Telit Wireless Solutions LE920 Hardware User's Manual

Telit Wireless Solutions
Brand
Telit Wireless Solutions
Model
LE920
Type
Hardware User's Manual
L
LE920
H
Hardware User Guide
1vv0301026 Rev.0 - draft4 – 2013-05-21 (
(Preliminary)
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APPLICABILITY TABLE
PRODUCT
LE920
-
-EU
LE920
-
-NA
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SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE
Notice
While reasonable efforts have been made to assure the accuracy of this document, Telit
assumes no liability resulting from any inaccuracies or omissions in this document, or from
use of the information obtained herein. The information in this document has been carefully
checked and is believed to be entirely reliable. However, no responsibility is assumed for
inaccuracies or omissions. Telit reserves the right to make changes to any products described
herein and reserves the right to revise this document and to make changes from time to time
in content hereof with no obligation to notify any person of revisions or changes. Telit does
not assume any liability arising out of the application or use of any product, software, or
circuit described herein; neither does it convey license under its patent rights or the rights of
others.
It is possible that this publication may contain references to, or information about Telit
products (machines and programs), programming, or services that are not announced in your
country. Such references or information must not be construed to mean that Telit intends to
announce such Telit products, programming, or services in your country.
Copyrights
This instruction manual and the Telit products described in this instruction manual may be,
include or describe copyrighted Telit material, such as computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and its licensors certain exclusive rights for copyrighted material, including the
exclusive right to copy, reproduce in any form, distribute and make derivative works of the
copyrighted material. Accordingly, any copyrighted material of Telit and its licensors
contained herein or in the Telit products described in this instruction manual may not be
copied, reproduced, distributed, merged or modified in any manner without the express
written permission of Telit. Furthermore, the purchase of Telit products shall not be deemed
to grant either directly or by implication, estoppel, or otherwise, any license under the
copyrights, patents or patent applications of Telit, as arises by operation of law in the sale of a
product.
Computer Software Copyrights
The Telit and 3rd Party supplied Software (SW) products described in this instruction manual
may include copyrighted Telit and other 3rd Party supplied computer programs stored in
semiconductor memories or other media. Laws in the Italy and other countries preserve for
Telit and other 3rd Party supplied SW certain exclusive rights for copyrighted computer
programs, including the exclusive right to copy or reproduce in any form the copyrighted
computer program. Accordingly, any copyrighted Telit or other 3rd Party supplied SW
computer programs contained in the Telit products described in this instruction manual may
not be copied (reverse engineered) or reproduced in any manner without the express written
permission of Telit or the 3rd Party SW supplier. Furthermore, the purchase of Telit products
shall not be deemed to grant either directly or by implication, estoppel, or otherwise, any
license under the copyrights, patents or patent applications of Telit or other 3rd Party supplied
SW, except for the normal non-exclusive, royalty free license to use that arises by operation
of law in the sale of a product.
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Usage and Disclosure Restrictions
License Agreements
The software described in this document is the property of Telit and its licensors. It is
furnished by express license agreement only and may be used only in accordance with the
terms of such an agreement.
Copyrighted Materials
Software and documentation are copyrighted materials. Making unauthorized copies is
prohibited by law. No part of the software or documentation may be reproduced, transmitted,
transcribed, stored in a retrieval system, or translated into any language or computer language,
in any form or by any means, without prior written permission of Telit
High Risk Materials
Components, units, or third-party products used in the product described herein are NOT
fault-tolerant and are NOT designed, manufactured, or intended for use as on-line control
equipment in the following hazardous environments requiring fail-safe controls: the operation
of Nuclear Facilities, Aircraft Navigation or Aircraft Communication Systems, Air Traffic
Control, Life Support, or Weapons Systems (High Risk Activities"). Telit and its supplier(s)
specifically disclaim any expressed or implied warranty of fitness for such High Risk
Activities.
Trademarks
TELIT and the Stylized T Logo are registered in Trademark Office. All other product or
service names are the property of their respective owners.
Copyright © Telit Communications S.p.A. 2012.
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Contents
1.
Introduction ........................................................................................................... 9
1.1. Scope ............................................................................................................................ 9
1.2. Audience ....................................................................................................................... 9
1.3. Contact Information, Support ...................................................................................... 9
1.4. Document Organization ............................................................................................. 10
1.5. Text Conventions ........................................................................................................ 11
1.6. Related Documents ................................................................................................... 11
2.
