Minebea MPC-201-25 User manual

Molding Pressure Conversion Module

MPC-201-25

Instruction Manual

EN294-1697G

I

Introduction

Thank you for purchasing the MPC-201-25 Molding Pressure Conversion Module.

This instruction manual describes how to operate the device, as well as noteworthy points.

Note that handling or operating the device incorrectly may result in malfunctions. Read this manual

thoroughly before use for safety and optimal results.

Keep this instruction manual in a location where it is readily accessible to end users.

Pictograms and conventions used in this manual

This manual uses the following pictograms to indicate actions to avoid at all times, aspects requiring

caution, and other noteworthy matters.

Be sure to read the descriptions provided alongside these pictograms.

WARNING

This indicates circumstances in which incorrect handling may result in death or serious injury to

users. Avoid the actions described here at all times.

CAUTION

This indicates circumstances in which incorrect handling may result in injury to users or damage to

property.

This indicates operating or procedural precautions or restrictions.

Always read the details included here to avoid malfunctioning.

II

Safety Precautions

Please be sure to read this manual before attempting to use the equipment.

1. Installation location

CAUTION

Install in a location where temperature and humidity conditions are within the ranges described below.

 Amplifier

Environmental temperature: －10° C ～ 50° C

Environmental humidity: 85 % RH or less (Non-condensing)

 Relay box

Environmental temperature: －10 °C ～ 70 °C

Environmental humidity: 85 % RH or less (Non-condensing)

WARNING

To minimize the risk of unforeseen accidents, avoid installing equipment in the following locations.

(1)

Do not install in the following locations:

 Hot locations or locations exposed to direct sunlight

 Damp locations

 Dusty locations

 Environments containing corrosive gases or salt

 Locations subject to sudden temperature or humidity fluctuations

 Close to equipment that generates magnetic or electromagnetic radiation

 Locations subject to the effects of radiation and radioactive materials

 Locations such as laboratories where chemical changes may occur

III

(2) When installing the amplifier

The individual component dimensions are as shown below:

The amplifier is held in place by sticking the magnetic sheet on the bottom of the device to the surface on

which it is to be installed.

The following conditions must be complied with when installing the amplifier.

 The surface on which it is installed must be flat and must be a strongly magnetic material (e.g., iron or

ferritic stainless steel) at least 5 mm thick.

 The magnetic sheet must be fully in contact with the surface.

CAUTION

Take care, as there is a risk of injury if your fingers become trapped between the magnetic sheet and

the equipment or rig on which the device is mounted.

CAUTION

Keep credit cards and cash cards away from the magnetic sheet, as the magnetism may render them

unusable.

Likewise, the magnetic sheet may also cause malfunctions if precision equipment such as PCs and

mobile phones are close by.

Unit: mm

IV

(3) When installing the relay box

The individual component dimensions are as shown below:

The relay box is held in place by sticking the magnetic sheet on the bottom of the device to the surface on

which it is to be installed.

It should be installed complying with the same conditions as for the amplifier unit.

If the magnetic sheet provides insufficient attraction, secure it using screws with the mounting plates

provided attached as shown below. (Four M3 tapped holes must be drilled in the mounting surface.)

CAUTION

If using the magnetic sheet to mount the relay box, do not attach the mounting plates as well, as these

will prevent proper contact between the magnetic sheet and the mounting surface and full magnetic

attraction will not be achieved.

CAUTION

When mounting using the magnetic sheet, check that there is sufficient magnetic attraction. If the

magnetic attraction is insufficient due to the mounting surface conditions, or if the relay box is to be

used for extended periods, mount using the screws and mounting plates.

CAUTION

Keep credit cards and cash cards away from the magnetic sheet, as the magnetism may render them

unusable. Likewise, the magnetic sheet may also cause malfunctions if precision equipment such as

PCs and mobile phones are close by.

