Eurotech Catalyst AL Owner's manual

Catalyst AL

High Performance Module

DESIGN-IN GUIDE

Rev A

– October 2020 – 110131-2000A

2 / 68

Trademarks

All trademarks or registered trademarks, logos, designs, and products appearing in this document are

property of their respective owners.

Warranty

Contact your local Eurotech Sales Office for detailed warranty terms and conditions.

Refer to the back cover of this document for full contact details.

Revision History

Revision

Description

Date

A

Initial Release

October 2020

Catalyst AL Design-in Guide Important Information

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TABLE OF CONTENTS

Trademarks ...........................................................................................................................................2

Warranty ...............................................................................................................................................2

Revision History ....................................................................................................................................2

TABLE OF CONTENTS ......................................................................................................................................3

IMPORTANT INFORMATION................................................................................................................................6

Warning and Caution Conventions ........................................................................................................6

Other Conventions ................................................................................................................................7

Disclaimer of Liability .............................................................................................................................7

Intended Audience ................................................................................................................................7

SAFETY INSTRUCTIONS....................................................................................................................................8

Antistatic Precautions ............................................................................................................................8

Connection to Power Supply or Other Devices.......................................................................................8

Principles of Safety Integration ..............................................................................................................9

DECLARATION OF CONFORMITY...................................................................................................................... 11

WEEE Compliance .............................................................................................................................. 11

RoHS Compliance ............................................................................................................................... 11

TECHNICAL ASSISTANCE ............................................................................................................................... 12

Product Returns .................................................................................................................................. 12

1 PRODUCT OVERVIEW ............................................................................................................................. 13

1.1 Block Diagram ........................................................................................................................... 14

1.2 Specifications ............................................................................................................................ 15

1.3 Design Checklist ........................................................................................................................ 16

1.4 Development Kit ........................................................................................................................ 19

1.5 Related documents .................................................................................................................... 19

2 SOFTWARE SPECIFICATION .................................................................................................................... 20

2.1 Operating System Support ......................................................................................................... 20

2.2 BIOS ......................................................................................................................................... 20

2.3 Everyware

™

Software Framework .............................................................................................. 20

3 HARDWARE SPECIFICATION .................................................................................................................... 21

3.1 Core Processor ......................................................................................................................... 21

3.1.1 Intel Atom Processor .................................................................................................................. 21

3.1.2 Embedded Controller (option) ..................................................................................................... 21

3.1.3 Trusted Platform Management (option) ....................................................................................... 21

3.2 Memory ..................................................................................................................................... 22

3.2.1 Synchronous DRAM ................................................................................................................... 22

3.2.2 Non-Volatile Memory .................................................................................................................. 22

3.2.3 Flash SSD (option) ..................................................................................................................... 22

3.2.4 External Memory Interfaces ........................................................................................................ 22

3.3 Communications ........................................................................................................................ 23

3.3.1 PCI Express ............................................................................................................................... 23

3.3.2 USB ........................................................................................................................................... 24

3.3.3 Gigabit Ethernet ......................................................................................................................... 24

3.3.4 I

2

C Bus ...................................................................................................................................... 24

3.3.5 SPI Bus (BIOS) .......................................................................................................................... 25

3.3.6 System Management Bus ........................................................................................................... 25

Important Information Catalyst AL Design-in Guide

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3.4 Display and User Interface ......................................................................................................... 25

3.4.1 DDI (Digital Display Interface) ..................................................................................................... 26

3.4.2 LVDS Display ............................................................................................................................. 26

3.4.3 Backlight .................................................................................................................................... 26

3.5 Inputs and Outputs .................................................................................................................... 26

3.5.1 Low Pin Count Bus ..................................................................................................................... 26

3.5.2 Reset Signals ............................................................................................................................. 27

3.5.3 General-Purpose Input and Output.............................................................................................. 27

3.6 Intel High Definition Audio .......................................................................................................... 28

3.7 Power Requirements ................................................................................................................. 28

3.7.1 Low Power States ...................................................................................................................... 28

3.7.2 Power Supply Architecture .......................................................................................................... 29

3.7.3 Input Power Voltages ................................................................................................................. 29

3.7.4 RTC Backup Power .................................................................................................................... 30

3.7.5 Power Switch ............................................................................................................................. 31

