Xilinx Virtex-4 ML461 User manual

Type
User manual
R
Virtex-4 ML461
Memory Interfaces
Development Board
User Guide
UG079 (v1.1) September 5, 2007
Virtex-4 ML461 Development Board User Guide www.xilinx.com UG079 (v1.1) September 5, 2007
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Virtex-4 ML461 Development Board
UG079 (v1.1) September 5, 2007
The following table shows the revision history for this document.
R
Date Version Revision
11/15/04 1.0 Initial Xilinx release.
UG079 (v1.1) September 5, 2007 www.xilinx.com Virtex-4 ML461 Development Board User Guide
09/05/07 1.1 Chapter 1: Added XAPP721 to “Virtex-4 ML461 Memory Interfaces Development
Board” section.
Chapter 3: Added tables on voltage margining: Table 3-12, Table 3-13, and Table 3-14.
Updated “Hardware Overview.” Updated Table 3-2.
Chapter 4: Added “Power Measurements on the ML461” section. Updated link to
Samsung documentation in Table 4-1 and Table 4-3.
Chapter 5: Updated Read Data (Q) values in Table 5-5.
Appendix A: Updated FPGA pinout tables.
General text edits.
Date Version Revision
Virtex-4 ML461 Development Board User Guide www.xilinx.com UG079 (v1.1) September 5, 2007
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UG079 (v1.1) September 5, 2007
Chapter 1: Introduction
About the Virtex-4 ML461 Memory Interfaces Tool Kit. . . . . . . . . . . . . . . . . . . . . . . . 7
Virtex-4 ML461 Memory Interfaces Development Board . . . . . . . . . . . . . . . . . . . . . . 8
Chapter 2: Getting Started
Documentation and Reference Design CD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Initial Board Check Before Applying Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Applying Power to the Board. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Chapter 3: Hardware Description
Hardware Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Memory Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Direct Clocking Data Capture Method . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
DDR400 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
DDR2 Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
QDR II Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
RLDRAM II Memory . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
External Interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Clock Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Liquid Crystal Display (LCD) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
Configuration INIT and DONE LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
User Pushbutton Switch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Program Switch (PROG) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
RS-232 Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
Z-DOK+ Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Test Headers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Characterization . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Voltage Regulators . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
Power Connectors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Board Design Considerations. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Chapter 4: Electrical Requirements
Power Consumption . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 37
FPGA Internal Power Budget. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Power Measurements on the ML461 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Chapter 5: Signal Integrity Recommendations and Simulations
Termination and Transmission Line Summaries . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49
IBIS Simulations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 52
Table of Contents
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Chapter 6: Configuration
Configuration Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
JTAG Chain. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
JTAG Port. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54
Parallel Cable IV Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
System ACE Interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55
Appendix A: FPGA Pinouts
FPGA #1 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57
FPGA #2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
FPGA #3 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70
FPGA #4 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 76
Appendix B: LCD Interface
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Display Hardware Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 83
Hardware Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
Peripheral Device KS0713 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
Controller – Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 87
Controller – LCD Panel Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 89
Controller – Power Supply Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92
Operation Example of the 64128EFCBC-3LP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 93
Instruction Set . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 96
Read/Write Characteristics (6800 Mode) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 99
Design Examples . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
LCD Panel Used in Full Graphics Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100
LCD Panel Used in Character Mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 101
Array Connector Numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
UCF Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
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Chapter 1
Introduction
This chapter introduces the Virtex™-4 ML461 reference design. It contains the following
sections:
”About the Virtex-4 ML461 Memory Interfaces Tool Kit
”Virtex-4 ML461 Memory Interfaces Development Board”
About the Virtex-4 ML461 Memory Interfaces Tool Kit
The Virtex-4 ML461 Memory Interfaces Tool Kit provides a complete development
platform to interface with external memory devices for designing and verifying
applications based on the Virtex-4 LX FPGA family. This kit allows designers to implement
high-speed applications with extreme flexibility using IP cores and customized modules.
The Virtex-4 LX FPGA, with its column-based architecture, makes it possible to develop
highly flexible memory interface applications.
