Eurotech Adbc8037 Owner's manual

Adbc8037
Eurotech
Brand
Eurotech
Model
Adbc8037
Category
Motherboards
Type
Owner's manual
Second edition – March 2014 – B31055B0-MN002-01
USER MANUAL
Adbc8037
Computer On Module
DIGITAL TECHNOLOGIES FOR A BETTER WORLD
www.eurotech.com
DIGITAL TECHNOLOGIES FOR A BETTER WORLD
www.eurotech.com
© 2014 Advanet Inc.
Preface
Thank you for choosing the Adbc8037. Please read this manual before using the Adbc8037 so that
you may obtain the greatest benefit from using the device.
This manual presents the specifications, functions, and method of use of the Adbc8037.
Eurotech has made every effort to carefully inspect each product and has taken great care to package
and to ship the product. In the unlikely event of the product’s failure to operate normally due to
problems in shipping or otherwise, the company will repair or replace the product at its own
responsibility.
If you have any questions, contact your local Eurotech Sales Office.
Trademarks
All trademarks both marked and not marked appearing in this document are the property of their
respective owners.
This document does not give permission to the implementation of patents or other rights held by
Eurotech or third parties.
Document Revision History
VERSION
DATE
Publication Number
First edition
Jun 26,2013 Issued
B31055B0-MN002-00
Second edition
Mar 28,2014 Issued
B31055B0-MN002-01
DIGITAL TECHNOLOGIES FOR A BETTER WORLD
www.eurotech.com
Table of Contents
3
Table of Contents
Document Revision History ............................................................................................................................ 2
Table of Contents ............................................................................................................................................ 3
1. Important User Information ........................................................................................................................ 5
1.1 Safety Notices and Warnings ................................................................................................................... 5
1.2 Life Support Policy ................................................................................................................................... 7
1.3 Warranty ................................................................................................................................................... 7
1.4 RoHS ........................................................................................................................................................ 7
1.5 Technical Assistance ............................................................................................................................... 7
1.6 Conventions ............................................................................................................................................. 7
1.7 Electromagnetic Compatibility .................................................................................................................. 7
2. Summary ...................................................................................................................................................... 8
2.1. Features .................................................................................................................................................. 8
2.2. Block Diagram ......................................................................................................................................... 9
3. Hardware Specifications ........................................................................................................................... 10
3.1. Processor .............................................................................................................................................. 11
3.1.1. Processor Options ........................................................................................................................ 11
3.1.2. Cache Memory ............................................................................................................................. 11
3.2 Memory .................................................................................................................................................. 11
3.2.1. Main Memory ................................................................................................................................ 11
3.2.2. Boot ROM ..................................................................................................................................... 11
3.3. COM Express ........................................................................................................................................ 12
3.3.1. PCI Express Graphics (PEG) ....................................................................................................... 12
3.3.2. PCI Express .................................................................................................................................. 12
3.3.3. USB2.0 ......................................................................................................................................... 13
3.3.4. USB3.0 ......................................................................................................................................... 13
3.3.5. SATA ............................................................................................................................................ 13
3.3.6. LAN ............................................................................................................................................... 13
3.3.7. LPC ............................................................................................................................................... 13
3.3.8. SPI ................................................................................................................................................ 13
3.3.9. Graphics DDI ................................................................................................................................ 14
3.3.10. Analog VGA ................................................................................................................................ 14
3.3.11. SMBus
（
System Management Bus
）
........................................................................................... 14
3.3.12. I
2
C bus ........................................................................................................................................ 14
3.3.13. GPIO ........................................................................................................................................... 15
3.3.14. Suspend Status .......................................................................................................................... 15
3.3.15. External BIOS ROM Support ...................................................................................................... 15
3.3.16. Reset .......................................................................................................................................... 15
3.3.17. Thermal Protection ..................................................................................................................... 16
3.3.18. Battery Low Alarm ...................................................................................................................... 16
3.3.19. Power button............................................................................................................................... 16
3.3.20. Power Good ................................................................................................................................ 16
3.3.21. Speaker ...................................................................................................................................... 16
3.4. LED ....................................................................................................................................................... 16
3.5. I
2
C＆SMBus multiplexer ........................................................................................................................ 17
3.6. Address Map ......................................................................................................................................... 18
3.6.1. I/O space ...................................................................................................................................... 18
3.6.2. Memory space .............................................................................................................................. 18
3.6.3. CPLD Internal Register ................................................................................................................. 19