3.7.6 Power Timing Diagrams ............................................................................................................. 32

4 MECHANICAL SPECIFICATIONS ................................................................................................................ 38

4.1 Mechanical Design .................................................................................................................... 38

4.1.1 Mechanical Drawing ................................................................................................................... 38

4.1.2 Total Stack Height ...................................................................................................................... 40

4.1.3 Mounting .................................................................................................................................... 40

4.1.4 Insertion and Removal ................................................................................................................ 41

4.2 Thermal Management................................................................................................................ 41

5 CARRIER BOARD DESIGN ....................................................................................................................... 43

5.1 Design Guidelines ..................................................................................................................... 43

5.1.1 Design Constraints ..................................................................................................................... 43

5.1.2 EMI/RFI Protection ..................................................................................................................... 43

5.1.3 Routing Guidelines ..................................................................................................................... 44

5.1.4 Power Planes ............................................................................................................................. 44

5.1.5 Requirements and Recommendations ......................................................................................... 45

5.1.6 Required Circuitry....................................................................................................................... 45

5.1.7 Carrier Board Configuration ........................................................................................................ 45

5.1.8 Recommended Circuitry ............................................................................................................. 46

5.2 Test and Debug ......................................................................................................................... 46

6 CONNECTORS ....................................................................................................................................... 47

6.1 Identifying Connectors ............................................................................................................... 47

6.2 Signal Headers .......................................................................................................................... 48

6.2.1 J1: Docking Connector: Data .................................................................................................... 48

6.2.2 J2: Docking Connector: Power .................................................................................................. 48

6.2.3 J3: ITP Debug Port .................................................................................................................... 49

7 SYSTEM SPECIFICATIONS ....................................................................................................................... 50

7.1 Power Supply ............................................................................................................................ 50

7.2 Electrical ................................................................................................................................... 51

7.2.1 PCIe Clock Buffer ....................................................................................................................... 51

7.2.2 Universal Serial Bus ................................................................................................................... 51

7.2.3 I

2

C Bus ...................................................................................................................................... 51

7.2.4 SMBus ....................................................................................................................................... 52

7.2.5 LVDS Display and Backlight ....................................................................................................... 52

7.2.6 Reset Signals ............................................................................................................................. 52

7.2.7 General-purpose Inputs and Outputs .......................................................................................... 53

7.2.8 Intel High Definition Audio ........................................................................................................... 53

7.3 General ..................................................................................................................................... 54

7.3.1 Crystal Frequencies.................................................................................................................... 54

7.3.2 Real-Time Clock ......................................................................................................................... 54

7.4 Environmental ........................................................................................................................... 54

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APPENDIX A – REFERENCE INFORMATION ....................................................................................................... 55

APPENDIX B – BOARD REVISION .................................................................................................................... 57

Identifying the Board Revision ............................................................................................................. 57

Board Revision History ........................................................................................................................ 57

Revision A ........................................................................................................................................... 57

APPENDIX C – COMMON CONFIGURATIONS ..................................................................................................... 58

Available Features ............................................................................................................................... 58

Pin Information .................................................................................................................................... 59

APPENDIX C – INTERNET OF THINGS (IOT) APPLICATIONS ................................................................................. 65

Everyware Software Framework (ESF) ................................................................................................ 65

Everyware Cloud (EC) ......................................................................................................................... 66

NOTES ......................................................................................................................................................... 67

Important Information Catalyst AL Design-in Guide

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IMPORTANT INFORMATION

CAREFULLY READ AND UNDERSTAND THE INSTRUCTIONS CONTAINED IN THIS DOCUMENT

BEFORE INSTALLING/OPERATING THE DEVICES.

KEEP THIS DOCUMENT FOR FUTURE REFERENCE.

Whenever you have any doubt regarding the correct understanding of the instructions contained in this

document contact your local Eurotech Technical Support Team (see the last page of this document for

further details).

To lower the risk of personal injury, electric shock, fire, or damage to equipment, observe the following

precautions, as well as using good technical judgment, whenever installing/operating the devices.

Warning and Caution Conventions

The following items may be used throughout this document.

DANGER

Indicates a hazard with a high level of risk which, if not avoided, will result in death or

serious personal injury.

WARNING

Indicates a hazard with a medium level of risk which, if not avoided, could result in

death or serious personal injury.

