Eurotech Adbc8037 Owner's manual

Second edition – March 2014 – B31055B0-MN002-01

USER MANUAL

Adbc8037

Computer On Module

DIGITAL TECHNOLOGIES FOR A BETTER WORLD

www.eurotech.com

DIGITAL TECHNOLOGIES FOR A BETTER WORLD

www.eurotech.com

Preface

Thank you for choosing the Adbc8037. Please read this manual before using the Adbc8037 so that

you may obtain the greatest benefit from using the device.

This manual presents the specifications, functions, and method of use of the Adbc8037.

Eurotech has made every effort to carefully inspect each product and has taken great care to package

and to ship the product. In the unlikely event of the product’s failure to operate normally due to

problems in shipping or otherwise, the company will repair or replace the product at its own

responsibility.

If you have any questions, contact your local Eurotech Sales Office.

Trademarks

All trademarks both marked and not marked appearing in this document are the property of their

respective owners.

This document does not give permission to the implementation of patents or other rights held by

Eurotech or third parties.

Document Revision History

VERSION

DATE

Publication Number

First edition

Jun 26,2013 Issued

B31055B0-MN002-00

Second edition

Mar 28,2014 Issued

B31055B0-MN002-01

DIGITAL TECHNOLOGIES FOR A BETTER WORLD

www.eurotech.com

Table of Contents

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Table of Contents

Document Revision History ............................................................................................................................ 2

Table of Contents ............................................................................................................................................ 3

1. Important User Information ........................................................................................................................ 5

1.1 Safety Notices and Warnings ................................................................................................................... 5

1.2 Life Support Policy ................................................................................................................................... 7

1.3 Warranty ................................................................................................................................................... 7

1.4 RoHS ........................................................................................................................................................ 7

1.5 Technical Assistance ............................................................................................................................... 7

1.6 Conventions ............................................................................................................................................. 7

1.7 Electromagnetic Compatibility .................................................................................................................. 7

2. Summary ...................................................................................................................................................... 8

2.1. Features .................................................................................................................................................. 8

2.2. Block Diagram ......................................................................................................................................... 9

3. Hardware Specifications ........................................................................................................................... 10

3.1. Processor .............................................................................................................................................. 11

3.1.1. Processor Options ........................................................................................................................ 11

3.1.2. Cache Memory ............................................................................................................................. 11

3.2 Memory .................................................................................................................................................. 11

3.2.1. Main Memory ................................................................................................................................ 11

3.2.2. Boot ROM ..................................................................................................................................... 11

3.3. COM Express ........................................................................................................................................ 12

3.3.1. PCI Express Graphics (PEG) ....................................................................................................... 12

3.3.2. PCI Express .................................................................................................................................. 12

3.3.3. USB2.0 ......................................................................................................................................... 13

3.3.4. USB3.0 ......................................................................................................................................... 13

3.3.5. SATA ............................................................................................................................................ 13

3.3.6. LAN ............................................................................................................................................... 13

3.3.7. LPC ............................................................................................................................................... 13

3.3.8. SPI ................................................................................................................................................ 13

3.3.9. Graphics DDI ................................................................................................................................ 14

3.3.10. Analog VGA ................................................................................................................................ 14

3.3.11. SMBus

（

System Management Bus

）

........................................................................................... 14

3.3.12. I

2

C bus ........................................................................................................................................ 14

3.3.13. GPIO ........................................................................................................................................... 15

3.3.14. Suspend Status .......................................................................................................................... 15

3.3.15. External BIOS ROM Support ...................................................................................................... 15

3.3.16. Reset .......................................................................................................................................... 15

3.3.17. Thermal Protection ..................................................................................................................... 16

3.3.18. Battery Low Alarm ...................................................................................................................... 16

3.3.19. Power button............................................................................................................................... 16

3.3.20. Power Good ................................................................................................................................ 16

3.3.21. Speaker ...................................................................................................................................... 16

3.4. LED ....................................................................................................................................................... 16

3.5. I

2

C＆SMBus multiplexer ........................................................................................................................ 17

3.6. Address Map ......................................................................................................................................... 18

3.6.1. I/O space ...................................................................................................................................... 18

3.6.2. Memory space .............................................................................................................................. 18

3.6.3. CPLD Internal Register ................................................................................................................. 19

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3.6.4. PCI ................................................................................................................................................ 20

4. Mechanical Specifications ........................................................................................................................ 21