General Product Description ................................................................................ 12
2.1. Overview ..................................................................................................................... 12
2.2. LE920 Mechanical Dimensions .................................................................................. 13
2.3. Weight ........................................................................................................................ 13
2.4. Environmental requirements .................................................................................... 14
2.4.1. Temperature range ........................................................................................................ 14
2.4.2. RoHS compliance ........................................................................................................... 14
2.5. Operating Frequency ................................................................................................. 15
2.5.1.1.
WCDMA1700 – B4 .................................................................................................. 15
2.5.1.2.
(LE920-NA only) ...................................................................................................... 15
2.5.1.3.
1710 ~ 1755 .............................................................................................................. 15
2.5.1.4.
2110 ~ 2155 .............................................................................................................. 15
2.5.1.5.
Tx: 1312 ~ 1513 ........................................................................................................ 15
2.5.1.6.
Rx: 9662 ~ 9938 ....................................................................................................... 15
2.5.1.7.
400 MHz .................................................................................................................. 15
3.
LE920 Module Connections .................................................................................. 17
3.1. PIN-OUT ..................................................................................................................... 17
3.1.1. LGA Pads Layout ............................................................................................................ 24
4.
Hardware Commands .......................................................................................... 25
4.1. Turning ON the LE920 ................................................................................................ 25
4.2. Initialization and Activation state ............................................................................... 25
4.3. Turning OFF the LE920 .............................................................................................. 27
4.3.1. Shutdown by Software Command .................................................................................. 28
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4.3.2. Hardware Shutdown ...................................................................................................... 29
4.3.3. Hardware Unconditional Restart ................................................................................... 30
4.3.4. Hardware Unconditional Shutdown ............................................................................... 31
4.4. Summary of Turning ON and OFF the module .......................................................... 32
5.
Power Supply ....................................................................................................... 33
5.1. Power Supply Requirements ..................................................................................... 33
5.2. General Design Rules ................................................................................................ 35
5.2.1. Electrical Design Guidelines .......................................................................................... 35
5.2.1.1. + 5V Input Source Power Supply Design Guidelines .............................................. 35
5.2.1.2. + 12V Input Source Power Supply Design Guidelines............................................. 36
5.2.1.3. Battery Source Power Supply Design Guidelines ................................................... 38
5.2.2. Thermal Design Guidelines............................................................................................ 39
5.2.3. Power Supply PCB Layout Guidelines ........................................................................... 40
6.
Antenna(s) ........................................................................................................... 42
6.1. GSM/WCDMA/LTE Antenna Requirements ............................................................... 42
6.2. GSM/WCDMA/LTE Antenna – PCB line Guidelines ................................................... 43
6.3. GSM/WCDMA/LTE Antenna – Installation Guidelines ............................................... 44
6.4. Antenna Diversity Requirements ............................................................................... 44
6.5. GPS/GNSS Antenna Requirements ........................................................................... 45
6.5.1. Combined GPS/GNSS Antenna ...................................................................................... 45
6.5.2. Linear and Patch GPS/GNSS Antenna ........................................................................... 46
6.5.3. Front End Design Considerations .................................................................................. 46
6.5.4. GPS/GNSS Antenna - PCB Line Guidelines ................................................................... 46
6.5.5. GPS/GNSS Antenna – Installation Guidelines ............................................................... 47
7.
Logic Level Specifications .................................................................................... 48
8.
USB Port .............................................................................................................. 49
9.
Serial Ports .......................................................................................................... 50
9.1. Modem Serial Port 1 .................................................................................................. 51
9.2. Modem Serial Port 2 .................................................................................................. 52
9.3. RS232 Level Translation ............................................................................................ 52
10.
Audio Section Overview ..................................................................................... 54
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10.1. Digital Audio ........................................................................................................... 54
11.
General Purpose I/O .......................................................................................... 56
11.1. Logic Level Specifications ...................................................................................... 57
11.2. Using a GPIO Pad as Input ...................................................................................... 57
11.3. Using a GPIO Pad as Output ................................................................................... 58
11.4. Using the Temperature Monitor Function ............................................................. 59
11.4.1. Short Description ........................................................................................................... 59
11.5. Indication of Network Service Availability .............................................................. 59
11.6. RTC Bypass Out ...................................................................................................... 60
11.7. VAUX Power Output ................................................................................................ 60
12.
ADC section ...................................................................................................... 61
12.1. ADC Converter ........................................................................................................ 61
12.1.1. Description ..................................................................................................................... 61
12.1.2. Using ADC Converter ..................................................................................................... 61
13.