The Virtex-4 ML461 Memory Interfaces Tool Kit includes the following:
Virtex-4 ML461 Memory Interfaces Development Board (XC4VLX25-FF668 FPGA)
5V/6.5 A DC power supply
Country-specific power supply line cord
RS-232 serial cable, DB9-F to DB9-F
Documentation and reference design CD-ROM
Optional items that also support development efforts include:
Xilinx ISE™ software
JTAG cable
Xilinx Parallel Cable IV
FCRAM-II memory is not supported any longer on the ML461 board.
For assistance with any of these items, contact your local Xilinx distributor or visit the
Xilinx online store at www.xilinx.com
.
The heart of the Virtex-4 ML461 Memory Interfaces Tool Kit is the Virtex-4 ML461
Development Board. This manual provides comprehensive information on Rev B1 and
later revisions of this board.
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Virtex-4 ML461 Memory Interfaces Development Board
A high-level functional block diagram of the Virtex-4 ML461 Memory Interfaces
Development Board is shown in Figure 1-1.
The Virtex-4 ML461 Development Board includes the following major functional blocks:
Four XC4VLX25-FF668 FPGAs (see DS112
: Virtex-4 Family Overview)
DDR1 DIMM memory: Two PC-3200 DIMM sockets for up to 64M x 144 bits (see
XAPP709
)
DDR400 components: 16M x 28 bits at 200 MHz clock speed
DDR2 DIMM memory: Two PC2-4300 DIMM sockets for up to 64M x 144 bits (see
XAPP702
and XAPP721)
DDR2-533 components: 8M x 28 bits at 267 MHz clock speed
QDR II memory: 2M x 72 bits at up to 300 MHz clock speed (see XAPP703
)
RLDRAM II memory: 16M x 36 bits at up to 400 MHz clock speed (see XAPP710
)
One DB9-M RS232 port
One 64 x 128 pixel Liquid Crystal Display (LCD)
A System ACE™ CompactFlash (CF) Configuration Controller that allows storing
and downloading of up to eight FPGA configuration image files
On-board power regulators with ±5% output margin test capabilities
Figure 1-1: Virtex-4 ML461 Development Board Block Diagram
DDR2 DIMM
144
DDR2 SDRAM
x4, x8,
x16
QDR II SRAM
72
72
RLDRAM II
36
FCRAM II
36
DDR1 DIMM
144
FPGA #1
LX25/
FF668
FPGA #2
LX25/
FF668
DDR1 SDRAM
x4, x8,
x16
SSTL2
SSTL18 HSTLHSTL/SSTL18
External Interfaces:
System ACE Controller,
ML410 Z-DOK+, LCD
UG079_c1_02_072905
FPGA #3
LX25/
FF668
FPGA #4
LX25/
FF668
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Figure 1-2 shows the Virtex-4 ML461 Development Board and indicates the locations of the
resident memory devices.
Figure 1-2: Virtex-4 ML461 Development Board
Source: Arial Narrow, 10 pt., white w/ drop shadow, F/L
DDR2 DIMM
DDR DIMM
System ACE
CompactFlash
Controller
FCRAM II
QDR II
SDRAM
LCD
Display
RLDRAM II
DDR2 SDRAM
DDR400
SDRAM
UG079_c1_02_102104
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Chapter 2
Getting Started
This chapter describes the items needed to configure the Virtex-4 ML461 Memory
Interfaces Development Board. The Virtex-4 ML461 Development Board is tested at the
factory after assembly and should be received in working condition. It is set up to load a
bitstream from the CompactFlash card at socket J6 through the System ACE controller
(U36).
This chapter contains the following sections:
“Documentation and Reference Design CD”
“Initial Board Check Before Applying Power”
“Applying Power to the Board”
Documentation and Reference Design CD
The CD included in the Virtex-4 ML461 Memory Interfaces Tool Kit contains the design
files for the Virtex-4 ML461 Development Board, including schematics, board layout, and
reference design files. Open the ReadMe.rtf file on the CD to review the list of contents.
Initial Board Check Before Applying Power
Perform these steps before applying board power:
1. Set up the Configuration Mode Switch SW1.
See “Configuration Modes” on page 53 for all available modes for the Virtex-4 ML461
Development Board.