4.1. External Dimension ............................................................................................................................... 21

4.2. Attachment to Carrier Board ................................................................................................................. 22

4.3. Heat Spreader ....................................................................................................................................... 23

5. Connectors and Jumpers ......................................................................................................................... 24

5.1. Adbc8037 On-board Components ........................................................................................................ 24

5.1.1. 12V Auxiliary Power Connector .................................................................................................... 24

5.2. Setting ................................................................................................................................................... 25

5.2.1. JP1 (CMOS clear pin) ................................................................................................................... 25

5.2.2. CN1 (SPI-ROM writing connector) ............................................................................................... 25

5.2.3. CN3 (CPLD data writing connector) ............................................................................................. 25

5.3. Pin Layout ............................................................................................................................................. 26

5.3.1. CN4 (COM Express stacking connector) ..................................................................................... 26

6. System Specifications............................................................................................................................... 28

6.1. Power supply specifications .................................................................................................................. 28

6.2. Environmental Specifications ................................................................................................................ 28

7. BIOS Setup ................................................................................................................................................. 29

7.1. Main Menu ............................................................................................................................................ 29

7.1.1. System Date ................................................................................................................................. 29

7.1.2. System Time ................................................................................................................................. 29

7.1.3. System Information ....................................................................................................................... 29

7.1.4. Boot Features ............................................................................................................................... 30

7.1.5. Error Manager............................................................................................................................... 30

7.2. Advanced Menu .................................................................................................................................... 31

7.2.1. Select Language ........................................................................................................................... 31

7.2.2. ACPI Configuration ....................................................................................................................... 31

7.2.3. Processor Configuration ............................................................................................................... 32

7.2.4. Peripheral Configuration ............................................................................................................... 34

7.2.5. HDD Configuration ....................................................................................................................... 35

7.2.6. Memory Configuration .................................................................................................................. 36

7.2.7. System Agent (SA) Configuration................................................................................................. 36

7.2.8. South Bridge Configuration .......................................................................................................... 41

7.2.9. Network Configuration .................................................................................................................. 44

7.2.10. LPC Configuration ...................................................................................................................... 44

7.2.11. SMBIOS Event Log .................................................................................................................... 45

7.2.12. ME Configuration ........................................................................................................................ 45

7.2.13. Thermal Configuration ................................................................................................................ 46

7.2.14. ICC Configuration ....................................................................................................................... 47

7.2.15. Intel Rapid Start Technology ...................................................................................................... 48

7.3. Security Menu ....................................................................................................................................... 49

7.4. Boot Menu ............................................................................................................................................. 49

7.5. Exit Menu .............................................................................................................................................. 49

Important User Information

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1. Important User Information

In order to lower the risk of personal injury, electric shock, fire, or equipment damage, users must

observe the following precautions as well as good technical judgment, whenever this product is

installed or used.

All reasonable efforts have been made to ensure the accuracy of this document; however, Eurotech

assumes no liability resulting from any error/omission in this document or from the use of the

information contained herein.

Eurotech reserves the right to revise this document and to change its contents at any time without

obligation to notify any person of such revision or changes. Reproduction of all or part of this

document without Eurotech’s permission is prohibited.

1.1 Safety Notices and Warnings

The following general safety precautions must be observed during all phases of operation, service, and

repair of this equipment. Failure to comply with these precautions or with specific warnings elsewhere

in this manual violates safety standards of design, manufacture, and intended use of the equipment.

Eurotech assumes no liability for the customer’s failure to comply with these requirements.

The safety precautions listed below represent warnings of certain dangers of which Eurotech is aware.

You, as the user of the product, should follow these warnings and all other safety precautions

necessary for the safe operation of the equipment in your operating environment.

Alerts that can be found throughout this manual

The following alerts are used within this manual and indicate potentially dangerous situations.

Danger, electrical shock hazard:

Information regarding potential electrical shock hazards:

Personal injury or death could occur. Also damage to the system, connected peripheral

devices, or software could occur if the warnings are not carefully followed.

Appropriate safety precautions should always be used, these should meet the

requirements set out for the environment that the equipment will be deployed in.

Warning:

Information regarding potential hazards:

Personal injury or death could occur. Also damage to the system, connected peripheral

devices, or software could occur if the warnings are not carefully followed.

Appropriate safety precautions should always be used, these should meet the

requirements set out for the environment that the equipment will be deployed in.

