TGU171/TGU173
Mini-ITX Industrial Motherboard
User’s Manual ©June 14, 2023 DFI Inc.
2User's Manual | TGU171/TGU173
Copyright
This publication contains information that is protected by copyright. No part of it may be
reproduced in any form or by any means or used to make any transformation/adaptation
without the prior written permission from the copyright holders.
This publication is provided for informational purposes only. The manufacturer makes
no representations or warranties with respect to the contents or use of this manual and
specifically disclaims any express or implied warranties of merchantability or fitness for any
particular purpose. The user will assume the entire risk of the use or the results of the use of
this document. Further, the manufacturer reserves the right to revise this publication and make
changes to its contents at any time, without obligation to notify any person or entity of such
revisions or changes.
Changes after the publication’s first release will be based on the product’s revision. The website
will always provide the most updated information.
© 2023. All Rights Reserved.
Trademarks
Product names or trademarks appearing in this manual are for identification purpose only and
are the properties of the respective owners.
FCC and DOC Statement on Class B
This equipment has been tested and found to comply with the limits for a Class B digital
device, pursuant to Part 15 of the FCC rules. These limits are designed to provide reasonable
protection against harmful interference when the equipment is operated in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference
to radio communications. However, there is no guarantee that interference will not occur
in a particular installation. If this equipment does cause harmful interference to radio or
television reception, which can be determined by turning the equipment off and on, the user is
encouraged to try to correct the interference by one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Connect the equipment into an outlet on a circuit different from that to which the
receiver is connected.
• Consult the dealer or an experienced radio TV technician for help.
Notice:
1. The changes or modifications not expressly approved by the party responsible for
compliance could void the user’s authority to operate the equipment.
2. Shielded interface cables must be used in order to comply with the emission limits.
3User's Manual | TGU171/TGU173
Table of Contents
Chapter 1 - Introduction................................................................................................................6
Specifications ......................................................................................................................... 6
Block Diagram ........................................................................................................................8
Dimension ............................................................................................................................... 8
Chapter 2 - Hardware Installation ................................................................................................9
Board Layout ...........................................................................................................................9
Installing the Heat Sink ........................................................................................................10
Jumper Settings ...................................................................................................................11
Clear CMOS (JP1) ..........................................................................................................11
COM 4 RS232 Power (JP3) ..........................................................................................11
COM 3 RS232 Power (JP2) ..........................................................................................11
SATA Selection (JP8) ....................................................................................................12
eDP Inverter Power (DPJP1) ........................................................................................12
Panel Inverter Power (DPJP2) ......................................................................................12
Panel Power Jumper (DPJP3) ..................................................................................... 13
Panel Backlight Selection (DPJP4) ..............................................................................13
PIN Assignment ....................................................................................................................14
CASEOPEN- ....................................................................................................................14
SMBus ............................................................................................................................14
Digital I/O Power ...........................................................................................................15
Digital I/O .......................................................................................................................15
COM 1 & COM 2 ............................................................................................................16
COM 3 & COM 4 ............................................................................................................16
USB 5/6 ..........................................................................................................................17
USB 7/8 ..........................................................................................................................17
SATA0/1 HDD Power ..................................................................................................... 18
Front Audio .....................................................................................................................18
LCD/Inverter Power .......................................................................................................19
LVDS ...............................................................................................................................20
eDP .................................................................................................................................21
Expansion Slots .................................................................................................................... 22
PCI Express x4 Slot .......................................................................................................22
Install PCI Express cards such as network cards or other expansion cards. .......... 22
Expansion Slots .................................................................................................................... 23
Installing the M.2 Module .............................................................................................23
Installing the SO-DIMM Module ...................................................................................24
Chapter 3 - BIOS Settings ...........................................................................................................25
Overview ...............................................................................................................................25
Updating the BIOS ................................................................................................................ 25
Main .......................................................................................................................................26
Advanced .............................................................................................................................26
CPU Configuration .........................................................................................................27
Power & Performance ...................................................................................................27
Power & Performance ► CPU- Power Management Control ..............................28
Power & Performance ► GT- Power Management Control .................................28
PCH-FW Configuration ..................................................................................................29
Trusted Computing ........................................................................................................29
PTN3460 Configuration ................................................................................................30
NCT6126D Super IO Configuration ..............................................................................30
NCT6126D HW Monitor ................................................................................................31
NCT6126D HW Monitor ► Smart FAN Function .................................................31
Serial Port Console Redirection ...................................................................................32
Serial Port Console Redirection ► Console Redirection Settings ........................32
ACPI Settings ................................................................................................................. 33
USB Configuration ........................................................................................................34
Network Stack Configuration........................................................................................35
USB Power Control ........................................................................................................36
Tls Auth Configuration ..................................................................................................36
Chipset ..................................................................................................................................37
System Agent (SA) Configuration ................................................................................37
System Agent (SA) Configuration► Graphics Configuration ................................ 38
PCH-IO Configuration ....................................................................................................38
PCH-IO Configuration► PCI Express Configuration ............................................. 39
PCH-IO Configuration► SATA And RST Configuration .........................................39
PCH-IO Configuration► HD Audio Configuration ................................................. 40
Security .................................................................................................................................41
Secure Boot ....................................................................................................................41
Boot .......................................................................................................................................42
Save & Exit ............................................................................................................................42
4User's Manual | TGU171/TGU173
About this Manual
This manual can be downloaded from the website.