Mounting the module on your board .................................................................. 62
13.1. General ................................................................................................................... 62
13.2. Finishing & Dimensions ......................................................................................... 62
13.3. Recommended foot print for the application ......................................................... 63
13.4. Stencil ..................................................................................................................... 64
13.5. PCB Pad Design ...................................................................................................... 64
13.6. Recommendations for PCB Pad Dimensions (mm) ............................................... 64
13.7. Solder Paste ........................................................................................................... 66
13.7.1. Solder Reflow ................................................................................................................. 66
14.
Application guide .............................................................................................. 68
14.1. Debug of the LE920 in production .......................................................................... 68
14.2. Bypass capacitor on Power supplies ..................................................................... 69
14.3. SIM interface........................................................................................................... 69
14.4. EMC recommendations (TBD) ................................................................................ 70
14.5. Download and Debug Port ...................................................................................... 71
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15.
Packing system ................................................................................................. 72
15.1. Tray Drawing........................................................................................................... 73
15.2. Moisture Sensibility ................................................................................................ 74
16.
Safety Recommendations .................................................................................. 75
17.
Document History ............................................................................................. 76
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1.
Introduction
1.1.
Scope
The aim of this document is the description of some hardware solutions useful for developing
a product with the Telit LE920-EU/NA module. All the features and solutions detailed are
applicable to all LE920, whereas “LE920” is intended the modules listed in the applicability
table.
When a specific feature is applicable to a specific product, it will be clearly highlighted.
1.2.
Audience
This document is intended for Telit customers, who are integrators, about to implement their
applications using our LE920
module.
1.3.
Contact Information, Support
For general contact, technical support, to report documentation errors and to order manuals,
contact Telit’s Technical Support Center (TTSC) at:
TS-EMEA@telit.com
TS-NORTHAMERICA@telit.com
TS-LATINAMERICA@telit.com
TS-APAC@telit.com
Alternatively, use:
http://www.telit.com/en/products/technical-support-center/contact.php
For detailed information about where you can buy the Telit modules or for recommendations
on accessories and components visit:
http://www.telit.com
To register for product news and announcements or for product questions contact Telit’s
Technical Support Center (TTSC).
Our aim is to make this guide as helpful as possible. Keep us informed of your comments and
suggestions for improvements.
Telit appreciates feedback from the users of our information.
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1.4.
Document Organization
This document contains the following chapters:
Chapter 1: “Introduction”
provides a scope for this document, target audience, contact and
support information, and text conventions.
Chapter 2: “General Product Description”
gives an overview of the features of the product.
Chapter 3: “LE920 Module Connections”
deals with the pin out configuration and layout.
Chapter 4: “Hardware Commands”
How to control the module via hardware
Chapter 5: “Power Supply”
deals on supply and consumption.
Chapter 6: “Antenna”
The antenna connection and board layout design are the most important
parts in the full product design
Chapter 7: “Logic Level specifications” Specific values adopted in the implementation of
logic levels for this module.
Chapter 8: “USB Port”
Chapter 9: “Serial Ports”
Chapter 10: “Audio Section Overview”
Chapter 11: “General Purpose I/O”
How the general purpose I/O pads can be configured.
Chapter 12 “DAC and ADC Section”
Deals with these two kind of converters.
Chapter 13: “Mounting the module on your board”
Chapter 14: “Application Guides”
Chapter 15: “Packing System”
Chapter 16: “Conformity Assessments”
Chapter 17: “Safety Recommendations”
Chapter 18: “Document History”
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1.5.
Text Conventions
Danger – This information MUST be followed or catastrophic equipment failure or bodily
injury may occur.
Caution or Warning – Alerts the user to important points about integrating the module, if
these points are not followed, the module and end user equipment may fail or malfunction.
Tip or Information – Provides advice and suggestions that may be useful when
integrating the module.
All dates are in ISO 8601 format, i.e. YYYY-MM-DD.
1.6.
Related Documents
x LE920-EU/NA Product Description, 80407ST10118A
x LE920-EU/NA AT command reference guide, 80407ST10116A
x Telit EVK2 User Guide, 1vv0300704
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2.
General Product Description
2.1.
Overview
The aim of this document is the description of some hardware solutions useful for developing
a product with the Telit LE920 module.