Information and/or Notes:

These will highlight important features or instructions that should be observed.

Protect the device from vibration and impact

Do not place the product in a location where it can fall or can be subject to vibration or impact because

this may cause device failure.

Do not modify the device

For safety reasons, under no circumstances should you modify the device. Eurotech will not repair

products that have been modified.

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Protect the product from water and chemicals

Contact between the product and water or chemicals can result in product failure, electrocution, or fire.

Protect the product from foreign material

Make sure that foreign material does not get into the product during use, storage, or transport because

this can result in product failure.

Use precautions in handling to ensure that you are not injured

The sharp projections on this product may cause injury. Take care in handling this product in order to

avoid injury.

Do not disassemble the product

In order to maintain guaranteed product performance, do not disassemble this product under any

circumstances.

Keep the product away from radios and TVs

Do not use the product near radios, television sets, or other devices generating strong magnetic or

electrical fields. This could result in failure or malfunction.

Keep the product away from flame, humidity, and direct sunlight

Do not use or store the product in any of the following locations, as this could result in product failure:

 Places where there is fire

 Locations high in humidity or exposed to rain

 Locations exposed to direct sunlight

 Dusty or dirty locations

 Locations containing excessive water or chemical vapors

Install the product in well-ventilated locations

Install the product in well-ventilated locations to efficiently disperse heat generated by the product.

Remove the power plug from the receptacle when not using the product

Turn off the main switch and remove the power plug from the receptacle when not using the product or

when there is the risk of lightning strike.

Use the device within rated parameters

Be sure to use the product within the ratings specified in this manual. Failure to do so may result in

malfunction.

Use care when cleaning the product

If the product becomes dirty, wipe it with a dry soft cloth. A thinned neutral cleaner may be used if the

product is particularly dirty. Do not use benzene, thinners, or other solvents under any circumstances.

Ground the product in order to prevent electrocution

Be sure to ground the product by connecting it to a 3-pole AC receptacle or by using an AC receptacle

having a grounding terminal.

Dispose of the product properly

Use appropriate methods for handling industrial wastes when disposing of this product.

Wire the product correctly

Failure to wire the product correctly can result in malfunction or fire. Read this manual and wire the

product correctly.

Important User Information

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Use antistatic precautions

This product comprises electronic parts that are highly susceptible to static electricity. Static electricity

can cause the product to malfunction. Take care not to touch any of the terminals, connectors, ICs, or

other parts with the hands.

Do not use a malfunctioning product

Stop using the product if you believe it is malfunctioning. Continuing to use a malfunctioning product

can cause the malfunction to spread to other products and can cause short circuits or fire.

1.2 Life Support Policy

Eurotech products are not authorized for use as critical components in life support devices or systems

without the express written approval of Eurotech.

1.3 Warranty

For warranty terms and conditions users should contact their local Eurotech Sales Office.

1.4 RoHS

This device, including all its components, subassemblies and the consumable materials that are an

integral part of the product, has been manufactured in compliance with the European directive

2002/95/EC known as the RoHS directive (Restrictions on the use of certain Hazardous Substances).

This directive targets the reduction of certain hazardous substances previously used in electrical and

electronic equipment (EEE).

1.5 Technical Assistance

If you have any technical questions, cannot isolate a problem with your device, or have any enquiry

about repair and returns policies, contact your local Eurotech Technical Support Team.

Transportation

When transporting any module or system, for any reason, it should be packed using anti-static material

and placed in a sturdy box with enough packing material to adequately cushion it.

Warning:

Any product returned to Eurotech that is damaged due to inappropriate packaging will not be covered by the

warranty.

1.6 Conventions

The following table describes the conventions for signal names used in this document.

Convention

Explanation

GND

Digital ground plane

#

Active low signal

+

Positive signal in differential pair

-

Negative signal in differential pair

NC

No connection

RSVD

Use is reserved to Eurotech

1.7 Electromagnetic Compatibility

This product is intended for industrial assembly only and is not for commercial use. Therefore, this

product is not an apparatus and so does not need to be subject to the EMC Directive.

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2. Summary

Adbc8037 is a basic size CPU Module compliant with the PICMG COM.0 Revision 2.1, and provides

PCI Express Graphics supporting PCI Express Gen3, Graphics DDI, USB3.0 and SATA-600 by using

in the combination of 3rd Generation Intel® Core i7 processors and the Mobile Intel® QM77 Express

chipset.

