Tyan Transport TA26 B2882 User manual

Transport TA26

B2882

Service Engineer’s Manual

Document part number: D1585-100

HDD-7

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HDD-6

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HDD-5

POWER

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HDD-4

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HDD-1

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HDD-2

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HDD-3

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HDD-8

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Power

Reset

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Preface

Copyright

This publication, including all photographs, illustrations, and soft-

ware, is protected under international copyright laws, with all rights

reserved. Neither this manual, nor any material contained herein,

may be reproduced without written consent of the manufacturer.

Version 1.00

Disclaimer

Information contained in this document is furnished by TYAN

computer Corporation and has been reviewed for accuracy and reli-

ability prior to printing. TYAN assumes no liability whatsoever, and

disclaims any express or implied warranty, relating to sale and/or

use of TYAN products including liability or warranties relating to fit-

ness for a particular purpose or merchantability. TYAN retains the

right to make changes to product descriptions and/or specifications

at any time, without notice. In no event will TYAN be held liable for

any direct or indirect, incidental or consequential damage, loss of

use, loss of data or other malady resulting from errors or inaccura-

cies of information contained in this document.

Trademark recognition

All registered and unregistered trademarks and company names

contained in this manual are property of their respective owners

including, but not limited to the following.

TYAN, TYAN S2882G3NR, and Transport TA26 are trademarks of

TYAN Computer Corporation.

AMD, Opteron, and combinations thereof are trademarks of

Advanced Micro Devices Corporation.

AMI, AMIBIOS, and combinations thereof are trademarks of AMI

Software Incorporated.

Microsoft Windows is a trademark of Microsoft Corporation.

IBM, PC, AT and PS/2 are trademarks of IBM Corporation.

Winbond is a trademark of Winbond Electronics Corporation.

ii

Federal Communications Commission

Notice for the USA Compliance Information State-

ment (Declaration of Conformity Procedure) DoC

FCC Part 15: This device complies with part 15 of the

FCC Rules

Operation is subject to the following conditions:

1) This device may not cause harmful interference, and

2) This device must accept any interference received including inter-

ference that may cause undesired operation. If this equipment does

cause harmful interference to radio or television reception, which

can be determined by turning the equipment off and on, the user is

encouraged to try one or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and the

receiver.

• Plug the equipment into an outlet on a circuit different from

that of the receiver.

Consult the dealer on an experienced radio/television technician for

help.

Notice for Canada

This apparatus complies with the Class B limits for radio interference

as specified in the Canadian Department of Communications Radio

Interference Regulations. (Cet appareil est conforme aux norms de

Classe B d’interference radio tel que specifie par le Ministere Cana-

dien des Communications dans les reglements d’ineteference

radio.)

Notice for Europe (CE Mark) This product is in conformity

with the Council Directive 89/336/EEC, 92/31/EEC

(EMC).

CAUTION: Lithium battery included with this board. Do not puncture,

mutilate, or dispose of battery in fire. Danger of explosion if battery

is incorrectly replaced. Replace only with the same or equivalent

type recommended by manufacturer. Dispose of used battery

according to manufacturer instructions and in accordance with your

local regulations.

iii

About this manual

This manual provides you with instructions on installing your Trans-

port TA26 (B2882), and consists of the following sections:

Chapter 1 – Overview:

Provides an introduction to the Transport TA26 (B2882) barebones,

shows a packing list, describes the external components, shows

tables of key components, and provides a block diagram of the sys-

tem.

Chapter 2 – Setting up:

Covers procedures on installing the CPUs, memory modules,

optional PCI card, and hard drives.

Chapter 3 – Replacing pre-installed components:

Covers removal and replacement procedures for pre-installed com-

ponents.

Appendix:

Provides detailed specifications, maintenance and troubleshooting

procedures, an explanation of BIOS, and technical diagrams.

iv

Safety information

Before installing and using the Transport TA26, take note of the fol-

lowing precautions:

• Read all instructions carefully.

• Do not place the unit on an unstable surface, cart, or stand.

• Do not block the slots or openings on the unit which are

provided for ventilation.

• Only use the power source indicated on the marking label.

If you are not sure, contact the power company.

• The unit uses a three-wire grounded cable, which is sup-

plied with a third pin to ground the unit and prevent electric

shock. Do not defeat the purpose of this pin. If your outlet

does not support this type of plug, contact an electrician to

replace the obsolete outlet.

