Seco SBC-S984-MX6 Owner's manual

SBC-984

Single Board Computer

with NXP i.MX6 Processor

SBC-984

All information contained in this manual is related to SBC-984 board with PCB REVC or higher. For boards with PCB REVB or less,

please refer to information contained in SECOμSBC-i.MX6_Manual_Rel_2.0.

Unauthorized use, duplication, modification or disclosure of the information to a third-party by any means without prior consent of SECO S.r.l. is prohibited.

Every effort has been made to ensure the accuracy of this manual. However, SECO S.r.l. accepts no responsibility for any inaccuracies, errors or omissions herein.

SECO S.r.l. reserves the right to change precise specifications without prior notice to supply the best product possible.

For further information on this module or other SECO products, but also to get the required assistance for any and possible issues, please contact us using the

dedicated web form available at http://www.seco.com (registration required).

Our team is ready to assist.

Revision

Date

Note

Ref

1.0

20th June 2013

First Official Release.

2.0

10th March 2014

Updated to rev. B of the PCB

3.0

16th December 2014

New release, suited to rev. C of the PCB

3.1

29th October 2015

RTS# and CTS# signals removed from connector J5. Paragraph 3.3.7 updated

consequently

4.0

26th January 2016

Product name Change

REVISION HISTORY

SBC-984

INDEX

INTRODUCTION .......................................................................................................................................................................... 5 Chapter 1.

1.1 Warranty ........................................................................................................................................................................................................................................ 6

1.2 Information and assistance ............................................................................................................................................................................................................. 7

1.3 RMA number request ..................................................................................................................................................................................................................... 7

1.4 Safety ............................................................................................................................................................................................................................................ 8

1.5 Electrostatic discharges ................................................................................................................................................................................................................. 8

1.6 RoHS compliance .......................................................................................................................................................................................................................... 8

1.7 Terminology and definitions ............................................................................................................................................................................................................ 9

1.8 Reference specifications .............................................................................................................................................................................................................. 11

OVERVIEW ............................................................................................................................................................................... 12 Chapter 2.

2.1 Introduction .................................................................................................................................................................................................................................. 13

2.2 Technical specifications ............................................................................................................................................................................................................... 14

2.3 Electrical specifications ................................................................................................................................................................................................................ 15

2.3.1 Power Consumption ............................................................................................................................................................................................................ 15

2.3.2 RTC Battery ......................................................................................................................................................................................................................... 17

2.3.3 Power rails naming convention ............................................................................................................................................................................................. 17

2.4 Mechanical specifications............................................................................................................................................................................................................. 18

2.5 Block diagram .............................................................................................................................................................................................................................. 19

CONNECTORS ......................................................................................................................................................................... 20 Chapter 3.

3.1 Introduction .................................................................................................................................................................................................................................. 21

3.2 Connectors overview ................................................................................................................................................................................................................... 22

3.3 Connectors description ................................................................................................................................................................................................................ 23

3.3.1 LVDS + backlight connector ................................................................................................................................................................................................. 23

3.3.2 HDMI connector................................................................................................................................................................................................................... 24

3.3.3 Ethernet connector .............................................................................................................................................................................................................. 25

3.3.4 USB ports............................................................................................................................................................................................................................ 26

3.3.5 MFG + Audio + Power/Reset buttons connector ................................................................................................................................................................... 28

3.3.6 Half-mini PCI-express / mSATA slot ...................................................................................................................................................................................... 29

3.3.7 Serial port RS-232 ............................................................................................................................................................................................................... 30

3.3.8 CAN Bus connector ............................................................................................................................................................................................................. 31

SBC-984

3.3.9 Debug UART / I2C Touch Connector ................................................................................................................................................................................... 31

3.3.10 Camera connector ............................................................................................................................................................................................................... 32

3.3.11 Recovery jumper .................................................................................................................................................................................................................. 32

APPENDICES............................................................................................................................................................................ 33 Chapter 4.