In addition to the above interfaces, Adbc8037 has the newly-defined type 6 pin layout for the COM

Express connector, in order to support multiple displays and USB3.0.

Moreover, with soldered down the ECC memory directly to the board, its high reliability is ensured.

Customer can choose the size of the processor and memory in accordance with the needs of each

application.

The lineup as of 5th June is shown in Table 1.

The standard configurations support the Intel® Core i7-3615QE (2.3GHz, Quad Core) and i7-3517UE

(1.7GHz, Dual Core) processors.

The memory size is installable from 2GB up to 8GB.

Product Lineup Table 1.

Memory

capacity

i7-3615QE

(SV/4core/2.3GHz/45W)

i7-3612QE

(SV/4core/2.1GHz/35W)

i7-3555LE

(LV/2core/2.5GHz/25W)

i7-3517UE

(ULV/2core/1.7GHz/17W)

2GB

-

producing

4GB

-

8GB

producing

-

As for the other lineup , please contact at sa[email protected]

2.1. Features

Adbc8037 has the following features:

 Embedded board for industrial equipment application

 3rd Generation Intel® Core i7 Processor

 ECC supported DDR3 1600 memory direct-mounted on board (maximum capacity of memory: 8GB)

 COM Express Basic Module size (125mm x 95mm)

 PICMG COM.0 Rev 2.1 compliant COM Express CPU module (type6 pin-out)

o 16 lanes of PCI Express Graphics(Gen3)

o 6 lanes of PCI Express(Gen2)

o 1 port of Analog VGA

o 3 ports of Graphics DDI

o 4 ports of USB2.0

o 2 ports of USB3.0

o 2 ports of SATA-600 interface

o 2 ports of SATA-300 interface

o 1 port of LAN(GbE)

 RoHS compliant

Summary

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2.2. Block Diagram

Adbc8037 Block Diagram is shown in Figure.1.

Figure 1. Block Diagram

PCIe

3rd Generation

Intel

Core Processor

Intel QM77

Chipset

PCIe

DDI1

DDI2

DDI3

VGA

SATA-300

SATA-600

USB2.0

USB3.0

PCIe

LPC

SMBus1

DDR3 1600

SDRAM with ECC

DDR3 1600

SDRAM with ECC

Multiplexer

CPLD

Ethernet

Intel 82579

SMBus0

SPI

Bus

Switch

BIOS

X16

X4

X1

Gen3

Gen2

X8

FDI

X4

DMI2

COM Express

Connector

PCIe

DisplayPort

VGA

SATA

USB2.0

USB3.0

LAN (GbE)

I

2

C

SMBus

LPC

SPI

72

USB2.0

4

X4

PCIe

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3. Hardware Specifications

The hardware specifications are shown in Table 2.

Hardware Specifications Table 2.

Item

Specifications

Processor

i7-3615QE

i7-3612QE

i7-3555LE

i7-3517UE

cores

4

2

TDP

45W

35W

25W

17W

Operation frequency (When

turbo boost is used)

2.3GHz

(3.3GHz)

2.1GHz

(3.1GHz)

2.5GHz

(3.2GHz)

1.7GHz

(2.8GHz)

L1 cache

32kB for data, 32kB for instruction (per core)

L2 cache

256kB for data and instruction (per core)

L3 cache

6MB

4MB

Memory

Main Memory

DDR3-1600 SDRAM

Memory capacity：Max8GB(2GB or 4GB or 8GB to

selection is possible.)

ECC compliant

Chipset

Model

BD82QM77

COM Express

PCI Express Graphics(Gen3)

16 lanes

PCI Express(Gen2)

6 lanes

USB 2.0

4 ports

USB 3.0

2 ports

SATA-300

2 ports

SATA-600

2 ports

LAN(GbE)

1 port

LPC

1 port

SPI

1 port

DDI

3 ports

VGA

1 port

SMBus

1 port

I

2

C

1 port

Other

Support functions and the following signals:

・Suspend Status

・External BIOS ROM Support

・Reset

・Thermal Protection

・Battery Low Alarm

・Power button

・Power Good

・Speaker

*The ExpressCard function is not supported.

On board IO

LED

2 (Green and Red)

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3.1. Processor

3.1.1. Processor Options

The following processors are available at factory option:

Processor Options Table 3.

