Eurotech Catalyst AL Owner's manual

Eurotech
Brand
Eurotech
Model
Catalyst AL
Category
Motherboards
Type
Owner's manual
Catalyst AL
High Performance Module
DESIGN-IN GUIDE
Rev A
– October 2020 – 110131-2000A
2 / 68
Trademarks
All trademarks or registered trademarks, logos, designs, and products appearing in this document are
property of their respective owners.
Warranty
Contact your local Eurotech Sales Office for detailed warranty terms and conditions.
Refer to the back cover of this document for full contact details.
Revision History
Revision
Description
Date
A
Initial Release
October 2020
Catalyst AL Design-in Guide Important Information
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TABLE OF CONTENTS
Trademarks ...........................................................................................................................................2
Warranty ...............................................................................................................................................2
Revision History ....................................................................................................................................2
TABLE OF CONTENTS ......................................................................................................................................3
IMPORTANT INFORMATION................................................................................................................................6
Warning and Caution Conventions ........................................................................................................6
Other Conventions ................................................................................................................................7
Disclaimer of Liability .............................................................................................................................7
Intended Audience ................................................................................................................................7
SAFETY INSTRUCTIONS....................................................................................................................................8
Antistatic Precautions ............................................................................................................................8
Connection to Power Supply or Other Devices.......................................................................................8
Principles of Safety Integration ..............................................................................................................9
DECLARATION OF CONFORMITY...................................................................................................................... 11
WEEE Compliance .............................................................................................................................. 11
RoHS Compliance ............................................................................................................................... 11
TECHNICAL ASSISTANCE ............................................................................................................................... 12
Product Returns .................................................................................................................................. 12
1 PRODUCT OVERVIEW ............................................................................................................................. 13
1.1 Block Diagram ........................................................................................................................... 14
1.2 Specifications ............................................................................................................................ 15
1.3 Design Checklist ........................................................................................................................ 16
1.4 Development Kit ........................................................................................................................ 19
1.5 Related documents .................................................................................................................... 19
2 SOFTWARE SPECIFICATION .................................................................................................................... 20
2.1 Operating System Support ......................................................................................................... 20
2.2 BIOS ......................................................................................................................................... 20
2.3 Everyware
™
Software Framework .............................................................................................. 20
3 HARDWARE SPECIFICATION .................................................................................................................... 21
3.1 Core Processor ......................................................................................................................... 21
3.1.1 Intel Atom Processor .................................................................................................................. 21
3.1.2 Embedded Controller (option) ..................................................................................................... 21
3.1.3 Trusted Platform Management (option) ....................................................................................... 21
3.2 Memory ..................................................................................................................................... 22
3.2.1 Synchronous DRAM ................................................................................................................... 22
3.2.2 Non-Volatile Memory .................................................................................................................. 22
3.2.3 Flash SSD (option) ..................................................................................................................... 22
3.2.4 External Memory Interfaces ........................................................................................................ 22
3.3 Communications ........................................................................................................................ 23
3.3.1 PCI Express ............................................................................................................................... 23
3.3.2 USB ........................................................................................................................................... 24
3.3.3 Gigabit Ethernet ......................................................................................................................... 24
3.3.4 I
2
C Bus ...................................................................................................................................... 24
3.3.5 SPI Bus (BIOS) .......................................................................................................................... 25
3.3.6 System Management Bus ........................................................................................................... 25
Important Information Catalyst AL Design-in Guide
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3.4 Display and User Interface ......................................................................................................... 25
3.4.1 DDI (Digital Display Interface) ..................................................................................................... 26
3.4.2 LVDS Display ............................................................................................................................. 26
3.4.3 Backlight .................................................................................................................................... 26
3.5 Inputs and Outputs .................................................................................................................... 26
3.5.1 Low Pin Count Bus ..................................................................................................................... 26
3.5.2 Reset Signals ............................................................................................................................. 27
3.5.3 General-Purpose Input and Output.............................................................................................. 27
3.6 Intel High Definition Audio .......................................................................................................... 28
3.7 Power Requirements ................................................................................................................. 28
3.7.1 Low Power States ...................................................................................................................... 28