4.1 Thermal Design ............................................................................................................................................................................................................................ 34

4.2 Accessories ................................................................................................................................................................................................................................. 35

4.2.1 RS-232 programming kit ASK-825REVB ............................................................................................................................................................................... 35

4.2.2 WiFi Modules ....................................................................................................................................................................................................................... 35

4.2.3 Cabled RTC battery. ............................................................................................................................................................................................................ 36

4.2.4 CSI Dongle Camera VA09 .................................................................................................................................................................................................... 36

4.2.5 Accessories kit CABKIT984REVC ......................................................................................................................................................................................... 36

4.2.6 7” Display Kit ........................................................................................................................................................................................................................ 37

SBC-984

Chapter 1.

Warranty

Information and assistance

RMA number request

Safety

Electrostatic discharges

RoHS compliance

Terminology and definitions

Reference specifications

SBC-984

1.1 Warranty

This product is subject to the Italian Law Decree 24/2002, acting European Directive 1999/44/CE on matters of sale and warranties to consumers.

The warranty on this product lasts for 1 year.

Under the warranty period, the Supplier guarantees the buyer assistance and service for repairing, replacing or credit of the item, at the Supplier’s own discretion.

Shipping costs that apply to non-conforming items or items that need replacement are to be paid by the customer.

Items cannot be returned unless previously authorized by the supplier.

The authorization is released after completing the specific form available on the web-site http://www.seco.com/en/prerma (RMA Online). The RMA authorization

number must be put both on the packaging and on the documents shipped with the items, which must include all the accessories in their original packaging, with

no signs of damage to, or tampering with, any returned item.

The error analysis form identifying the fault type must be completed by the customer and has must accompany the returned item.

If any of the above mentioned requirements for RMA is not satisfied, the item will be shipped back and the customer will have to pay any and all shipping costs.

Following a technical analysis, the supplier will verify if all the requirements, for which a warranty service applies, are met. If the warranty cannot be applied, the

Supplier will calculate the minimum cost of this initial analysis on the item and the repair costs. Costs for replaced components will be calculated separately.

Warning!

All changes or modifications to the equipment not explicitly approved by SECO S.r.l. could impair the equipment’s functionality and could void

the warranty

SBC-984

1.2 Information and assistance

What do I have to do if the product is faulty?

SECO S.r.l. offers the following services:

SECO website: visit http://www.seco.com to receive the latest information on the product. In most of the cases it is possible to find useful information to

solve the problem.

SECO Sales Representative: the Sales Rep can help to determine the exact cause of the problem and search for the best solution.

SECO Help-Desk: contact SECO Technical Assistance. A technician is at disposal to understand the exact origin of the problem and suggest the correct

solution. E-mail: technical.se[email protected]

Fax (+39) 0575 340434

Repair center: it is possible to send the faulty product to the SECO Repair Centre. In this case, follow this procedure:

o Returned items must be accompanied by a RMA Number. Items sent without the RMA number will be not accepted.

o Returned items must be shipped in an appropriate package. SECO is not responsible for damages caused by accidental drop, improper usage, or

customer neglect.

Note: Please have the following information before asking for technical assistance:

Name and serial number of the product;

Description of Customer’s peripheral connections;

Description of Customer’s software (operative system, version, application software, etc.);

A complete description of the problem;

The exact words of every kind of error message encountered.

1.3 RMA number request

To request a RMA number, please visit SECO’s web-site. On the home page, please select “RMA Online” and follow the procedure described.

A RMA Number will be sent within 1 working day (only for on-line RMA requests).

SBC-984

Whenever handling a SBC-984 board, ground yourself through an anti-static wrist strap. Placement of the board on an anti-static

surface is also highly recommended.

1.4 Safety

The SBC-984 board uses only extremely-low voltages.

While handling the board, please use extreme caution to avoid any kind of risk or damages to electronic components.

1.5 Electrostatic discharges

The SBC-984 board, like any other electronic product, is an electrostatic sensitive device: high voltages caused by static electricity could damage some or all the

devices and/or components on-board.

1.6 RoHS compliance

The SBC-984 board is designed using RoHS compliant components and is manufactured on a lead-free production line. It is therefore fully RoHS compliant.

Always switch the power off, and unplug the power supply unit, before handling the board and/or connecting cables or other

boards.