• Do not place anything on the power cord. Place the power

cord where it will not be stepped on.

• Follow all warnings and cautions in this manual and on the

unit case.

• Do not push objects in the ventilation slots as they may

touch high voltage components and result in shock and

damage to the components.

• When replacing parts, ensure that you use parts specified

by the manufacturer.

• When service or repairs have been carried out, perform

routine safety checks to verify that the system is operating

correctly.

• Avoid using the system near water, in direct sunlight, or

near a heating device.

• Cover the unit when not in use.

• Disassembly of this unit should not be attempted by

unqualified persons. When the chassis cover is removed

there is a danger of electric shock and risk of damage to

the system.

Table of Contents

Chapter 1: Overview

1.1 About the Transport TA26 (B2882)............................................. 1

1.2 Features ........................................................................................ 2

1.3 Unpacking .................................................................................... 3

1.3.1 Box contents .......................................................................... 3

1.3.2 Accessories ............................................................................ 4

1.3.3 Opening the box..................................................................... 5

1.4 About the product......................................................................... 6

1.4.1 System front view and front panel......................................... 6

1.4.2 System rear view.................................................................... 6

1.4.3 System internal view.............................................................. 7

1.4.4 Block diagram........................................................................ 8

Chapter 2: Setting up

2.1 Before you begin .......................................................................... 9

2.1.1 Work area............................................................................... 9

2.1.2 Tools ...................................................................................... 9

2.1.3 Precautions............................................................................. 10

2.2 Installing motherboard components ............................................. 11

2.2.1 Removing the chassis cover................................................... 11

2.2.2 Installing CPUs and heatsinks ............................................... 12

2.2.3 Installing memory .................................................................. 15

2.2.4 Installing a PCI card .............................................................. 16

2.3 Installing a SCSI hard drive ......................................................... 19

2.4 Installing a floppy disk drive........................................................ 20

2.5 Rack mounting ............................................................................. 23

Chapter 3: Replacing pre-installed components

3.1 Introduction .................................................................................. 25

3.2 Replacing motherboard components............................................ 25

3.2.1 Disconnecting all motherboard cables................................... 25

3.2.2 Replacing the motherboard.................................................... 30

3.3 Replacing the slim CD-ROM drive.............................................. 31

3.4 Replacing the LED control board ................................................ 32

3.5 Replacing the USB board............................................................. 34

3.6 Replacing the SCSI backplane ..................................................... 35

3.6.1 SCSI backplane features ........................................................ 38

3.6.2 SCSI backplane specifications and settings........................... 39

3.7 Replacing the power supply ......................................................... 44

3.7.1 Standard power supply........................................................... 44

3.7.2 Optional 1+1 redundant power supply .................................. 45

3.7.3 Optional 1+1 redundant power supply chassis ...................... 45

3.8 Replacing the cooling fans ........................................................... 47

3.8.1 Pin header diagram ................................................................ 48

Appendix

BIOS.................................................................................................. 49

Introduction.................................................................................... 49

BIOS setup utility .......................................................................... 49

BIOS menu bar .............................................................................. 51

BIOS legend bar............................................................................. 51

BIOS main menu ........................................................................... 52

BIOS advanced menu .................................................................... 53

IDE configuration submenu........................................................... 54

Floppy configuration submenu ...................................................... 55

Super I/O configuration submenu.................................................. 56

Hardware health event monitoring submenu................................. 58

Motherboard voltages report submenu .......................................... 59

ACPI settings submenu.................................................................. 60

Advanced ACPI configuration submenu ....................................... 61

Event logging details submenu...................................................... 62

Hyper transport configuration submenu ........................................ 63

Device and PCI slots configuration submenu................................ 64

Remote access configuration submenu.......................................... 66

USB configuration submenu.......................................................... 67

Advanced PCI/PnP menu............................................................... 68

BIOS boot settings menu ............................................................... 70

Boot settings configuration submenu ............................................ 70

Boot device priority submenu........................................................ 72

Hard disk submenu ........................................................................ 73

Removable drives submenu........................................................... 74

ATAPI CD-ROM drives submenu ................................................ 75

BIOS security menu....................................................................... 76

BIOS chipset settings..................................................................... 77

Northbridge chipset configuration submenu.................................. 78

Memory configuration submenu.................................................... 78