3.7.2 Power Supply Architecture .......................................................................................................... 29
3.7.3 Input Power Voltages ................................................................................................................. 29
3.7.4 RTC Backup Power .................................................................................................................... 30
3.7.5 Power Switch ............................................................................................................................. 31
3.7.6 Power Timing Diagrams ............................................................................................................. 32
4 MECHANICAL SPECIFICATIONS ................................................................................................................ 38
4.1 Mechanical Design .................................................................................................................... 38
4.1.1 Mechanical Drawing ................................................................................................................... 38
4.1.2 Total Stack Height ...................................................................................................................... 40
4.1.3 Mounting .................................................................................................................................... 40
4.1.4 Insertion and Removal ................................................................................................................ 41
4.2 Thermal Management................................................................................................................ 41
5 CARRIER BOARD DESIGN ....................................................................................................................... 43
5.1 Design Guidelines ..................................................................................................................... 43
5.1.1 Design Constraints ..................................................................................................................... 43
5.1.2 EMI/RFI Protection ..................................................................................................................... 43
5.1.3 Routing Guidelines ..................................................................................................................... 44
5.1.4 Power Planes ............................................................................................................................. 44
5.1.5 Requirements and Recommendations ......................................................................................... 45
5.1.6 Required Circuitry....................................................................................................................... 45
5.1.7 Carrier Board Configuration ........................................................................................................ 45
5.1.8 Recommended Circuitry ............................................................................................................. 46
5.2 Test and Debug ......................................................................................................................... 46
6 CONNECTORS ....................................................................................................................................... 47
6.1 Identifying Connectors ............................................................................................................... 47
6.2 Signal Headers .......................................................................................................................... 48
6.2.1 J1: Docking Connector: Data .................................................................................................... 48
6.2.2 J2: Docking Connector: Power .................................................................................................. 48
6.2.3 J3: ITP Debug Port .................................................................................................................... 49
7 SYSTEM SPECIFICATIONS ....................................................................................................................... 50
7.1 Power Supply ............................................................................................................................ 50
7.2 Electrical ................................................................................................................................... 51
7.2.1 PCIe Clock Buffer ....................................................................................................................... 51
7.2.2 Universal Serial Bus ................................................................................................................... 51
7.2.3 I
2
C Bus ...................................................................................................................................... 51
7.2.4 SMBus ....................................................................................................................................... 52
7.2.5 LVDS Display and Backlight ....................................................................................................... 52
7.2.6 Reset Signals ............................................................................................................................. 52
7.2.7 General-purpose Inputs and Outputs .......................................................................................... 53
7.2.8 Intel High Definition Audio ........................................................................................................... 53
7.3 General ..................................................................................................................................... 54
7.3.1 Crystal Frequencies.................................................................................................................... 54
7.3.2 Real-Time Clock ......................................................................................................................... 54
7.4 Environmental ........................................................................................................................... 54
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APPENDIX A – REFERENCE INFORMATION ....................................................................................................... 55
APPENDIX B – BOARD REVISION .................................................................................................................... 57
Identifying the Board Revision ............................................................................................................. 57
Board Revision History ........................................................................................................................ 57
Revision A ........................................................................................................................................... 57
APPENDIX C – COMMON CONFIGURATIONS ..................................................................................................... 58
Available Features ............................................................................................................................... 58
Pin Information .................................................................................................................................... 59
APPENDIX C – INTERNET OF THINGS (IOT) APPLICATIONS ................................................................................. 65
Everyware Software Framework (ESF) ................................................................................................ 65
Everyware Cloud (EC) ......................................................................................................................... 66
NOTES ......................................................................................................................................................... 67
Important Information Catalyst AL Design-in Guide
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IMPORTANT INFORMATION
CAREFULLY READ AND UNDERSTAND THE INSTRUCTIONS CONTAINED IN THIS DOCUMENT
BEFORE INSTALLING/OPERATING THE DEVICES.
KEEP THIS DOCUMENT FOR FUTURE REFERENCE.
Whenever you have any doubt regarding the correct understanding of the instructions contained in this
document contact your local Eurotech Technical Support Team (see the last page of this document for
further details).
To lower the risk of personal injury, electric shock, fire, or damage to equipment, observe the following
precautions, as well as using good technical judgment, whenever installing/operating the devices.
Warning and Caution Conventions
The following items may be used throughout this document.
DANGER
Indicates a hazard with a high level of risk which, if not avoided, will result in death or
serious personal injury.