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3.6.4. PCI ................................................................................................................................................ 20
4. Mechanical Specifications ........................................................................................................................ 21
4.1. External Dimension ............................................................................................................................... 21
4.2. Attachment to Carrier Board ................................................................................................................. 22
4.3. Heat Spreader ....................................................................................................................................... 23
5. Connectors and Jumpers ......................................................................................................................... 24
5.1. Adbc8037 On-board Components ........................................................................................................ 24
5.1.1. 12V Auxiliary Power Connector .................................................................................................... 24
5.2. Setting ................................................................................................................................................... 25
5.2.1. JP1 (CMOS clear pin) ................................................................................................................... 25
5.2.2. CN1 (SPI-ROM writing connector) ............................................................................................... 25
5.2.3. CN3 (CPLD data writing connector) ............................................................................................. 25
5.3. Pin Layout ............................................................................................................................................. 26
5.3.1. CN4 (COM Express stacking connector) ..................................................................................... 26
6. System Specifications............................................................................................................................... 28
6.1. Power supply specifications .................................................................................................................. 28
6.2. Environmental Specifications ................................................................................................................ 28
7. BIOS Setup ................................................................................................................................................. 29
7.1. Main Menu ............................................................................................................................................ 29
7.1.1. System Date ................................................................................................................................. 29
7.1.2. System Time ................................................................................................................................. 29
7.1.3. System Information ....................................................................................................................... 29
7.1.4. Boot Features ............................................................................................................................... 30
7.1.5. Error Manager............................................................................................................................... 30
7.2. Advanced Menu .................................................................................................................................... 31
7.2.1. Select Language ........................................................................................................................... 31
7.2.2. ACPI Configuration ....................................................................................................................... 31
7.2.3. Processor Configuration ............................................................................................................... 32
7.2.4. Peripheral Configuration ............................................................................................................... 34
7.2.5. HDD Configuration ....................................................................................................................... 35
7.2.6. Memory Configuration .................................................................................................................. 36
7.2.7. System Agent (SA) Configuration................................................................................................. 36
7.2.8. South Bridge Configuration .......................................................................................................... 41
7.2.9. Network Configuration .................................................................................................................. 44
7.2.10. LPC Configuration ...................................................................................................................... 44
7.2.11. SMBIOS Event Log .................................................................................................................... 45
7.2.12. ME Configuration ........................................................................................................................ 45
7.2.13. Thermal Configuration ................................................................................................................ 46
7.2.14. ICC Configuration ....................................................................................................................... 47
7.2.15. Intel Rapid Start Technology ...................................................................................................... 48
7.3. Security Menu ....................................................................................................................................... 49
7.4. Boot Menu ............................................................................................................................................. 49
7.5. Exit Menu .............................................................................................................................................. 49
Important User Information
5
1. Important User Information
In order to lower the risk of personal injury, electric shock, fire, or equipment damage, users must
observe the following precautions as well as good technical judgment, whenever this product is
installed or used.
All reasonable efforts have been made to ensure the accuracy of this document; however, Eurotech
assumes no liability resulting from any error/omission in this document or from the use of the
information contained herein.
Eurotech reserves the right to revise this document and to change its contents at any time without
obligation to notify any person of such revision or changes. Reproduction of all or part of this
document without Eurotech’s permission is prohibited.
1.1 Safety Notices and Warnings
The following general safety precautions must be observed during all phases of operation, service, and
repair of this equipment. Failure to comply with these precautions or with specific warnings elsewhere
in this manual violates safety standards of design, manufacture, and intended use of the equipment.
Eurotech assumes no liability for the customer’s failure to comply with these requirements.
The safety precautions listed below represent warnings of certain dangers of which Eurotech is aware.
You, as the user of the product, should follow these warnings and all other safety precautions
necessary for the safe operation of the equipment in your operating environment.
Alerts that can be found throughout this manual
The following alerts are used within this manual and indicate potentially dangerous situations.
Danger, electrical shock hazard:
Information regarding potential electrical shock hazards:
Personal injury or death could occur. Also damage to the system, connected peripheral
devices, or software could occur if the warnings are not carefully followed.
Appropriate safety precautions should always be used, these should meet the
requirements set out for the environment that the equipment will be deployed in.
Warning:
Information regarding potential hazards:
Personal injury or death could occur. Also damage to the system, connected peripheral
devices, or software could occur if the warnings are not carefully followed.
Appropriate safety precautions should always be used, these should meet the
requirements set out for the environment that the equipment will be deployed in.