Processor

Core

Thread

Operation

frequency

Maximum frequency

of in-use turbo boost

Max TDP

i7-3615QE

4

8

2.3GHz

3.3G Hｚ

45W

i7-3612QE

4

8

2.1GHz

3.1GHｚ

35W

i7-3555LE

2

4

2.5GHz

3.2GHｚ

25W

i7-3517UE

2

4

1.7GHz

2.8GHｚ

17W

3.1.2. Cache Memory

CPU has the following cache memory:

 L1 cache

32kB for data, 32kB for instruction (per core)

 L2 cache

256kB for data and instruction (per core)

 L3 cache (shared by all cores)

o Intel® CoreTM i7-3615QE 6MB

o Intel® CoreTM i7-3612QE 6MB

o Intel® CoreTM i7-3555LE 4MB

o Intel® CoreTM i7-3517UE 4MB

3.2 Memory

Adbc8037 memory is shown below.

3.2.1. Main Memory

The main memory of Adbc8037 is DDR3-1600 SDRAM.

You can choose the memory capacity from 2GB, 4GB, or 8GB at factory option.

It supports ECC, automatically corrects 1-bit error, and also detects 2-bit errors.

3.2.2. Boot ROM

This is a SPI-FLASH memory directly-mounted on Adbc8037 with 8MB of capacity.

It saves BIOS data.

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3.3. COM Express

Adbc8037 has the newly-defined type 6 pin layout, and is satisfied all the functions except

ExpressCard. The followings are the detail of each interface.

3.3.1. PCI Express Graphics (PEG)

This interface is compliant with PCI Express Rev3.0 standard (8GT/s per-lane), and composed of

sixteen-lane. The PCI Express link configuration Graphics is selectable one from three choices in

Table 4. Customer cannot change once the configuration is set up due to the factory default.

If the configuration is not specified, the factory default is selected as the link configuration 3. The lane

reverse is not supported.

PCI Express Graphics Link Configuration Table 4.

COM Express

Pin Name

PCI Express

Lane

Link Configuration

1

Link Configuration

2

Link Configuration

3(Default)

PCIE15

15

X 4

X 8

X 16

PCIE14

14

PCIE13

13

PCIE12

12

PCIE11

11

X 4

PCIE10

10

PCIE9

9

PCIE8

8

PCIE7

7

X 8

PCIE6

6

PCIE5

5

PCIE4

4

PCIE3

3

PCIE2

2

PCIE1

1

PCIE0

0

3.3.2. PCI Express

This interface is compliant with PCI Express Rev2.0 standard (5GT/s per-lane), and composed of six-

lane.

The PCI Express link configuration is selectable one from four choices in Table 5 by setting BIOS. The

default setting is the configuration 4.

PCI Express Link Configuration Table 5.

COM

Express

Pin Name

PCI Express

Lane

Link

Configuration 1

Link

Configuration 2

Link

Configuration 3

Link

Configuration 4

(Default)

PCIE5

4

X 1

PCIE4

3

X 1

PCIE3

8

X 1

X 2

X 4

PCIE2

7

X 1

PCIE1

6

X 1

X 2

PCIE0

5

X 1

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3.3.3. USB2.0

This interface is compliant with USB2.0 standard (maximum transfer speed: 480Mb/s), and composed

of four ports.

3.3.4. USB3.0

This interface is compliant with USB3.0 standard (maximum transfer speed: 5Gb/s), and composed of

two ports.

3.3.5. SATA

This interface is compliant with SATA-600 (maximum transfer speed: 6Gb/s) and SATA-300 (maximum

transfer speed: 3Gb/s) standard, and composed of four ports.

The SATA configuration to connect between QM77 (PCH) and COM Express connector is shown in

Table 6.

SATA Configuration Table 6.

SATA

PCH

COM Express Connector

SATA-600

SATA0

A16,A17,A19,A20

SATA-600

SATA1

B16,B17,B19,B20

SATA-300

SATA2

A22,A23,A25,A26

SATA-300

SATA3

B22,B23,B25,B26

3.3.6. LAN

This interface is compliant with 10/100/1000Base-T standard, and composed of one port.

QM77 MAC and Intel EthernetPHY(82579) used.

3.3.7. LPC

This interface is compliant with LPC1.1 standard, and composed of one port.

The super I/O controller is LPC47M107S manufactured by SMSC that we have used.

3.3.8. SPI

This interface has an operating frequency of 16MHz, and is composed of one port.