WARNING
Indicates a hazard with a medium level of risk which, if not avoided, could result in
death or serious personal injury.
CAUTION
Indicates a hazard with a low level of risk which, if not avoided, could result in minor
or moderate personal injury.
NOTICE
Indicates:
• An instruction to follow to use the devices effectively.
• A statement of company policy directly or indirectly related to personnel safety
or property protection.
•
An instruction to follow to not damage the devices.
Catalyst AL Design-in Guide Important Information
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Other Conventions
The following table describes the conventions for signal names used in this document.
Convention
Explanation
GND
Digital ground plane
#
Active low signal
_P
Positive signal in differential pair
_N or _M
Negative signal in differential pair
The following table describes the abbreviations for direction and electrical characteristics of a signal
used in this document.
Type
Explanation
I
Signal is an input to the system
O
Signal is an output from the system
IO
Signal may be input or output
P
Power and ground
A
Analog signal
OD
Open-drain/open-collector
CMOS
3.3 V CMOS
LVCMOS
1.05 V CMOS
LVTTL
Low Voltage TTL
5
5 V signal level
HDA
High Definition Audio, 1.5 V
LVDS
Low Voltage Differential Signalling
PCIe
PCI Express signal
SATA
SATA differential signal
NC
No Connection (this connector pin is floating)
Reserved
Use is reserved to Eurotech
The following table describes the abbreviations that specify the signal termination.
Termination
Explanation
C
Series capacitor
PD
Pull-down resistor
PU
Pull-up resistor to the specified voltage
R
Series resistor
Disclaimer of Liability
Eurotech has reviewed the contents of this document to ensure accuracy and consistency with the
hardware and software described.
Always refer to the latest available manual revision available at: www.eurotech.com
.
Intended Audience
This guide provides details about the various features of the Catalyst AL and about how it creates a
system that meets your application needs. It extends the information provided in the Catalyst AL
Development Kit User Manual. Design details are provided as guidelines for custom carrier board
design.
This document is intended for system developers who are skilled persons with a thorough knowledge
in installing and implementing computer systems, networks, and related operating software.
Safety Instructions Catalyst AL Design-in Guide
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SAFETY INSTRUCTIONS
Observe the following safety instructions when installing/operating the devices.
Failure to comply with these instructions or with specific warnings elsewhere in this document violates
safety standards of design, manufacture, and intended use of the device.
Eurotech assumes no liability for any failure to comply with these instructions.
Antistatic Precautions
NOTICE
Preventing Electrostatic Discharge (ESD)
appropriate antistatic precautions to avoid damages due to electrostatic
discharge.
For example: use a wrist strap or ESD cuff kept in constant contact with
Connection to Power Supply or Other Devices
WARNING
Risk of electricity hazards
Before applying power to the system, thoroughly review all installation,
operation, and safety instructions.
Failure to install the system power supply correctly or to follow all
operating instructions correctly may create an electrical shock hazard,
which could result in personal injury or loss of life, and / or damage to
equipment or other property.
To avoid injuries:
• Before operating any equipment, carefully read any supplied instructions.
• Do not perform any connections with wet hands.
• Check any power cords for damage before using them.
• Use certified power cables. The power cables must meet the power requirements of the device.
• Position cables with care. Avoid positioning cables in places where they may be trampled on or
compressed by objects placed on them.
• Take particular care of plugs, power-points, and outlets.
• Always disconnect power and discharge circuits before touching them.
• Only start the product with a power supply that meets the requirements stated on the voltage
label. In case of uncertainties about the required power supply, contact the Eurotech Technical
Support Team or the electricity authority.
Catalyst AL Design-in Guide Safety Instructions
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Principles of Safety Integration
The installation must be accomplished by a skilled person following all the safety rules.
Do Not Operate in an Explosive Atmosphere
WARNING
Do not operate the equipment in the presence of flammable gases or fumes. Operation
of any electrical equipment in such an environment constitutes a definite safety
hazard.
Installation
WARNING
• Verify that the mounting location can withstand the added loads caused by the
addition of the device, it should be firmly secured so that it will not cause any
potentially hazardous situations (e.g. falling down due to vibration or shock)
• Do not operate the device near heat sources or flames.
• If the device must be moved from one place to another with different ambient
temperatures, ensure sufficient time for the temperature of the device to
stabilize before repowering.
