Intel® Desktop Board DQ67EP Executive Series
Technical Specications
Processor Support
•2ndgenerationIntel®Core™i5vPro™and
Intel®Core™i3processorsintheLGA1155package
•Intel®Hyper-ThreadingTechnology
8
•Intel®TurboBoostTechnology
7
•IntegratedMemoryControllerwithsupportforup
to32GBofsystemmemoryusingeitherDDR3
1333/1066MHz
•Intel®FastMemoryAccess
•SupportsIntel®64architecture
10
Intel® Q67 Express Chipset
•Intel®82Q67PlatformControllerHub(PCH)
•Intel®ActiveManagementTechnology7.0
•Intel®RapidStorageTechnology(RAID0,1,5,10)
Integrated Intel® PCH Controllers
•FourHi-SpeedUSB2.0ports
•Sixadditionalportsviainternalheaders
•TwoSATA6.0Gb/sportsandfour
SATA3.0Gb/sports
System BIOS
•32MbFlashEEPROMwithIntel®Platform
InnovationFrameworkforEFIPlugandPlay,
IDEdriveauto-configure
•Advancedconfigurationandpowerinterface
V1.0b,DMI2.5
•Intel®ExpressBIOSupdatesupport
Hardware Management Features
•Processorfanspeedcontrol
•Systemchassisfanspeedcontrol
•Voltageandtemperaturesensing
•Fansensorinputsusedtomonitorfanactivity
•PowermanagementsupportforACPI1.0b
Intel® 82579LM ENERGY STAR*-ready Intel® PRO
10/100/1000 Network Connection
•HighqualityandreliabilitywithIntel’sworld-class
manufacturingandvalidation
•Newlow-powerdesign
Expansion Capabilities
•OnePCIExpress*2.0x16slot
•OneMini-PCIExpressMiniCardslotsupporting
half-lengthconfiguration
Audio
•8-channelIntel®HighDefinitionAudio
9
with
multi-streaming
•Onefrontpanelaudioheader
•OneS/PDIFoutputinternalheader
Memory Capacity
•Two240-pinDIMMconnectorssupporting
uptotwodouble-sidedDIMMs
Memory Types
•DDR31333/1066SDRAMmemorysupport
•Non-ECCMemory
Memory Voltage
•Memoryvoltagecontrolfrom1.2Vto1.8V
•1.5VstandardJEDECvoltage
Jumpers
•Singleconfigurationjumperdesign
•JumperaccessforBIOSmaintenancemode
Front Panel Connectors
•Reset,HDLED,PowerLEDs,poweron/off
•Threefront-panelHi-SpeedUSB2.0headers
•Front-panelaudioheader
Board Style
•Mini-ITXformfactor
Board Size
•6.7¨x6.7¨(12.7cmx12.7cm)
Baseboard Power Requirements
•ATX12V
Operating Temperature
•0°Cto+55°C
Storage Temperature
•-20°Cto+70°C
United States and Canada
CSA/UL60950-1,FirstEdition(Binational
Standard)UL1950,Thirdedition—CAN/CSAC22.2
No.950-95withrecognizedU.S.andCanadian
componentmarks
Europe
(LowVoltageDirective2006/95/EC)
EN60950-1:2006
NemkocertifiedtoEN60950International
NemkocertifiedtoIEC60950
(CBreportwithCBcertificate)
EMCdirective89/336/EEC;EN55022:1998
ClassB;EN55024:1998
EMC Regulations (testedinrepresentativechassis)
United States
FCCPart15,ClassB
FCCPart15,ClassBopen-chassis
(coveroff)testing
Canada
ICES-003,ClassB
Australia/New Zealand
AS/NZS3548,ClassB
Taiwan
CNS13438,ClassBInternational
CISPR22:1997,ClassB
For ordering information, visit:
For the most current
product information, visit:
or
For specific CPU compatibility, visit:
Lead-Free: Thesymbolisusedtoidentify
electricalandelectronicassembliesandcom-
ponentsinwhichthelead(Pb)concentration
levelinanyoftherawmaterialsandtheendproduct
isnotgreaterthan0.1%byweight(1000ppm).
Thissymbolisalsousedtoindicateconformance
tolead-freerequirementsanddefinitionsadopted
undertheEuropeanUnion’sRestrictiononHazardous
Substances(RoHS)directive,2002/95/EC.
Power requirements vary. Complies with US CRF via EN55022 +6 db in
system congurations with an open chassis and EU Directive 89/336/EEC
and use via EN55022 and EN50082-1 in a representative chassis.
1
Requires the use of a discrete graphics card.
2
System resources and hardware (such as PCI and PCI Express*) require
physical memory address locations that can reduce available addressable
system memory. This could result in a reduction of as much as 1 GB or more
of physical addressable memory being available to the operating system and
applications, depending on the system conguration and operating system.
3
DisplayPort (DP): The next generation in high-performance digital connectiv-
ity delivering high-resolution digital display and digital audio.
4
The original equipment manufacturer must provide TPM functionality, which
requires a TPM-supported BIOS. TPM functionality must be initialized and
may not be available in all countries.
5
For Intel eco-smart technologies, visit www.intel.com/go/ecosmart.
6
The Intel
®
Core Utilities Bundle includes Intel
®
Integrator Assistant, Intel
®
Integrator Toolkit, Intel
®
Express Installer, and Intel
®
Express BIOS Update.
7
Intel
®
Turbo Boost Technology requires a PC with a processor with Intel Turbo
Boost Technology capability. Intel Turbo Boost Technology performance
varies depending on hardware, software, and overall system conguration.
Check with your PC manufacturer on whether your system delivers Intel Turbo
Boost Technology. See www.intel.com/technology/turboboost for
more information.
8
Intel
®
Hyper-Threading Technology requires a computer system with a
processor supporting HT Technology and an HT Technology-enabled
chipset, BIOS, and operating system. Performance will vary depending
on the specic hardware and software you use. For more information
including details on which processors support HT Technology, see
www.intel.com/info/hyperthreading.
9
Intel
®
High Denition Audio requires a system with an appropriate Intel
®
chip-
set and a motherboard with an appropriate codec and the necessary drivers
installed. System sound quality will vary depending on actual implementation,
controller, codec, drivers, and speakers. For more information about Intel
®
HD
Audio, refer to www.intel.com/design/chipsets/hdaudio.htm.
10
64-bit computing on Intel
®
architecture requires a computer system with a
processor, chipset, BIOS, operating system, device drivers, and applications
enabled for Intel
®
64 architecture. Processors will not operate (including 32-
bit operation) without an Intel 64 architecture enabled BIOS. Performance
will vary depending on your hardware and software congurations. See
http://developer.intel.com/technology/intel64/index.htm for more information.
INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION
WITH INTEL
®
PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY
ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY
RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN
INTEL’S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS,
INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS
ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR
USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES
RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANT-
ABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT, OR OTHER
INTELLECTUAL PROPERTY RIGHT.
Intel products are not intended for use in medical, life-saving, or life-sustaining
applications. Intel may make changes to specications and product descrip-
tions at any time, without notice. All products, dates, and gures specied are
preliminary based on current expectations, and are subject to change without
notice. Availability in different channels may vary. Actual Intel
®
Desktop Board
may differ from the image shown.
Copyright © 2010 Intel Corporation. All rights reserved. Intel, the Intel logo,
Intel vPro, and Intel Core are trademarks of Intel Corporation in the U.S. and
other countries.
*Other names and brands may be claimed as the property of others.
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