Dell Inspiron 5481 2-in-1 User manual

Inspiron 5481 2-in-1
Dell
Brand
Dell
Model
Inspiron 5481 2-in-1
Category
Notebooks
Type
User manual
Inspiron 5481
Service Manual
Regulatory Model: P93G
Regulatory Type: P93G001
Notas, precauciones y avisos
NOTA: Una NOTA indica información importante que le ayuda a hacer un mejor uso de su producto.
PRECAUCIÓN: Una PRECAUCIÓN indica la posibilidad de daños en el hardware o la pérdida de datos, y le explica cómo
evitar el problema.
AVISO: Un mensaje de AVISO indica el riesgo de daños materiales, lesiones corporales o incluso la muerte.
© 2018 Dell Inc. or its subsidiaries. All rights reserved. Dell, EMC, and other trademarks are trademarks of Dell Inc. or its subsidiaries.
Other trademarks may be trademarks of their respective owners.
2018 - 08
Rev. A00
1 Antes de manipular el interior del equipo.........................................................................................8
Antes de empezar .................................................................................................................................................................8
2 Después de manipular el interior del equipo.................................................................................... 9
3 Instrucciones de seguridad.......................................................................................................... 10
Electrostatic discharge—ESD protection.........................................................................................................................10
ESD field service kit .............................................................................................................................................................11
Transporte de componentes delicados............................................................................................................................. 12
4 Recommended tools....................................................................................................................13
5 Screw list...................................................................................................................................14
6 Removing the base cover.............................................................................................................15
Procedure..............................................................................................................................................................................15
7 Colocación de la cubierta de la base.............................................................................................. 17
Procedure..............................................................................................................................................................................17
8 Extracción de la batería............................................................................................................... 19
Requisitos previos................................................................................................................................................................ 19
Procedure..............................................................................................................................................................................19
9 Colocación de la batería...............................................................................................................21
Procedure..............................................................................................................................................................................21
Requisitos posteriores.........................................................................................................................................................22
10 Extracción de la batería de tipo botón......................................................................................... 23
Procedure............................................................................................................................................................................. 23
11 Colocación de la batería de tipo botón......................................................................................... 24
Procedure............................................................................................................................................................................. 24
12 Extracción de los módulos de memoria........................................................................................25
Extracción de la tarjeta inalámbrica...................................................................................................................................25
Requisitos previos..........................................................................................................................................................25
Procedure....................................................................................................................................................................... 25
Procedure.............................................................................................................................................................................26
13 Colocación de los módulos de memoria........................................................................................27
Procedure............................................................................................................................................................................. 27
Colocación de la tarjeta inalámbrica.................................................................................................................................. 28
Contents
Contents 3
Procedure....................................................................................................................................................................... 28
Requisitos posteriores...................................................................................................................................................29
14 Removing the solid-state drive/Intel Optane memory module....................................................... 30
Prerequisites........................................................................................................................................................................ 30
Procedure.............................................................................................................................................................................30
15 Replacing the solid-state drive/Intel Optane memory module........................................................31
Procedure..............................................................................................................................................................................31
Post-requisites......................................................................................................................................................................31
16 Removing the hard drive............................................................................................................32
Prerequisites.........................................................................................................................................................................32
Procedure............................................................................................................................................................................. 32
17 Replacing the hard drive............................................................................................................ 34
Procedure............................................................................................................................................................................. 34
Post-requisites.....................................................................................................................................................................35
18 Extracción del disipador de calor................................................................................................ 36
Requisitos previos................................................................................................................................................................36
Procedure.............................................................................................................................................................................36
19 Colocación del disipador de calor................................................................................................ 37
Procedure............................................................................................................................................................................. 37
Requisitos posteriores.........................................................................................................................................................37
20 Extracción del ventilador...........................................................................................................38
Procedure............................................................................................................................................................................. 38
21 Colocación del ventilador........................................................................................................... 39
Procedure.............................................................................................................................................................................39
