DISCO DFD-2D/8 is a high-performance wafer dicing saw with a number of advanced features that make it ideal for a variety of dicing applications. Some of the key capabilities of the DFD-2D/8 include:
High-precision dicing: The DFD-2D/8 is capable of dicing wafers with a high degree of precision, thanks to its advanced motion control system and high-resolution linear scales. This makes it ideal for applications where precise dicing is critical, such as in the production of semiconductor devices.
High-speed dicing: The DFD-2D/8 is also capable of dicing wafers at high speeds, making it a productive choice for high-volume production environments. The saw's high-speed spindle motor and optimized motion control system allow it to achieve dicing speeds of up to 800 mm/sec.
DISCO DFD-2D/8 is a high-performance wafer dicing saw with a number of advanced features that make it ideal for a variety of dicing applications. Some of the key capabilities of the DFD-2D/8 include:
High-precision dicing: The DFD-2D/8 is capable of dicing wafers with a high degree of precision, thanks to its advanced motion control system and high-resolution linear scales. This makes it ideal for applications where precise dicing is critical, such as in the production of semiconductor devices.
High-speed dicing: The DFD-2D/8 is also capable of dicing wafers at high speeds, making it a productive choice for high-volume production environments. The saw's high-speed spindle motor and optimized motion control system allow it to achieve dicing speeds of up to 800 mm/sec.
DISCO DFD-2D/8 is a high-performance wafer dicing saw with a number of advanced features that make it ideal for a variety of dicing applications. Some of the key capabilities of the DFD-2D/8 include:
High-precision dicing: The DFD-2D/8 is capable of dicing wafers with a high degree of precision, thanks to its advanced motion control system and high-resolution linear scales. This makes it ideal for applications where precise dicing is critical, such as in the production of semiconductor devices.
High-speed dicing: The DFD-2D/8 is also capable of dicing wafers at high speeds, making it a productive choice for high-volume production environments. The saw's high-speed spindle motor and optimized motion control system allow it to achieve dicing speeds of up to 800 mm/sec.
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