CAUTION

Indicates a hazard with a low level of risk which, if not avoided, could result in minor

or moderate personal injury.

NOTICE

Indicates:

• An instruction to follow to use the devices effectively.

• A statement of company policy directly or indirectly related to personnel safety

or property protection.

•

An instruction to follow to not damage the devices.

Catalyst AL Design-in Guide Important Information

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Other Conventions

The following table describes the conventions for signal names used in this document.

Convention

Explanation

GND

Digital ground plane

#

Active low signal

_P

Positive signal in differential pair

_N or _M

Negative signal in differential pair

The following table describes the abbreviations for direction and electrical characteristics of a signal

used in this document.

Type

Explanation

I

Signal is an input to the system

O

Signal is an output from the system

IO

Signal may be input or output

P

Power and ground

A

Analog signal

OD

Open-drain/open-collector

CMOS

3.3 V CMOS

LVCMOS

1.05 V CMOS

LVTTL

Low Voltage TTL

5

5 V signal level

HDA

High Definition Audio, 1.5 V

LVDS

Low Voltage Differential Signalling

PCIe

PCI Express signal

SATA

SATA differential signal

NC

No Connection (this connector pin is floating)

Reserved

Use is reserved to Eurotech

The following table describes the abbreviations that specify the signal termination.

Termination

Explanation

C

Series capacitor

PD

Pull-down resistor

PU

Pull-up resistor to the specified voltage

R

Series resistor

Disclaimer of Liability

Eurotech has reviewed the contents of this document to ensure accuracy and consistency with the

hardware and software described.

Always refer to the latest available manual revision available at: www.eurotech.com

.

Intended Audience

This guide provides details about the various features of the Catalyst AL and about how it creates a

system that meets your application needs. It extends the information provided in the Catalyst AL

Development Kit User Manual. Design details are provided as guidelines for custom carrier board

design.

This document is intended for system developers who are skilled persons with a thorough knowledge

in installing and implementing computer systems, networks, and related operating software.

Safety Instructions Catalyst AL Design-in Guide

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SAFETY INSTRUCTIONS

Observe the following safety instructions when installing/operating the devices.

Failure to comply with these instructions or with specific warnings elsewhere in this document violates

safety standards of design, manufacture, and intended use of the device.

Eurotech assumes no liability for any failure to comply with these instructions.

Antistatic Precautions

NOTICE

Preventing Electrostatic Discharge (ESD)

When handing the devices described in this document, always use

appropriate antistatic precautions to avoid damages due to electrostatic

discharge.

For example: use a wrist strap or ESD cuff kept in constant contact with

bare skin and attached to an ESD ground.

Connection to Power Supply or Other Devices

WARNING

Risk of electricity hazards

Before applying power to the system, thoroughly review all installation,

operation, and safety instructions.

Failure to install the system power supply correctly or to follow all

operating instructions correctly may create an electrical shock hazard,

which could result in personal injury or loss of life, and / or damage to

equipment or other property.

To avoid injuries:

• Before operating any equipment, carefully read any supplied instructions.

• Do not perform any connections with wet hands.

• Check any power cords for damage before using them.

• Use certified power cables. The power cables must meet the power requirements of the device.

• Position cables with care. Avoid positioning cables in places where they may be trampled on or

compressed by objects placed on them.

• Take particular care of plugs, power-points, and outlets.

• Always disconnect power and discharge circuits before touching them.

• Only start the product with a power supply that meets the requirements stated on the voltage

label. In case of uncertainties about the required power supply, contact the Eurotech Technical

Support Team or the electricity authority.

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Principles of Safety Integration

The installation must be accomplished by a skilled person following all the safety rules.

Do Not Operate in an Explosive Atmosphere

WARNING

Do not operate the equipment in the presence of flammable gases or fumes. Operation

of any electrical equipment in such an environment constitutes a definite safety

hazard.

Installation

WARNING

• Verify that the mounting location can withstand the added loads caused by the

addition of the device, it should be firmly secured so that it will not cause any

potentially hazardous situations (e.g. falling down due to vibration or shock)

• Do not operate the device near heat sources or flames.

• If the device must be moved from one place to another with different ambient

temperatures, ensure sufficient time for the temperature of the device to

stabilize before repowering.

