LG GM210 User manual

Category
Musical Equipment
Type
User manual
Service Manual Model : GM210
Internal Use Only
Service Manual
GM210
Date: April, 2009 / Issue 1.0
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Copyright © 2009 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
Table Of Contents
1. INTRODUCTION ...............................................5
1.1 Purpose ......................................................................5
1.2 Regulatory Information .................................................5
1.3 Abbreviations ..............................................................7
2. SYSTEM SPECIFICATION.................................9
2.1 H/W Features ..............................................................9
2.2 Technical Specifi cation ...............................................11
3. TECHNICAL BRIEF .........................................16
3.1 Main Processor(Digital Part : AD6725, U102) ..............16
3.2 Main Processor (Analog Part : AD6725, U102) ............19
3.3 RF Transceiver (AD6546) ...........................................26
3.4 Power Amplifi er Module (SKY77523) ..........................39
3.5 BT Module with integrated FM tuner ...........................30
3.6 MEMORY(PF38F5060M0Y0BE, U100 ) .......................32
3.7 Multi-Media Processor (AIT817, U602) .......................35
3.8 SIM Card Interface .....................................................38
3.9 Micro-SD Card Interface ............................................39
3.10 LCD Interface ..........................................................40
3.11 Battery Charger Interface .........................................43
3.12 Keypad Interface .....................................................44
3.13 Audio Interface ........................................................46
3.14 Camera Interface(2M Fixed Focus Camera) ...............53
3.15 KEY BACLKLIGHT LED Interface ................................55
3.16 Vibrator Interface .....................................................57
4. TROUBLE SHOOTING .....................................58
4.1 RF Component ..........................................................58
4.2 RX Trouble ................................................................59
4.3 TX Trouble .................................................................64
4.4 Power On Trouble ......................................................68
4.5 Charging Trouble .......................................................71
4.6 Vibrator Trouble .........................................................73
4.7 LCD Trouble ..............................................................75
4.8 Camera Trouble .........................................................79
4.9 Speaker Trouble ........................................................83
4.10 Earphone Trouble .....................................................85
4.11 Receiver Trouble ......................................................89
4.12 Microphone Trouble .................................................91
4.13 SIM Card Interface Trouble .......................................93
4.14 KEY backlight Trouble ..............................................95
4.15 RTC Trouble ............................................................97
4.16 Folder on/off Trouble ................................................99
4.17 Micro SD Trouble ...................................................101
4.18 FM radio Trouble ...................................................103
5. DOWNLOAD .................................................105
5.1 Download................................................................105
6. BLOCK DIAGRAM ........................................ 111
7. CIRCUIT DIAGRAM ......................................113
8. BGA Pin Map ..............................................121
9. PCB LAYOUT ............................................... 125
10. Confi guration of HOT KIMCHI .................131
10.1 BB Test [MENU 1] ..................................................132
10.2 RF Test [MENU 2] ..................................................134
10.3 MF mode [MENU 3] ...............................................134
10.4 Trace option [MENU 4] ...........................................135
10.5 Call timer [MENU 5] ...............................................135
10.6 Fact. Reset [MENU 6] .............................................135
10.7 S/W version ..........................................................135
11. STAND ALONE TEST.................................. 136
11.1 Introduction ...........................................................136
11.2 Setting Method ......................................................136
11.3 Means of Test ........................................................137
12. RF Calibration ..........................................139
12.1 Overview ...............................................................139
12.2 Procedure .............................................................139
12.3 AGC ......................................................................140
12.4 APC ......................................................................140
12.5 ADC ......................................................................140
13. EXPLODED VIEW & REPLACEMENT
PART LIST ................................................ 141
13.1 EXPLODED VIEW ...................................................141
13.2 Replacement Parts ................................................143
13.3 Accessory .............................................................166
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Copyright © 2009 LG Electronics. Inc. All right reserved.
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LGE Internal Use Only
1. INTRODUCTION
1. INTRODUCTION
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
1.1 Purpose
This manual provides the information necessary to repair, calibration, description and download the
features of this model.
1.2 Regulatory Information
A. Security
Toll fraud, the unauthorized use of telecommunications system by an unauthorized part (for example,
persons other than your company’s employees, agents, subcontractors, or person working on your
company’s behalf) can result in substantial additional charges for your telecommunications services. System
users are responsible for the security of own system. There are may be risks of toll fraud associated with your
telecommunications system. System users are responsible for programming and configuring the equipment
to prevent unauthorized use. The manufacturer does not warrant that this product is immune from the
above case but will prevent unauthorized use of common-carrier telecommunication service of facilities
accessed through or connected to it.
