512K x 16 Static RAM
CY62157CV30/33
Cypress Semiconductor Corporation • 198 Champion Court • San Jose, CA 95134-1709 • 408-943-2600
Document #: 38-05014 Rev. *F Revised August 31, 2006
Features
• Temperature Ranges
— Automotive-A: –40°C to 85°C
— Automotive-E: –40°C to 125°C
• Voltage range:
— CY62157CV30: 2.7V–3.3V
— CY62157CV33: 3.0V–3.6V
• Ultra-low active power
— Typical active current: 1.5 mA @ f = 1 MHz
— Typical active current: 5.5 mA @ f = f
max
• Low standby power
• Easy memory expansion with CE
1
, CE
2
and OE features
• Automatic power-down when deselected
• CMOS for optimum speed/power
• Available in Pb-free and non Pb-free 48-ball FBGA
package
Functional Description
[1]
The CY62157CV30/33 are high-performance CMOS static
RAMs organized as 512K words by 16 bits. These devices
feature advanced circuit design to provide ultra-low active
current. This is ideal for providing More Battery Life™
(MoBL™) in portable applications such as cellular telephones.
The devices also have an automatic power-down feature that
significantly reduces power consumption by 80% when
addresses are not toggling. The device can also be put into
standby mode reducing power consumption by more than 99%
when deselected (CE
1
HIGH or CE
2
LOW or both BLE and
BHE
are HIGH). The input/output pins (I/O
0
through I/O
15
) are
placed in a high-impedance state when: deselected (CE
1
HIGH or CE
2
LOW), outputs are disabled (OE HIGH), both
Byte High Enable and Byte Low Enable are disabled (BHE
,
BLE
HIGH), or during a write operation (CE
1
LOW and CE
2
HIGH and WE LOW).
Writing to the device is accomplished by taking Chip Enable 1
(CE
1
) and Write Enable (WE) inputs LOW and Chip Enable 2
(CE
2
) HIGH. If Byte Low Enable (BLE) is LOW, then data from
I/O pins (I/O
0
through I/O
7
), is written into the location
specified on the address pins (A
0
through A
18
). If Byte High
Enable (BHE
) is LOW, then data from I/O pins (I/O
8
through
I/O
15
) is written into the location specified on the address pins
(A
0
through A
18
).
Reading from the device is accomplished by taking Chip
Enable 1 (CE
1
) and Output Enable (OE) LOW and Chip
Enable 2 (CE
2
) HIGH while forcing the Write Enable (WE)
HIGH. If Byte Low Enable (BLE
) is LOW, then data from the
memory location specified by the address pins will appear on
I/O
0
to I/O
7
. If Byte High Enable (BHE) is LOW, then data from
memory will appear on I/O
8
to I/O
15
. See the truth table at the
back of this data sheet for a complete description of read and
write modes.
The CY62157CV30/33 are available in a 48-ball FBGA
package.
Note:
1. For best practice recommendations, please refer to the Cypress application note “System Design Guidelines” on http://www.cypress.com.
Logic Block Diagram
512K × 16
RAM Array
I/O
0
–I/O
7
ROW DECODER
A
8
A
7
A
6
A
5
A
2
COLUMN DECODER
A
11
A
12
A
13
A
14
A
15
SENSE AMPS
DATA IN DRIVERS
OE
A
4
A
3
I/O
8
–I/O
15
WE
BLE
BHE
A
16
A
0
A
1
A
17
A
9
A
18
A
10
Power -down
Circuit
BHE
BLE
CE
2
CE
1
CE
2
CE
1
[+] Feedback
CY62157CV30/33
Document #: 38-05014 Rev. *F Page 2 of 13
Product Portfolio
Product Range
V
CC
Range
Power Dissipation
Operating (I
CC
) mA
Standby (I
SB2
)
µAf = 1 MHz f = f
max
Min. Typ.
[2]
Max. Typ.
[2]
Max. Typ.
[2]
Max. Typ.
[2]
Max.
CY62157CV30 Automotive-E 2.7V 3.0V 3.3V 1.5 3 7 15 8 70
CY62157CV33 Automotive-A 3.0V 3.3V 3.6V 1.5 3 5.5 12 10 30
Automotive-E 1.5 3 7 15 10 80
Pin Configurations
[2, 3, 4]
FBGA (Top View)
Pin Definitions
Name Definition
Input A
0
-A
18
. Address Inputs
Input/Output I/O
0
-I/O
15
. Data lines. Used as input or output lines depending on operation
Input/Control WE
. Write Enable, Active LOW. When selected LOW, a WRITE is conducted. When selected HIGH, a READ is
conducted.
Input/Control CE
1
. Chip Enable 1, Active LOW.
Input/Control CE
2
. Chip Enable 2, Active HIGH.
Input/Control OE
. Output Enable, Active LOW. Controls the direction of the I/O pins. When LOW, the I/O pins behave as
outputs. When deasserted HIGH, I/O pins are three-stated, and act as input data pins
Ground Vss. Ground for the device
Power Supply Vcc. Power supply for the device
Notes:
2. Typical values are included for reference only and are not guaranteed or tested. Typical values are measured at V
CC
= V
CC(typ.)