In this document all the basic functions of a mobile phone will be taken into account; for each
one of them a proper hardware solution will be suggested and eventually the wrong solutions
and common errors to be avoided will be evidenced. Obviously this document cannot
embrace the whole hardware solutions and products that may be designed. The wrong
solutions to be avoided must be considered as mandatory, while the suggested hardware
configurations must not be considered mandatory, instead the information given must be used
as a guide and a starting point for properly developing your product with the Telit LE920
module.
.
NOTICE:
The integration of the GSM/GPRS/EGPRS/WCDMA/HSPA+/LTE LE920 cellular module
within user application must be done according to the design rules described in this manual.
The information presented in this document is believed to be accurate and reliable. However,
no responsibility is assumed by Telit Communication S.p.A. for its use, such as any
infringement of patents or other rights of third parties which may result from its use. No
license is granted by implication or otherwise under any patent rights of Telit Communication
S.p.A. other than for circuitry embodied in Telit products. This document is subject to change
without notice.
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2.2.
LE920 Mechanical Dimensions
The Telit LE920 module overall dimensions are:
 Length: 34 mm
Width: 40 mm
 Thickness: 2.9 mm
2.3.
Weight
The module weight of LE920-EU/NA is about 9.0 gram.
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2.4.
Environmental requirements
2.4.1.
Temperature range
Note
Operating Temperature
Range
–20°C ~ +55°C The module is fully functional (*) in all the
temperature range, and it fully meets the ETSI
specifications.
–40°C ~ +85°C The module is fully functional (*) in all the
temperature range. Temperatures outside of
the range –20°C ÷ +55°C might slightly
deviate from ETSI specifications.
Storage and non-operating
Temperature Range
–40°C ~ +85°C
(*)Functional: the module is able to make and receive voice calls, data calls and SMS.
2.4.2.
RoHS compliance
As a part of Telit corporate policy of environmental protection, the LE920 complies with the
RoHS (Restriction of Hazardous Substances) directive of the European Union (EU directive
2002/95/EG).
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2.5.
Operating Frequency
The operating frequencies in GSM850, EGSM900, DCS1800, PCS1900, WCDMA & LTE
modes are conformed to the 3GPP specifications.
Mode Freq. TX (MHz) Freq. RX (MHz) Channels TX - RX
offset
GSM850 824 ~ 849 869 ~ 894 128 ~ 251 45 MHz
EGSM900
890 ~ 915 935 ~ 960 0 ~ 124 45 MHz
880 ~ 890 925 ~ 935 975 ~ 1023 45 MHz
DCS1800 1710 ~ 1785 1805 ~ 1880 512 ~ 885 95MHz
PCS1900 1850 ~ 1910 1930 ~ 1990 512 ~ 810 80MHz
WCDMA2100 – B1
(LE920 both models)
1920 ~ 1980 2110 ~ 2170
Tx: 9612 ~ 9888
Rx: 10562 ~ 10838
190MHz
WCDMA1900 – B2
(LE920-NA only)
1850 ~ 1910 1930 ~ 1990
Tx: 9262 ~ 9538
Rx: 9662 ~ 9938
80MHz
WCDMA1800 – B3
(LE920-EU only)
1710 ~ 1785 1805 ~ 1880 Tx: 937 ~ 1288
Rx: 1162 ~ 1513
95MHz
WCDMA1700 – B4
(LE920-NA only)
1710 ~ 1755 2110 ~ 2155
Tx: 1312 ~ 1513
Rx: 9662 ~ 9938
400 MHz
WCDMA850 – B5
(LE920-NA only)
824 ~ 849 869 ~ 894
Tx: 4132 ~ 4233
Rx: 4357 ~ 4458
45MHz
WCDMA800 – B6
(LE920-NA only)
830 ~ 840 875 ~ 885
Tx: 4162 ~ 4188
Rx: 4387 ~ 4413
45MHz
WCDMA900 – B8
(LE920-EU only)
880 ~ 915 925 ~ 960
Tx: 2712 ~ 2863
Rx: 2937 ~ 3088
45MHz
LTE2100 – B1
(LE920 both models)
1920 ~ 1980 2110 ~ 2170
Tx: 18000 ~ 18599
Rx: 0 ~ 599
190MHz
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LTE1900 – B2
(LE920-NA only)
1850 ~ 1910 1930 ~ 1990
Tx: 18600 ~ 19199
Rx: 600 ~ 1199
80MHz
LTE1800 – B3
(LE920-EU only)
1710 ~ 1785 1805 ~ 1880 Tx: 19200 ~ 19949
Rx: 1200 ~ 1949
95MHz
LTE1700 – B4
(LE920-NA only)
1710~ 1755 2110 ~ 2155
Tx: 19950 ~ 20399
Rx: 1950 ~ 2399
400MHz
LTE850 – B5
(LE920-NA only)
824 ~ 849 869 ~ 894
Tx: 20400 ~ 20649
Rx: 2400 ~ 2649
45MHz
LTE2600 – B7
(LE920-EU only)
2500 ~ 2570 2620 ~ 2690
Tx: 20750 ~ 21449
Rx: 2750 ~ 3449
120MHz
LTE900 – B8
(LE920-EU only)
880 ~ 915 925 ~ 960
Tx: 21450 ~ 21799
Rx: 3450 ~ 3799
45MHz
LTE700 – B17
(LE920-NA only)
704 ~ 716 734 ~ 746
Tx: 23730 ~ 23849
Rx: 5730 ~ 5849
30MHz
LTE800 – B20
(LE920-EU only)
832 ~ 862 791 ~ 821
Tx: 24150 ~ 24449
Rx: 6150 ~ 6449
-41MHz
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3.