Ventilation
WARNING
Ensure adequate ventilation to avoid overheating, Eurotech suggests the following
steps:
• When installing the device within a cabinet, rack or other enclosed space, be
sure to leave sufficient space to allow adequate air circulation
•
Do not block any ventilation openings
Maintenance
DANGER
•
Never open, dismantle or repair the device!
• For your maintenance or repair requirement please contact a qualified
Eurotech engineer.
• If the device does not function correctly and you are unable to find a solution,
feel free to contact the Eurotech Technical Support Team.
• If the equipment does not work properly, unplug it immediately and
contact the
Eurotech Technical Support Team (see last page of this manual for further
details).
Safety Instructions Catalyst AL Design-in Guide
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Cleaning
WARNING
When cleaning the device, remember to:
• Ensure sufficient ESD protection during the cleaning process.
• Remove any power from the device.
• When cleaning an enclosed system or peripheral use a dry cloth on the
external casing.
Do not use detergents, aerosol sprays, solvents or abrasive sponges.
Life Support Policy
WARNING
Users must not use Eurotech products as critical components of life support devices or
systems without the express written approval of Eurotech Spa.
Transportation
When transporting any module or system, for any reason, it should be packed using anti-static material
and placed in a sturdy box with enough packing material to adequately cushion it.
WARNING
Any product returned to Eurotech that is damaged due to inappropriate packaging will
not be covered by the warranty!
Catalyst AL Design-in Guide Declaration of Conformity
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DECLARATION OF CONFORMITY
WEEE Compliance
In compliance with the Directive 2012/19/EU of the European Parliament and of the
Council of 4 July 2012 on waste electrical and electronic equipment (WEEE), the
symbol on the right, shown on the product or within its literature, indicates separate
collection for this EEE (electrical and electronic equipment), that has been placed on
the market after 2005.
This product, at the end of its life cycle, must be collected separately and managed in
accordance with the provisions of the current Directive on waste electrical and
electronic equipment.
Because of the substances present in the product, improper use or disposal of the
refuse can cause damage to human health and the environment.
To avoid any possible legal implications, contact the local waste collection body for full
recycling information.
RoHS Compliance
The product described in this document, including all its components and its sub-assemblies, have
been manufactured in compliance with the Directive 2011/65/EU of the European Parliament and of
the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical
and electronic equipment.
Technical Assistance Catalyst AL Design-in Guide
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TECHNICAL ASSISTANCE
For any technical questions, or if you cannot isolate a problem with your device, or for any inquiry
about repair and returns policies, contact:
• The Eurotech Global Support Center: https://support.eurotech.com
• Your local Eurotech Technical Support Team: See the back cover for full contact details.
Product Returns
To return a product to Eurotech, complete the following steps:
1. Complete the online RMA request form (http://support.eurotech-inc.com/RMA/rma_form.asp
) or
submit a support ticket at support.eurotech.com specifying:
o Product Model Number (printed on the device label)
o Product Serial Number (printed on the device label)
o Brief fault description
2. Receive the reply from the Eurotech RMA Department. It contains:
o RMA number
o Shipping information
3. Pack the product using anti-static material and place it in a sturdy box with enough packing
material to adequately cushion it.
4. Ship the product to Eurotech following the information received from the Eurotech RMA
Department.
NOTICE
Any product returned to Eurotech that is found to be damaged due to inappropriate
packaging will not be covered by the warranty.
Catalyst AL Design-in Guide Product Overview
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1 PRODUCT OVERVIEW
The Catalyst AL is a high-performance, low-power module based on the Intel Atom
®
processor E39xx
series, formerly Apollo Lake. The Intel Atom E39xx processor contains an integrated 2D/3D graphics
engine supporting hardware-accelerated graphics display and video processing capabilities. The
Catalyst AL conforms to the same footprint as Eurotech’s other Catalyst modules, allowing existing
customers to migrate to the Catalyst AL with minimal effort and allows embedded users to gain higher
performance with greater energy efficiency.
An application-specific carrier board integrates with the Catalyst AL for a total production solution.
This flexible, modular architecture enables easy customization and quick time-to-market. A Eurotech
carrier board is available that implements several industry-standard interfaces allowing development
across a broad spectrum of end-use applications.