Information and/or Notes:
These will highlight important features or instructions that should be observed.
Protect the device from vibration and impact
Do not place the product in a location where it can fall or can be subject to vibration or impact because
this may cause device failure.
Do not modify the device
For safety reasons, under no circumstances should you modify the device. Eurotech will not repair
products that have been modified.
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Protect the product from water and chemicals
Contact between the product and water or chemicals can result in product failure, electrocution, or fire.
Protect the product from foreign material
Make sure that foreign material does not get into the product during use, storage, or transport because
this can result in product failure.
Use precautions in handling to ensure that you are not injured
The sharp projections on this product may cause injury. Take care in handling this product in order to
avoid injury.
Do not disassemble the product
In order to maintain guaranteed product performance, do not disassemble this product under any
circumstances.
Keep the product away from radios and TVs
Do not use the product near radios, television sets, or other devices generating strong magnetic or
electrical fields. This could result in failure or malfunction.
Keep the product away from flame, humidity, and direct sunlight
Do not use or store the product in any of the following locations, as this could result in product failure:
Places where there is fire
Locations high in humidity or exposed to rain
Locations exposed to direct sunlight
Dusty or dirty locations
Locations containing excessive water or chemical vapors
Install the product in well-ventilated locations
Install the product in well-ventilated locations to efficiently disperse heat generated by the product.
Remove the power plug from the receptacle when not using the product
Turn off the main switch and remove the power plug from the receptacle when not using the product or
when there is the risk of lightning strike.
Use the device within rated parameters
Be sure to use the product within the ratings specified in this manual. Failure to do so may result in
malfunction.
Use care when cleaning the product
If the product becomes dirty, wipe it with a dry soft cloth. A thinned neutral cleaner may be used if the
product is particularly dirty. Do not use benzene, thinners, or other solvents under any circumstances.
Ground the product in order to prevent electrocution
Be sure to ground the product by connecting it to a 3-pole AC receptacle or by using an AC receptacle
having a grounding terminal.
Dispose of the product properly
Use appropriate methods for handling industrial wastes when disposing of this product.
Wire the product correctly
Failure to wire the product correctly can result in malfunction or fire. Read this manual and wire the
product correctly.
Important User Information
7
Use antistatic precautions
This product comprises electronic parts that are highly susceptible to static electricity. Static electricity
can cause the product to malfunction. Take care not to touch any of the terminals, connectors, ICs, or
other parts with the hands.
Do not use a malfunctioning product
Stop using the product if you believe it is malfunctioning. Continuing to use a malfunctioning product
can cause the malfunction to spread to other products and can cause short circuits or fire.
1.2 Life Support Policy
Eurotech products are not authorized for use as critical components in life support devices or systems
without the express written approval of Eurotech.
1.3 Warranty
For warranty terms and conditions users should contact their local Eurotech Sales Office.
1.4 RoHS
This device, including all its components, subassemblies and the consumable materials that are an
integral part of the product, has been manufactured in compliance with the European directive
2002/95/EC known as the RoHS directive (Restrictions on the use of certain Hazardous Substances).
This directive targets the reduction of certain hazardous substances previously used in electrical and
electronic equipment (EEE).
1.5 Technical Assistance
If you have any technical questions, cannot isolate a problem with your device, or have any enquiry
about repair and returns policies, contact your local Eurotech Technical Support Team.
Transportation
When transporting any module or system, for any reason, it should be packed using anti-static material
and placed in a sturdy box with enough packing material to adequately cushion it.
Warning:
Any product returned to Eurotech that is damaged due to inappropriate packaging will not be covered by the
warranty.
1.6 Conventions
The following table describes the conventions for signal names used in this document.
Convention
Explanation
GND
Digital ground plane
#
Active low signal
+
Positive signal in differential pair
-
Negative signal in differential pair
NC
No connection
RSVD
Use is reserved to Eurotech
1.7 Electromagnetic Compatibility
This product is intended for industrial assembly only and is not for commercial use. Therefore, this
product is not an apparatus and so does not need to be subject to the EMC Directive.
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2. Summary
Adbc8037 is a basic size CPU Module compliant with the PICMG COM.0 Revision 2.1, and provides
PCI Express Graphics supporting PCI Express Gen3, Graphics DDI, USB3.0 and SATA-600 by using
in the combination of 3rd Generation Intel® Core i7 processors and the Mobile Intel® QM77 Express
chipset.
In addition to the above interfaces, Adbc8037 has the newly-defined type 6 pin layout for the COM
Express connector, in order to support multiple displays and USB3.0.