2. Confirm that the JTAG chain jumpers P9, P10, P26, and P60 are connecting pins 1 to 2.
This way, all four devices are in the chain. Otherwise, the ISE iMPACT software will
not find all four devices to configure. For more information see “JTAG Chain” on
page 54.
3. Make sure that no inhibit jumpers are present on any of the power supply regulator
modules. For more information, see “Voltage Regulators” on page 30.
4. The Virtex-4 ML461 Development Board has a 200 MHz on-board oscillator, which
provides a copy of a differential LVPECL clock to each of the four FPGAs through a
differential clock buffer (ICS853006). There is also a connection to a pair of SMA
connectors to provide a differential LVDS clock from an off-board signal generator.
Another differential clock buffer (ICS853006) provides a copy of this clock to each
FPGA. These clocks are available after configuration for the design to use for various
system clocks.
5. Insert the CompactFlash card included in the kit into socket J6 on the ML461
Development Board. To select the startup file, check that SW6 is set to position 0.
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Applying Power to the Board
The Virtex-4 ML461 Development Board is now ready to power on. The Virtex-4 ML461
Development Board is shipped with a country-specific AC line cord for the universal input
5V desktop power supply. Follow these steps to power on the Virtex-4 ML461
Development Board:
1. Confirm that the ON-OFF switch, SW4, is in the OFF position.
2. Plug the 5V desktop power supply into the 5V DC input barrel jack J9 on the Virtex-4
ML461 Development Board. Plug the desktop power supply AC line cord into an
electrical outlet supplying the appropriate voltage.
3. Turn SW4 to the ON position. The power indicators for all regulator modules should
come on, indicating output from the regulators. The System ACE status LED D9 comes
on when the System ACE controller (U36) extracts the BIT configuration file from the
CompactFlash card to the FPGA. If no CompactFlash card is installed in the card
socket J6 on the Virtex-4 ML461 Development Board, the red System ACE error LED
D11 flashes.
4. If a CompactFlash card is not installed in socket J6, a JTAG cable must be used to
configure the FPGAs. To use a Parallel Cable IV or other JTAG pod, download the
FPGA configuration bitstream into each FPGA. After the DONE LED (D1) comes on,
the FPGAs are configured and ready to use.
5. Eject the CompactFlash card from J6 after configuration is done and push the reset
button SW2.
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Chapter 3
Hardware Description
This chapter describes the major hardware blocks on the Virtex-4 ML461 Development
Board and provides useful design consideration. It contains the following sections:
“Hardware Overview”
“Memory Interfaces”
“External Interfaces”
“Board Design Considerations”
Hardware Overview
The ML461 Development/Evaluation system reference design is implemented with four
XC4VLX25-FF668 devices from the Virtex-4 FPGA device family to demonstrate high-
speed external memory application interfaces. The memory technologies supported by the
Virtex-4 ML461 Development Board are DDR1 (DIMM and discrete components), DDR2
(DIMM and discrete components), QDR II, and RLDRAM II.
Figure 3-1 is a high-level block diagram of the Virtex-4 ML461 Memory Interfaces
Development Board.
Figure 3-1: Virtex-4 ML461 Memory Interfaces Development Board Block Diagram
36
72
DDR2 Components
28
144
DDR2 DIMM
144
28
DDR1 DIMM
DDR1 Components
QDR II
72
36
FCRAM II
RLDRAM II
FPGA #4FPGA #3FPGA #2FPGA #1
Parallel IV Port
External Interface,
System ACE
Controller
MII Links Between FPGA #4 and Three Other FPGAs
Power Supply
+ Clocks
ML410 Z-DOK+ Interface
LCD Display
SSTL2 SSTL18 HSTL/SSTL18 HSTL
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Memory Interfaces
Table 3-1 summarizes the implementation of the Virtex-4 ML461 Development Board for
various memory types. The maximum speed goal is based on using faster speed grade
XC4VLX25-FF668-12 devices.
When a memory with a larger data/strobe ratio is implemented, for example, a x36 QDR II
device, the smaller configurations can also be demonstrated by programming the FPGA
for a smaller data width, such as a 9:1 data/strobe ratio for the QDR II device.