22 Extracción de los altavoces........................................................................................................40
Requisitos previos................................................................................................................................................................40
Procedure.............................................................................................................................................................................40
23 Colocación de los altavoces........................................................................................................41
Procedure..............................................................................................................................................................................41
Requisitos posteriores..........................................................................................................................................................41
24 Extracción de la placa de E/S.....................................................................................................42
Requisitos previos................................................................................................................................................................42
Procedure............................................................................................................................................................................. 42
25 Colocación de la placa de E/S.................................................................................................... 43
Procedure............................................................................................................................................................................. 43
Requisitos posteriores.........................................................................................................................................................43
4
Contents
26 Extracción del puerto del adaptador de alimentación................................................................... 44
Procedure............................................................................................................................................................................. 44
27 Colocación del puerto del adaptador de alimentación................................................................... 45
Procedure.............................................................................................................................................................................45
28 Extracción de la tarjeta inalámbrica............................................................................................46
Requisitos previos................................................................................................................................................................46
Procedure.............................................................................................................................................................................46
29 Colocación de la tarjeta inalámbrica............................................................................................48
Procedure............................................................................................................................................................................. 48
Requisitos posteriores.........................................................................................................................................................48
30 Extracción del ensamblaje de la pantalla..................................................................................... 49
Prerequisites........................................................................................................................................................................ 49
Procedure.............................................................................................................................................................................49
31 Colocación del ensamblaje de la pantalla...................................................................................... 51
Procedure..............................................................................................................................................................................51
Post-requisites.....................................................................................................................................................................52
32 Extracción del ensamblaje de la antena y la cubierta posterior de la pantalla.................................. 53
Prerequisites........................................................................................................................................................................ 53
Procedure.............................................................................................................................................................................53
33 Colocación del ensamblaje de antena y la cubierta posterior de la pantalla..................................... 55
Procedure.............................................................................................................................................................................55
Post-requisites.....................................................................................................................................................................56
34 Extracción de las bisagras de la pantalla......................................................................................57
Prerequisites.........................................................................................................................................................................57
Procedure............................................................................................................................................................................. 57
35 Colocación de las bisagras de la pantalla.....................................................................................58
Procedure.............................................................................................................................................................................58
Post-requisites.....................................................................................................................................................................58
36 Extracción de la cámara............................................................................................................ 59
Prerequisites........................................................................................................................................................................ 59
Procedure.............................................................................................................................................................................59
37 Colocación de la cámara............................................................................................................ 60
Procedure.............................................................................................................................................................................60
Post-requisites.....................................................................................................................................................................60
38 Extracción del cable de la pantalla.............................................................................................. 61
Contents
5
Prerequisites......................................................................................................................................................................... 61
Procedure..............................................................................................................................................................................61
39 Colocación del cable de la pantalla..............................................................................................62
Procedure.............................................................................................................................................................................62
Post-requisites.....................................................................................................................................................................62
40 Extracción del panel de la pantalla..............................................................................................63
Prerequisites........................................................................................................................................................................ 63
Procedure.............................................................................................................................................................................63
41 Colocación del panel de la pantalla.............................................................................................. 64
Procedure.............................................................................................................................................................................64
Post-requisites.....................................................................................................................................................................64
42 Extracción de la placa base........................................................................................................65