The BIOS is bootable from the ROM that is connected to this port.

Any way other than the above is not considered.

Please refer to the “3.3.15. External BIOS ROM Support page 15 for the BIOS boot.

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3.3.9. Graphics DDI

This interface is compliant with DisplayPort 1.1a standard, and composed of three ports.

Supporting the dual-mode DisplayPort (DP++), it is switchable between DisplayPort and HDMI / DVI

using DDIx_DDC_AUX_SEL signal.

When using as DisplayPort, please float the signal on carrier board.

When using as HDMI or DVI, please pull the signal up to 3.3V at 100KΩ on the carrier board.

When using as DisplayPort support up to 2560x1600@60Hz and 24bpp (full-color: 16777216), while

HDMI or DVI support up to 1920x1200@60Hz and 24bpp (full-color : 16777216).

Adbc8037 can output to up to three monitors.

The composition is shown in Table 7.

Display composition Table 7.

Monitor

Configuration1

Monitor

Configuration2

Monitor

Configuration3

Display1

DisplayPort

Any Display

*1

Any Display

*1

Display2

DisplayPort

Any Display

*1

-

Display3

Any Display

*1

-

*1 : DisplayPort / HDMI / DVI/Analog VGA

3.3.10. Analog VGA

This interface is Analog VGA port for VGA monitor, and composed of one port.

It support up to 1920x1200@60Hz and 24bpp (full-color: 16777216).

3.3.11. SMBus

（

System Management Bus

）

This interface is composed of one port.

Each SMBus signal is pulled up to 3.3V on the board.

3.3.12. I

2

C bus

This interface is composed of one port.

Each I

2

C bus signal is pulled up to 3.3V on the board.

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3.3.13. GPIO

3.3.13.1. GPI

Adbc8037 is supporting four GPI (General Purpose Input) signals. Each GPI signal is connected to the

GPIO pin of Intel QM77 PCH, and enables to read out the status from the corresponding register.

The assignment of GPI signal is shown in Table 8.

GPI control register Table 8.

Signal

Intel QM77 connecting pin

Supporting register bit

GPI0

GPIO68

GP_LVL3 bit 4

GPI1

GPIO69

GP_LVL3 bit 5

GPI2

GPIO70

GP_LVL3 bit 6

GPI3

GPIO71

GP_LVL3 bit 7

When GPIx is input High, the register value is ‘1’. When GPIx is input Low, the register value is ‘0’.

3.3.13.2. GPO

Adbc8037 is supporting four GPO (General Purpose Output) signals

Each GPI signal is connected to the GPIO pin of Intel QM77 PCH, and enables to control output by

setting any given value to the corresponding register. The assignment of GPO signal is shown in Table 9.

GPO control register Table 9.

Signal

Intel QM77 connecting

Supporting register bit

Initial setting

(logic level)

GPO0

GPIO8

GP_LVL bit 8

High

GPO1

GPIO15

GP_LVL bit 15

Low

GPO2

GPIO24

GP_LVL bit 24

Low

GPO3

GPIO28

GP_LVL bit 28

Low

When the register value is “1”, GPOx is output High. When the register value is “0”, GPOx is output

Low.

3.3.14. Suspend Status

Adbc8037 is supporting SUS_STAT#, SUS_S3#, SUS_S4#, SUS_S5# and WAKE0# signals.

3.3.15. External BIOS ROM Support

Adbc8037 is supporting BIOS_DIS0# signal, and BIOS boot destination is selectable.

BIOS_DIS1# signal is not supported.

The following is the selection method by processing the BIOS_DIS0# signal on the carrier board.

-When BIOS_DIS0# is floating: BIOS boot from SPI_FLASH memory on Adbc8037

-When BIOS_DIS0# is short the GND: BIOS boot from SPI_FLASH memory on the carrier board

3.3.16. Reset

Adbc8037 is supporting the SYS_RESET# and CB_RESET# signals.

CB_RESET# signal is an output signal to carrier board and used to reset the devices on the carrier

board, while the SYS_RESET# signal is an input signal from carrier board.

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3.3.17. Thermal Protection

Adbc8037 is supporting THRM# and THRMTRIP# signals.

THRM# is an input signal from carrier board.

The status of the THRM# can be referred to “3.6.3.2. Status Register page 19”.

THRMTRIP# is an output signal to carrier board.