Figure 3-2 illustrates a detailed block diagram of the Virtex-4 ML461 Development Board
showing connectivity between the memory types and the four XC4VLX25-FF668 FPGAs.
The conventions for showing multiple loads on a net are as follows:
stacks of devices are shown with overlapping blocks, such as two x4 devices for the
DDR1 component interface
multiple signals are on the same arrow, such as Address/Control signals to most of
the memories
Table 3-1: Summary of ML461 Memory Interfaces
Memory Type
Maximum
Speed
Data Rate Data Width I/O Standard
Data/Strobe
Ratios
DDR2 DIMM 267 MHz 533 Mb/s 144 SSTL18 4:1, 8:1
DDR2 SDRAM 267 MHz 533 Mb/s 28 SSTL18 4:1, 8:1
DDR1 DIMM 200 MHz 400 Mb/s 144 SSTL2 4:1, 8:1
DDR1 SDRAM 200 MHz 400 Mb/s 28 SSTL2 4:1, 8:1
QDR II 300 MHz 1.2 Gb/s 72 HSTL 18:1, 36:1
RLDRAM II 300 MHz 600 Mb/s 36 HSTL Class II 9:1, 18:1
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Memory Interfaces
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Figure 3-2: ML461-XC4VLX25-FF668 Board Connectivity Diagram
ADDR/CNTL
36-Bit
RLDRAM II
36-Bit
FCRAM II
72-Bit
QDR II
28-Bit
DDR2
COMP
144-Bit
DDR2
DIMM
144-Bit
DDR1
DIMM
28-Bit
DDR1
COMP
Virtex-4
FPGA #1
(XC4VLX25-FF668)
448 I/Os
External Interfaces
8
16
4
8
16
4
72
72
72
72
36
36
36
36
36
18
18
ADDR/CNTL
ADDR/CNTL
ADDR/CNTL
ADDR/CNTL
ADDR/CNTL
ADDR/CNTL
Virtex-4
FPGA #2
(XC4VLX25-FF668)
448 I/Os
Virtex-4
FPGA #3
(XC4VLX25-FF668)
448 I/Os
Virtex-4
FPGA #4
(XC4VLX25-FF668)
448 I/Os
UG079_c3_02_072905
16 www.xilinx.com Virtex-4 ML461 Development Board User Guide
UG079 (v1.1) September 5, 2007
Chapter 3: Hardware Description
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Direct Clocking Data Capture Method
The read data capture technique for all five memories (DDR1, DDR2, QDR II, and
RLDRAM II) is labeled as Direct Clocking method. Refer to XAPP701
: “Memory Interfaces
Data Capture Using Direct Clocking Technique” for a detailed description. Figure 3-3
shows a basic block diagram for all external memory interfaces on the Virtex-4 ML461
Development Board.
The memory controller in the respective FPGA sits in between the physical layer to the
external memory devices and the user interface. Refer to the respective application notes of
reference designs for each memory interface to understand the details of the memory
controller implementations.
Figure 3-3: Basic Memory Controller Block Diagram
UG079_c3_03_082807
External
Memory
Device
DCM
Datapath
Address and Controls
Data Bus
CLKs
Clock/Strobe
Rd/Wr Addr
Write Data
System
Clock
DCM Clocks
DCM Clocks
Ctrl
FPGA
Memory
Clock
Memory
Controller
State
Machine
Memory Interfaces Board
Read Data
User
Interface
(Testbench)
Virtex-4 ML461 Development Board User Guide www.xilinx.com 17
UG079 (v1.1) September 5, 2007
Memory Interfaces
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DDR400 Memory
The FPGA #1 device on the Virtex-4 ML461 Development Board is connected to DDR1
memories. The DDR1 memory interface includes:
a 144-bit-wide DIMM connection to two 184-pin DDR1 DIMM sockets
a 28-bit-wide datapath to four DDR400 memory discrete components
For the 144-bit-wide DIMM datapath, the data bytes are spread across multiple banks of
the FPGA #1 device. Figure 3-4 summarizes the distribution of DDR1 DIMM and discrete
component interface signals among the different banks of the FPGA #1 device.