Ventilation

WARNING

Ensure adequate ventilation to avoid overheating, Eurotech suggests the following

steps:

• When installing the device within a cabinet, rack or other enclosed space, be

sure to leave sufficient space to allow adequate air circulation

•

Do not block any ventilation openings

Maintenance

DANGER

•

Never open, dismantle or repair the device!

• For your maintenance or repair requirement please contact a qualified

Eurotech engineer.

• If the device does not function correctly and you are unable to find a solution,

feel free to contact the Eurotech Technical Support Team.

• If the equipment does not work properly, unplug it immediately and

contact the

Eurotech Technical Support Team (see last page of this manual for further

details).

Safety Instructions Catalyst AL Design-in Guide

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Cleaning

WARNING

When cleaning the device, remember to:

• Ensure sufficient ESD protection during the cleaning process.

• Remove any power from the device.

• When cleaning an enclosed system or peripheral use a dry cloth on the

external casing.

Do not use detergents, aerosol sprays, solvents or abrasive sponges.

Life Support Policy

WARNING

Users must not use Eurotech products as critical components of life support devices or

systems without the express written approval of Eurotech Spa.

Transportation

When transporting any module or system, for any reason, it should be packed using anti-static material

and placed in a sturdy box with enough packing material to adequately cushion it.

WARNING

Any product returned to Eurotech that is damaged due to inappropriate packaging will

not be covered by the warranty!

Catalyst AL Design-in Guide Declaration of Conformity

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DECLARATION OF CONFORMITY

WEEE Compliance

In compliance with the Directive 2012/19/EU of the European Parliament and of the

Council of 4 July 2012 on waste electrical and electronic equipment (WEEE), the

symbol on the right, shown on the product or within its literature, indicates separate

collection for this EEE (electrical and electronic equipment), that has been placed on

the market after 2005.

This product, at the end of its life cycle, must be collected separately and managed in

accordance with the provisions of the current Directive on waste electrical and

electronic equipment.

Because of the substances present in the product, improper use or disposal of the

refuse can cause damage to human health and the environment.

To avoid any possible legal implications, contact the local waste collection body for full

recycling information.

RoHS Compliance

The product described in this document, including all its components and its sub-assemblies, have

been manufactured in compliance with the Directive 2011/65/EU of the European Parliament and of

the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical

and electronic equipment.

Technical Assistance Catalyst AL Design-in Guide

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TECHNICAL ASSISTANCE

For any technical questions, or if you cannot isolate a problem with your device, or for any inquiry

about repair and returns policies, contact:

• The Eurotech Global Support Center: https://support.eurotech.com

• Your local Eurotech Technical Support Team: See the back cover for full contact details.

Product Returns

To return a product to Eurotech, complete the following steps:

1. Complete the online RMA request form (http://support.eurotech-inc.com/RMA/rma_form.asp

) or

submit a support ticket at support.eurotech.com specifying:

o Product Model Number (printed on the device label)

o Product Serial Number (printed on the device label)

o Brief fault description

2. Receive the reply from the Eurotech RMA Department. It contains:

o RMA number

o Shipping information

3. Pack the product using anti-static material and place it in a sturdy box with enough packing

material to adequately cushion it.

4. Ship the product to Eurotech following the information received from the Eurotech RMA

Department.

NOTICE

Any product returned to Eurotech that is found to be damaged due to inappropriate

packaging will not be covered by the warranty.

Catalyst AL Design-in Guide Product Overview

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1 PRODUCT OVERVIEW

The Catalyst AL is a high-performance, low-power module based on the Intel Atom

®

processor E39xx

series, formerly Apollo Lake. The Intel Atom E39xx processor contains an integrated 2D/3D graphics

engine supporting hardware-accelerated graphics display and video processing capabilities. The

Catalyst AL conforms to the same footprint as Eurotech’s other Catalyst modules, allowing existing

customers to migrate to the Catalyst AL with minimal effort and allows embedded users to gain higher

performance with greater energy efficiency.

An application-specific carrier board integrates with the Catalyst AL for a total production solution.

This flexible, modular architecture enables easy customization and quick time-to-market. A Eurotech

carrier board is available that implements several industry-standard interfaces allowing development

across a broad spectrum of end-use applications.