Moreover, with soldered down the ECC memory directly to the board, its high reliability is ensured.
Customer can choose the size of the processor and memory in accordance with the needs of each
application.
The lineup as of 5th June is shown in Table 1.
The standard configurations support the Intel® Core i7-3615QE (2.3GHz, Quad Core) and i7-3517UE
(1.7GHz, Dual Core) processors.
The memory size is installable from 2GB up to 8GB.
Product Lineup Table 1.
Memory
capacity
i7-3615QE
(SV/4core/2.3GHz/45W)
i7-3612QE
(SV/4core/2.1GHz/35W)
i7-3555LE
(LV/2core/2.5GHz/25W)
i7-3517UE
(ULV/2core/1.7GHz/17W)
2GB
-
-
-
producing
4GB
-
-
-
-
8GB
producing
-
-
-
As for the other lineup , please contact at sa[email protected]
2.1. Features
Adbc8037 has the following features:
Embedded board for industrial equipment application
3rd Generation Intel® Core i7 Processor
ECC supported DDR3 1600 memory direct-mounted on board (maximum capacity of memory: 8GB)
COM Express Basic Module size (125mm x 95mm)
PICMG COM.0 Rev 2.1 compliant COM Express CPU module (type6 pin-out)
o 16 lanes of PCI Express Graphics(Gen3)
o 6 lanes of PCI Express(Gen2)
o 1 port of Analog VGA
o 3 ports of Graphics DDI
o 4 ports of USB2.0
o 2 ports of USB3.0
o 2 ports of SATA-600 interface
o 2 ports of SATA-300 interface
o 1 port of LAN(GbE)
RoHS compliant
Summary
9
2.2. Block Diagram
Adbc8037 Block Diagram is shown in Figure.1.
Figure 1. Block Diagram
PCIe
3rd Generation
Intel
Core Processor
Intel QM77
Chipset
PCIe
PCIe
PCIe
DDI1
DDI2
DDI3
VGA
SATA-300
SATA-300
SATA-600
SATA-600
USB2.0
USB2.0
USB3.0
USB3.0
PCIe
LPC
SMBus1
DDR3 1600
SDRAM with ECC
DDR3 1600
SDRAM with ECC
Multiplexer
CPLD
Ethernet
Intel 82579
SMBus0
SPI
Bus
Switch
BIOS
X16
X4
X1
X1
Gen3
Gen2
Gen2
Gen2
X8
FDI
X4
DMI2
COM Express
Connector
PCIe
PCIe
PCIe
DisplayPort
DisplayPort
DisplayPort
VGA
SATA
SATA
SATA
SATA
USB2.0
USB2.0
USB3.0
USB3.0
LAN (GbE)
I
2
C
SMBus
LPC
SPI
72
72
USB2.0
USB2.0
USB2.0
USB2.0
4
4
4
X4
X4
X4
PCIe
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3. Hardware Specifications
The hardware specifications are shown in Table 2.
Hardware Specifications Table 2.
Item
Specifications
Processor
Processor
i7-3615QE
i7-3612QE
i7-3555LE
i7-3517UE
cores
4
4
2
2
TDP
45W
35W
25W
17W
Operation frequency (When
turbo boost is used)
2.3GHz
(3.3GHz)
2.1GHz
(3.1GHz)
2.5GHz
(3.2GHz)
1.7GHz
(2.8GHz)
L1 cache
32kB for data, 32kB for instruction (per core)
L2 cache
256kB for data and instruction (per core)
L3 cache
6MB
6MB
4MB
4MB
Memory
Main Memory
DDR3-1600 SDRAM
Memory capacity：Max8GB(2GB or 4GB or 8GB to
selection is possible.)
ECC compliant
Chipset
Model
BD82QM77
COM Express
PCI Express Graphics(Gen3)
16 lanes
PCI Express(Gen2)
6 lanes
USB 2.0
4 ports
USB 3.0
2 ports
SATA-300
2 ports
SATA-600
2 ports
LAN(GbE)
1 port
LPC
1 port
SPI
1 port
DDI
3 ports
VGA
1 port
SMBus
1 port
I
2
C
1 port
Other
Support functions and the following signals:
・Suspend Status
・External BIOS ROM Support
・Reset
・Thermal Protection
・Battery Low Alarm
・Power button
・Power Good
・Speaker
*The ExpressCard function is not supported.
On board IO
LED
2 (Green and Red)
Hardware Specifications
11
3.1. Processor
3.1.1. Processor Options
The following processors are available at factory option:
Processor Options Table 3.