The Catalyst AL is available with a variety of operating systems. Support is also available for the Java
Virtual Machine and Eurotech’s Everyware
™
Software Framework, which offers an easy-to-use, Java-
based development environment that minimizes time to market and allows for easy portability for
future expansion.
The Catalyst AL includes the following features:
• Single and Quad-core, low power Intel Atom SoC – Based on the highly integrated Intel Atom
®
E39xx system on chip (SoC) with multiple industrial configurations
• High reliability – Optional Error correcting code (ECC) and virtualization for data integrity and
system uptime
• Graphic capabilities – HD graphics support through standard interfaces
• Maximum system integration options – with the COM design of the Catalyst AL, a carrier board
enables the specific functionality required for an application, for a cost-optimized and full-featured
solution
• Familiar format – 67 x 100 mm format extends the Catalyst line of COM products for logical
migration in next gen designs
• Power management – Eurotech’s strengths in power management design take a set of low power
consuming components and integrate them for battery-operated and power-efficient designs
Product Overview Catalyst AL Design-in Guide
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1.1 Block Diagram
The following diagram illustrates the system organization of the Catalyst AL. Notice that the data
connector has been divided into two sections for this illustration. Dotted lines indicate options.
Catalyst AL Design-in Guide Product Overview
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1.2 Specifications
Processor
• Intel Atom
®
E3950, 1.8-2.0GHz, 4 Core, formerly Apollo Lake
• Intel Atom
®
E3940, 1.6-1.8GHz, 4 Core, formerly Apollo Lake
• Intel Atom
®
E3930, 1.3-1.8GHz, 1 Core, formerly Apollo Lake
• Core Level Multi-Processing
• Quad-Dual Core Capability
• Integrated System Functions
• Embedded Controller and Trusted Platform Management (optional)
Memory
• (Up to 8 GB) DDR-3 DRAM
• Integrated system BIOS
• Battery-backed real-time clock
• On-board SATA or eMMC flash SSD (optional)
• External memory support: (Up to 2) SATA disk drive, (8) USB ports, SD card
Communications
• (Up to 4) PCI Express one lane slots
• (6) Universal Serial Bus 2.0 ports and (2) Universal Serial Bus 3.0 port (optional)
• (Up to 3) serial ports (1 x full-function, 2 x RX/TX only)
• Gigabit Ethernet with physical layer transceiver
• (Up to 4) I
2
C buses with I
2
C master device and (1) Carrier I
2
C bus
• SPI bus
• System Management Bus
User Interface and Display
• (Up to 2) DDI ports, MIPI CSI
• LVDS Display interface
• Backlight interface with control signals for intensity and power
Inputs and Outputs
• Low Pin Count bus for general-purpose I/O expansion
• (Up to 11) General-purpose inputs and outputs GPIO
Audio Interface
• Intel
®
High Definition Audio interface
Power Supply
• 3.3 V and 5 V main power inputs
• ACPI power management
Temperature
• Operating from: -40° to +85° C
Mechanical
• 67 mm x 100 mm dimensions, Less than 10 mm total stack height
Product Overview Catalyst AL Design-in Guide
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1.3 Design Checklist
Eurotech provides a host of services to ensure that your product is up and running from the first
prototype release. We recommend the following process for every Catalyst AL carrier board design:
Kickoff Stage
During the Kickoff Stage, you will develop your block diagram and identify any customizations your
application may require.
Gather your reference materials
Eurotech provides several documents that include key information for designing a custom carrier
board. Use the following resources and ask questions:
• Catalyst AL Design-In Guide
• Catalyst AL Development Kit User Manual
• Catalyst XL-TC-BT-AL Compatibility Technical Bulletin (for migrating designs)
• Carrier Board Routing Guidelines
• 3D CAD models
• Reference Carrier Board Schematic
• Reference Carrier Board Bill of Materials
Define your requirements
Define your system’s requirement. Be sure to include requirements such as the product features, the
input power, the type of transient protection on the power supply, connectivity to the module, and all
I/O to your system.
Create a block diagram
Create a block diagram of your proposed design. This step helps to formulate the best way to connect
different devices to the module.
Identify customizations
Identify any customizations that your application requires. Examples of customizations are custom
LCD panel timings and backlight control, custom module configurations, or supporting a device that is
not included on Eurotech’s standard carrier board. Customizations may require updates to the BIOS.