The manufacturer will not be responsible for any charges that result from such unauthorized use.
B. Incidence of Harm
If a telephone company determines that the equipment provided to customer is faulty and possibly causing
harm or interruption in service to the telephone network, it should disconnect telephone service until repair
can be done. A telephone company may temporarily disconnect service as long as repair is not done.
C. Changes in Service
A local telephone company may make changes in its communications facilities or procedure. If these
changes could reasonably be expected to affect the use of the this phone or compatibility with the network,
the telephone company is required to give advanced written notice to the user, allowing the user to take
appropriate steps to maintain telephone service.
D. Maintenance Limitations
Maintenance limitations on this model must be performed only by the manufacturer or its authorized agent.
The user may not make any changes and/or repairs expect as specifically noted in this manual. Therefore,
note that unauthorized alternations or repair may affect the regulatory status of the system and may void
any remaining warranty.
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1. INTRODUCTION
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
LGE Internal Use Only
E. Notice of Radiated Emissions
This model complies with rules regarding radiation and radio frequency emission as defined by local
regulatory agencies. In accordance with these agencies, you may be required to provide information such
as the following to the end user.
F. Pictures
The pictures in this manual are for illustrative purposes only; your actual hardware may look slightly
different.
G. Interference and Attenuation
Phone may interfere with sensitive laboratory equipment, medical equipment, etc.Interference from
unsuppressed engines or electric motors may cause problems.
H. Electrostatic Sensitive Devices
ATTENTION
Boards, which contain Electrostatic Sensitive Device (ESD), are indicated
by the sign. Following information is ESD handling:
• Service personnel should ground themselves by using a wrist strap when exchange system
boards.
• When repairs are made to a system board, they should spread the floor with anti-static mat
which is also grounded.
• Use a suitable, grounded soldering iron.
• Keep sensitive parts in these protective packages until these are used.
• When returning system boards or parts like EEPROM to the factory, use the protective
package as described.
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1. INTRODUCTION
Copyright © 2008 LG Electronics. Inc. All right reserved.
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1.3 Abbreviations
For the purposes of this manual, following abbreviations apply:
Offset Phase Locked LoopOPLL
Light Emitting DiodeLED
Low Drop OutputLDO
Liquid Crystal DisplayLCD
Intermediate FrequencyIF
International Portable User IdentityIPUI
Global System for Mobile CommunicationsGSM
General Purpose Interface BusGPIB
Gaussian Minimum Shift KeyingGMSK
Flexible Printed Circuit BoardFPCB
Electrostatic DischargeESD
Electrical Erasable Programmable Read-Only MemoryEEPROM
Digital Signal ProcessingDSP
dB relative to 1 milli wattdBm
Digital Communication SystemDCS
Digital to Analog ConverterDAC
Constant Current – Constant VoltageCC-CV
Bit Error RatioBER
BasebandBB
Automatic Power ControlAPC
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1. INTRODUCTION
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Wireless Application Protocol
WAP
Voltage Control Temperature Compensated Crystal OscillatorVCTCXO
Voltage Controlled OscillatorVCO
Universal Asynchronous Receiver/TransmitterUART
Time Division Multiple AccessTDMA
Time Division DuplexTDD
Travel AdapterTA
Side Tone Masking RatingSTMR
Pseudo SRAMPSRAM
Static Random Access MemorySRAM
Sending Loudness RatingSLR
Subscriber Identity ModuleSIM
Surface Acoustic WaveSAW
Real Time ClockRTC
Root Mean SquareRMS
Receiving Loudness RatingRLR
Radio FrequencyRF
Public Switched Telephone NetworkPSTN
Phase Locked LoopPLL
Programmable Gain AmplifierPGA
Printed Circuit BoardPCB
Power Amplifier ModulePAM
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2. SYSTEM SPECIFICATION
Copyright © 2008 LG Electronics. Inc. All right reserved.