The low status of THRMTRIP# indicates the thermal shutdown of the CPU.

3.3.18. Battery Low Alarm

Adbc8037 is supporting BATLOW# signal.

BATLOW# is an input signal from carrier board.

The status of BATLOW# can be referred to “3.6.3.2. Status Register page 19”.

3.3.19. Power button

Adbc8037 is supporting the PWRBTN# signal.

PWRBTN# is an input signal from carrier board.

3.3.20. Power Good

Adbc8037 is supporting the PWR_OK signal.

The PWR_OK signal is an input signal from carrier board.

Adbc8037 start to supply the power to on-board device, after PWR_OK asserted.

3.3.21. Speaker

Adbc8037 is supporting the SPKR signal for speaker output.

3.4. LED

Adbc8037 has green and red LEDs.

The conditions for turning on and off the LEDs are shown in Table 10.

LED Condition Table 10.

LED_EN

*2

PCH platform reset

*3

LED1(Green)

LED2(Red)

0

Assert

OFF

ON

de-assert

ON

OFF

1

-

GRN_LED=’1’→ ON

RED_LED=’1’→ ON

-

GRN_LED=’0’→ OFF

RED_LED=’0’→ OFF

*2 : Refer to” 3.6.3.1. LED Control Register (offset：0000h) page 19” for a setup of LED_EN.

*3 : Assert of PCH platform reset means that the internal board is being initialized, and de-assert means

that the initialization is finished.

Hardware Specifications

17

B31055B0-MN002-01

3.5. I

2

C＆SMBus multiplexer

Adbc8037 has two SMBus ports (SMBus0 and SMBus1) compliant with SMBus 2.0.

SMBus0 is for Ethernet PHY only, while SMBus1 is connected to devices on Adbc8037 (refer to the

Figure. 11) and CN4 (COM Express stacking connector).

SMBus1 is connected to 4-channel I

2

C multiplexer for address expansion (and separate the address

between Adbc8037 and Carier board).

Two channels out of 4-channel I

2

C multiplexer are connected to COM Express connector, while the

remaining two channels are not in use.

The SMBus1 address map is shown in Table 11.

SMBus Address Map Table 11.

Device

Address

Main Memory SPD (channel A)

1010 000b

Main memory SPD (channel B)

1010 001b

I

2

C multiplexer (PCA9544APW)

1110 000b

I

2

C multiplexer channel map is shown in Table 12.

I

2

C multiplexer channel map Table 12.

Device

Address

Unused

0

SMBus device on the carrier board

1

I

2

C device on the carrier board

2

Unused

3

Channel is not selected after BIOS start up. Do not switch to channel 0 or channel 3 as they are

unused.

Please refer to the PCA9544APW (TI) datasheet for I

2

C multiplexer setting method.

Adbc8037 - User Manual

18

B31055B0-MN002-01

3.6. Address Map

3.6.1. I/O space

I/O space Address Map is shown in Table 13

I/O space Address Map Table 13.

Device

Address

DMA Controller

0000h - 001Fh

Interrupt Controller

0020h - 002Dh

LPC SIO

002Eh - 002Fh

Interrupt Controller

0030h - 003Dh

Timer/Counter

0040h - 0043h

LPC SIO

004Eh - 004Fh

Timer/Counter

0050h - 0053h

Microcontroller

0060h

NMI Controller

0061h

Microcontroller

0062h - 0066h

RTC Controller

0070h - 0077h

DMA Controller

0080h - 0091h

Reset Generator

0092h

DMA Controller

0093h - 009Fh

Interrupt Controller

00A0h - 00B1h

Power Management

00B2h - 00B3h

Interrupt Controller

00B4h - 00BDh

DMA Controller

00C0h - 00DFh

PCI and Master Abort

00F0h

Serial ATA

0170h - 0177h

Serial ATA

01F0h - 01F7h

Serial ATA

0376h

Serial ATA

03F6h

Interrupt Controller

04D0h - 04D1h

Reset Generator

0CF9h

3.6.2. Memory space

Memory space Address Map is shown in Table 14

Memory space Address Map Table 14.

Device

Address

Main Memory

0000_0000h

--- 000D_FFFFh

LPC(BIOS)

*4

000E_0000h

--- 000F_FFFFh

Main Memory / PCI Device

0010_0000h

--- TOM

*5

I/O APIC

FEC0_0000h

--- FECF_FFFFh

High Precision Event Timers

FED0_0000h

--- FED0_33FFh

TPM on LPC

FED4_0000h

--- FED4_BFFFh

LPC(BIOS)

*4

FF00_0000h

--- FFFF_FFFFh

*4 : Occupied area depends on the setting of Firmware Hub Decode Enable.