Prerequisites........................................................................................................................................................................ 65
Procedure.............................................................................................................................................................................65
43 Colocación de la placa base........................................................................................................68
Procedure.............................................................................................................................................................................68
Post-requisites.....................................................................................................................................................................69
44 Extracción de la superficie táctil.................................................................................................71
Prerequisites......................................................................................................................................................................... 71
Procedure..............................................................................................................................................................................71
45 Colocación de la superficie táctil................................................................................................ 73
Procedure............................................................................................................................................................................. 73
Post-requisites..................................................................................................................................................................... 74
46 Removing the palm-rest and keyboard assembly......................................................................... 75
Prerequisites.........................................................................................................................................................................75
Procedure............................................................................................................................................................................. 75
47 Replacing the palm-rest and keyboard assembly..........................................................................76
Procedure............................................................................................................................................................................. 76
Post-requisites..................................................................................................................................................................... 76
48 Controladores de dispositivo......................................................................................................78
Intel Chipset Software Installation Utility......................................................................................................................... 78
Video drivers.........................................................................................................................................................................78
Intel Serial IO driver............................................................................................................................................................. 78
Intel Serial IO driver............................................................................................................................................................. 78
Intel Trusted Execution Engine Interface......................................................................................................................... 78
Intel Virtual Button driver................................................................................................................................................... 78
Wireless and Bluetooth drivers.......................................................................................................................................... 78
6
Contents
49 System setup........................................................................................................................... 79
Boot Sequence.....................................................................................................................................................................79
Navigation keys....................................................................................................................................................................79
Descripción general de BIOS..............................................................................................................................................79
Acceso al programa de configuración del BIOS.............................................................................................................. 80
System setup options......................................................................................................................................................... 80
Clearing CMOS settings..................................................................................................................................................... 84
Clearing BIOS (System Setup) and System passwords.................................................................................................84
50 Solución de problemas.............................................................................................................. 86
Actualización del BIOS........................................................................................................................................................86
Actualización del BIOS (llave USB)...................................................................................................................................86
Diagnósticos Enhanced Pre-boot System Assessment (Evaluación del sistema de preinicio ePSA)...................... 86
Running the ePSA diagnostics..................................................................................................................................... 87
Diagnostics........................................................................................................................................................................... 87
Enabling Intel Optane memory...........................................................................................................................................88
Disabling Intel Optane memory..........................................................................................................................................88
WiFi power cycle................................................................................................................................................................. 88
Flea power release...............................................................................................................................................................88
51 Getting help and contacting Dell................................................................................................ 90
Contents
7
Antes de manipular el interior del equipo
NOTA: The images in this document may differ from your computer depending on the configuration you ordered.
Antes de empezar
1. Guarde y cierre todos los archivos abiertos y salga de todas las aplicaciones abiertas.
2. Apague el equipo. Haga clic en Inicio > Alimentación > Apagar.
NOTA: Si utiliza otro sistema operativo, consulte la documentación de su sistema operativo para conocer las
instrucciones de apagado.
3. Desconecte el equipo y todos los dispositivos conectados de las tomas de alimentación eléctrica.
4. Desconecte del equipo todos los dispositivos de red y periféricos conectados como el teclado, el mouse y el monitor.
5. Extraiga cualquier tarjeta de medios y disco óptico del equipo, si corresponde.
1
8 Antes de manipular el interior del equipo
Después de manipular el interior del equipo
PRECAUCIÓN: Leaving stray or loose screws inside your computer may severely damage your computer.
1. Coloque todos los tornillos y asegúrese de que ninguno quede suelto en el interior de equipo.
2. Conecte todos los dispositivos externos, los periféricos y los cables que haya extraído antes de manipular el equipo.
3. Coloque las tarjetas multimedia, los discos y cualquier otra pieza que haya extraído antes de manipular el equipo.
4. Conecte el equipo y todos los dispositivos conectados a la toma eléctrica.
5. Encienda el equipo.
2
Después de manipular el interior del equipo 9
Instrucciones de seguridad
Utilice las siguientes directrices de seguridad para proteger su equipo de posibles daños y para garantizar su seguridad personal.
NOTA: Before working inside your computer, read the safety information that shipped with your computer. For more
safety best practices, see the Regulatory Compliance home page at www.dell.com/regulatory_compliance.
NOTA: Disconnect all power sources before opening the computer cover or panels. After you finish working inside the
computer, replace all covers, panels, and screws before connecting to the electrical outlet.
PRECAUCIÓN: To avoid damaging the computer, ensure that the work surface is flat and clean.
PRECAUCIÓN: To avoid damaging the components and cards, handle them by their edges, and avoid touching pins and
contacts.
PRECAUCIÓN: You should only perform troubleshooting and repairs as authorized or directed by the Dell technical
assistance team. Damage due to servicing that is not authorized by Dell is not covered by your warranty. See the safety
instructions that shipped with the product or at www.dell.com/regulatory_compliance.