ECC configuration submenu.......................................................... 79

Southbridge chipset configuration submenu.................................. 81

PCI-X chipset configuration submenu........................................... 82

BIOS power menu ......................................................................... 84

BIOS exit menu ............................................................................. 85

Technical support .............................................................................. 86

Help resources: .............................................................................. 86

Returning merchandise for service ................................................ 86

Chapter 1: Overview 1

Chapter 1: Overview

1.1 About the Transport TA26 (B2882)

Congratulations on your purchase of the TA26 (B2882), rack

mountable, barebone system for the AMD Opteron proces-

sor. The TA26 uses AMD's revolutionary x86-64 Opteron™

processor technology, offering exceptional computing power

and simultaneous support of 32-bit and 64-bit applications.

Removable SCSI hard disk drives provide maximum flexibility

and combine with gigabit Ethernet ports to provide powerful

computing capacity and optimal I/O bandwidth for the most

demanding of enterprises.

The rugged, industry standard 19-inch, rack mountable

design includes eight HDD bays, and one slim CD-ROM bay,

making it both flexible and practical.

WARNING: This product should be ser-

viced only by qualified service engineers. Do

not remove the chassis cover or attempt to

service this product unless you are qualified

to do so. Once the chassis cover is removed

there is a risk of electric shock which could

lead to serious injury or death.

HDD-7

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HDD-6

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HDD-5

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HDD-4

POWER

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HDD-1

POWER

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HDD-2

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HDD-3

POWER

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HDD-8

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1.2 Features

2 Chapter 1: Overview

1.2 Features

Enclosure

• Industry standard, 19-inch rack

mountable, 2U chassis

• (8) external 3.5-inch HDD bays (one

can be used for 3.5-inch FDD)

• (1) slim CD-ROM bay

• 21.5 x 17 x 3.45 inch

(547 x 432 x 88 mm)

Storage

• Up to eight hot-swappable Ultra 320

SCSI HDDs

• Slim 24x CD-ROM drive

• Optional 3.5-inch FDD

• Dual channel IDE support

• Dual channel Adaptec AIC-7902

Ultra 320 SCSI controller with ZCR

support

Processors

• Dual PGA 940-pin ZIF sockets

• Support for single or dual AMD

®

Opteron™ 200 series processors

Motherboard

• Tyan Thunder K8S Pro S2882G3NR

motherboard

• eATX form factor (13x12 inches)

Chipset

• AMD-8131™ HyperTransport PCI-X

Tunnel

• AMD-8111™ HyperTransport I/O

Hub

• Winbond W83627HF Super I/O chip

• Analog Devices ADM1027 Hardware

Monitoring IC

BIOS

•AMI

®

BIOS 8.0 on 4 MB LPC flash

ROM

• ACPI 1.0b & 2.0 support

• PnP, DMI2.0, WfM2.0 power

management

• Power management S1, S4 and S5

support

Memory

• 128-bit dual channel memory bus

• (8) 184-pin 2.5V DDR DIMM sockets

• Up to 16 GB of registered DDR

• ECC type memory module support

• DDR400/333/266 support

Networking

• (2) Gbit Ethernet ports (Broadcom

®

BCM5704C dual-channel GbE LAN

controller connected to PCI-X bridge)

with teaming feature support

• (1) 10/100 Mbps LAN port (Intel

®

82551QM controller)

Expansion slots

• (3) 64-bit 66/100/133 MHz PCI-X slot

on riser card

Power supply

• EPS 12V, 2U, 460W with PFC

• Optional 460W 1+1 redundant power

supply

Back I/O ports

• Stacked PS/2 mouse and keyboard

ports

• (2) stacked USB 1.1 ports

• (1) 9-pin UART serial port

• (3) RJ-45 LAN ports

• (1) 15-pin VGA port

Video

•ATI

®

Rage™ XL PCI Graphics

controller

• 8 MB frame buffer video memory

Front panel

• (2) USB 1.1 ports

• HDD activity, LAN

activity, fan failure, and power LEDs

• Power, mute, and reset switches

Regulatory

• FCC Class B (declaration of

conformity)

• CE (declaration of conformity)

1.3 Unpacking

Chapter 1: Overview 3

1.3 Unpacking

This section describes the TA26 package contents and

accessories.