Only for training and service purposes
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2.1 H/W Features
Item Feature Comment
Standard Battery Li-ion Polymer, 3.7V 800mAh
Stand by TIME Up to 200 hrs : Paging Period 5, RSSI 85dBm
Talk time Up to 200min : GSM Tx Level 7
Stand by time Up to 200 hours (Paging Period: 5, RSSI: -85 dBm)
Charging time Approx. 3 hours
RX Sensitivity GSM, EGSM: -109dBm, DCS: -109dBm
TX output power
GSM, EGSM: 32.3dBm(Level 5),
DCS , PCS: 29.5dBm(Level 0)
SIM card type 3V/1.8V Small
Display TFT 240 × 320 pixel 65K Color
KEYPAD
0 ~ 9, #, *, Up/Down/Left/Right Navigation Key
Music Key, Clear Key, OK Key, PWR Key
Send Key, Soft Key(Left/Right)
Volume Key(Up/Down), Camera Key, Hold Key
ANT Internal(GSM, Bluetooth)
EAR Phone Jack Yes
3.5 Ø only
PC Synchronization Yes
Speech coding
EFR/FR/HR/AMR
Data and Fax Yes
GPRS compatibility Class 12
Vibrator Yes
Loud Speaker Yes
Voice Recoding Yes
Microphone Yes
EDGE compatibility Class 12
2. SYSTEM SPECIFICATION
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2. SYSTEM SPECIFICATION
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Travel Adapter Yes
Speaker/Receiver Oval Type(1812), Speaker & Receiver Dual Mode
MIDI SW MIDI (Mono SPK)
Item Feature Comment
Camera 2M
Bluetooth / FM Radio Bluetooth version 2.1 / 76~108MHz supported
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2. SYSTEM SPECIFICATION
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2.2 Technical Specification
Ite m De scription
3 Frequency Error
Level Power Toler. Level Power Toler.
5 33 dBm ±2dB 13 17 dBm ±3dB
6 31 dBm ±3dB 14 15 dBm ±3dB
7 29 dBm ±3dB 15 13 dBm ±3dB
8 27 dBm ±3dB 16 11 dBm ±5dB
9 25 dBm ±3dB 17 9 dBm ±5dB
10 23 dBm ±3dB 18 7 dBm ±5dB
11 21 dBm ±3dB 19 5 dBm ±5dB
12 19 dBm ±3dB
Level Power Toler. Level Power Toler.
0 30 dBm ±2dB 8 14 dBm ±3dB
1 28 dBm ±3dB 9 12 dBm ±4dB
2 26 dBm ±3dB 10 10 dBm ±4dB
3 24 dBm ±3dB 11 8 dBm ±4dB
4 22 dBm ±3dB 12 6 dBm ±4dB
5 20 dBm ±3dB 13 4 dBm ±4dB
6 18 dBm ±3dB 14 2 dBm ±5dB
7 16 dBm ±3dB 15 0 dBm ±5dB
DCS1800
Specification
GSM900
TX: 890 + n ´ 0.2 MHz (n=1 ~ 124)
890 + (n-1024) ´ 0.2 MHz (n=975 ~ 1023)
GSM850
TX: 824 + n ´ 0.2 MHz (n=1 ~ 124)
RX: TX + 45 MHz
Peak < 20 degrees
1 Frequency Band
RX: TX + 95 MHz
PCS1900
TX: 1850 + ( n-511 ) ´ 0.2 MHz
RX: TX + 45 MHz
< 0.1ppm
RX: 1930 + ( n-511 ) ´ 0.2 MHz (n = 512 ~ 810)
TX: 1710 + ( n-511 ) ´ 0.2 MHz (n = 512 ~ 885)
4 Power Level
GSM850/GSM900
DCS1800/PCS1900
2 Phase Error
RMS < 5 degrees
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5
Output RF Spectrum
(due to modulation)
Offset from Carrier (kHz). Max. dBc
100 +0.5
200
-30
250
-33
400
-60
600~ <1,200
-60
1,200~ <1,800
-60
1,800~ <3,000
-63
3,000~ <6,000
-65
6,000 -71
GSM, EGSM
Offset from Carrier (kHz). Max. dBc
100 +0.5
200
-30
250
-33
400
-60
600~ <1,200
-60
1,200~ <1,800
-60
1,800~ <3,000
-65
3,000~ <6,000
-65
6,000 -73
DCS/PCS
6
Output RF Spectrum
(due to switching
transient)
GSM, EGSM
Offset from Carrier (kHz). Max. dBm
400
-19
600
-21
1,200 -21
1,800 -24
Item Description Specification
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Item Description Specification
6
Output RF Spectrum
(due to switching
transient)
Offset from Carrier (kHz). Max. dBm
400
-22
600
-24
1,200 -24
1,800 -27
7 Spurious Emissions Conduction, Emission Status
8 Bit Error Ratio
GSM, EGSM
BER (Class II) < 2.439% @-104 dBm
DCS, PCS
BER (Class II) < 2.439% @-104 dBm
9 RX Level Report Accuracy ±3 dB
10 SLR 8±3 dB
11 Sending Response
300
-12
1,000 -6
2,000 -6
3,000 -6
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000
-
3,400 -9
0
0
4
4
-12
0
0
4
12 RLR 2±3 dB
DCS/PCS
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2. SYSTEM SPECIFICATION
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Item Description Specification
13 Receiving Response
300
-7
500
-5
1,000 -5
3,000 -5
Frequency (Hz) Max.(dB) Min.(dB)
100 -
200 -
4,000
3,400 -10
2
*
0
2
-12
0
2
2
14 STMR 13±5 dB
* Mean that Adopt a straight line in between 300 Hz
and 1,000 Hz to be Max. level in the range.