The Catalyst AL is available with a variety of operating systems. Support is also available for the Java

Virtual Machine and Eurotech’s Everyware

™

Software Framework, which offers an easy-to-use, Java-

based development environment that minimizes time to market and allows for easy portability for

future expansion.

The Catalyst AL includes the following features:

• Single and Quad-core, low power Intel Atom SoC – Based on the highly integrated Intel Atom

®

E39xx system on chip (SoC) with multiple industrial configurations

• High reliability – Optional Error correcting code (ECC) and virtualization for data integrity and

system uptime

• Graphic capabilities – HD graphics support through standard interfaces

• Maximum system integration options – with the COM design of the Catalyst AL, a carrier board

enables the specific functionality required for an application, for a cost-optimized and full-featured

solution

• Familiar format – 67 x 100 mm format extends the Catalyst line of COM products for logical

migration in next gen designs

• Power management – Eurotech’s strengths in power management design take a set of low power

consuming components and integrate them for battery-operated and power-efficient designs

Product Overview Catalyst AL Design-in Guide

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1.1 Block Diagram

The following diagram illustrates the system organization of the Catalyst AL. Notice that the data

connector has been divided into two sections for this illustration. Dotted lines indicate options.

Catalyst AL Design-in Guide Product Overview

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1.2 Specifications

Processor

• Intel Atom

®

E3950, 1.8-2.0GHz, 4 Core, formerly Apollo Lake

• Intel Atom

®

E3940, 1.6-1.8GHz, 4 Core, formerly Apollo Lake

• Intel Atom

®

E3930, 1.3-1.8GHz, 1 Core, formerly Apollo Lake

• Core Level Multi-Processing

• Quad-Dual Core Capability

• Integrated System Functions

• Embedded Controller and Trusted Platform Management (optional)

Memory

• (Up to 8 GB) DDR-3 DRAM

• Integrated system BIOS

• Battery-backed real-time clock

• On-board SATA or eMMC flash SSD (optional)

• External memory support: (Up to 2) SATA disk drive, (8) USB ports, SD card

Communications

• (Up to 4) PCI Express one lane slots

• (6) Universal Serial Bus 2.0 ports and (2) Universal Serial Bus 3.0 port (optional)

• (Up to 3) serial ports (1 x full-function, 2 x RX/TX only)

• Gigabit Ethernet with physical layer transceiver

• (Up to 4) I

2

C buses with I

2

C master device and (1) Carrier I

2

C bus

• SPI bus

• System Management Bus

User Interface and Display

• (Up to 2) DDI ports, MIPI CSI

• LVDS Display interface

• Backlight interface with control signals for intensity and power

Inputs and Outputs

• Low Pin Count bus for general-purpose I/O expansion

• (Up to 11) General-purpose inputs and outputs GPIO

Audio Interface

• Intel

®

High Definition Audio interface

Power Supply

• 3.3 V and 5 V main power inputs

• ACPI power management

Temperature

• Operating from: -40° to +85° C

Mechanical

• 67 mm x 100 mm dimensions, Less than 10 mm total stack height

Product Overview Catalyst AL Design-in Guide

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1.3 Design Checklist

Eurotech provides a host of services to ensure that your product is up and running from the first

prototype release. We recommend the following process for every Catalyst AL carrier board design:

Kickoff Stage

During the Kickoff Stage, you will develop your block diagram and identify any customizations your

application may require.

 Gather your reference materials

Eurotech provides several documents that include key information for designing a custom carrier

board. Use the following resources and ask questions:

• Catalyst AL Design-In Guide

• Catalyst AL Development Kit User Manual

• Catalyst XL-TC-BT-AL Compatibility Technical Bulletin (for migrating designs)

• Carrier Board Routing Guidelines

• 3D CAD models

• Reference Carrier Board Schematic

• Reference Carrier Board Bill of Materials

 Define your requirements

Define your system’s requirement. Be sure to include requirements such as the product features, the

input power, the type of transient protection on the power supply, connectivity to the module, and all

I/O to your system.

 Create a block diagram

Create a block diagram of your proposed design. This step helps to formulate the best way to connect

different devices to the module.

 Identify customizations

Identify any customizations that your application requires. Examples of customizations are custom

LCD panel timings and backlight control, custom module configurations, or supporting a device that is

not included on Eurotech’s standard carrier board. Customizations may require updates to the BIOS.