1.3.1 Box contents

Component Description

Industry standard 2U chassis with eight

drive bays.

Tyan S2882UG3NR motherboard (pre-

installed)

24x slim CD-ROM (pre-installed)

SCSI backplane (pre-installed)

LED control board (pre-installed)

Riser card assembly

EPS 12V 2U 460W power supply (pre-

installed) or optional 460W 1+1 redun-

dant power supply.

Fans

80mm X 80mm (2 units)

60mm X 60mm (1 unit)

HDD-7

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HDD-6

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HDD-5

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HDD-4

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H

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Reset

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1.3 Unpacking

4 Chapter 1: Overview

1.3.2 Accessories

Rail for rack mounting

FDD cables and bracket

Driver CD and diskettes

Mounting ears

Short SCSI daisy chain cable

Motherboard and system manual

http://www.t yan .com

Adaptec

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S2882

K8S Pro AJS

#D 1528 - 100

Revision 1.0

High Performance Motherboard

User's Manual

2U Server Platform

B2882

Transport TA26

ID : 1540 - 100

Revision 1.0

Hardware

Installation Guide

1.3 Unpacking

Chapter 1: Overview 5

1.3.3 Opening the box

Open the box carefully and ensure that all components are

present and undamaged. The product should arrive pack-

aged as illustrated below.

Contact your distributor if anything is missing or appears

damaged.

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S2882

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#D 1528 - 100

Revision 1.0

High Performance Motherboard

User's Manual

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S2882

Thunder K8S PRO

#D 1528 - 100

Revision 1.0

High Performance Motherboard

User's Manual

Packaged box contents

Accessory pack Accessories unpacked

1.4 About the product

6 Chapter 1: Overview

1.4 About the product

This section contains hardware diagrams and a block dia-

gram of the TA26 system.

1.4.1 System front view and front panel

See the diagram below for details of the front panel indicators

and switches.

1.4.2 System rear view

HDD-1

POWER

ACUIVE

USB

1 2

LAN

3

HDD-2

POWER

ACUIVE

HDD-3

POWER

ACUIVE

HDD-8

POWER

ACUIVE

HDD-7

POWER

ACUIVE

HDD-6

POWER

ACUIVE

HDD-5

POWER

ACUIVE

HDD-4

POWER

ACUIVE

disc

Fall HDD Power Reset Mute

USB

1 2

LAN

3

Fall HDD Power Reset Mute

USB ports

Lan activity

LEDs

Tempera-

ture fail LED

Reset

button

Mute

button

Power

LED

IDE

activity

LED

Power

button

SCSI

HDD bays

SCSI HDD

or FDD bay

1

2

3

1

2

Cooling fan

AC input

RJ45 port

Serial port (com 1)

Expansion slots

Stacked keyboard and mouse ports

USB ports

VGA port

RJ45 ports

1.4 About the product

Chapter 1: Overview 7

1.4.3 System internal view

1 LED control board 6 PCI riser card assembly

2 CD-ROM drive 7 EPS 12V 460W power supply

3 FDD/HDD bay 8 Processor sockets

4 System fans 9 Power connector

5 Memory slots 10 SCSI backplane

1

9

8

2

3

4

5

6

7

10

1.4 About the product

8 Chapter 1: Overview

1.4.4 Block diagram

AMD

Opteron

TM

Processor

AMD

AMD-8131

AMD

AMD-8111

Winbond

W83627F/HF

LPC Super I/O

Floppy Disk Drive

Intel-82551

10/100

(Optional)

16x16 Hyper Transport@1600MT/s

AMD Chipset

LPC

AMD

Opteron

TM

Processor

32-Bit/33MHz

ATI RAGE XL

8MB

Silicon Image

SiI3114

16x16 Hyper Transport@1600MT/s

PCI

Slot

ADM1027

Hardware

monitor

LPC

ROM

PS/2 Keyboard &

Mouse

Parallel Port x 1

EIDE(ATA/133) x2

USB 1.1 x2

LINK 0B

OUT

IN

OUT

LINK 0A

LINK 1

8x8 ncHyper Transport@400MT/s

IN OUT

2 to header

IN

200-333MT/s

144-Bit

184 pin

DIMM0

184 pin

DIMM1

184 pin

DIMM2

184 pin

DIMM3

Adaptec

AIC-7902 SCSI

BCM5704C

Gigabit LAN

64-Bit/100/66MHz

PCI-X Slot

(PCI4 / ZCR)