Processor
Core
Thread
Operation
frequency
Maximum frequency
of in-use turbo boost
Max TDP
i7-3615QE
4
8
2.3GHz
3.3G Hｚ
45W
i7-3612QE
4
8
2.1GHz
3.1GHｚ
35W
i7-3555LE
2
4
2.5GHz
3.2GHｚ
25W
i7-3517UE
2
4
1.7GHz
2.8GHｚ
17W
3.1.2. Cache Memory
CPU has the following cache memory:
L1 cache
32kB for data, 32kB for instruction (per core)
L2 cache
256kB for data and instruction (per core)
L3 cache (shared by all cores)
o Intel® CoreTM i7-3615QE 6MB
o Intel® CoreTM i7-3612QE 6MB
o Intel® CoreTM i7-3555LE 4MB
o Intel® CoreTM i7-3517UE 4MB
3.2 Memory
Adbc8037 memory is shown below.
3.2.1. Main Memory
The main memory of Adbc8037 is DDR3-1600 SDRAM.
You can choose the memory capacity from 2GB, 4GB, or 8GB at factory option.
It supports ECC, automatically corrects 1-bit error, and also detects 2-bit errors.
3.2.2. Boot ROM
This is a SPI-FLASH memory directly-mounted on Adbc8037 with 8MB of capacity.
It saves BIOS data.
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3.3. COM Express
Adbc8037 has the newly-defined type 6 pin layout, and is satisfied all the functions except
ExpressCard. The followings are the detail of each interface.
3.3.1. PCI Express Graphics (PEG)
This interface is compliant with PCI Express Rev3.0 standard (8GT/s per-lane), and composed of
sixteen-lane. The PCI Express link configuration Graphics is selectable one from three choices in
Table 4. Customer cannot change once the configuration is set up due to the factory default.
If the configuration is not specified, the factory default is selected as the link configuration 3. The lane
reverse is not supported.
PCI Express Graphics Link Configuration Table 4.
COM Express
Pin Name
PCI Express
Lane
Link Configuration
1
Link Configuration
2
Link Configuration
3(Default)
PCIE15
15
X 4
X 8
X 16
PCIE14
14
PCIE13
13
PCIE12
12
PCIE11
11
X 4
PCIE10
10
PCIE9
9
PCIE8
8
PCIE7
7
X 8
X 8
PCIE6
6
PCIE5
5
PCIE4
4
PCIE3
3
PCIE2
2
PCIE1
1
PCIE0
0
3.3.2. PCI Express
This interface is compliant with PCI Express Rev2.0 standard (5GT/s per-lane), and composed of six-
lane.
The PCI Express link configuration is selectable one from four choices in Table 5 by setting BIOS. The
default setting is the configuration 4.
PCI Express Link Configuration Table 5.
COM
Express
Pin Name
PCI Express
Lane
Link
Configuration 1
Link
Configuration 2
Link
Configuration 3
Link
Configuration 4
(Default)
PCIE5
4
X 1
PCIE4
3
X 1
PCIE3
8
X 1
X 1
X 2
X 4
PCIE2
7
X 1
X 1
PCIE1
6
X 1
X 2
X 2
PCIE0
5
X 1
Hardware Specifications
13
3.3.3. USB2.0
This interface is compliant with USB2.0 standard (maximum transfer speed: 480Mb/s), and composed
of four ports.
3.3.4. USB3.0
This interface is compliant with USB3.0 standard (maximum transfer speed: 5Gb/s), and composed of
two ports.
3.3.5. SATA
This interface is compliant with SATA-600 (maximum transfer speed: 6Gb/s) and SATA-300 (maximum
transfer speed: 3Gb/s) standard, and composed of four ports.
The SATA configuration to connect between QM77 (PCH) and COM Express connector is shown in
Table 6.
SATA Configuration Table 6.
SATA
PCH
COM Express Connector
SATA-600
SATA0
A16,A17,A19,A20
SATA-600
SATA1
B16,B17,B19,B20
SATA-300
SATA2
A22,A23,A25,A26
SATA-300
SATA3
B22,B23,B25,B26
3.3.6. LAN
This interface is compliant with 10/100/1000Base-T standard, and composed of one port.
QM77 MAC and Intel EthernetPHY(82579) used.
3.3.7. LPC
This interface is compliant with LPC1.1 standard, and composed of one port.
The super I/O controller is LPC47M107S manufactured by SMSC that we have used.