*5 : Most significant address depends on the setting of TOM register.

Hardware Specifications

19

B31055B0-MN002-01

3.6.3. CPLD Internal Register

CPLD Internal Register is shown in Table 15

PLD Internal Register map Table 15.

Register Name

Address

Item

LED Control Register

0000h

3.6.3.1.

Status Register

0001h

3.6.3.2.

The CPLD is mounted as internal control logic on Adbc8037.

CPLD internal register is accessible by LPC bus of “3.3.7. LPC page 13 “. The base address is 0280h.

The register is configured with 8-bit. Both Read (shown below as: R) and Write (shown below as: W)

are performed by 8-bit length.

R/W : Read and Write

RO : Read only (ignore Write)

WO : Write only (Read value is not defined)

3.6.3.1. LED Control Register (offset：0000h)

This register controls LED on board.

LED Control Register Table 16.

bit

Name

Meaning

initial

value

Access

7..3

RSVD

00000

RO

2

LED_EN

1：RED/GRN_LED control enabled

0：RED/GRN_LED control disabled

0

R/W

1

RED_LED

1：LED(RED) On

0：LED(RED) Off

0

R/W

0

GRN_LED

1：LED(GRN) On

0：LED(GRN) Off

0

R/W

LED_EN=’0’ : RED_LED turns on during assertion of the Platform reset that is output by

PCH,while GRN_LED turns on during de-assertion. Please refer to “3.4. LED page 16” for further

details.

3.6.3.2. Status Register

This register reports input signal status from carrier board.

Status Register Table 17.

bit

Name

Meaning

initial

value

Access

7..4

RSVD

000000

RO

3

BIOS_DISABLE#

Request signal from carrier board

-

RO

2

THRM#

1：Temperature sensor on carrier board shows a

normal value

0：Temperature sensor on carrier board is shows

an abnormal value

-

RO

1

BATLOW#

1：battery voltage on carrier board is a normal value

0：battery voltage on carrier board is an abnormal value

-

RO

0

RSVD

0

RO

Adbc8037 - User Manual

20

B31055B0-MN002-01

3.6.4. PCI

PCI devices are shown in Table 18.

List of PCI devices Table 18.

Bus

number

Device

number

Function

number

Device

Device model

number

0

DRAM Controller

Intel

®

Core

TM

i7

1

0

PCI Express Controller 1

Intel

®

Core

TM

i7

1

PCI Express Controller 2

Intel

®

Core

TM

i7

2

PCI Express Controller 3

Intel

®

Core

TM

i7

2

0

Integrated Graphics Device

Intel

®

Core

TM

i7

6

0

PCI Express Controller 4

Intel

®

Core

TM

i7

22

0

Intel

®

Management Engine Interface #1

Intel

®

QM77

1

Intel

®

Management Engine Interface #2

Intel

®

QM77

2

IDE-R

Intel

®

QM77

3

KT

Intel

®

QM77

25

0

Gigabit Ethernet Controller

Intel

®

QM77

26

0 to 7

USB EHCI Controller #2

Intel

®

QM77

27

0 to 7

Intel

®

High Definition Audio Controller

Intel

®

QM77

28

0

PCI Express Port 1

Intel

®

QM77

1

PCI Express Port 2

Intel

®

QM77

2

PCI Express Port 3

Intel

®

QM77

3

PCI Express Port 4

Intel

®

QM77

4

PCI Express Port 5

Intel

®

QM77

5

PCI Express Port 6

Intel

®

QM77

6

PCI Express Port 7

Intel

®

QM77

7

PCI Express Port 8

Intel

®

QM77

29

0 to 7

USB EHCI Controller #1

Intel

®

QM77

30

0

PCI-to-PCI Bridge

Intel

®

QM77

31

0

LPC Controller

Intel

®

QM77

2

SATA Controller #1

Intel

®

QM77

3

SMBus Controller

Intel

®

QM77

5

SATA Controller #2

Intel

®

QM77

6

Thermal Subsystem

Intel

®

QM77

M

*6

－

PCI Express

－

*6 : M depends on the largest bus number shown on PCI Express.

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