The manual is subject to change and update without notice, and may be based on editions
that do not resemble your actual products. Please visit our website or contact our sales
representatives for the latest editions.
Warranty
1. Warranty does not cover damages or failures that arise from misuse of the product,
inability to use the product, unauthorized replacement or alteration of components and
product specifications.
2. The warranty is void if the product has been subjected to physical abuse, improper
installation, modification, accidents or unauthorized repair of the product.
3. Unless otherwise instructed in this user’s manual, the user may not, under any
circumstances, attempt to perform service, adjustments or repairs on the product,
whether in or out of warranty. It must be returned to the purchase point, factory or
authorized service agency for all such work.
4. We will not be liable for any indirect, special, incidental or consequential damages to
the product that has been modified or altered.
Static Electricity Precautions
It is quite easy to inadvertently damage your PC, system board, components or devices even
before installing them in your system unit. Static electrical discharge can damage computer
components without causing any signs of physical damage. You must take extra care in
handling them to ensure against electrostatic build-up.
1. To prevent electrostatic build-up, leave the system board in its anti-static bag until you
are ready to install it.
2. Wear an antistatic wrist strap.
3. Do all preparation work on a static-free surface.
4. Hold the device only by its edges. Be careful not to touch any of the components,
contacts or connections.
5. Avoid touching the pins or contacts on all modules and connectors. Hold modules or
connectors by their ends.
Important:
Electrostatic discharge (ESD) can damage your processor, disk drive and other
components. Perform the upgrade instruction procedures described at an ESD
workstation only. If such a station is not available, you can provide some ESD
protection by wearing an antistatic wrist strap and attaching it to a metal part
of the system chassis. If a wrist strap is unavailable, establish and maintain
contact with the system chassis throughout any procedures requiring ESD
protection.
Safety Measures
• To avoid damage to the system, use the correct AC input voltage range.
• To reduce the risk of electric shock, unplug the power cord before removing the
system chassis cover for installation or servicing. After installation or servicing, cover
the system chassis before plugging the power cord.
5User's Manual | TGU171/TGU173
About the Package
The package contains the following items. If any of these items are missing or damaged,
please contact your dealer or sales representative for assistance.
• 1 TGU171/TGU173 motherboard
• 1 COM port cable (Length: 250mm, 1 x COM ports)
• 1 Serial ATA data with power cable (Length: 300mm)
• 1 Heat sink
Note: The items are subject to change in the developing stage.
The board and accessories in the package may not come similar to the information listed
above. This may differ in accordance with the sales region or models in which it was sold. For
more information about the standard package in your region, please contact your dealer or
sales representative.
Before Using the System Board
When installing the system board in a new system, you will need at least the following internal
components.
• Power adapter
External system peripherals may also be required for navigation and display, including at least a
keyboard, a mouse and a video display monitor.