 Utilize the Catalyst AL Development Kit

Utilize the Catalyst AL Development Kit for validating your proposed design.

 Kickoff review

Early in the development of your carrier board, meet with your Eurotech representative to review your

block diagram and discuss customizations. Incorporate any changes into your design.

Preliminary Design Stage

During the Preliminary Design Stage, you will finalize your block diagram, agree on customizations,

and begin your preliminary schematic.

 Use the reference schematic

Use Eurotech’s reference carrier board schematic as a starting point for your design. This schematic

includes many commonly used interfaces. Using the same connectivity to the module will minimize the

time spent in debugging your design.

Catalyst AL Design-in Guide Product Overview

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 Select components from the reference bill of materials

Select the same components as those used in Eurotech’s reference carrier board bill of materials.

Eurotech selects components that are optimized for embedded systems based on quality, low-power

consumption, availability, reliability, and industrial temperature options. Selecting the same

components also allows you to use the drivers Eurotech has already integrated with the OS builds.

 Follow the design requirements and recommendations

Follow the design requirements and recommendations listed in Carrier Board Design, page 43 of this

design-in guide. This section provides details about circuitry to include on the carrier board.

 Preliminary design review

Stay in contact with your Eurotech representative during your preliminary design. Together, finalize

your block diagram and agree on customizations needed. Continue to ask questions as you move

towards finalizing your design.

Critical Design Stage

During the Critical Design Stage, you will finalize your schematic making sure that you have met all the

module’s electrical, thermal, and mechanical design requirements.

 Implement power supply sequencing

Implement the exact power supply sequencing described in Power Requirements, page 28 of this

design-in guide. The module has very specific power-on sequence requirements in order to power-up

and operate correctly. Power sequencing the multiple voltage rails, as described in this section, is

CRITICAL. If your design does not meet these requirements, the module will not boot.

 Provide a system-level reset

Buffer and use the system reset signal RST# (J1 B56), described in Reset Signals, page 27, to reset

all devices on the carrier board. The embedded controller controls the de-assertion of this signal with

appropriate timings relative to power being stable. Timing requirements for power stable to reset de-

asserted and reset de-asserted to device available are critical.

 Create a power budget

Create a power budget that takes into account the current requirement of the module, as specified in

Power Supply, page 50, and of the devices that are used with the module. Design your power supply

to handle the maximum current requirement.

 Determine thermal management

Determine what type of thermal management is required for your design. Use your power budget and

the information provided in Thermal Management, page 41 of this design-in guide to design a heat

spreader, if necessary.

 Follow the module’s mechanical requirements

Follow the exact mechanical requirements given in Mechanical Design, page 38 for mounting holes

placement, position of the board-to-board connectors, and stack height on your carrier board design.

Product Overview Catalyst AL Design-in Guide

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 Use advanced layout and high-speed routing techniques

Follow the design constraints and routing guidelines described in Design Guidelines, page 43 of this

design-in guide. Adhering to good design practices for high-speed PCB design is essential. You

should have your schematic 95% complete, especially the high-speed signals and buses of the

module, power sequencing, and system reset, before you start board layout. Meet with your Eurotech

representative to review your schematic before you begin layout. After your layout is complete, meet

again to review your complete design.

 Have a strategy to debug your design

Review your strategy to bring-up and to debug your design. Ensure that you have included the

necessary support in your design. The maintenance serial port is extremely important in bring-up of a

new design. Eurotech highly recommends including an external connection to SMC_UART_RX

(J1 B57) and SMC_UART_TX (J1 B106) on your carrier board.

 Critical design review

Do an in-depth review of your finished design, including final schematic and board layout, to ensure

that you have met all the requirements described in this checklist and throughout this design-in guide.

Again, ask your Eurotech representative questions.

Prototype Bring-up Stage

Eurotech provides assistance in bringing-up your prototype at your site or ours. We have several tools

that can assist the process including "stand-alone" BIOS releases, BIOS modifications to meet specific

platform or test requirements, and power monitoring applications for the module. The "stand-alone"

BIOS sets up the internal functions of the module and basic I/O functions. It is not dependent on any

specific carrier board, devices, or circuits. This BIOS provides "basic" level functionality and can be

used as a tool in the bring-up or debug of your unique carrier board.