Avoid using metallic components - like paper clips, screws and similar - near the board when connected to a power supply, to avoid

short circuits due to unwanted contacts with other board components.

If the board has become wet, never connect it to any external power supply unit or battery.

Check carefully that all cables are correctly connected and that they are not damaged.

SBC-984

1.7 Terminology and definitions

AC’97 Audio Codec’97, a standard for audio hardware codecs developed by Intel® in 1997

ACPI Advanced Configuration and Power Interface, an open industrial standard for board’s devices configuration and power management

AHCI Advanced Host Controller Interface, a standard which defines the operations modes of SATA interface

API Application Program Interface, a set of commands and functions that can be used by programmers for writing software for specific Operating

Systems

CAN Bus Controller Area network, a protocol designed for in-vehicle communication

CEC Consumer Electronics Control, an HDMI feature which allows controlling more devices connected together by using only one remote control

CSI2 MIPI Camera Serial Interface, 2nd generation standard regulating communication between a peripheral device (camera) and a host processor

DDC Display Data Channel, a kind of I2C interface for digital communication between displays and graphics processing units (GPU)

DDR Double Data Rate, a typology of memory devices which transfer data both on the rising and on the falling edge of the clock

DDR3 DDR, 3rd generation

DVI Digital Visual interface, a type of digital video display interface

FFC/FPC Flexible Flat Cable / Flat Panel Cable

GBE Gigabit Ethernet

Gbps Gigabits per second

GND Ground

GPI/O General purpose Input/Output

HDMI High Definition Multimedia Interface, a digital audio and video interface

I2C Bus Inter-Integrated Circuit Bus, a simple serial bus consisting only of data and clock line, with multi-master capability

LVDS Low Voltage Differential Signaling, a standard for transferring data at very high speed using inexpensive twisted pairs copper cables, usually used

for video applications

MAC Medium Access Controller, the hardware implementing the Data Link Layer of ISO/OSI-7 model for communication systems

Mbps Megabits per second

MIPI Mobile Industry Processor Interface Alliance

MMC/eMMC MultiMedia Card / embedded MMC, a type of memory card, having the same interface as the SD card. The eMMC is the embedded version of

the MMC, i.e. they are devices that incorporate the memory controller and the flash memories on a single BGA chip

N.A. Not Applicable

N.C. Not Connected

SBC-984

OpenCL Open Computing Language, a software library based on C99 programming language, conceived explicitly to realise parallel computing using

Graphics Processing Units (GPU)

OpenGL Open Graphics Library, an Open Source API dedicated to 2D and 3D graphics

OpenVG Open Vector Graphics, an Open Source API dedicated to hardware accelerated 2D vector graphics

OS Operating System

OTG On-the-Go, a specification that allows to USB devices to act indifferently as Host or as a Client, depending on the device connected to the port

PCI-e Peripheral Component Interface Express

PHY Abbreviation of Physical, it is the device implementing the Physical Layer of ISO/OSI-7 model for communication systems

PSU Power Supply Unit

PWM Pulse Width Modulation

PWR Power

RGMII Reduced Gigabit Media Independent Interface, a particular interface defining the communication between an Ethernet MAC and a PHY

SATA Serial Advance Technology Attachment, a differential half duplex serial interface for Hard Disks

SD Secure Digital, a memory card type

SM Bus System Management Bus, a subset of the I2C bus dedicated to communication with devices for system management, like smart batteries and

other power supply-related devices

SPI Serial Peripheral Interface, a 4-Wire synchronous full-duplex serial interface which contemplates a master and one or more slaves, individually

enabled through a Chip Select line

TBM To be measured

TMDS Transition-Minimized Differential Signaling, a method for transmitting high speed serial data, normally used on DVI and HDMI interfaces

TTL Transistor-transistor Logic

USB Universal Serial Bus

uSDHC Ultra Secure Digital Host Controller

V_REF Voltage reference Pin

SBC-984

1.8 Reference specifications

Here below it is a list of applicable industry specifications and reference documents.