Unit: mm

Magnetic sheet

Mounting plates (provided)

Countersunk screws × 4 (provided)

Mounting plates

V

2. Power supply

WARNING

Turn off power before connecting or disconnecting cables.

Leaving power on may result in electric shock or equipment damage.

WARNING

Before turning on power, confirm that the power supply specifications match the power supply

specifications for the equipment.

Contact with us if the specifications do not match. Using an unconfirmed power supply may result in

electric shock or equipment damage.

CAUTION

Always ground the equipment.

Failure to ground the equipment may result in electric shock or malfunctions.

3. Precautions

CAUTION

Always set the sensor or pressure transmitting pin using the software before first use or after

replacing them. Failure to set the equipment may result in incorrect measurements, equipment

malfunctions, and damage to peripheral equipment. Likewise, reset the equipment if it has been set

once but gives incorrect results.

CAUTION

Confirm that the wiring is correctly connected before attempting to use the equipment. Incorrect

wiring of the equipment may lead to incorrect measurements, equipment malfunctions, damage to

peripheral equipment, and serious accidents.

CAUTION

Altering the settings while carrying out measurements using the equipment will result in incorrect

measurements, equipment malfunctions, and damage to peripheral equipment.

CAUTION

Protect the equipment from impact or shock—for example, impact or shock caused by striking against

other objects.

Impact or shock may damage the equipment and lead to failures in the electrical circuits.

CAUTION

Do not remove the equipment case cover or attempt to disassemble the equipment.

Doing so may damage the case and affect durability and operations.

This system saves measurement data to a PC memory storage device (e.g., hard disk drive).

Periodically sort out stored data to prevent freezing or degradation of PC performance.

To prevent communication errors, always shut down the measurement software before turning off the

equipment power or disconnecting the USB cable connecting the equipment and PC.

VI

Do not open numerical data or alarm history csv files while acquiring data with the PC.

Opening such files while acquiring data with the PC will result in an error, and will turn the PC interface

off-line without updating the numerical data or alarm history.

Set the start trigger signal interrupt interval to at least 1 s.

Leave an interval of at least 1 s before starting measurement after changing the conditions or aborting

measurement using the [Stop] button.

Always make sure that the latest version of the measurement software is installed and used. Older

versions of the software will not operate with the latest version of the amplifier updated with additional

features.

The latest software version supports all previous amplifiers.

When upgrading the measurement software, always uninstall the old software version first before

installing the new version.

For details on how to attach the sensor to the mold, see Section 25 "Appendix".

VII

4. Compatible standards

This equipment conforms to the following standards:

EN61326-1: 2013

"Electrical equipment for measurement, control, and laboratory use - EMC requirements"

"Immunity requirements for equipment intended to be used in industrial locations"

EN50581: 2012

"Technical documentation for the assessment of electrical and electronic products with

respect to the restriction of hazardous substances" (RoHS Directive)

CAUTION

The following usage conditions must be strictly adhered to ensure that this equipment complies with

the above standards. The equipment may not be compliant if these conditions are not followed.

 Power supply

A "CE mark compliant" 24 V DC power supply must always be used.

 Cables

Always use shielded cables, except for power cables.

The USB cable must be fitted with a ferrite core as described in Section 5-2-4 "USB Connection".

 Shielding

The shield wire of the I/O cable must be connected to the protective ground terminal.

The shield wire of the V-OUT cable must be connected to the F.G. terminal.

The opposing shield wires of the I/O cable and V-OUT cable must be grounded (grounded at both

ends).

 Grounding

Ground the equipment based on single grounding using a protective ground terminal.

For details of the protective ground terminal and F.G. terminal, see Section 4 "Equipment Part Names

and Functions".

VIII

Revision History

Date Manual No. Revision reason (details)

December

2014 DRW. No. 294-1697 1st issue

July 2015 DRW. No. 294-1697A

In accordance with ECN No. FN15-02028.

Section 5-2-2: Added precautions.

Changed sensor cable label diagram in Section 9-1-2.

Changed ejector pin diameter and pressure conversion table

and description.