6
Chapter 1
INTRODUCTION
User's Manual | TGU171/TGU173
XSpecifications
SYSTEM
Processor 11th Generation Intel® Core™ Processors
Intel® Core™ i7-1185GRE, Quad Core, 12M Cache, 1.8GHz (4.4GHz), 15W
Intel® Core™ i5-1145GRE, Quad Core, 8M Cache, 1.5GHz (4.1GHz), 15W
Intel® Core™ i3-1115GRE, Dual Core, 6M Cache, 2.2GHz (3.9GHz), 15W
Intel® Celeron® 6305E, Dual Core, 4M Cache, 1.8GHz (1.8GHz), 15W
Memory 2 x 260-pin SO-DIMM up to 64GB (32GB per slot)
Dual channel DDR4 up to 3200MHz (Support in-band ECC)
BIOS AMI SPI 256Mbit
GRAPHICS
Controller Intel® Iris® Xe Graphics for i7/i5 Processors
Intel® UHD Graphics for i3/Celeron Processors
Feature OpenGL 4.5, DirectX 12, OpenCL 2.1
HW Decode: WMV9, AVC/H264, JPEG/MJPEG, HEVC/H265, VP9, AV1
HW Encode: AVC/H264, JPEG, HEVC/H265, VP9
Display 1 x LVDS (Resolution up to 1920x1200 @60Hz)
1 x eDP (Resolution up to 3840x2160 @60Hz)
1 x DP++ (Resolution up to 3840x2160 @60Hz)
1 x HDMI (Resolution up to 3840x2160 @60Hz)
1 x USB Type C (Resolution up to 3840x2160 @60Hz. Support USB3.1 Gen2, 15W power delivery and DP Alt mode)
Quad Displays LVDS + eDP + DP++ + HDMI + USB Type C
EXPANSION
Interface 1 x PCIe x4 (PCIe Gen 3 x4)
1 x M.2 2242/2280 M Key (PCIe Gen4 x4) (Support NVMe and Intel® Optane memory) (Support DFI proprietary expansion module)
1 x M.2 2242/3042/3052 B Key (PCIe Gen3 x1/SATA/USB 3.1 Gen1) (Support 4G/5G and storage module) (Opt.: PCIe Gen3 x2)
1 x M.2 2230 E Key (USB2.0) (Support Intel® CNVi module only and Intel® vPro)
1 x Nano-SIM Socket (Connect to M.2 Key B for 4G/5G module)
**Note: Intel CNVi module Support List: AX201 & AC-9560
AUDIO Audio Codec Realtek ALC888
ETHERNET Controller 2 x Intel® I211AT/I210IT PCIe (10/100/1000Mbps)
1 x Intel® I225LM/I225IT PCIe (10/100/1000Mbps/2.5Gbps)
REAR I/O
Ethernet 2 x GbE (RJ-45)
1 x 2.5GbE (RJ-45)
USB 4 x USB 3.1 Gen2 (Type-A)
1 x USB Type-C (Support USB 3.1 Gen2, 15W power delivery and DP Alt mode)
Display 1 x DP++
1 x HDMI
Chapter 1 - Introduction
7
Chapter 1
INTRODUCTION
User's Manual | TGU171/TGU173
INTERNAL I/O
Serial 2 x RS-232/422/485 (2.0mm pitch)
2 x RS-232 (2.0mm pitch) (RS-232 w/ power)
USB 4 x USB 2.0 (2.0mm pitch)
Display 1 x LVDS
1 x eDP
Audio 1 x Front Audio (2.0mm pitch)
SATA 2 x SATA 3.0 (up to 6Gb/s) (RAID 0/1)
2 x SATA Power
DIO 1 x 8-bit DIO
1 x DIO Power
Cooling 1 x CPU fan
1 x System fan
WATCHDOG
TIMER
Output &
Interval System Reset, Programmable via Software from 1 to 255 Seconds
SECURITY TPM fTPM (default) / dTPM (option)
POWER
Type TGU171: Single 12V +/-5% DC
TGU173: Wide Range 9~36V
Connector DC-in Jack
Right Angle Connector (4-pin) (available upon request)
Straightl Type Connector (4-pin) (available upon request)
Consumption Idle: TGU173-IE-1185GRE 15W: 12V@ 1.12A (13.44W)
Max: TGU173-IE-1185GRE 15W: 12V@ 6.26A (75.12W)
RTC Battery CR2032 Coin Cell
OS SUPPORT
Microsoft Windows 10 IoT Enterprise 64-bit
Linux Linux
ENVIRONMENT
Temperature Operating: -5 to 65°C / -20 to 70°C
Storage: -40 to 85°C
Humidity Operating: 5 to 90% RH
Storage: 5 to 90% RH
MTBF TGU171-IE-1185GRE 414,291 hrs @ 25°C; 254,601 hrs @ 45°C; 166,963 hrs @ 60°; 124,264 hrs @ 70°C;