Reference

Link

AC’97

http://download.intel.com/support/motherboards/desktop/sb/ac97_r23.pdf

ACPI

http://www.acpi.info

AHCI

http://www.intel.com/content/www/us/en/io/serial-ata/ahci.html

CAN Bus

http://www.bosch-semiconductors.de/en/ubk_semiconductors/safe/ip_modules/can_literature/can_literature.html

CSI

http://www.mipi.org/specifications/camera-interface

DDC

http://www.vesa.org

Gigabit Ethernet

http://standards.ieee.org/about/get/802/802.3.html

HDMI

http://www.hdmi.org/index.aspx

I2C

http://www.nxp.com/documents/other/UM10204_v5.pdf

LVDS

http://www.ti.com/ww/en/analog/interface/lvds.shtml

http://www.ti.com/lit/ml/snla187/snla187.pdf

MIPI

http://www.mipi.org

MMC/eMMC

http://www.jedec.org/committees/jc-649

OpenCL

http://www.khronos.org/opencl

OpenGL

http://www.opengl.org

OpenVG

http://www.khronos.org/openvg

PCI Express

http://www.pcisig.com/specifications/pciexpress

PCI Express mini cards

http://www.pcisig.com/specifications/pciexpress/specifications/specifications/pciexpress/base2/#MCEM2

SATA

https://www.sata-io.org

SD Card Association

https://www.sdcard.org/home

SM Bus

http://www.smbus.org/specs

TMDS

http://www.siliconimage.com/technologies/tmds

USB 2.0 and USB OTG

http://www.usb.org/developers/docs/usb_20_070113.zip

NXP i.MX6 processor

http://www.nxp.com/products/microcontrollers-and-processors/arm-processors/i.mx-applications-processors-based-on-arm-

cores/i.mx-6-processors:IMX6X_SERIES?cof=0&am=0

SBC-984

Chapter 2.

Introduction

Technical specifications

Electrical specifications

Mechanical specifications

Block diagram

SBC-984

2.1 Introduction

SBC-984 is a Single Board Computer, measuring just 80 x 67 mm (3.15” x 2.64”) based on embedded NXP i.MX6 processor, an ARM® Cortex®-A9 processor,

Single-, Dual- and Quad-Core, with frequencies up to 1.2GHz, which is ideal for applications requiring multimedia capabilities and/or high levels of parallel

computing maintaining advantages offered by low-power consuming ARM architecture in an extremely reduced space.

Graphics features of the board are managed directly by NXP i.MX6 processors, which integrate up to three separated accelerators for 2D, OpenGL® ES2.0 3D

and OpenVG , giving the processor incredible graphical performances (OpenVG accelerator is not available with i.MX6 Solo and Dual Lite processors).

The board is able to support up to 3 independent displays, which can be driven through the HDMI connector and/or the LVDS connector. LVDS interface is also

able to drive one 18/24 bit Single / Dual Channel display as well as two independent 18/24 bit Single Channel displays. Using i.MX6 Dual Lite and Solo

processors, support is limited to 2 independent displays.

The board is completed with up to 2GB DDR3 (up to 1GB with i.MX6 Solo) directly soldered on board, and one eMMC Flash Disk, directly accessible like any

standard Hard Disk, with up to 8GB of capacity. Mass storage capabilities are completed by the half-length mSATA slot, which can also be used to host miniPCI-e

cards.

RGMII i.MX6 native interface is internally carried to a Micrel KSZ9031RN Ethernet Transceiver, allowing the implementation of a Gigabit Ethernet interface.

USB native ports are carried to two USB2.0 USB Hub controllers, which allow implementing three standard USB 2-0 Type A ports, one USB OTG (micro-AB

connector) and another internal USB port, intended for the connection of optional WiFi modules.

The features of this extremely versatile and compact board are completed by an AC’97 Audio Codec, which manages an internal LineOut and Min in connector,

and one RS-232 Serial port.

It is possible to have the board in EXTREME version, where all the components mounted onboard are certified to work in industrial range, therefore the board is

specifically developed to work in range -40°C ÷ +85°C..

Please refer to following chapter for a complete list of all peripherals integrated and characteristics.

