation effectiveness.

#

INTEGRATOR’S NOTE

The board may be powered by using an external 12 VDC or internal ATX12V-compliant

power supply. Use of an external 12 VDC power supply is preferred.

For information about Refer to

Power supply connectors Section 2.2.2.3, page 45

Product Description

15

1.4 System Memory

The board has one 200-pin DDR2 SO-DIMM socket and supports the following memory

features:

• DDR2 SDRAM SO-DIMMs with gold-plated contacts

• Unbuffered, single-sided or double-sided SO-DIMMs

• 2 GB maximum total system memory

• Minimum total system memory: 256 MB

• Non-ECC SO-DIMMs

• Serial Presence Detect

• DDR2 533 MHz SDRAM SO-DIMMs (DDR2 800 MHz and DDR2 667 MHz validated to

run at 533 MHz only)



NOTE

Due to passively-cooled thermal constraints, system memory must have an operating

temperature rating of 85

o

C.

The board is designed to be passively cooled in a properly ventilated chassis. Chassis

venting locations are recommended above the system memory area for maximum

heat dissipation effectiveness.

 NOTE

To be fully compliant with all applicable DDR2 SDRAM memory specifications, the

board should be populated with SO-DIMMs that support the Serial Presence Detect

(SPD) data structure. This allows the BIOS to read the SPD data and program the

chipset to accurately configure memory settings for optimum performance. If non-

SPD memory is installed, performance and reliability may be impacted or the

SO-DIMMs may not function under the determined frequency.

Table 3 lists the supported SO-DIMM configurations.

Table 3. Supported Memory Configurations

SO-DIMM

Capacity

Configuration

SDRAM

Density

SDRAM Organization

Front-side/Back-side

Number of SDRAM

Devices

256 MB SS 256 Mbit 32 M x 8/empty 8

256 MB SS 512 Mbit 32 M x 16/empty 4

512 MB DS 256 Mbit 32 M x 8/32 M x 8 16

512 MB SS 512 Mbit 64 M x 8/empty 8

512 MB SS 1 Gbit 64 M x 16/empty 4

1024 MB DS 512 Mbit 64 M x 8/64 M x 8 16

1024 MB SS 1 Gbit 128 M x 8/empty 8

2048 MB DS 1 Gbit 128 M x 8/128 M x 8 16

Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of SDRAM)

and “SS” refers to single-sided memory modules (containing one row of SDRAM).

Intel Desktop Board D945GSEJT Technical Product Specification

16

1.5 Mobile Intel

®

945GSE Chipset

The Mobile Intel 945GSE chipset consists of the following devices:

• Intel 82945GSE Graphics and Memory Controller Hub (GMCH) with Direct Media

Interface (DMI) interconnect

• Intel 82801GBM I/O Controller Hub (ICH7-M) with DMI interconnect

The GMCH component provides interfaces to the CPU, memory, and the DMI

interconnect. The component also provides integrated graphics capabilities supporting

3D, 2D, and display capabilities. The ICH7-M is a centralized controller for the board’s

I/O paths.



NOTE

The board is designed to be passively cooled in a properly ventilated chassis. Chassis

venting locations are recommended above the GMCH heatsink area for maximum heat

dissipation effectiveness.

For information about Refer to

The Intel 945GSE chipset http://www.intel.com/design/chipsets/embedded/945gse/

Resources used by the chipset Chapter 2

1.5.1 Intel 945GSE Graphics Subsystem

1.5.1.1 Intel

®

GMA950 Graphics Controller

The Intel GMA950 graphics controller features the following:

• 166 MHz core frequency

• High performance 3-D setup and render engine

• High quality texture engine

⎯ DX9* Compliant Hardware Pixel Shader 2.0

⎯ Alpha and luminance maps

⎯ Texture color-keying/chroma-keying

⎯ Cubic environment reflection mapping

⎯ Enhanced texture blending functions

• 3D Graphics Rendering enhancements

⎯ 1.3 Dual Texture GigaPixel/Sec Fill Rate

⎯ 16 and 32 bit color

⎯ Maximum 3D supported resolution of 1600 x 1200 x 32 at 85 Hz

⎯ Vertex cache

⎯ Anti-aliased lines

⎯ OpenGL* version 1.4 support with vertex buffer and EXT_Shadow extensions

Product Description

17

• 2D Graphics enhancements

⎯ 8, 16, and 32 bit color

⎯ Optimized 256-bit BLT engine

⎯ Color space conversion

⎯ Anti-aliased lines

• Video

⎯ Hardware motion compensation for MPEG2

⎯ Software DVD at 30 fps full screen

• Intel

®

Zoom Utility

For information about Refer to

Obtaining graphics software and utilities Section 1.2, page 14

1.5.1.2 Video Memory Allocation

Video memory is allocated from the total available system memory for the efficient

balancing of 2-D/3-D graphics performance and overall system performance. Dynamic

allocation of system memory to video memory is as follows:

• 256 MB total RAM results in 32 MB video RAM

• 512 MB total RAM results in 64 MB video RAM

• 1 GB total RAM results in 128 MB video RAM

• 2 GB total RAM results in 224 MB video RAM

1.5.1.3 Analog Display (VGA)

The VGA port supports analog displays. The maximum supported resolution is 2048 x

1536 (QXGA) at a 75 Hz refresh rate.