Section 19-1: Corrected numbering of reference items in table.

Section 21-2: Corrected measurement range from 0 MPa ~ 200

MPa to 0 MPa ~ 999.99 MPa.

Corrected other errors.

In accordance with ECN No. FN15-02064.

APP Ver.1.100 and ROM Ver.1.014 or later

Changed screen images following application version upgrade.

Beginning, Section 3: Added precautions.

Section 5, Section 5-4: Added precautions.

Section 6: Removed all "*" symbols in flowchart (7).

Section 8-1: Corrected item numbers.

Section 8-1 (2): Removed "Data processing" and "Statistics".

Deleted "* To use statistics, first stop loading data."

Section 8-1 (7): Changed description.

Section 8-6: Changed description.

Added Section 8-6-2 "Adjust Scale Automatically".

Section 9-1-1: Changed overlay description.

Section 9-1-2: Corrected errors, and added peak over eject

force calculation method.

Section 9-1-4: Added start trigger interrupt setting description

and precautions.

Added Section 9-2-6 "Alarm Signal Output Settings".

Section 9-5: Added precautions.

Added Section 10-3-2 "Adjust Scale Automatically".

Section 10-3-3: Added precautions.

Section 12 (1): Added description, alarm record settings, and

precautions.

Added Section 17 "Check ERROR LED Details".

Section 18-2: Added "Alarm record settings" item and

precautions.

Section 19: Added "Software Condition Setting Precautions".

Section 21: Expanded troubleshooting details.

IX

Date Manual No. Revision reason (details)

July 2015 DRW. No. 294-1697A

Section 21-5: Changed "ERROR LED Illuminated" description.

Added Section 21-6 "PC Personalization".

Section 22-1: Added "Graph scale auto adjustment" item.

Section 22-3: Standardized terminology and changed

description.

Added "Start trigger interrupt setting".

Section 22-4: Added "Alarm record" and "Alarm output timing

settings".

Section 22-11: Changed graph scale setting description.

Added Section 22-15 "ERROR LED Information Check

Function"

March 2016 DRW. No. EN294-1697B

In accordance with ECN No. FN16-02015-B.

APP Ver.1.300 and ROM Ver.1.100 or later

Changed screen images following application version upgrade.

General correction of errors and standardization of terminology

Cover: Replaced product illustration with photograph.

Section 5-3: Added note about software version.

Section 8-1 (6): Added. (subsequent section numbering altered)

Section 8-2: Added note about condition changes.

Section 9: Added note about setup file.

Section 9-1-5: Added note about eject detection range.

Section 9-2-1: Changed sensor label illustration and added

100K to sensor capacity.

Section 10-3-3: Added note about spreadsheet software.

Section 12 (1): Added explanations for waveform data and

numerical data.

Section 22-4: Added explanation for data saving function.

Section 23-1: Added LSMS-100K-S06 to analog specifications.

Jan. 2017 DRW. No. EN294-1697C In accordance with ECN No. FN16-02169

Section 2: Added Windows 10 to the operating system.

Aug. 2017 DRW. No. EN294-1697D

In accordance with ECN FN17-02017

・Delete the company name in the contents.

Dec. 2017 DRW. No. 294-1697E

In accordance with ECN No. FN17-02163B

APP Ver.1.500 and ROM Ver.1.200 or later

Changed screen images and product illustrations following

application version upgrade and acquisition of CE marking.

Cover: Replaced product photograph.

Beginning, Section 1: Replaced dimensions diagram.

Beginning, Sections 3, 5-2-5, 8-5: Added cross-reference to

precautions.

Beginning, Section 4: Compatible standards: Added standards

and precautions.

X

Date Manual No. Revision reason (details)

Dec. 2017 DRW. No. 294-1697E

Section 3: Added cross-reference to precautions.

Section 4-1: Changed cable shield connection details, and

added CE mark compliance conditions to precautions.

Section 5-1-2: Added recommended cable clamping location to

diagram.

