TABLE OF CONTENTS
M68331BCC/D i MOTOROLA
TABLE OF CONTENTS
CHAPTER 1 GENERAL INFORMATION
1.1 Introduction......................................................................................................................... 1-1
1.2 Features............................................................................................................................... 1-1
1.3 Specifications...................................................................................................................... 1-2
1.4 General Description............................................................................................................ 1-3
1.5 Equipment Required........................................................................................................... 1-4
CHAPTER 2 HARDWARE PREPARATION AND INSTALLATION
2.1 Introduction......................................................................................................................... 2-1
2.2 Unpacking Instructions....................................................................................................... 2-1
2.3 Hardware Preparation......................................................................................................... 2-1
2.3.1 RAM Chip Enable Select Header (J2)...................................................................... 2-5
2.3.3 EPROM Chip Select Header (J3)............................................................................. 2-6
2.3.4 TxD Select Header (J4)............................................................................................ 2-7
2.3.5 RxD Select Header (J5)............................................................................................ 2-8
2.3.6 Clock Input Select Header (J6)................................................................................. 2-9
2.4 Installation Instructions .................................................................................................... 2-11
2.4.1 Power Supply - BCC Interconnection.................................................................... 2-11
2.4.2 Terminal - BCC Interconnection............................................................................ 2-12
2.4.3 Target System - BCC Interconnection ................................................................... 2-14
CHAPTER 3 OPERATING INSTRUCTIONS
3.1 Introduction......................................................................................................................... 3-1
3.2 Limitations.......................................................................................................................... 3-1
3.2.1 Chip Select Usage .................................................................................................... 3-2
3.2.2 Other MCU Resources Used by CPU32Bug............................................................ 3-3
3.3 Operating Procedure........................................................................................................... 3-5
3.4 Monitor Description............................................................................................................ 3-6
3.4.1 Memory and Register Display and Modification Commands.................................. 3-7
3.4.2 Breakpoint Capabilities............................................................................................ 3-7
3.4.3 System Calls............................................................................................................. 3-8
3.4.4 Diagnostic Monitor................................................................................................. 3-10
Frees
cale Semiconductor,
I
Freescale Semiconductor, Inc.
For More Information On This Product,
Go to: www.freescale.com
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