Utilize the Catalyst AL Development Kit
Utilize the Catalyst AL Development Kit for validating your proposed design.
Kickoff review
Early in the development of your carrier board, meet with your Eurotech representative to review your
block diagram and discuss customizations. Incorporate any changes into your design.
Preliminary Design Stage
During the Preliminary Design Stage, you will finalize your block diagram, agree on customizations,
and begin your preliminary schematic.
Use the reference schematic
Use Eurotech’s reference carrier board schematic as a starting point for your design. This schematic
includes many commonly used interfaces. Using the same connectivity to the module will minimize the
time spent in debugging your design.
Catalyst AL Design-in Guide Product Overview
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Select components from the reference bill of materials
Select the same components as those used in Eurotech’s reference carrier board bill of materials.
Eurotech selects components that are optimized for embedded systems based on quality, low-power
consumption, availability, reliability, and industrial temperature options. Selecting the same
components also allows you to use the drivers Eurotech has already integrated with the OS builds.
Follow the design requirements and recommendations
Follow the design requirements and recommendations listed in Carrier Board Design, page 43 of this
design-in guide. This section provides details about circuitry to include on the carrier board.
Preliminary design review
Stay in contact with your Eurotech representative during your preliminary design. Together, finalize
your block diagram and agree on customizations needed. Continue to ask questions as you move
towards finalizing your design.
Critical Design Stage
During the Critical Design Stage, you will finalize your schematic making sure that you have met all the
module’s electrical, thermal, and mechanical design requirements.
Implement power supply sequencing
Implement the exact power supply sequencing described in Power Requirements, page 28 of this
design-in guide. The module has very specific power-on sequence requirements in order to power-up
and operate correctly. Power sequencing the multiple voltage rails, as described in this section, is
CRITICAL. If your design does not meet these requirements, the module will not boot.
Provide a system-level reset
Buffer and use the system reset signal RST# (J1 B56), described in Reset Signals, page 27, to reset
all devices on the carrier board. The embedded controller controls the de-assertion of this signal with
appropriate timings relative to power being stable. Timing requirements for power stable to reset de-
asserted and reset de-asserted to device available are critical.
Create a power budget
Create a power budget that takes into account the current requirement of the module, as specified in
Power Supply, page 50, and of the devices that are used with the module. Design your power supply
to handle the maximum current requirement.
Determine thermal management
Determine what type of thermal management is required for your design. Use your power budget and
the information provided in Thermal Management, page 41 of this design-in guide to design a heat
spreader, if necessary.
Follow the module’s mechanical requirements
Follow the exact mechanical requirements given in Mechanical Design, page 38 for mounting holes
placement, position of the board-to-board connectors, and stack height on your carrier board design.
Product Overview Catalyst AL Design-in Guide
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Use advanced layout and high-speed routing techniques
Follow the design constraints and routing guidelines described in Design Guidelines, page 43 of this
design-in guide. Adhering to good design practices for high-speed PCB design is essential. You
should have your schematic 95% complete, especially the high-speed signals and buses of the
module, power sequencing, and system reset, before you start board layout. Meet with your Eurotech
representative to review your schematic before you begin layout. After your layout is complete, meet
again to review your complete design.
Have a strategy to debug your design
Review your strategy to bring-up and to debug your design. Ensure that you have included the
necessary support in your design. The maintenance serial port is extremely important in bring-up of a
new design. Eurotech highly recommends including an external connection to SMC_UART_RX
(J1 B57) and SMC_UART_TX (J1 B106) on your carrier board.
Critical design review
Do an in-depth review of your finished design, including final schematic and board layout, to ensure
that you have met all the requirements described in this checklist and throughout this design-in guide.
Again, ask your Eurotech representative questions.
Prototype Bring-up Stage
Eurotech provides assistance in bringing-up your prototype at your site or ours. We have several tools
that can assist the process including "stand-alone" BIOS releases, BIOS modifications to meet specific
platform or test requirements, and power monitoring applications for the module. The "stand-alone"
BIOS sets up the internal functions of the module and basic I/O functions. It is not dependent on any
specific carrier board, devices, or circuits. This BIOS provides "basic" level functionality and can be
used as a tool in the bring-up or debug of your unique carrier board.