2.2 Technical specifications

Processors

NXP i.MX6 Family, based on ARM® CORTEX-A9 processors

- i.MX6S Solo - Single core up to 1GHz

- i.MX6D Dual - Dual core up to 1.2GHz per core

- i.MX6DL Dual Lite - Dual core up to 1GHz per core

- i.MX6Q Quad - Quad core up to 1.2GHz per core

Memory

Up to 2GB DDR3l soldered onboard (up to 1GB with i.MX6S)

Graphics

Dedicated 2D Hardware accelerator

Dedicated 3D Hardware accelerator, supports OpenGL® ES2.0 3D

Dedicated Vector Graphics accelerator supports OpenVG™ (only i.MX6D and

i.MX6Q)

Supports up to 3 independent displays with i.MX6D and i.MX6Q

Supports 2 independent displays with i.MX6DL and i.MX6S

Video Interface

1 x LVDS Dual Channel or 2 x LVDS Single Channel 18/24 bit interface

HDMI Interface

Video Input Port / Camera connector (only with PCB rev. C or higher)

Video Resolution

LVDS, up to 1920x1200

HDMI, up to 1080p

Mass Storage

Onboard eMMC Disk, up to 8 GB *

mSATA Half-length slot (shared with miniPCI-express)

* Please consider that for HDD and Flash Disk manufacturers, 1GB = 10^9 Byte.

Some OS (like, for example, Windows) intends 1GB = 1024^3 byte, so global

capacity shown for Disk Properties will be less than expected. Please also consider

that a portion of disk capacity will be used by internal Flash Controller for Disk

management, so final capacity will be lower

USB

3 x standard USB 2.0 Type A

1 x USB OTG on micro-AB connector

Internal USB for optional WiFi module

Networking

Gigabit Ethernet connector

Audio

AC’97 Audio Codec

Mic In, Line out internal pin header connector

PCI Express

Half-mini PCI-e slot, shared with mSATA (only PCI-e 1.1 and Gen2 are supported)

Serial ports

1x RS-232 serial port

TTL debug UART (Tx, RX only)

CAN interface internal connector

Other Interfaces

I2C touch Connector

Internal connector for power and reset buttons

Power supply

+12VDC ± 10%

Embedded additional RTC circuitry for lowest power consumption

Optional RTC Battery with lead cable and connector

Operating temperature:

0°C ÷ +70°C** (commercial version)

-40°C ÷ +85°C (industrial version)

Dimensions: 80 x 67 mm (3.15” x 2.64”).

Supported Operating Systems:

Linux

** is to be considered at any point of the heatspreader/heatsink. Actual

temperature will widely depend on application, enclosure and/or

environment. Upon customer to consider specific cooling solutions for the

final system.

Please also check paragraph 4.1

2.3 Electrical specifications

SBC-984 needs to be supplied only with an external 12VDC ± 10% power supply.

This voltage can be supplied through a standard 6.3mm (internal pin, diameter 2.0 mm) Power Jack.

Internal pin is VIN power line.

As an alternative, +12VDC can also be supplied using dedicated internal connector J8, which is a MOLEX “Micro-Fit

3.0™” 2-pin connector, p/n 43045-0212 or equivalent, 5A max current per contact, with pinout shown in the table

on the left.

Mating connector: MOLEX 43025-0200 receptacle with MOLEX 43030 series of female crimp terminals.

2.3.1 Power Consumption

The power consumptions have been measured on +12VDC VIN power line using the following modules configurationS:

Quadmo747-X/i.MX6 module with i.MX6Q Quad - Quad Core processor @ 1GHz, 2GB DDR3L, 4GB eMMC, commercial temperature range

Quadmo747-X/i.MX6 module with i.MX6DL Dual Lite - Dual Core processor @ 1GHz, 2GB DDR3L, 4GB eMMC, commercial temperature range

Quadmo747-X/i.MX6 module with i.MX6S Solo- Single core processor @ 1GHz, 512MB DDR3L, 4GB eMMC, commercial temperature range

The File System installed onboard is iMX6_FS_ubuntu-minimal_v4.0.4.tar.gz

The measures have been performed in the following situations:

IDLE: System powered and turned on, without tasks in execution. HDMI display connected, at Full HD resolution. No network connection.