TGU173-IE-1185GRE 397,863 hrs @ 25°C; 244,099 hrs @ 45°C; 160,483 hrs @ 60°; 119,765 hrs @ 70°C;
Calculation model: Telcordia Issue 4 Environment: GB, GC – Ground Benign, Controlled
MECHANICAL
Dimensions 170mm (6.7") x 170mm (6.7")
Height Top Side: 16.5mm, Bottom Side: 3.5mm
CERTIFICATIONS Certifications CE, FCC, RoHS, UKCA
8
Chapter 1
INTRODUCTION
User's Manual | TGU171/TGU173
XBlock Diagram XDimension
9
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
Chapter 2 - Hardware Installation
XBoard Layout
1
2
51
2
5
1
1
48
1
7
8
9
10
11
12
13
14
15
16
17
18
41
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37 38
39
40
42
43
44
45
46
47
49
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
140
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
Intel
BGA 1449
2
3
4
5
6
13
14
15
16
17
18
19
20
LCD/Inverter Power
System FAN
Buzzer
Clear CMOS
Battery
Debug Card
CASEOPEN-
USB 7/8
21
22
23
24
USB 5/6
SATA Selection
SATA1 Power
SATA1
11
12
Panel Inverter Power
Panel Backlight Selection
1
2
3
4
5
6
7
8
9
10
CPU FAN
Front Panel
Digital I/O Power
Digital I/O
SMBus
eDP
Panel Power Jumper
LVDS
Innoage HDR1
eDP Inverter Power
37
38
39
40
USB Type-C
M.2-M
M.2-E
M.2-B
41
42
43
44
45
46
47
COM4 RS232 Power
COM4
COM3 RS232 Power
COM3
COM2
COM1
SIM slot
25
26
27
28
29
30
SATA0
SATA0 Power
Debug
Debug
DC-in
HDMI
31
32
33
34
35
36
DP++
LAN1
LAN2
2.5G LAN1
USB 1/2 (USB 3.1 Gen2)
USB 3/4 (USB 3.1 Gen2)
48
PCIe x4
49
Front Audio
10
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
The CPU must be kept cool by using a heat sink, otherwise the CPU will overheat damaging both the CPU and system board.
1. Before you install the fan / heat sink, you must apply a thermal paste onto the top of the CPU. The thermal paste is usually supplied when you purchase the fan / heat sink assembly. Do not
spread the paste all over the surface. When you later place the heat sink on top of the CPU, the compound will disperse evenly.
Some heat sinks come with a patch of pre-applied thermal paste. Do not apply thermal paste if the fan / heat sink already has a patch of thermal paste on its underside. Peel the strip that
covers the paste before you place the fan / heat sink on top of the CPU.
2. Place the heat sink on top of the CPU. The 4 spring screws around the heat sink, which are used to secure the heat sink onto the system board, must match the 4 mounting holes around the
board.
3. Screw tight two of the spring screws at opposite corners into the mounting holes. And then proceed with the other two spring screws.
Mounting holes
Note:
Some components are optional and only available upon request.
Important:
Electrostatic discharge (ESD) can damage your board, processor,
disk drives, add-in boards, and other components. Perform
installation procedures at an ESD workstation only. If such a
station is not available, you can provide some ESD protection by
wearing an antistatic wrist strap and attaching it to a metal part
of the system chassis. If a wrist strap is unavailable, establish
and maintain contact with the system chassis throughout any
procedures requiring ESD protection.