SO-DIMM144

(ZCR)

PCI-X Slots

184 pin

DIMM2

184 pin

DIMM1

184 pin

DIMM0

184 pin

DIMM3

144-Bit

USB 1.1 x 2

USB Ports: 2 to backplane

200-333MHz

4 X Serial ATA

RAID Ports

150MB/s

Serial Port x 2

64-Bit/133/100MHz

*ZCR support with Adaptec

PCI or SO-DIMM ZCR card

(Optional)

Chapter 2: Setting up 9

Chapter 2: Setting up

2.1 Before you begin

This chapter explains how to install motherboard components

including CPUs, memory modules, and PCI cards. There are

also instructions in this section for installing SCSI hard drives.

Careful attention should be given to the precautions men-

tioned in this section when setting up your system.

2.1.1 Work area

Make sure you have a stable, clean working environment.

Dust and dirt can get into components and cause malfunc-

tions. Use containers to keep small components separated.

Putting all small components in separate containers prevents

them from becoming lost. Adequate lighting and proper tools

can prevent you from accidentally damaging the internal

components.

2.1.2 Tools

The following tools will be required to complete the installa-

tions described in this chapter.

• A cross head (Phillips) screwdriver

• A grounding strap and/or anti-static pad

Most of the electrical and mechanical connectors in your sys-

tem can be disconnected using your fingers. It is recom-

mended that you do not use needle-nosed pliers to remove

connectors as these can damage the soft metal or plastic

parts of the connectors.

2.1 Before you begin

10 Chapter 2: Setting up

2.1.3 Precautions

Components and electronic circuit boards can be damaged

by static electricity. Working on a system that is connected to

a power supply can be extremely dangerous. Follow the

guidelines below to avoid damage to the Transport TA26 or

injury to yourself.

• Ground yourself properly before removing the top

cover of the system. Unplug the power from the

power supply and then touch a safely grounded

object to release static charge (i.e. power supply

case). If available, wear a grounded wrist strap. Alter-

natively, discharge any static electricity by touching

the bare metal chassis of the unit case, or the bare

metal body of any other grounded appliance.

• Avoid touching motherboard components, IC chips,

connectors, memory modules, and leads.

• The motherboard is pre-installed in the system.

When removing the motherboard, always place it on

a grounded anti-static surface until you are ready to

reinstall it.

• Hold electronic circuit boards by the edges only. Do

not touch the components on the board unless it is

necessary to do so. Do not flex or stress circuit

boards.

• Leave all components inside the static-proof packag-

ing that they ship with until they are ready for installa-

tion.

• After replacing optional devices, make sure all

screws, springs, or other small parts are in place and

are not left loose inside the case. Metallic parts or

metal flakes can cause electrical shorts.

• Always use the correct size screws and fixings when

installing or replacing components.

Note: All connectors are designed to fit

one way only, no force should required to

make a connection.

2.2 Installing motherboard components

Chapter 2: Setting up 11

2.2 Installing motherboard components

This section describes how to install CPUs, memory mod-

ules, and PCI cards.

2.2.1 Removing the chassis cover

Follow these instructions to remove the TA26 chassis cover.

This step is required before any other procedures in this

chapter can be undertaken.

1. Remove the single screw that secures the chassis lid at

the back of the unit.

2. Slide the chassis lid back (A) and lift if free from he chas-

sis (B).

1

2

1

2

3

Securing screw

1

2

1

2

3

1

2

1

2

3

A

B

2.2 Installing motherboard components

12 Chapter 2: Setting up

Refitting the chassis cover is a reverse of the removal pro-

cess. Place the lid on the chassis and push it forward into

place before tightening the screw on the rear of the unit.

2.2.2 Installing CPUs and heatsinks

This section describes how to install AMD Opteron proces-

sors and heatsinks in your TA26 system.

Note: The heatsink retainers on the moth-

erboard are pre-installed.

1. Remove the chassis cover. See Removing the chassis

cover on page 11.

2. Locate the two CPU sockets on the motherboard.

3. Ensure that the two heatsink retainers are firmly secured

to the motherboard with two screws as shown.

CPU sockets

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Tyan Transport TA26 B2882 User manual

Tyan Transport TA26 B2882 User manual

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