Section 5-2-1: Added ground terminal details to precautions.

Section 5-2-2: Modified F.G. terminal description and

precautions.

Section 5-2-3: Modified precautions.

Section 5-2-4: Added underlining to description and added CE

mark compliance conditions to precautions.

Section 8-1 (8): Added compatible ROM versions to

precautions.

Section 8-10 (1): Modified/added drive free space threshold,

modified "less than 30%" to "not exceeding 30%", and added

cross-reference to precautions.

Section 9-1-2.2): Added condition copy button, changed rated

capacity input description , added four high-capacity sensor

types, modified/added calculation table, added compatible

ROM versions to precautions, and added cross-reference to

precautions.

Sections 9-1-4, 9-2-6: Added compatible ROM versions to

description and precautions.

Section 9-5: Added precautions.

Section 12 (4): Added drive free space threshold setting.

Section 17: Added compatible ROM versions to precautions.

Sections 18-2, 22-4: Added OL and OVF tables.

Section 21-1: Added compatible ROM versions, added "USB

communication is unstable", and added "Cannot read the

configuration file".

Section 21-2: Modified description relating to drive free space.

Sections 21-3, 22-3, 22-6, 22-15: Added compatible ROM

versions to description.

Section 21-5: Added compatible ROM versions to description

and precautions, and modified description.

Section 23-1: Added four high-capacity types and compatible

ROM versions to applicable transducer description.

Section 25: Added appendix.

Dec. 2017 DRW. No. 294-1697F

In accordance with ECN No. FN17-02191

Beginning, Section 1 (3): Changed outline dimensions..

Section 9-1-2: Changed measurable pressure calculation

method.

Section 9-1-2: Changed calculation table.

Corrected other errors.

XI

Date Manual No. Revision reason (details)

Aug. 2018 DRW. No. 294-1697G

In accordance with ECN FN18-02048C

APP Ver.1.520 and ROM Ver.1.220 or later.

General: Replaced software screen images, corrected errors,

and modified phrasing.

Section 2: Changed resolution in Software System Operating

Requirements to "At least 1,280 × 768 resolution".

Section 8: Added explanatory note about LED display.

Section 8-1 (5): Added description.

Section 8-3: Added "current pressure" to description.

Section 8-5: Added new "Error Display" section.

Section 8-7 (2): Removed description about template display.

Section 8-7-3: Removed "Viewing Templates" section.

Section 8-9: Added description about template display

switching.

Section 9-1-3: Added description about long time

measurement, and modified sampling interval and span setting

range.

Section 9-1-5: Added setting range for long time measurement

related to eject pressure detection range.

Section 9-2-4 (1): Removed "Settings" section.

Section 9-2-4 (1): Changed title to "Alarm monitoring using

zone".

Section 9-2-4 (2): Added "Monitoring zone setting method" with

description and image.

Section 9-2-4 (3): Added title "Alarm monitoring using integral

pressure".

Section 9-3-1 (3): Added details about limit to maximum number

of overlay shots in long time measurement.

Section 9-3-3: Added description about thickness setting and

[Line Style] description to template display.

Section 12 (1): Added description about wave data.

Section 12 (2): Added description about password.

Section 12 (5): Added "Measurement screen value display"

section with description.

Section 17: Added error confirmation method for error display.

Section 17: Added description about [Error description] button.

Section 18-2: Removed note.

Section 19-1: Added description about long time measurement.

Section 19-1: Changed table details.

Section 19-1: Changed title and modified general description.

Section 19-1: Removed text for setting example.

Section 21-2: Added details related to revisions to

troubleshooting.

Section 22: Removed all software function specifications.

Section 22-1: Added "Max. 600 s for long time measurement" in

sampling interval.