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
XInstalling the Heat Sink
11
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
XJumper Settings
Clear CMOS (JP1)
1-2 On: Normal (default)
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
COM 4 RS232 Power (JP3)
2
1
3
2-3 On: Clear CMOS Data
2
1
3
3
6
5
2
1
2-4 On: Standard RS232(default)
6
5
2
1
6
5
2
1
COM 3 RS232 Power (JP2)
2
1
6
5
2
1
1-3 On: Standard RS232 (default)
6
5
2
1
2-4 On: Standard RS232(default)
6
5
2
1
1-3 On: Standard RS232 (default)
12
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
SATA Selection (JP8)
1-2 On: M.2 Key B (default)
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
eDP Inverter Power (DPJP1)
2-3 On: SATA1
3
Panel Inverter Power (DPJP2)
21
3
21
3
1-2 On: +12V (default)
2-3 On: 5V
2
13
3
1-2 On: 5V (default)
2-3 On: 12V
2
13
2
13
21
3
21
1
2
2
13
JP8 SATA0 SATA1 M.2_B KEY
1-2 SATA0 (via PCIe11) N/A PCIe x1/SATA (controled
by M.2 Pin69)
USB3.0
(from PCIe Switch)
2-3 SATA0 (via PCIe11) SATA1 (via PCIe12) N/A USB3.0
(from PCIe Switch)
1-2 N/A N/A PCIe x2 (via PCIe11/12)
It can be able to swap each function below in BIOS :
13
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
Panel Power Jumper (DPJP3)
1-2 On: 12V
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
3-4 On: 5V
Panel Backlight Selection (DPJP4)
1-2 On: 3.3V (default) 2-3 On: 5V
3
65
21
65
21
65
21
65
21
5-6 On: 3.3V (default)
3
21
2
13
2
1
14
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
XPIN Assignment
SMBus
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
SMBus
Pin Assignment Pin Assignment
13V3SB 2GND
3SMB_CLK 4SMB_DATA
5SMB_ALERT 6--
CASEOPEN-
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
CASEOPEN-
Pin Function Pin Function
1CASEOPEN- 2GND
15
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
Digital I/O
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
Digital I/O
Pin Function Pin Function
1DIO_0 5DIO_4
2DIO_1 6DIO_5
3DIO_2 7DIO_6
4DIO_3 8DIO_7
Digital I/O Power
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
Digital I/O Power
Pin Function Pin Function
1+12V 2GND
35VSB 45V
16
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
COM 1 & COM 2
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
COM 1
COM 2
COM 3 & COM 4
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
COM 3
COM 4
Pin Function Pin Function
1X_MDCD3(4)# 2MSIN3(4)#
3MSO3(4)# 4MDTR3(4)#
5GND 6MDSR3(4)#
7MRTS3(4)# 8MCTS3(4)#
9X_MRI3(4)# 10 --
Pin Function Pin Function
1MDCD1(2)# 2MSIN1(2)
3MSOUT1(2) 4MDTR1(2)#
5GND 6MDSR1(2)#
7MRTS1(2)# 8MCTS1(2)#
9MRI1(2)# 10 --
17
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
USB 5/6
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
USB 5/6
USB 7/8
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
Pin Assignment Pin Assignment
15V 25V
3USB2_7_C_N 4USB2_8_C_N
5USB2_7_C_P 6USB2_8_C_P
7GND 8GND
9--- 10 N.C.
Pin Assignment Pin Assignment
15V 25V
3USB2_5_C_N 4USB2_6_C_N
5USB2_5_C_P 6USB2_6_C_P
7GND 8GND
9--- 10 N.C.
USB 7/8
18
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
Front Audio
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
Front Audio
SATA0/1 HDD Power
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
SATA1 Power
SATA0 Power
Pin Assignment Pin Assignment
1+12V_SATA 2GND
3GND 45V_SATA
Pin Assignment Pin Assignment
1Mic2-L 2GND
3Mic2-R 4N.C.
5Line2-R 6Mic2-JD
7GND 8---
9Line2-L 10 Line2-JD
19
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
LCD/Inverter Power
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
LCD/Inverter Power
Pin Assignment
1GND
2GND
3Panel Inverter Brightness Voltage Control
4Panel Power
5+3.3V
6Panel Backlight On/O Control
712V / 5V (default)
812V / 5V (default)
20
Chapter 2
HARDWARE INSTALLATION
User's Manual | TGU171/TGU173
LVDS
1
2
51
2
5
1
1
DDR4_2 SODIMM
DDR4_1 SODIMM
40
39 1
2
8
1
19
2
19
2
1
2
9
10
11
1
8
1
19
2
19
2
1 1
1
40
1 3
1 3
1 3
2
5
12
1
2
5
6
1
1
2
11
12
1
1 1
1
1
2
9
10
1
2
9
10
1
21
214
13
LVDS
Pin Assignment Pin Assignment
1GND 2GND
3LVDS_A3+ 4LVDS_B3+
5LVDS_A3- 6LVDS_B3-
7GND 8GND
9LVDS_A2+ 10 LVDS_B2+
11 LVDS_A2- 12 LVDS_B2-
13 GND 14 GND
15 LVDS_A1+ 16 LVDS_B1+
17 LVDS_A1- 18 LVDS_B1-
19 GND 20 GND
21 LVDS_A0+ 22 LVDS_B0+
23 LVDS_A0- 24 LVDS_B0-
25 GND 26 GND
27 LVDS_CLK1+ 28 LVDS_CLK2+
29 LVDS_CLK1- 30 LVDS_CLK2-
31 GND 32 GND
33 LVDS_DDC_CLK 34 NC
35 LVDS_DDC_DATA 36 +3.3V
37 Panel Power 38 Panel Power
39 Panel Power 40 Panel Power
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