15 Stability Margin > 6 dB
-20
-10
0
7
dB to ARL (dB) Level Ratio (dB)
-35
-30
10
30.7
33.3
33.7
31.7
17.5
22.5
25.5
16 Distortion
17 Side Tone Distortion Three stage distortion < 10%
18
System frequency
(13 MHz) tolerance
2.5 ppm
19 32.768KHz tolerance 30 ppm
20 Ringer Volume
At least 65 dBspl under below conditions:
1. Ringer set as ringer.
2. Test distance set as 50 cm
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2. SYSTEM SPECIFICATION
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Item Description Specification
21 Charge Current
Fast Charge : Typ. 390 mA
Slow Charge : Typ. 80mA
Total Charging Time : < 3 hours
2 -> 1
0 -> OFF
Bar Number Power
4 -> 2
-104 ± 2
~ -106
-98 ± 2
-101 ± 2
22 Antenna Display
2 -> 1
1 -> 0
Battery Bar Number Voltage
3
3 -> 2
3.75 ± 0.05 V
23 Battery Indicator
24
Low Voltage Warning
( Blinking Bar)
3.54 ± 0.05V (Call), 1/1-minute(Receiver)
3.4 ± 0.05V (Standby), 1/3-minute(Speaker)
25
Forced shut down
Voltage
3.33 ± 0.05V
27 Battery Type
Li-Polymer Battery
Standard Voltage = 3.7 V
Battery full charge voltage = 4.2 V
Capacity: 800mAh
28 Travel Charger
Switching-mode charger
Input: 100 ~ 350V, 50/60 Hz
Output: 5.6 V, 400 mA
3.75± 0.05 V
26
Sustain RTC
without battery
Over 50 hours
3.64 ± 0.05 V
3.54 ± 0.05 V
7
7 -> 5
5 -> 4
-93 ~
-93 ± 2
1 -> 0 -106 ± 2
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3. TECHNICAL BRIEF
3. TECHNICAL BRIEF
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Figure. 3-1-1 AD6725 FUNCTIONAL BLOCK DIAGRAM
The AD6725 is a tightly integrated single-package baseband processing solution offered by Analog Devices
as part of the AD20msp520 SoftFone® chipset family. The AD6725 incorporates all digital, analog, and power
management functions required in GSM, GPRS, EGPRS handsets with advanced multimedia and system
power management capabilities.
3.1 Main Processor(Digital Part : AD6725, U102)
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3.1.1 Features of AD6725
Complete Single-Chip Programmable Baseband Processor divided into several subsystems
MCU Control Processor Subsystem:
32-bit ARM926EJ-S® MCU Control Processor
208 MHz operation at 1.2V
2 dedicated caches, 16kB each, for instructions and data
4kB Instruction Tightly Coupled Memory (TCM)
2-Mbit On-chip System SRAM
Ciphering coprocessor for GPRS supporting GEA1 and GEA2 encryption algorithms
Kasumi cipher coprocessor for GEA3 encryption
Dedicated multichannel DMA controller
DSP Subsystem:
16-bit fixed-point Blackfin® DSP Processor
208 MHz operation at 1.
Memory:
L1 program space: 64 kB SRAM and 16 kB configurable as instruction cache
or SRAM
L1 data space: Two banks of 16K bytes, each with 8K bytes of dedicated SRAM
and an additional 8K bytes that can be configured as either cache or SRAM
L2 space: 64KB SRAM
Ciphering coprocessor (GEA1 and GEA2)
Kasumi cipher coprocessor for GEA3 encryption
Dedicated multichannel DMA controller
Peripherals Subsystem:
Shared on-chip peripherals and off-chip interfaces:
Support for Burst-mode, Page-mode, and NAND Flash memory
Support for SRAM, SDRAM, and PSRAM (cellular RAM)
Full-Speed USB 2.0 Dual-Role Interface with OTG (On-The-Go) Host Mode or
traditional Peripheral-only mode
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Serial Display Interface
8x8 Keypad Interface
Thumbwheel Interface
4 Independent Programmable Backlights plus a Service Light
1.8V and 3.0V, 64 kbps SIM Interface
Universal System Connector Interface
Multimedia Card (MMC) Interface
Secure Data (SD) Card Interface and SD I/O
IrDA transceiver interfaces, including Fast IrDA (4 Mbps baud)
2 Configurable Generic Serial Ports (GSPs)
7 Configurable Enhanced Generic Serial Ports (eGSPs)
Applications Subsystem for Enhanced Multimedia:
Dedicated 8/16/18-bit interface for parallel displays
8/10-bit Parallel Peripheral Interface (PPI) for camera sensor
Image Signal Processing (ISP) module supporting resolutions up to 3.14 mega pixels.
Flexible 2-D DMA controller
Camera Flash synchronization strobe
Hardware image scaling
YCbCr/RGB color conversion
JPEG decoder hardware Hardware
JPEG compression
OTHER FEATURES
Real-Time Clock (RTC) with Alarm
Four General-Purpose Timers
Compatible with Othello® radio subsystem
Configurable interrupt controller architecture
Programmable bus arbitration to optimize system performance
Programmable Power Management and Clock Management
Slow Clocking Scheme for Low Idle Mode Current
Power Down modes
Dynamic Core Voltage Scaling
Active Leakage Current Management
Independent I/O Voltage Domains
On-chip support for EGPRS Data Services up to Class 12
JTAG Interface for Test and In-Circuit Emulation of both the MCU and DSP
Embedded Trace Macrocell for MCU Debug
Advanced features for security Real-Time Clock (RTC) with Alarm
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3.2 Main Processor (Analog Part : AD6725, U102)
Figure. 3-2-1 AD6725 FUNCTIONAL BLOCK DIAGRAM
The AD6725 is a complete mixed-signal baseband processor that combines all of the data converters and
power supply regulators required for a GSM 900 / GSM 850 / DCS 1800 / PCS 1900 mobile on a single device,
including HSCSD, GPRS and EGPRS.
AUDIO Subsystem
Radio Interface
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3.2.1 General Description
The AD6725 baseband transmit section supports the following mobile station GMSK
modulation power classes:
• GSM 900/850 power classes 4 and 5,
• DCS 1800 power classes 1 and 2, and
• PCS 1900 power classes 1 and 2.
The AD6725 baseband transmit section supports the following mobile station 8-PSK
modulation power classes:
• GSM 900/850 power classes E2 and E3,
• DCS 1800 power classes E2 and E3, and
• PCS 1900 power classes E2 and E3.
The AD6725 baseband receive section supports GMSK and 8-PSK applications.
The AD6725 auxiliary section provides a voltage reference, an automatic frequency control DAC, an auxiliary
ADC, and light controllers. The auxiliary ADC provides two channels for measuring temperature using discrete
external devices placed in critical locations. The AD6725 audio section provides 8 kHz and 16 kHz sampling
rates for voiceband data input and output and provides nine standard sample rates ranging from 8kHz to 48
kHz for personal audio output on two PCM Audio serial ports. The two Audio serial ports allow support for
concurrency. The AD6725 power management section provides voltage regulators for digital and analog
components, a battery charger, battery protection circuitry, and power supply activation logic. The AD6725
digital processor
interface provides serial ports for control data, baseband transmit and receive data, and two for audio data.
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3.2.2 Power Block
CSPORT interface, power management control interface and the circuit that generates power up RESET
pulses(RESET1P8) for use by the DBB chip.
All regulators except the USB interface regulator are powered from the main battery.
The USB regulator is powered from USB VBUS.
And the user presses KEYON which puts the AD6725 power management system into ACTIVATION state
(see definitions below) and signals DBB software that it’s time to wake up and operate using the KEYOUT
signal.
Figure. 3-2-2 AD6725 POWER BLOCK DIAGRAM
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LG GM210 User manual

Category
Musical Equipment
Type
User manual

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