METTLER TOLEDO IND560x Terminal Installation Manual
Contents
2.2. Understanding Approval Parameters ................................................ 2-2
2.2.1. Entity Value Calculations ...................................................................................... 2-2
2.2.2. Fiber Optic Interface ............................................................................................. 2-2
2.3. United States Approvals ................................................................. 2-2
2.3.1. Special Conditions (FMus) ................................................................................... 2-3
2.4. European Approvals ...................................................................... 2-3
2.4.1. Special Conditions (ATEX) .................................................................................... 2-3
2.5. Canadian Approvals ...................................................................... 2-4
2.5.1. Special Conditions (FMca) ................................................................................... 2-4
2.6. IECEx Approval ............................................................................. 2-4
2.6.1. Special Conditions (IECEx) ................................................................................... 2-4
2.7. Approval Entity Values ................................................................... 2-5
3. Installation .................................................................................. 3-1
3.1. Opening the Enclosures ................................................................. 3-2
3.1.1. Panel-Mount Enclosure ........................................................................................ 3-2
3.1.2. Harsh Enclosure .................................................................................................. 3-2
3.2. Mounting the Terminal ................................................................... 3-3
3.2.1. Panel-Mount Enclosure ........................................................................................ 3-3
3.2.2. Harsh Enclosure .................................................................................................. 3-6
3.3. Installing Cables and Connectors .................................................... 3-9
3.3.1. Ferrite ................................................................................................................. 3-9
3.3.2. Harsh Enclosure Cable Glands ............................................................................ 3-10
3.3.3. Main Board Wiring Connections .......................................................................... 3-13
3.4. Wiring Connections for Internal Options ......................................... 3-20
3.4.1. IND560x-PAB ................................................................................................... 3-20
3.4.2. Discrete I/O ....................................................................................................... 3-26
3.4.3. I.S. Current Loop Interface .................................................................................. 3-31
3.4.4. Fiber Optic Interface ........................................................................................... 3-33
3.5. Wiring Connections for ACM500 Options ....................................... 3-37
3.6. Bonding and Grounding ............................................................... 3-38
3.7. Equipotential Bonding (EB) .......................................................... 3-38
3.7.1. 13BWarnings ................................................................................................... 3-38
3.8. PCB Switch Settings .................................................................... 3-39
3.8.1. Main PCB Switches ........................................................................................... 3-39
3.9. PCB Jumper Positions ................................................................. 3-40
3.9.1. On/Off Key Disable ............................................................................................ 3-40
3.9.2. 2mV/V 3mV/V Jumper ....................................................................................... 3-40
3.9.3. IND560x-PAB Jumper ....................................................................................... 3-41
3.10. Closing the Enclosure .................................................................. 3-42
3.10.1. Panel-Mount Enclosure ...................................................................................... 3-42
3.10.2. Harsh Enclosure ................................................................................................ 3-42