XII

XIII

Contents

Page

Introduction ....................................................................................... I

Pictograms and conventions used in this manual ................................... I

Safety Precautions ............................................................................ II

1. Installation location ............................................................................................................. II

2. Power supply ...................................................................................................................... V

3. Precautions ......................................................................................................................... V

4. Compatible standards ....................................................................................................... VII

Revision History ............................................................................. VIII

1. Overview ........................................................................................ 1

2. Software System Operating Requirements ......................................... 1

3. System Configuration ...................................................................... 2

4. Equipment Part Names and Functions ............................................... 3

4-1. Amplifier ......................................................................................................................... 3

4-2. Relay Box ....................................................................................................................... 4

5. System Setup ................................................................................. 5

5-1. Installation on Molding Machine ..................................................................................... 6

5-1-1. Relay Box Installation ................................................................... 6

5-1-2. Amplifier Installation .................................................................... 6

5-2. Terminal Board Connections .......................................................................................... 7

5-2-1. Power and Ground Connections ..................................................... 7

5-2-2. External Control Input/Output Connection ....................................... 8

5-2-3. Analog Voltage Output Connection ................................................. 9

5-2-4. USB Connection ........................................................................... 9

5-2-5. Sensor Connection ..................................................................... 10

5-3. Installing the Software ................................................................................................... 11

5-4. Installing the Driver Software ....................................................................................... 14

6. Starting to Use the Software .......................................................... 19

7. Launching the Software ................................................................. 20

7-1. To Launch the Software ................................................................................................ 20

8. Explanation of the Measurement Screen .......................................... 21

8-1. Menu Bar ...................................................................................................................... 22

8-2. Measurement Buttons .................................................................................................. 28

8-3. Measurement Data Display .......................................................................................... 28

8-4. Alarm Display ............................................................................................................... 28

8-5. Error Display ................................................................................................................. 29

8-6. No. of Shots Display ..................................................................................................... 29

8-7. Waveform Display ........................................................................................................ 30

XIV

8-7-1. Using Graph Zoom, In/Out, Move ................................................. 32

8-7-2. Adjust Scale Automatically .......................................................... 37

8-8. Measurement Conditions Display ................................................................................. 38

8-9. Display Channel Selection ........................................................................................... 38

8-10. Status Display 1 ........................................................................................................... 39

8-11. Status Display 2 ........................................................................................................... 39

9. Change Condition Screen .............................................................. 40

9-1. Measurement Conditions Tab ....................................................................................... 40

9-1-1. Measurement Mode .................................................................... 41

9-1-2. Sensor Channels ....................................................................... 42

9-1-3. Measurement ............................................................................ 45

9-1-4. Start Trigger .............................................................................. 46

9-1-5. Eject Detection Range ................................................................ 47

9-2. Alarm Conditions Tab ................................................................................................... 48

9-2-1. Alarm Detection Enabled Setting ................................................. 48

9-2-2. Graph ....................................................................................... 49

9-2-3. Alarm Condition Setting Channel ................................................. 49

9-2-4. Alarm Output Condition Settings .................................................. 50

9-2-5. Alarm Setting Examples .............................................................. 53

9-2-6. Alarm Signal Output Settings ...................................................... 55

9-2-7. Alarm Cancel Conditions Settings ................................................ 56

9-3. Graph Tab ..................................................................................................................... 57

9-3-1. Real Time Graph and Overlay Graph ............................................ 57

9-3-2. Trend Graph .............................................................................. 59

9-3-3. Template ................................................................................... 60

9-4. Analog Output Tag ........................................................................................................ 61

9-4-1. Analog Output Settings ............................................................... 61

9-5. Operating Buttons ........................................................................................................ 62

10. Data Processing Screen ............................................................. 63

10-1. Menu Bar ...................................................................................................................... 64

10-1-1. File .......................................................................................... 64

10-1-2. Print ......................................................................................... 64

10-1-3. Display ..................................................................................... 64

10-1-4. Window .................................................................................... 64

10-2. Operating Buttons ........................................................................................................ 65

10-3. Waveform Display Area ................................................................................................ 66