1.5.1.4 Digital Visual Interface (DVI)

The DVI-D port supports digital DVI displays. The maximum supported resolution is

1600 x 1200 (UXGA). The DVI port is compliant with the DVI 1.0 specification.

Intel Desktop Board D945GSEJT Technical Product Specification

18

1.5.2 USB

The board supports up to seven USB 2.0 ports, supports UHCI and EHCI, and uses

UHCI- and EHCI-compatible drivers.

ICH7-M provides the USB controllers for all USB ports. The port arrangement is as

follows:

• Three ports are implemented through a single vertical and a dual-port horizontal

connector on the back panel

• Four ports are routed to two separate front panel USB headers



NOTE

One of the front panel USB headers supports an Intel Z-U130 USB Solid-State Drive

(or compatible device).

Computer systems that have an unshielded cable attached to a USB port may not

meet FCC Class B requirements, even if no device is attached to the cable. Use

shielded cable that meets the requirements for full-speed devices.

For information about Refer to

The location of the USB connectors on the back panel Figure 2-2, page 37

The location of the front panel USB headers Figure 2-4, page 39

1.5.3 ATA Support

The board provides three ATA interface connectors:

• One PATA connector that supports two devices

• Two SATA connectors that support one device per connector

1.5.3.1 PATA Interface

The ICH7-M’s PATA controller has one bus-mastering PATA interface that is accessible

through a 44-pin connector that is compatible with 2.5 or 3.5 inch PATA hard drives

(including 2.5 inch hard drive power support). The PATA interface supports the

following modes:

• Programmed I/O (PIO): processor controls data transfer.

• 8237-style DMA: DMA offloads the processor, supporting transfer rates of up to

16 MB/sec.

• Ultra DMA: DMA protocol on ATA bus supporting host and target throttling and

transfer rates of up to 33 MB/sec.

• ATA-66: DMA protocol on ATA bus supporting host and target throttling and

transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is

device driver compatible.

• ATA-100: DMA protocol on ATA bus allows host and target throttling. The

ICH7-M’s ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write

transfer rates up to 88 MB/sec.

Product Description

19

 NOTE

ATA-66 and ATA-100 are faster timings and require a specialized cable to reduce

reflections, noise, and inductive coupling.

The PATA interface also supports ATAPI devices (such as CD-ROM drives) and ATA

devices using the transfer modes.

The BIOS supports Logical Block Addressing (LBA) and Extended Cylinder Head Sector

(ECHS) translation modes. The drive reports the transfer rate and translation mode to

the BIOS.

For information about Refer to

The location of the PATA connector Figure 2-4, page 39

1.5.3.2 SATA Interfaces

The ICH7-M’s SATA controller offers two independent SATA ports with a theoretical

maximum transfer rate of 3.0 Gbits/sec on each port. One device can be installed on

each port for a maximum of two SATA devices. A point-to-point interface is used for

host to device connections, unlike PATA which supports a master/slave configuration

and two devices on each channel.

For compatibility, the underlying SATA functionality is transparent to the operating

system. The SATA controller supports IDE and AHCI configuration and can operate in

both legacy and native modes. In legacy mode, standard ATA I/O and IRQ resources

are assigned (IRQ 14 and 15). In Native mode, standard PCI Conventional bus

resource steering is used. Native mode is the preferred mode for configurations using

the Windows* XP and Windows Vista* operating systems.

The board ships with a 1 x 4 power connector and a power cable for powering internal

SATA storage devices. SATA power delivery is rated as follows for any combination of

hard drives and/or optical drives:

• 5 V rail: up to 3 A

• 12 V rail: up to 1.5 A

For information about Refer to

Obtaining AHCI driver Section 1.2, page 14

The location of the SATA connectors Figure 2-4, page 39

Intel Desktop Board D945GSEJT Technical Product Specification

20

1.6 Real-Time Clock Subsystem

A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When

the computer is not plugged into a wall socket, the battery has an estimated life of

three years. When the computer is plugged in, the standby current from the power

supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at

25 ºC with 3.3 VSB applied.

 NOTE

If the battery and AC power fail, custom defaults, if previously saved, will be loaded

into CMOS RAM at power-on.

When the voltage drops below a certain level, the BIOS Setup program settings stored

in CMOS RAM (for example, the date and time) might not be accurate. Replace the

battery with an equivalent one. Figure 1-1 on page 11 shows the location of the

battery.

1.7 Legacy I/O Controller

The Legacy I/O Controller provides the following features:

• Two serial ports

• One parallel port with Extended Capabilities Port (ECP) and Enhanced Parallel Port

(EPP) support

• Serial IRQ interface compatible with serialized IRQ support for PCI Conventional

bus systems

• PS/2-style keyboard interface

• Intelligent power management, including a programmable wake-up event interface

• PCI Conventional bus power management support

The BIOS Setup program provides configuration options for the Legacy I/O controller.

1.7.1 Serial Ports

The serial ports, COM 1 and COM 2, are implemented as two 10-pin headers on the

board. The serial ports support data transfers at speeds up to 115.2 kbits/sec with

BIOS support.

For information about Refer to

The location of the serial port headers Figure 2-4, page 39

Page is loading ...

Intel BLKD945GSEJT?KIT Datasheet

Intel BLKD945GSEJT?KIT Datasheet

Related papers

Other documents