PRECAUCIÓN: Before touching anything inside your computer, ground yourself by touching an unpainted metal surface,
such as the metal at the back of the computer. While you work, periodically touch an unpainted metal surface to
dissipate static electricity, which could harm internal components.
PRECAUCIÓN: When you disconnect a cable, pull on its connector or on its pull tab, not on the cable itself. Some cables
have connectors with locking tabs or thumb-screws that you must disengage before disconnecting the cable. When
disconnecting cables, keep them evenly aligned to avoid bending any connector pins. When connecting cables, ensure
that the ports and connectors are correctly oriented and aligned.
PRECAUCIÓN: Press and eject any installed card from the media-card reader.
Electrostatic discharge—ESD protection
ESD is a major concern when you handle electronic components, especially sensitive components such as expansion cards, processors,
memory DIMMs, and system boards. Very slight charges can damage circuits in ways that may not be obvious, such as intermittent
problems or a shortened product life span. As the industry pushes for lower power requirements and increased density, ESD protection is
an increasing concern.
Due to the increased density of semiconductors used in recent Dell products, the sensitivity to static damage is now higher than in
previous Dell products. For this reason, some previously approved methods of handling parts are no longer applicable.
Two recognized types of ESD damage are catastrophic and intermittent failures.
• Catastrophic – Catastrophic failures represent approximately 20 percent of ESD-related failures. The damage causes an immediate
and complete loss of device functionality. An example of catastrophic failure is a memory DIMM that has received a static shock and
immediately generates a "No POST/No Video" symptom with a beep code emitted for missing or nonfunctional memory.
• Intermittent – Intermittent failures represent approximately 80 percent of ESD-related failures. The high rate of intermittent failures
means that most of the time when damage occurs, it is not immediately recognizable. The DIMM receives a static shock, but the
tracing is merely weakened and does not immediately produce outward symptoms related to the damage. The weakened trace may
take weeks or months to melt, and in the meantime may cause degradation of memory integrity, intermittent memory errors, etc.
The more difficult type of damage to recognize and troubleshoot is the intermittent (also called latent or "walking wounded") failure.
Perform the following steps to prevent ESD damage:
• Use a wired ESD wrist strap that is properly grounded. The use of wireless anti-static straps is no longer allowed; they do not provide
adequate protection. Touching the chassis before handling parts does not ensure adequate ESD protection on parts with increased
sensitivity to ESD damage.
• Handle all static-sensitive components in a static-safe area. If possible, use anti-static floor pads and workbench pads.
3
10 Instrucciones de seguridad
• When unpacking a static-sensitive component from its shipping carton, do not remove the component from the anti-static packing
material until you are ready to install the component. Before unwrapping the anti-static packaging, ensure that you discharge static
electricity from your body.
• Before transporting a static-sensitive component, place it in an anti-static container or packaging.
ESD field service kit
The unmonitored Field Service kit is the most commonly used service kit. Each Field Service kit includes three main components: anti-
static mat, wrist strap, and bonding wire.
Components of an ESD field service kit
The components of an ESD field service kit are:
• Anti-Static Mat – The anti-static mat is dissipative and parts can be placed on it during service procedures. When using an anti-
static mat, your wrist strap should be snug and the bonding wire should be connected to the mat and to any bare metal on the system
being worked on. Once deployed properly, service parts can be removed from the ESD bag and placed directly on the mat. ESD-
sensitive items are safe in your hand, on the ESD mat, in the system, or inside a bag.
• Wrist Strap and Bonding Wire – The wrist strap and bonding wire can be either directly connected between your wrist and bare
metal on the hardware if the ESD mat is not required, or connected to the anti-static mat to protect hardware that is temporarily
placed on the mat. The physical connection of the wrist strap and bonding wire between your skin, the ESD mat, and the hardware is
known as bonding. Use only Field Service kits with a wrist strap, mat, and bonding wire. Never use wireless wrist straps. Always be
aware that the internal wires of a wrist strap are prone to damage from normal wear and tear, and must be checked regularly with a
wrist strap tester in order to avoid accidental ESD hardware damage. It is recommended to test the wrist strap and bonding wire at
least once per week.