3.3.8. SPI
This interface has an operating frequency of 16MHz, and is composed of one port.
The BIOS is bootable from the ROM that is connected to this port.
Any way other than the above is not considered.
Please refer to the “3.3.15. External BIOS ROM Support page 15 for the BIOS boot.
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3.3.9. Graphics DDI
This interface is compliant with DisplayPort 1.1a standard, and composed of three ports.
Supporting the dual-mode DisplayPort (DP++), it is switchable between DisplayPort and HDMI / DVI
using DDIx_DDC_AUX_SEL signal.
When using as DisplayPort, please float the signal on carrier board.
When using as HDMI or DVI, please pull the signal up to 3.3V at 100KΩ on the carrier board.
When using as DisplayPort support up to 2560x1600@60Hz and 24bpp (full-color: 16777216), while
HDMI or DVI support up to 1920x1200@60Hz and 24bpp (full-color : 16777216).
Adbc8037 can output to up to three monitors.
The composition is shown in Table 7.
Display composition Table 7.
Monitor
Monitor
Configuration1
Monitor
Configuration2
Monitor
Configuration3
Display1
DisplayPort
Any Display
*1
Any Display
*1
Display2
DisplayPort
Any Display
*1
-
Display3
Any Display
*1
-
-
*1 : DisplayPort / HDMI / DVI/Analog VGA
3.3.10. Analog VGA
This interface is Analog VGA port for VGA monitor, and composed of one port.
It support up to 1920x1200@60Hz and 24bpp (full-color: 16777216).
3.3.11. SMBus
（
System Management Bus
）
This interface is composed of one port.
Each SMBus signal is pulled up to 3.3V on the board.
3.3.12. I
2
C bus
This interface is composed of one port.
Each I
2
C bus signal is pulled up to 3.3V on the board.
Hardware Specifications
15
3.3.13. GPIO
3.3.13.1. GPI
Adbc8037 is supporting four GPI (General Purpose Input) signals. Each GPI signal is connected to the
GPIO pin of Intel QM77 PCH, and enables to read out the status from the corresponding register.
The assignment of GPI signal is shown in Table 8.
GPI control register Table 8.
Signal
Intel QM77 connecting pin
Supporting register bit
GPI0
GPIO68
GP_LVL3 bit 4
GPI1
GPIO69
GP_LVL3 bit 5
GPI2
GPIO70
GP_LVL3 bit 6
GPI3
GPIO71
GP_LVL3 bit 7
When GPIx is input High, the register value is ‘1’. When GPIx is input Low, the register value is ‘0’.
3.3.13.2. GPO
Adbc8037 is supporting four GPO (General Purpose Output) signals
Each GPI signal is connected to the GPIO pin of Intel QM77 PCH, and enables to control output by
setting any given value to the corresponding register. The assignment of GPO signal is shown in Table 9.
GPO control register Table 9.
Signal
Intel QM77 connecting
pin
Supporting register bit
Initial setting
(logic level)
GPO0
GPIO8
GP_LVL bit 8
High
GPO1
GPIO15
GP_LVL bit 15
Low
GPO2
GPIO24
GP_LVL bit 24
Low
GPO3
GPIO28
GP_LVL bit 28
Low
When the register value is “1”, GPOx is output High. When the register value is “0”, GPOx is output
Low.
3.3.14. Suspend Status
Adbc8037 is supporting SUS_STAT#, SUS_S3#, SUS_S4#, SUS_S5# and WAKE0# signals.
3.3.15. External BIOS ROM Support
Adbc8037 is supporting BIOS_DIS0# signal, and BIOS boot destination is selectable.
BIOS_DIS1# signal is not supported.
The following is the selection method by processing the BIOS_DIS0# signal on the carrier board.
-When BIOS_DIS0# is floating: BIOS boot from SPI_FLASH memory on Adbc8037
-When BIOS_DIS0# is short the GND: BIOS boot from SPI_FLASH memory on the carrier board
3.3.16. Reset
Adbc8037 is supporting the SYS_RESET# and CB_RESET# signals.
CB_RESET# signal is an output signal to carrier board and used to reset the devices on the carrier
board, while the SYS_RESET# signal is an input signal from carrier board.
Adbc8037 - User Manual
16
B31055B0-MN002-01
3.3.17. Thermal Protection
Adbc8037 is supporting THRM# and THRMTRIP# signals.
THRM# is an input signal from carrier board.
The status of the THRM# can be referred to “3.6.3.2. Status Register page 19”.