Begin with the basics
Begin by checking basic functionality such as power, reset, and clocks. Verify that the power
sequencing is as it should be and that the voltage regulator outputs are at nominal levels. Check that
the system reset signal is asserted and de-asserted according to the power sequencing requirements.
Ensure all clocks necessary for bring-up are running properly.
Start with minimal devices
Minimize the number of devices required for bring-up. Using Eurotech’s "debug" set of firmware is a
good start. This firmware can be used (on case-by-case) basis as a debug and bring-up tool for your
specific design prototyping or in the debugging phases of your development. It disables all Non-
Critical-to-Boot functions to simplify the system functionality to base level. After you have verified this
base level, enable each subsystem as needed. Adding one device at a time will help determine which
subsystem, if any, is having problems.
Utilize the maintenance port
Utilize the maintenance port output to identify problems during bring-up. This port provides important
debug information including BIOS POST codes and error messages that enable you to monitor the
operation of the module.
Use your Catalyst AL Development Kit
Use your Catalyst AL Development Kit to isolate problems. If a problem occurs during bring-up of your
carrier board, try to duplicate the problem on the development kit.
Prototype bring-up review
Review your bring-up process and share lessons learned with your Eurotech representative.
Catalyst AL Design-in Guide Product Overview
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Acceptance of Customizations
Eurotech is committed to your design success. Using our support services throughout the
development cycle ensures a complete and robust solution with which to move forward.
Customization Acceptance
Meet with your Eurotech representative to discuss acceptance of any customizations and to plan the
steps toward production of your Catalyst AL design.
1.4 Development Kit
The Catalyst AL Development Kit is designed to get the developer up and running quickly. The
development kit includes the Catalyst AL, a standard development kit carrier board, and supporting
peripheral devices. To provide flexibility and allow development across a broad spectrum of end-use
applications, the carrier board maximizes the Catalyst AL functionality and implements many industry-
standard interfaces. This configuration allows you to become familiar with the Catalyst AL functionality
prior to customization for your specific application. In addition, the standard development kit carrier
board provides a reference for custom carrier board design.
For a complete description of the Catalyst AL Development Kit, refer to the Catalyst AL Development
Kit User Manual.
1.5 Related documents
The following documents are also important resources for the Catalyst AL.
Document
Catalyst AL Development Kit User Manual
110131-4000
Catalyst AL Development Kit Quick Start
110131-2001
Catalyst AL Carrier Board Routing Guidelines
110131-
Catalyst XL-TC-BT-AL Compatibility Technical Bulletin
110131-
Catalyst Module Installation and Removal
110122-2014
Check the Eurotech support site (http://support.eurotech-inc.com/
) for errata reports and for the latest
releases of these documents.
For further information, refer to the following documentation:
Documentation
Available at
Catalyst AL Product Page
http://www.eurotech.com/en/products/Catalyst
Everyware Software Framework Documentation
http://esf.eurotech.com/doc/ESFDevGuide/
Everyware Cloud Documentation
http://everywarecloud.eurotech.com/doc/ECDevGuide/
Software Specification Catalyst AL Design-in Guide
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2 SOFTWARE SPECIFICATION
Eurotech provides an application-ready platform including BIOS, operating system, and development
environment. This section gives a brief description of the software support available for the Catalyst
AL. For additional details, contact your local Eurotech representative.
2.1 Operating System Support
The Catalyst AL is compatible with the following operating systems:
• Microsoft Windows
®
10
• Wind River Linux
• Yocto Linux
• Fedora Linux
• Select real-time operating systems
For details about available support of each operating system, contact your local Eurotech
representative.
2.2 BIOS
The Catalyst AL incorporates a custom system BIOS developed by Eurotech.
2.3 Everyware
™
Software Framework
Everyware Software Framework (ESF) is an inclusive software framework that puts a middleware layer
between the operating system and the OEM application. It provides industry-standard interfaces that
shorten development time, simplify coding, and allow software to be ported from one Eurotech
hardware platform to another. The Catalyst AL supports ESF. If your application requires ESF,
contact your local Eurotech representative.
Information about ESF is available at http://esf.eurotech.com
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Eurotech Catalyst AL Owner's manual

Eurotech
Brand
Eurotech
Model
Catalyst AL
Category
Motherboards
Type
Owner's manual
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