• ESD Wrist Strap Tester – The wires inside of an ESD strap are prone to damage over time. When using an unmonitored kit, it is a
best practice to regularly test the strap prior to each service call, and at a minimum, test once per week. A wrist strap tester is the
best method for doing this test. If you do not have your own wrist strap tester, check with your regional office to find out if they have
one. To perform the test, plug the wrist-strap's bonding-wire into the tester while it is strapped to your wrist and push the button to
test. A green LED is lit if the test is successful; a red LED is lit and an alarm sounds if the test fails.
• Insulator Elements – It is critical to keep ESD sensitive devices, such as plastic heat sink casings, away from internal parts that are
insulators and often highly charged.
• Working Environment – Before deploying the ESD Field Service kit, assess the situation at the customer location. For example,
deploying the kit for a server environment is different than for a desktop or portable environment. Servers are typically installed in a
rack within a data center; desktops or portables are typically placed on office desks or cubicles. Always look for a large open flat work
area that is free of clutter and large enough to deploy the ESD kit with additional space to accommodate the type of system that is
being repaired. The workspace should also be free of insulators that can cause an ESD event. On the work area, insulators such as
Styrofoam and other plastics should always be moved at least 12 inches or 30 centimeters away from sensitive parts before physically
handling any hardware components.
• ESD Packaging – All ESD-sensitive devices must be shipped and received in static-safe packaging. Metal, static-shielded bags are
preferred. However, you should always return the damaged part using the same ESD bag and packaging that the new part arrived in.
The ESD bag should be folded over and taped shut and all the same foam packing material should be used in the original box that the
new part arrived in. ESD-sensitive devices should be removed from packaging only at an ESD-protected work surface, and parts
should never be placed on top of the ESD bag because only the inside of the bag is shielded. Always place parts in your hand, on the
ESD mat, in the system, or inside an anti-static bag.
• Transporting Sensitive Components – When transporting ESD sensitive components such as replacement parts or parts to be
returned to Dell, it is critical to place these parts in anti-static bags for safe transport.
ESD protection summary
It is recommended that all field service technicians use the traditional wired ESD grounding wrist strap and protective anti-static mat at all
times when servicing Dell products. In addition, it is critical that technicians keep sensitive parts separate from all insulator parts while
performing service and that they use anti-static bags for transporting sensitive components.
Instrucciones de seguridad
11
Transporte de componentes delicados
Cuando transporte componentes sensibles a descarga electroestática, como, piezas de reemplazo o piezas que hay que devolver a Dell, es
muy importante que las coloque dentro de bolsas antiestáticas para garantizar un transporte seguro.
Elevación del equipo
Siga las pautas que se indican a continuación cuando deba levantar un equipo pesado:
PRECAUCIÓN: No levante un peso superior a 50 libras. Siempre obtenga recursos adicionales o utilice un dispositivo de
elevación mecánica.
1. Asegúrese de tener un punto de apoyo firme. Aleje los pies para tener mayor estabilidad y con los dedos hacia fuera.
2. Apriete los músculos del abdomen. Los músculos del abdomen le proporcionarán el soporte adecuado para la espalda y le ayudarán a
compensar la fuerza de la carga.
3. Levante el equipo con la ayuda de las piernas, no de la espalda.
4. Mantenga la carga cerca del cuerpo. Cuanto más cerca esté a su columna vertebral, menos fuerza tendrá que hacer con la espalda.
5. Mantenga la espalda derecha cuando levante o coloque en el piso la carga. No agregue el peso de su cuerpo a la carga. Evite torcer su
cuerpo y espalda.