THRMTRIP# is an output signal to carrier board.
The low status of THRMTRIP# indicates the thermal shutdown of the CPU.
3.3.18. Battery Low Alarm
Adbc8037 is supporting BATLOW# signal.
BATLOW# is an input signal from carrier board.
The status of BATLOW# can be referred to “3.6.3.2. Status Register page 19”.
3.3.19. Power button
Adbc8037 is supporting the PWRBTN# signal.
PWRBTN# is an input signal from carrier board.
3.3.20. Power Good
Adbc8037 is supporting the PWR_OK signal.
The PWR_OK signal is an input signal from carrier board.
Adbc8037 start to supply the power to on-board device, after PWR_OK asserted.
3.3.21. Speaker
Adbc8037 is supporting the SPKR signal for speaker output.
3.4. LED
Adbc8037 has green and red LEDs.
The conditions for turning on and off the LEDs are shown in Table 10.
LED Condition Table 10.
LED_EN
*2
PCH platform reset
*3
LED1(Green)
LED2(Red)
0
Assert
OFF
ON
de-assert
ON
OFF
1
-
GRN_LED=’1’→ ON
RED_LED=’1’→ ON
-
GRN_LED=’0’→ OFF
RED_LED=’0’→ OFF
*2 : Refer to” 3.6.3.1. LED Control Register (offset：0000h) page 19” for a setup of LED_EN.
*3 : Assert of PCH platform reset means that the internal board is being initialized, and de-assert means
that the initialization is finished.
Hardware Specifications
17
3.5. I
2
C＆SMBus multiplexer
Adbc8037 has two SMBus ports (SMBus0 and SMBus1) compliant with SMBus 2.0.
SMBus0 is for Ethernet PHY only, while SMBus1 is connected to devices on Adbc8037 (refer to the
Figure. 11) and CN4 (COM Express stacking connector).
SMBus1 is connected to 4-channel I
2
C multiplexer for address expansion (and separate the address
between Adbc8037 and Carier board).
Two channels out of 4-channel I
2
C multiplexer are connected to COM Express connector, while the
remaining two channels are not in use.
The SMBus1 address map is shown in Table 11.
SMBus Address Map Table 11.
Device
Address
Main Memory SPD (channel A)
1010 000b
Main memory SPD (channel B)
1010 001b
I
2
C multiplexer (PCA9544APW)
1110 000b
I
2
C multiplexer channel map is shown in Table 12.
I
2
C multiplexer channel map Table 12.
Device
Address
Unused
0
SMBus device on the carrier board
1
I
2
C device on the carrier board
2
Unused
3
Channel is not selected after BIOS start up. Do not switch to channel 0 or channel 3 as they are
unused.
Please refer to the PCA9544APW (TI) datasheet for I
2
C multiplexer setting method.
Adbc8037 - User Manual
18
B31055B0-MN002-01
3.6. Address Map
3.6.1. I/O space
I/O space Address Map is shown in Table 13
I/O space Address Map Table 13.
Device
Address
DMA Controller
0000h - 001Fh
Interrupt Controller
0020h - 002Dh
LPC SIO
002Eh - 002Fh
Interrupt Controller
0030h - 003Dh
Timer/Counter
0040h - 0043h
LPC SIO
004Eh - 004Fh
Timer/Counter
0050h - 0053h
Microcontroller
0060h
NMI Controller
0061h
Microcontroller
0062h - 0066h
RTC Controller
0070h - 0077h
DMA Controller
0080h - 0091h
Reset Generator
0092h
DMA Controller
0093h - 009Fh
Interrupt Controller
00A0h - 00B1h
Power Management
00B2h - 00B3h
Interrupt Controller
00B4h - 00BDh
DMA Controller
00C0h - 00DFh
PCI and Master Abort
00F0h
Serial ATA
0170h - 0177h
Serial ATA
01F0h - 01F7h
Serial ATA
0376h
Serial ATA
03F6h
Interrupt Controller
04D0h - 04D1h
Reset Generator
0CF9h
3.6.2. Memory space
Memory space Address Map is shown in Table 14
Memory space Address Map Table 14.
Device
Address
Main Memory
0000_0000h
--- 000D_FFFFh
LPC(BIOS)
*4
000E_0000h
--- 000F_FFFFh
Main Memory / PCI Device
0010_0000h
--- TOM
*5
I/O APIC
FEC0_0000h
--- FECF_FFFFh
High Precision Event Timers
FED0_0000h
--- FED0_33FFh
TPM on LPC
FED4_0000h
--- FED4_BFFFh
LPC(BIOS)
*4
FF00_0000h
--- FFFF_FFFFh
*4 : Occupied area depends on the setting of Firmware Hub Decode Enable.