LE920 Module Connections
3.1.
PIN-OUT
PAD Signal I/O Function Type COMMENT
USB HS 2.0 Communication Port
D19
USB_D+ I/O USB differential Data(+)
F19
USB_D- I/O USB differential Data(+)
A18
USB_VBUS AI Power sense for the internal USB transceiver Power
Asynchronous UART – Prog. / data +HW Flow Control
AH19
C103/TXD I Serial data input (TXD) from DTE 1.8V
AF19
C104/RXD O Serial data output to DTE 1.8V
AC18
C108/DTR I Input for Data terminal ready signal (DTR) from DTE 1.8V
AA18
C105/RTS I Input for Request to send signal (RTS) from DTE 1.8V
AK19
C106/CTS O Output for Clear to send signal (CTS) to DTE 1.8V
AE18
C109/DCD O Output for Data carrier detect signal (DCD) to DTE 1.8V
AG18
C107/DSR O Output for Data set ready signal (DSR) to DTE 1.8V
AJ18
C125/RING O Output for Ring indicator signal (RI) to DTE 1.8V
Asynchronous Auxiliary UART
AB19
TXD_AUX O Auxillary UART (TX Data to DTE) 1.8V
AD19
RXD_AUX I Auxillary UART (RX Data from DTE) 1.8V
SIM Card Interface 1
A10
SIMCLK1 O External SIM signal – Clock 1.8/2.85V
B11
SIMRST1 O External SIM signal – Reset 1.8/2.85V
B9
SIMIO1 I/O External SIM signal - Data I/O 1.8/2.85V
B7
SIMIN1 I External SIM signal - Presence (active low) 1.8V
A8
SIMVCC1 - External SIM signal – Power supply for the SIM 1.8/2.85V
Audio
B5
EAR1_MT+ AO Earphone signal output1, phase + Audio
A4
EAR1_MT- AO Earphone signal output1, phase - Audio
B3
MIC1_MT+ AI Mic signal input1, phase + Audio
A2
MIC1_MT- AI Mic signal input1, phase - Audio
E2
EAR2_MT+ AO Earphone signal output2, phase + Audio
D1
EAR2_MT- AO Earphone signal output2, phase - Audio
C2
MIC2_MT+ AI Mic signal input2, phase + Audio
B1
MIC2_MT- AI Mic signal input2, phase - Audio
Digital Voice interface (DVI)
D11
DVI_WA0 O Digital Voice interface (WA0 master output) 1.8V
C8
DVI_RX I Digital Voice interface (RX) 1.8V
D9
DVI_TX O Digital Voice interface (TX) 1.8V
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PAD Signal I/O Function Type COMMENT
C10
DVI_CLK O Digital Voice interface (CLK master output) 1.8V
Digital I/O
F9
GPIO_01
I/O
GPIO_01
1.8V
E10
GPIO_02
I/O
GPIO_02
1.8V
F11
GPIO_03
I/O
GPIO_03
1.8V
E12
GPIO_04
I/O
GPIO_04
1.8V
F13
GPIO_05
I/O
GPIO_05
1.8V
E14
GPIO_06
I/O
GPIO_06
1.8V
R18
GPIO_07
I/O
GPIO_07
1.8V
S19
GPIO_08
I/O
GPIO_08
1.8V
U19
GPIO_09
I/O
GPIO_09
1.8V
W19
GPIO_10
I/O
GPIO_10
1.8V
RF Section
AD1
Antenna I/O GSM/EDGE/UMTS/LTE Antenna (50 Ohm) RF
AU9
ANT_DIV I UMTS/LTE Antenna Diversity Input (50 Ohm) RF
GPS Section
S1
ANT_GPS I GPS Antenna (50 Ohm) RF
Miscellaneous Function
AP1
RESET# I Reset Input Active Low
AS1
ON_OFF# I Input Command for Power ON Active Low
AN12
SHDN_N I Unconditional Shut down Input Active Low
F17
VRTC AI VRTC Backup Capacitor Power
To be used to
back up the
RTC section
P17
VAUX/PWRMON O
Supply Output for External Accessories / Power ON
Monitor
1.8V
D5