VPU: HDMI display connected, at Full HD resolution, displaying a 1080p @ 30fps video. No network connection.

GPU: HDMI display connected, displaying the tutorial7 demo available in folder /opt/viv_sample/vdk. No network connection.

VPU + GPU: The previous two situations combined together.

PCIe: System powered and turned on. HDMI display connected, at Full HD resolution. WiFi card DHXA-195 plugged on miniPCI-e slot (scanning for Wi-Fi

networks).

mSATA: System powered and turned on. HDMI display connected, at Full HD resolution. 16GB Half-size mSATA disk plugged (continuous data transfer).

CPU 50%: System powered and turned on. HDMI display connected, at Full HD resolution. Half of the cores working at 100% (i.e., 2 cores working at 100% on

i.MX6Q, 1 core working at 100% on i.MX6DL)

CPU 100%: System powered and turned on. HDMI display connected, at Full HD resolution. All cores working at 100%.

Power In Connector - J8

Signal

VIN

GND

SBC-984

Network: System powered and turned on. HDMI display connected, at Full HD resolution. Iperf tool testing bidirectional Ethernet connection.

Stress Test: tests VPU, GPU, CPU 100% and Network performed simultaneously

The power consumption measurements excluded the USB ports, the LVDS display, the camera interface, the CAN interface and the RS-232 transceiver.

Test

Processor

i.MX6S

i.MX6DL

i.MX6Q

IDLE

1.94W

2.2W

2.39W

VPU

2.6W

2.9W

3.16W

GPU

3.61W

4.48W

6.38W

VPU + GPU

3.61W

4.8W

6.28W

PCIe

3.6W

4.04W

3.7W

mSATA

---

3.34W

CPU 50%

---

3.01W

4.35W

CPU 100%

2.96W

3.83W

5.94W

Network

3.3W

170 Mbits/sec RX

130Mbits/sec TX

4.05W

270 Mbits/sec RX

140Mbits/sec TX

4.3W

270 Mbits/sec RX

140Mbits/sec TX

Stress test

4.69W

6.11W

9.81W

SBC-984

CAUTION: handling batteries incorrectly or replacing with not-approved devices may present a risk of fire or explosion.

2.3.2 RTC Battery

For the occurrences when the module is not powered with an external power supply, it is possible to connect a cabled coin 3V Lithium Battery to supply the Real

Time Clock embedded inside i.MX6 Processor. Such a battery is optional. Please also check par. 4.2.3.

Battery used is a cabled CR2032-LD Lithium coin-cell battery, with a nominal capacity of 220mAh.

The battery is not rechargeable, and can be connected to the board using dedicated connector J2 which is a 2-pin

p1.27 mm type MOLEX p/n 53398-0271 or equivalent, with pinout shown in the table on the left.

Mating connector: MOLEX 51021-0200 receptacle with MOLEX 50079-8000 female crimp terminals.

In case of exhaustion, the battery should only be replaced with devices of the same type. Always check the orientation before

inserting and make sure that they are aligned correctly and are not damaged or leaking.

Never allow the batteries to become short-circuited during handling.

Batteries supplied with SBC-984 are compliant to requirements of European Directive 2006/66/EC regarding batteries and accumulators. When putting out of

order SBC-984, remove the batteries from the board in order to collect and dispose them according to the requirement of the same European Directive above

mentioned. Even when replacing the batteries, the disposal has to be made according to these requirements.

2.3.3 Power rails naming convention

In all the tables contained in this manual, Power rails are named with the following meaning:

_S: Switched voltages, i.e. power rails that are active only when the board is in ACPI’s S0 (Working) state. Examples: +3.3V_S, +5V_S.

_A: Always-on voltages, i.e. power rails that are active both in ACPI’s S0 (Working), S3 (Standby) and S5 (Soft Off) state. Examples: +5V_A, +3.3V_A.

Other suffixes are used for application specific power rails, which are derived from same voltage value of voltage switched rails, if it is not differently stated (for

example, +5VHDMI is derived from +5V_S, and so on).