*5 : Most significant address depends on the setting of TOM register.
Hardware Specifications
19
3.6.3. CPLD Internal Register
CPLD Internal Register is shown in Table 15
PLD Internal Register map Table 15.
Register Name
Address
Item
LED Control Register
0000h
3.6.3.1.
Status Register
0001h
3.6.3.2.
The CPLD is mounted as internal control logic on Adbc8037.
CPLD internal register is accessible by LPC bus of “3.3.7. LPC page 13 “. The base address is 0280h.
The register is configured with 8-bit. Both Read (shown below as: R) and Write (shown below as: W)
are performed by 8-bit length.
R/W : Read and Write
RO : Read only (ignore Write)
WO : Write only (Read value is not defined)
3.6.3.1. LED Control Register (offset：0000h)
This register controls LED on board.
LED Control Register Table 16.
bit
Name
Meaning
initial
value
Access
7..3
RSVD
RSVD
00000
RO
2
LED_EN
1：RED/GRN_LED control enabled
0：RED/GRN_LED control disabled
0
R/W
1
RED_LED
1：LED(RED) On
0：LED(RED) Off
0
R/W
0
GRN_LED
1：LED(GRN) On
0：LED(GRN) Off
0
R/W
LED_EN=’0’ : RED_LED turns on during assertion of the Platform reset that is output by
PCH,while GRN_LED turns on during de-assertion. Please refer to “3.4. LED page 16” for further
details.
3.6.3.2. Status Register
This register reports input signal status from carrier board.
Status Register Table 17.
bit
Name
Meaning
initial
value
Access
7..4
RSVD
RSVD
000000
RO
3
BIOS_DISABLE#
Request signal from carrier board
-
RO
2
THRM#
1：Temperature sensor on carrier board shows a
normal value
0：Temperature sensor on carrier board is shows
an abnormal value
-
RO
1
BATLOW#
1：battery voltage on carrier board is a normal value
0：battery voltage on carrier board is an abnormal value
-
RO
0
RSVD
RSVD
0
RO
Adbc8037 - User Manual
20
B31055B0-MN002-01
3.6.4. PCI
PCI devices are shown in Table 18.
List of PCI devices Table 18.
Bus
number
Device
number
Function
number
Device
Device model
number
0
0
0
DRAM Controller
Intel
®
Core
TM
i7
1
0
PCI Express Controller 1
Intel
®
Core
TM
i7
1
PCI Express Controller 2
Intel
®
Core
TM
i7
2
PCI Express Controller 3
Intel
®
Core
TM
i7
2
0
Integrated Graphics Device
Intel
®
Core
TM
i7
6
0
PCI Express Controller 4
Intel
®
Core
TM
i7
22
0
Intel
®
Management Engine Interface #1
Intel
®
QM77
1
Intel
®
Management Engine Interface #2
Intel
®
QM77
2
IDE-R
Intel
®
QM77
3
KT
Intel
®
QM77
25
0
Gigabit Ethernet Controller
Intel
®
QM77
26
0 to 7
USB EHCI Controller #2
Intel
®
QM77
27
0 to 7
Intel
®
High Definition Audio Controller
Intel
®
QM77
28
0
PCI Express Port 1
Intel
®
QM77
1
PCI Express Port 2
Intel
®
QM77
2
PCI Express Port 3
Intel
®
QM77
3
PCI Express Port 4
Intel
®
QM77
4
PCI Express Port 5
Intel
®
QM77
5
PCI Express Port 6
Intel
®
QM77
6
PCI Express Port 7
Intel
®
QM77
7
PCI Express Port 8
Intel
®
QM77
29
0 to 7
USB EHCI Controller #1
Intel
®
QM77
30
0
PCI-to-PCI Bridge
Intel
®
QM77
31
0
LPC Controller
Intel
®
QM77
2
SATA Controller #1
Intel
®
QM77
3
SMBus Controller
Intel
®
QM77
5
SATA Controller #2
Intel
®
QM77
6
Thermal Subsystem
Intel
®
QM77
M
*6
－
－
PCI Express
－
*6 : M depends on the largest bus number shown on PCI Express.
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Eurotech Adbc8037 Owner's manual

Adbc8037
Eurotech
Brand
Eurotech
Model
Adbc8037
Category
Motherboards
Type
Owner's manual
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