10-3-1. Using Graph Zoom, In/Out, Move ................................................. 66

10-3-2. Adjust Scale Automatically .......................................................... 66

10-3-3. Analyzing Waveform Data ........................................................... 67

XV

10-4. Information Display Area .............................................................................................. 74

10-4-1. Explanation of Display Area ........................................................ 75

11. Statistics Screen ........................................................................ 76

11-1. Display Selection .......................................................................................................... 76

11-2. Operating buttons ......................................................................................................... 76

12. Administrator Setup Screen ........................................................ 77

13. I/O Test Screen .......................................................................... 81

14. Analog Output Test Screen ......................................................... 82

15. Monitor Screen .......................................................................... 82

16. Analog Output Fine Adjustment Screen ........................................ 83

17. Check ERROR LED Details ......................................................... 86

18. File Output Destinations ............................................................. 87

18-1. Error Log File Output Destination ................................................................................. 87

18-2. Measurement Results Auto File Output Destination ..................................................... 87

18-3. Manual File Output Destination .................................................................................... 88

19. Software Condition Setting Precautions ....................................... 89

19-1. Maximum Number of Overlay Shots Setting ................................................................ 89

20. Software Uninstall Procedure ...................................................... 90

20-1. Uninstalling the Software .............................................................................................. 90

21. Troubleshooting ......................................................................... 92

21-1. General ......................................................................................................................... 92

21-2. Measurement Problems ............................................................................................... 93

21-3. External Control Input/Output Problems ....................................................................... 94

21-4. Analog Voltage Output Problems ................................................................................. 94

21-5. Amplifier Error Problems (ERROR LED Illuminated) .................................................... 95

21-6. PC Personalization ....................................................................................................... 96

22. Hardware Specifications ............................................................. 97

22-1. Analog Specifications ................................................................................................... 97

22-2. Digital Specifications .................................................................................................... 97

22-3. Interface ....................................................................................................................... 97

22-4. General Specifications ................................................................................................. 98

22-5. Accessories .................................................................................................................. 98

23. Warranty ................................................................................... 99

23-1. Warranty ....................................................................................................................... 99

23-2. Repairs ......................................................................................................................... 99

23-3. Component Service Lives ............................................................................................ 99

24. Appendix ................................................................................. 100

24-1. Embedding the sensor ............................................................................................... 100

24-2. Counterboring the sensor embedding hole ................................................................ 101

24-3. Anchoring the sensor cable ........................................................................................ 102

XVI

24-4. Vertically positioning the ejector plate ........................................................................ 102

24-5. Removing a sensor .................................................................................................... 103

1

1. Overview

This equipment is an eight-channel input digital conversion module for measuring resin pressure inside

molds in injection molding machines.

The pressure input from force sensors is monitored in accordance with preset parameters, and the

results are output in the form of an alarm signal.

Pressure waveforms converted to analog voltages can be transmitted to the molding machine.

PC software can also be used to display the pressure waveforms in real time, save, export and

analyze them, and perform various settings. The PC can be disconnected after setting performed by

the software, enabling the pressure to be monitored continuously using the module itself.

2. Software System Operating Requirements

PC PC/AT compatible machine

Operating system Windows 7, 8, 8.1, 10

CPU 2 GHz or higher

RAM 4.0 GB or higher

USB port 1 port required

CD-ROM drive Required

Mouse or similar input device Required

Keyboard Required

Monitor At least 1,280 x 768 resolution

* Software is not guaranteed to run on all PCs.

Spreadsheet software such as Microsoft Excel should be used for complex analysis work, plotting

data for multiple waveforms, and other works.

2

3. System Configuration

For details on how to attach the sensor to the mold, see Section 25 "Appendix".

Relay box

MPC-308

Mold interior

Force sensors (LSMS × 8)

. . .

START (Start trigger input)

ALARM RESET (Alarm cancel input)

ALARM (Alarm output)

DC24 V

8-channel amplifier

USB

Analog voltage output (8 channels)

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