6. Siga las mismas técnicas en orden inverso para dejar la carga.
12 Instrucciones de seguridad
Recommended tools
The procedures in this document may require the following tools:
• Philips screwdriver #1
• Flat-head screwdriver
• Plastic scribe
4
Recommended tools 13
Screw list
Table 1. Screw list
Component Secured to Screw type Quantity Screw image
Base cover Palm-rest and keyboard
assembly
M2x6 6
Battery Palm-rest and keyboard
assembly
M2x3 4
Hard-drive assembly Palm-rest and keyboard
assembly
M2x3 4
Hard-drive bracket Hard drive M3x3 4
Solid-state drive Palm-rest and keyboard
assembly
M2x2 Big Head 1
I/O board Palm-rest and keyboard
assembly
M2x3 1
Fan Palm-rest and keyboard
assembly
M2x3 2
Wireless card System board M2x3 1
Power-adapter port Palm-rest and keyboard
assembly
M2x3 1
System board Palm-rest and keyboard
assembly
M2x2 Big Head 4
Touchpad bracket Palm-rest and keyboard
assembly
M2x2 Big Head 3
Touchpad Palm-rest and keyboard
assembly
M2x2 Big Head 4
Display assembly Palm-rest and keyboard
assembly
M2.5x4 6
Display assembly Palm-rest and keyboard
assembly
M2x3 2
Display hinges Display back-cover and
antenna assembly
M2.5x2.5 Big Head 6
Display hinges Display back-cover and
antenna assembly
M2x3 2
5
14 Screw list
Removing the base cover
NOTA: Before working inside your computer, read the safety information that shipped with your computer and follow
the steps in Before working inside your computer. After working inside your computer, follow the instructions in After
working inside your computer. For more safety best practices, see the Regulatory Compliance home page at
www.dell.com/regulatory_compliance.
Procedure
1. Remove the six screws (M2.5x6) that secure the base cover to the palm-rest and keyboard assembly.
2. Loosen the three captive screws that secure the base cover to the palm-rest and keyboard assembly.
3. Using your fingertips, pry the base cover off the palm-rest and keyboard assembly from the top left corner.
4. Lift the base cover off the palm-rest and keyboard assembly.
6
Removing the base cover 15
5. Peel off the tape that secures the battery cable to the battery.
6. Peel the tape that secures the battery cable to the battery-cable connector.
7. Disconnect the battery cable from the system board.
8. Turn the computer over, open the display, then press and hold the power button for 15 seconds to ground the system board.
16
Removing the base cover
Colocación de la cubierta de la base
NOTA: Before working inside your computer, read the safety information that shipped with your computer and follow
the steps in Before working inside your computer. After working inside your computer, follow the instructions in After
working inside your computer. For more safety best practices, see the Regulatory Compliance home page at
www.dell.com/regulatory_compliance.
Procedure
1. Close the display and turn the computer over. Connect the battery cable to the system board.
2. Adhere the tape that secures the battery cable to the battery-cable connector.
3. Adhere the tape that secures the battery cable to the battery.
4. Align the tabs on the base cover with the slots on the palm-rest and keyboard assembly and snap the base cover into place.
7
Colocación de la cubierta de la base 17
5. Tighten the three captive screws that secure the base cover to the palm-rest and keyboard assembly.
6. Replace the six screws (M2.5x6) that secure the base cover to the palm-rest and keyboard assembly.
18 Colocación de la cubierta de la base
Extracción de la batería
NOTA: Before working inside your computer, read the safety information that shipped with your computer and follow
the steps in Before working inside your computer. After working inside your computer, follow the instructions in After
working inside your computer. For more safety best practices, see the Regulatory Compliance home page at
www.dell.com/regulatory_compliance.
Requisitos previos
Extraiga la cubierta de la base.
Procedure
1. Peel off the tape that secures the battery cable to the battery.
2. Peel the tape that secures the battery cable to the battery-cable connector.
3. Disconnect the battery cable from the system board.
4. Remove the four screws (M2x3) that secure the battery to the palm-rest and keyboard assembly.
5. Lift the battery off the palm-rest and keyboard assembly.
8
Extracción de la batería 19
20 Extracción de la batería
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Dell Inspiron 5481 2-in-1 User manual

Inspiron 5481 2-in-1
Dell
Brand
Dell
Model
Inspiron 5481 2-in-1
Category
Notebooks
Type
User manual
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