Z Microsystems Multi Processor Unit Z MPU User manual

Brand: Z Microsystems

Model: Multi Processor Unit Z MPU

Category: Chassis components

Type: User manual

This manual is also suitable for

Z MPU

FIELDFIELD

FIELD

READREAD

READ

Z Microsystems

System Overview

1.0

System

1.1

Sealed

1.2

Independent

Z MPUZ MPU

Z MPU

• Shared Chassis -- Shared

Peripherals

• Less space, less weight, less

power, less cost

The rugged Z MPU delivers

four independent computers.

Each computer is an Intel or

Sun COTS computer encased in

its own environmentally sealed

hot swappable module.

Each computer is a complete

stand alone system with its

own dedicated boot disk.

• Hot swappable Sealed

Computer Modules (SCM) and

Disk modules

• Mix & match platforms and

OS’s

The chassis can be quickly

populated with SCM’s and hard

drives, and can be mixed and

matched with Intel and Sun

motherboards using IDE and

SCSI hard drives.

Each hot pluggable computer

and its dedicated disk module

is environmentally sealed

against sand and dust,

effectively reducing

maintenance and increasing

reliability and system life.

• Independent Stand Alone

Systems

Four physically and logically

separate computers enable

different software applications

to run independently.

Each computer has its own

dedicated TranzPak 7 disk

module, its own external I/O

connectors, and shared access

to support peripherals.

Each computer has two

independent USB busses that

are matrix-switched to the

array of USB peripherals.

1.1

Sealed

1.2

Independent

Each docking slot has a transition board that mates with the removable SCM and its dedicated TranzPak 7 disk module. Inside each SCM

an interface board generates the required voltages and transitions the motherboard’s I/O signals to the outside world.

Hot swap SCM’s contain environmentally sealed COTS motherboards. Keep your

configurations current with the latest Intel/Sun motherboards.

Hot swap TranzPak 7 Modules contain

environmentally sealed IDE or SCSI hard drives.

Component Overview

Dedicated 28 VDC

Power and ATX

Interface Board

Heatsinks

conduct thermal

energy to module

cover for

dispersion

ATX Motherboard

(Intel or Sun)

Internal DC Power Input

and Switched USB

Transition

Board

Dedicated Disk

(SCSI or IDE)

PCI Card

Operator Front

External I/O

Connectors

2.2

Inside Look

2.1

SCM

2.0

TranzPak 7

Shared Peripherals & System Administration

• Shared Peripheral Clusters

The Peripheral Device Layer

organizes an array of the most

popular USB devices (CDW, floppy,

PCMCIA) and an external hub into

four switchable clusters that can

be individually and dynamically

switched to any SCM.

• Maximum Flexibility

Each SCM has two independent

internal USB busses that are

assignable to any of the four

peripheral clusters.

Peripheral assignments can be

made locally using the front panel

or remotely via the SysAdmin

network facility.

• Web Based SysAdmin

An embedded multiprocessor

monitors system health and

watch-dog activity.

An HTML web page provides

network capability for remote

monitoring and system

administration.

The ability to independently

control power, reboot, monitor

environmental performance,

execute failover strategies, and

administer system functions

across the network allows the

system to be located in “lights

out” inaccessible locations.

3.1

Peripheral Cluster

3.2

Remote SysAdmin

3.0

Peripheral Sharing

uture Proof Tuture Proof T

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tiontion

tion

Z Microsystems - Multi Processor Unit

Quad

modulated

fan array

provides

front to

back

cooling

Fan array

control

board

DC Power In

TranzPak 7

removable

disk module

(SCM)

Sealed

computer

module

stack

6.0

System Architecture

Peripheral

clusters

External

connector

transition

board

Switched

peripheral

and power

distribution

backplane

7.0 Schematics

7.1 Specifications

Z Microsystems 5945 Pacific Center Blvd., Suite 505 San Diego, CA 92121-4309 T: 858.657.1000 F: 858.657.1001 www.zmicro.com

Motherboards Intel and Sun ATX form

factor

Storage Options SCSI and/or IDE

Dimensions 10.5” H x 17.5" W x 22" D

Net Weight 110 lbs. (depending on

device)

Power

DC Voltage: 22 – 29 VDC

DC Current: 18A @ 28VDC Typ.

AC Voltage: 85 – 264 VAC @ 47-63 Hz

AC Current : 5.6A @ 120VAC Typ.

Environmental

Operating Temp. 5º to + 50º Celsius

Non Op. Temp. -40º to + 65º Celsius

Operating Humidity 5% to 95% Non condensing

Non Op. Humidity 5% to 95% Non condensing

Shipping Humidity 5% to 95% Non condensing

Non Op. Altitude -1,300 to 40,000 ft.

Operating Altitude -1,300 to 10,000 ft.

Operating Vibration Wheeled and tracked vehicles, fixed

and rotary wing aircraft.

Mil-Std-167 (in transit case)

Shock Operating Mil-Std-810E, Method 516, 30g’s

Fungus Non Nutrients / contaminants

Reliability

Operating Life 10 years

Maintainability <20 minutes

Regulatory

Safety UL 1950

EMI FCC Class A

Quality/Workmanship IPC / ISO 9002 and applicable section

of MIL-HDBK-454

Z MPU 4X

Z MPU 2X

7.2 Options

Z Microsystems Multi Processor Unit Z MPU User manual

Brand: Z Microsystems

Model: Multi Processor Unit Z MPU

Category: Chassis components

Type: User manual

This manual is also suitable for

Z MPU

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Z Microsystems Multi Processor Unit Z MPU User manual

This manual is also suitable for

Z Microsystems Multi Processor Unit Z MPU User manual

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