ADC_IN1 AI Analog/Digital Converter Input 1 Analog
E6
ADC_IN2 AI Analog/Digital Converter Input 2 Analog
F7
ADC_IN3 AI Analog/Digital Converter Input 3 Analog
AU3
STAT_LED O Status Indicator LED 1.8V
AN10
SW_RDY O Indicates that the boot sequence completed successfully 1.8V
Power Supply
AP17
VBATT - Main Power Supply (Digital Section)
Power
AP19
VBATT - Main Power Supply (Digital Section)
Power
AR18
VBATT - Main Power Supply (Digital Section)
Power
AS17
VBATT_PA - Main Power Supply (RF Transmit Power Section)
Power
AS19
VBATT_PA - Main Power Supply (RF Transmit Power Section)
Power
AT18
VBATT_PA - Main Power Supply (RF Transmit Power Section)
Power
AU17
VBATT_PA - Main Power Supply (RF Transmit Power Section)
Power
AU19
VBATT_PA - Main Power Supply (RF Transmit Power Section)
Power
A6
GND - Ground
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PAD Signal I/O Function Type COMMENT
A12
GND - Ground
B13
GND
- Ground
B15
GND
- Ground
B17
GND - Ground
C4
GND - Ground
C6
GND
- Ground
D3
GND - Ground
D7
GND - Ground
E18
GND
- Ground
F1
GND - Ground
G18
GND - Ground
H19
GND - Ground
M1
GND - Ground
N2
GND
- Ground
P1
GND
- Ground
P3
GND - Ground
R2
GND Ground
T2
GND Ground
T18
GND - Ground
U1
GND - Ground
V18
GND - Ground
W1
GND
- Ground
X2
GND
- Ground
X18
GND - Ground
Y1
GND - Ground
Y19
GND Ground
AA2
GND - Ground
AB1
GND - Ground
AC2
GND
- Ground
AE2
GND
- Ground
AF1
GND - Ground
AG2
GND - Ground
AH1
GND - Ground
AJ2
GND - Ground
AK1
GND - Ground
AK17
GND - Ground
AL18
GND - Ground
AM17
GND - Ground
AM19
GND - Ground
AN16
GND - Ground
AN18
GND - Ground
L
LE920 Hardware User Guide
1vv0301026 Rev.0 - draft4 – 2013-05-
Reproduction forbidden without written authorization from Telit Communications S.p.A. - All Rights Reserved. Page 20 of 76
PAD Signal I/O Function Type COMMENT
AP3
GND - Ground
AP5
GND - Ground
AP7
GND - Ground
AP9
GND - Ground
AP11
GND - Ground
AP13
GND - Ground
AP15
GND - Ground
AR2
GND - Ground
AR4
GND - Ground
AR6
GND - Ground
AR8
GND - Ground
AR10
GND - Ground
AR12
GND - Ground
AR14
GND - Ground
AR16
GND - Ground
AS5
GND - Ground
AS7
GND - Ground
AS9
GND - Ground
AS11
GND - Ground
AS13
GND - Ground
AS15
GND - Ground
AT4
GND - Ground
AT6
GND - Ground
AT8
GND - Ground
AT10
GND - Ground
AT12
GND - Ground
AT14
GND - Ground
AT16
GND - Ground
AU1
GND - Ground
AU5
GND - Ground
AU7
GND - Ground
AU11
GND - Ground
AU15
GND - Ground
Reserved
C12
Reserved - Reserved
A14
Reserved - Reserved
A16
Reserved - Reserved
M17
Reserved - Reserved
AN6
Reserved - Reserved
V2
Reserved - Reserved
C14
Reserved - Reserved
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Telit Wireless Solutions LE920 Hardware User's Manual

Telit Wireless Solutions
Brand
Telit Wireless Solutions
Model
LE920
Type
Hardware User's Manual
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