 Begin with the basics

Begin by checking basic functionality such as power, reset, and clocks. Verify that the power

sequencing is as it should be and that the voltage regulator outputs are at nominal levels. Check that

the system reset signal is asserted and de-asserted according to the power sequencing requirements.

Ensure all clocks necessary for bring-up are running properly.

 Start with minimal devices

Minimize the number of devices required for bring-up. Using Eurotech’s "debug" set of firmware is a

good start. This firmware can be used (on case-by-case) basis as a debug and bring-up tool for your

specific design prototyping or in the debugging phases of your development. It disables all Non-

Critical-to-Boot functions to simplify the system functionality to base level. After you have verified this

base level, enable each subsystem as needed. Adding one device at a time will help determine which

subsystem, if any, is having problems.

 Utilize the maintenance port

Utilize the maintenance port output to identify problems during bring-up. This port provides important

debug information including BIOS POST codes and error messages that enable you to monitor the

operation of the module.

 Use your Catalyst AL Development Kit

Use your Catalyst AL Development Kit to isolate problems. If a problem occurs during bring-up of your

carrier board, try to duplicate the problem on the development kit.

 Prototype bring-up review

Review your bring-up process and share lessons learned with your Eurotech representative.

Catalyst AL Design-in Guide Product Overview

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Acceptance of Customizations

Eurotech is committed to your design success. Using our support services throughout the

development cycle ensures a complete and robust solution with which to move forward.

 Customization Acceptance

Meet with your Eurotech representative to discuss acceptance of any customizations and to plan the

steps toward production of your Catalyst AL design.

1.4 Development Kit

The Catalyst AL Development Kit is designed to get the developer up and running quickly. The

development kit includes the Catalyst AL, a standard development kit carrier board, and supporting

peripheral devices. To provide flexibility and allow development across a broad spectrum of end-use

applications, the carrier board maximizes the Catalyst AL functionality and implements many industry-

standard interfaces. This configuration allows you to become familiar with the Catalyst AL functionality

prior to customization for your specific application. In addition, the standard development kit carrier

board provides a reference for custom carrier board design.

For a complete description of the Catalyst AL Development Kit, refer to the Catalyst AL Development

Kit User Manual.

1.5 Related documents

The following documents are also important resources for the Catalyst AL.

Document

Catalyst AL Development Kit User Manual

110131-4000

Catalyst AL Development Kit Quick Start

110131-2001

Catalyst AL Carrier Board Routing Guidelines

110131-

Catalyst XL-TC-BT-AL Compatibility Technical Bulletin

110131-

Catalyst Module Installation and Removal

110122-2014

Check the Eurotech support site (http://support.eurotech-inc.com/

) for errata reports and for the latest

releases of these documents.

For further information, refer to the following documentation:

Documentation

Available at

Catalyst AL Product Page

http://www.eurotech.com/en/products/Catalyst

Everyware Software Framework Documentation

http://esf.eurotech.com/doc/ESFDevGuide/

Everyware Cloud Documentation

http://everywarecloud.eurotech.com/doc/ECDevGuide/

Software Specification Catalyst AL Design-in Guide

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2 SOFTWARE SPECIFICATION

Eurotech provides an application-ready platform including BIOS, operating system, and development

environment. This section gives a brief description of the software support available for the Catalyst

AL. For additional details, contact your local Eurotech representative.

2.1 Operating System Support

The Catalyst AL is compatible with the following operating systems:

• Microsoft Windows

®

10

• Wind River Linux

• Yocto Linux

• Fedora Linux

• Select real-time operating systems

For details about available support of each operating system, contact your local Eurotech

representative.

2.2 BIOS

The Catalyst AL incorporates a custom system BIOS developed by Eurotech.

2.3 Everyware

™

Software Framework

Everyware Software Framework (ESF) is an inclusive software framework that puts a middleware layer

between the operating system and the OEM application. It provides industry-standard interfaces that

shorten development time, simplify coding, and allow software to be ported from one Eurotech

hardware platform to another. The Catalyst AL supports ESF. If your application requires ESF,

contact your local Eurotech representative.

Information about ESF is available at http://esf.eurotech.com

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Eurotech Catalyst AL Owner's manual

Eurotech Catalyst AL Owner's manual

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