Table 3-2 describes all the signals associated with DDR1 DIMM component memories. For
a bus or a group of signals, a shorthand method is used to describe these signals and
follows these rules:
1. All entities with a pair of square brackets represent a different signal.
For example, DDR1_[RAS,CAS,WE]_N represents three signals: DDR1_RAS_N,
DDR1_CAS_N, and DDR1_WE_N.
2. All numbers are represented as a range, for example, n:m, expands into (n-m+1)
unique signals.
For example, DDR1_A[12:0] represents 13 separate signals: DDR1_A12, DDR1_A11,
…., DDR1_A0.
3. Other items are listed within brackets separated by commas.
Figure 3-4: FPGA #1 Banks for DDR1 (SSTL2) Interfaces (Top View)
BANK 8 (64)
DIMM Bytes:
4, 5, 12, 13
BANK 10 (64)
DIMM Addr/Cntl
Component Bytes:
3
BANK 9 (64)
DIMM Bytes:
CB0_7, CB8_15
Component Bytes:
1,2
BANK 6 (64)
DIMM Bytes:
2, 3, 10, 11
Component Bytes:
0
BANK 7 (64)
DIMM Bytes:
6, 7, 14, 15
BANK 5 (64)
DIMM Bytes:
0, 1, 8, 9
BANK 0
(Configuration)
BANK 4 (16)
Global Clock Inputs
BANK 2 (16)
Component Control/Clocks
BANK 3 (16)
Inter-FPGA SERDES Links
BANK 1 (16)
Component Address
Note: Banks 1 & 2 do not have DCI capability due to lack of VRP/VRN.
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Chapter 3: Hardware Description
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For example, DDR1_CK[3:0]_[P,N] represents 4 * 2 = 8 signals to fully expand two sets
of brackets. That is, the eight signals are: DDR1_CK3_P, DDR1_CK3_N, DDR1_CK2_P,
…., DDR1_CK0_N.
To use Registered DDR1 DIMMs with the ML461 memory board, it is necessary to connect
Pin 10 of socket XP2 (reset#) and drive this signal with FPGA1.
Table 3-2: DDR1 DIMM Signal Summary
Board Signal Name(s) Bits Description Bank #
Schematic
Page #
DDR1_DIMM_A[12:0] 13 DDR1 DIMM Address 10 10
DDR1_DIMM_CK[5:0]_[P,N] 12 DDR1 DIMM Differential Clock 10 10
DDR1_DIMM_[RAS,CAS,WE]_N,
DDR1_DIMM_CKE, DDR1_DIMM_BA[1:0],
DDR1_DIMM_CS[3:0]_N,
10 DDR1 DIMM Control Signals 10 10
DDR1_DIMM_DQ_BY[0,1,8,9]_B[7:0],
DDR1_DIMM_DQS_BY[0,1,8,9]_L_P,
DDR1_DIMM_DM_DQS_BY[0,1,8,9]_H_P
40 DDR1 DIMM Data and Strobes:
Bytes 0, 1, 8, 9
68
DDR1_DIMM_DQ_BY[2,3,10,11]_B[7:0],
DDR1_DIMM_DQS_BY[2,3,10,11]_L_P,
DDR1_DIMM_DM_DQS_BY[2,3,10,11]_H_P
40 DDR1 DIMM Data and Strobes:
Bytes 0, 1, 8, 9
811
DDR1_DIMM_DQ_BY[4,5,12,13]_B[7:0],
DDR1_DIMM_DQS_BY[4,5,12,13]_L_P,
DDR1_DIMM_DM_DQS_BY[4,5,12,13]_H_P
40 DDR1 DIMM Data and Strobes:
Bytes 0, 1, 8, 9
57
DDR1_DIMM_DQ_BY[6,7,14,15]_B[7:0],
DDR1_DIMM_DQS_BY[6,7,14,15]_L_P,
DDR1_DIMM_DM_DQS_BY[6,7,14,15]_H_P
40 DDR1 DIMM Data and Strobes:
Bytes 6, 7, 14, 15
68
DDR1_DIMM_DQ_CB0_7_B[7:0],
DDR1_DIMM_DQS_CB0_7_L_P,
DDR1_DIMM_DM_DQS_CB0_7_H_P
10 DDR1 DIMM Data and Strobes:
Check Byte 0
99
DDR1_DIMM_DQ_CB8_15_B[7:0],
DDR1_DIMM_DQS_CB8_15_L_P,
DDR1_DIMM_DM_DQS_CB8_15_H_P
10 DDR1 DIMM Data and Strobes:
Check Byte 1
99
Notes:
1. DDR1_DIMM_CKE is connected to a 4.7K pull-down resistor.
Virtex-4 ML461 Development Board User Guide www.xilinx.com 19
UG079 (v1.1) September 5, 2007
Memory Interfaces
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Table 3-3 describes all signals associated with DDR400 Component memories.
A copy of XAPP709
: "DDR SDRAM Controller Using Virtex-4 FPGA Devices" and its
corresponding reference design RTL code are included on the CD shipped with the ML461
Tool Kit. For a complete list of FPGA #1 signals and their pin locations, refer to Appendix
A, “FPGA Pinouts.”
Table 3-3: DDR400 Component Signal Summary
Board Signal Name(s) Bits Description
Bank
#
Schematic
Page #
DDR1_A[12:0] 13 DDR400 Component Address 1 4
DDR1_CK[3:0]_[P,N] 8 DDR400 Component Differential Clock 2 4
DDR1_[RAS,CAS,WE]_N, DDR1_CKE,
DDR1_BA[1:0], DDR1_CS[3:0]_N,
DDR1_DM_BY[3:0]
14 DDR400 Component Control Signals 2, 10 4, 10
DDR1_DQ_BY0_B[3:0],
DDR1_DQS_BY0_L_P
5 DDR400 Data and Strobe: Byte 0 6 8
DDR1_DQ_BY1_B[7:0],
DDR1_DQS_BY1_P
9 DDR400 Data and Strobe: Byte 1 6 8
DDR1_DQ_BY2_B[7:0],
DDR1_DQS_BY2_P
9 DDR400 Data and Strobe: Byte 2 6 8
DDR1_DQ_BY3_B[7:0],
DDR1_DQS_BY3_P
9 DDR400 Data and Strobe: Byte 3 6 8
Notes:
1. DDR1_CKE is connected to a 4.7K pull-down resistor.
20 www.xilinx.com Virtex-4 ML461 Development Board User Guide
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Chapter 3: Hardware Description
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DDR2 Memory
The FPGA #2 device on the Virtex-4 ML461 Development Board is connected to DDR2
memories. The DDR2 memory interface includes:
a 144-bit-wide DIMM connection to two 240-pin DDR2 DIMM sockets
a 28-bit-wide datapath to four DDR2 memory discrete components
For the 144-bit-wide DIMM datapath, the data bytes are spread across multiple banks of
the FPGA #2 device. Figure 3-5 summarizes the distribution of DDR2 DIMM and discrete
component interface signals among the different banks of the FPGA #2 device.
Table 3-4 describes all the signals associated with DDR2 DIMM component memories.
Figure 3-5: FPGA #2 Banks for DDR2 (SSTL18) Interfaces (Top View)
BANK 8 (64)
DIMM Bytes:
4, 5, 12, 13
BANK 10 (64)
DIMM Address/Control
Component Bytes:
3
BANK 9 (64)
DIMM Bytes:
CB0_7, CB8_15
Component Bytes:
1,2
BANK 6 (64)
DIMM Bytes:
2, 3, 10, 11
Component Bytes:
0
BANK 7 (64)
DIMM Bytes:
6, 7, 14, 15
BANK 5 (64)
DIMM Bytes:
0, 1, 8, 9
BANK 0
(Configuration)
BANK 4 (16)
Global Clock Inputs
BANK 2 (16)
Component Control/Clocks
BANK 3 (16)
Inter-FPGA SERDES Links
BANK 1 (16)
Component Address
Note: Banks 1 & 2 do not have DCI capability due to lack of VRP/VRN.
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Xilinx Virtex-4 ML461 User manual

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