, T
A
= 25°C.
3. NC pins are not connected on the die.
4. E3 (DNU) can be left as NC or V
SS
to ensure proper application.
WE
A
11
A
10
A
6
A
0
A
3
CE
1
I/O
10
I/O
8
I/O
9
A
4
A
5
I/O
11
I/O
13
I/O
12
I/O
14
I/O
15
V
SS
A
9
A
8
OE
A
7
I/O
0
BHE
CE
2
A
17
A
2
A
1
BLE
V
CC
I/O
2
I/O
1
I/O
3
I/O
4
I/O
5
I/O
6
I/O
7
A
15
A
14
A
13
A
12
NC
A
18
NC
D
E
B
A
C
F
G
H
A
16
DNU
V
SS
V
CC
326541
[+] Feedback
CY62157CV30/33
Document #: 38-05014 Rev. *F Page 3 of 13
Maximum Ratings
(Above which the useful life may be impaired. For user guide-
lines, not tested.)
Storage Temperature ................................. –65°C to +150°C
Ambient Temperature with
Power Applied.............................................–55°C to +125°C
Supply Voltage to Ground Potential...–0.5V to V
ccmax
+ 0.5V
DC Voltage Applied to Outputs
in High-Z State
[5]
....................................–0.5V to V
CC
+ 0.3V
DC Input Voltage
[5]
.................................–0.5V to V
CC
+ 0.3V
Output Current into Outputs (LOW).............................20 mA
Static Discharge Voltage.......................................... > 2001V
(per MIL-STD-883, Method 3015)
Latch-up Current ................................................... > 200 mA
Operating Range
Device Range
Ambient
Temperature
[T
A
]
[6]
V
CC
CY62157CV30 Automotive-E –40°C to +125°C 2.7V – 3.3V
CY62157CV33 Automotive-A –40°C to +85°C 3.0V – 3.6V
Automotive-E –40°C to +125°C
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions
CY62157CV30-70
UnitMin. Typ.
[2]
Max.
V
OH
Output HIGH Voltage I
OH
= –1.0 mA V
CC
= 2.7V 2.4 V
V
OL
Output LOW Voltage I
OL
= 2.1 mA V
CC
= 2.7V 0.4 V
V
IH
Input HIGH Voltage 2.2 V
CC
+ 0.3V V
V
IL
Input LOW Voltage –0.3 0.8 V
I
IX
Input Leakage
Current
GND < V
I
< V
CC
–10 +10 µA
I
OZ
Output Leakage
Current
GND < V
O
< V
CC
, Output Disabled –10 +10 µA
I
CC
V
CC
Operating
Supply
Current
f = f
MAX
= 1/t
RC
V
CC
= 3.3V
I
OUT
= 0 mA
CMOS Levels
715mA
f = 1 MHz 1.5 3
I
SB1
Automatic CE
Power-Down
Current— CMOS
Inputs
CE
1
> V
CC
– 0.2V or CE
2
< 0.2V
V
IN
> V
CC
– 0.2V or V
IN
< 0.2V,
f = f
max
(Address and Data Only),
f=0 (OE
, WE, BHE and BLE)
870µA
I
SB2
Automatic CE
Power-Down
Current—CMOS
Inputs
CE
1
> V
CC
– 0.2V or CE
2
< 0.2V
V
IN
> V
CC
– 0.2V or V
IN
< 0.2V,
f = 0, V
CC
= 3.3V
870µA
Notes:
5. V
IL(min.)
= –2.0V for pulse durations less than 20 ns.
6. T
A
is the “Instant-On” case temperature.
[+] Feedback
CY62157CV30/33
Document #: 38-05014 Rev. *F Page 4 of 13
Electrical Characteristics Over the Operating Range
Parameter Description Test Conditions
CY62157CV33-70
UnitMin. Typ.
[2]
Max.
V
OH
Output HIGH
Voltage
I
OH
= –1.0 mA
V
CC
= 3.0V
2.4 V
V
OL
Output LOW
Voltage
I
OL
= 2.1 mA
V
CC
= 3.0V
0.4 V
V
IH
Input HIGH Voltage 2.2 V
CC
+ 0.3V V
V
IL
Input LOW Voltage –0.3 0.8 V
I
IX
Input Leakage
Current
GND < V
I
< V
CC
Auto-A –1 +1 µA
Auto-E –10 +10 µA
I
OZ
Output Leakage
Current
GND < V
O
< V
CC
, Output Disabled Auto-A –1 +1 µA
Auto-E –10 +10 µA
I
CC
V
CC
Operating
Supply
Current
f = f
MAX
= 1/t
RC
V
CC
= 3.6V
I
OUT
= 0 mA
CMOS Levels
Auto-A 5.5 12 mA
Auto-E 7 15
f = 1 MHz Auto-A/
Auto-E
1.5 3
I
SB1
Automatic CE
Power-Down
Current—CMOS
Inputs
CE
1
> V
CC
– 0.2V or
CE
2
< 0.2V
V
IN
> V
CC
– 0.2V or
V
IN
< 0.2V,
f = f
max
(Address and Data
Only),
f = 0 (OE,WE,BHE,and BLE)
Auto-A 10 30 µA
Auto-E 10 80 µA
I
SB2
Automatic CE
Power-Down
Current—CMOS
Inputs
CE
1
> V
CC
– 0.2V or
CE
2
< 0.2V
V
IN
> V
CC
– 0.2V or
V
IN
< 0.2V,
f = 0, V
CC
= 3.6V
Auto-A 10 30 µA
Auto-E 10 80 µA
Thermal Resistance
[7]
Parameter Description Test Conditions FBGA Unit
Θ
JA
Thermal Resistance
(Junction to Ambient)
Still Air, soldered on a 3 x 4.5 inch, two-layer printed
circuit board
55 °C/W
Θ
JC
Thermal Resistance
(Junction to Case)
16 °C/W
Note:
7. Tested initially and after any design or process changes that may affect these parameters.
[+] Feedback
CY62157CV30/33
Document #: 38-05014 Rev. *F Page 5 of 13
Capacitance
[7]
Parameter Description Test Conditions Max. Unit
C
IN
Input Capacitance T
A
= 25°C, f = 1 MHz,
V
CC
= V
CC(typ.)
6pF
C
OUT
Output Capacitance 8 pF
AC Test Loads and Waveforms
V
CC
Typ
V
CC
OUTPUT
R2
30 pF
INCLUDING
JIG AND
SCOPE
GND
90%
10%
90%
10%
OUTPUT V
TH
Equivalent to: THÉVENIN EQUIVALENT
ALL INPUT PULSES
R
TH
R1
Rise TIme: 1 V/ns Fall Time: 1 V/ns
Parameters 3.0V 3.3V Unit
R1 1.105 1.216 ΚΩ
R2 1.550 1.374 ΚΩ
R
TH
0.645 0.645 ΚΩ
V
TH
1.75 1.75 V
Data Retention Characteristics (Over the Operating Range)
Parameter Description Conditions Min. Typ.
[2]
Max. Unit
V
DR
V
CC
for Data Retention 1.5 V
I
CCDR
Data Retention Current V
CC
= 1.5V, CE
1
> V
CC
– 0.2V or
CE
2
< 0.2V,
V
IN
> V
CC
– 0.2V or V
IN
< 0.2V
Auto-A 4 20 µA
Auto-E
460µA
t
CDR
[8]
Chip Deselect to Data
Retention Time
0ns
t
R
[8]
Operation Recovery Time t
RC
ns
Data Retention Waveform
[9]
Notes:
8. Full Device AC operation requires linear V
CC
ramp from V
DR
to V
CC(min.)
> 100 µs or stable at V
CC(min.)
>100 µs.
9. BHE
.BLE is the AND of both BHE and BLE. Chip can be deselected by either disabling the chip enable signals or by disabling both BHE and BLE.
V
CC(min.)
V
CC(min.)
t
CDR
V
DR
> 1.5 V
DATA RETENTION MODE
t
R
CE
1
or
V
CC
BHE.BLE
CE
2
or
[+] Feedback
CY62157CV30/33
Document #: 38-05014 Rev. *F Page 6 of 13
Switching Characteristics Over the Operating Range
[10]
Parameter Description
70 ns
UnitMin. Max.
Read Cycle
t
RC
Read Cycle Time 70 ns
t
AA
Address to Data Valid 70 ns
t
OHA
Data Hold from Address Change 10 ns
t
ACE
CE
1
LOW and CE
2
HIGH to Data Valid 70 ns
t
DOE
OE LOW to Data Valid 35 ns
t
LZOE
OE LOW to Low-Z
[11]
5ns
t
HZOE
OE HIGH to High-Z
[11, 12]
25 ns
t
LZCE
CE
1
LOW and CE
2
HIGH to Low-Z
[11]
10 ns
t
HZCE
CE
1
HIGH or CE
2
LOW to High-Z
[11, 12]
25 ns
t
PU
CE
1
LOW and CE
2
HIGH to Power-up 0 ns
t
PD
CE
1
HIGH or CE
2
LOW to Power-down 70 ns
t
DBE
BHE/BLE LOW to Data Valid 70 ns
t
LZBE
[11]
BHE/BLE LOW to Low-Z
[13]
5ns
t
HZBE
BHE/BLE HIGH to High-Z
[11, 12]
25 ns
Write Cycle
[14]
t
WC
Write Cycle Time 70 ns
t
SCE
CE
1
LOW and CE
2
HIGH to Write End 60 ns
t
AW
Address Set-up to Write End 60 ns
t
HA
Address Hold from Write End 0 ns
t
SA
Address Set-up to Write Start 0 ns
t
PWE
WE Pulse Width 50 ns
t
BW
BHE/BLE Pulse Width 60 ns
t
SD
Data Set-up to Write End 30 ns
t
HD
Data Hold from Write End 0 ns
t
HZWE
WE LOW to High-Z
[11, 12]
25 ns
t
LZWE
WE HIGH to Low-Z
[11]
5ns
Notes:
10.Test conditions assume signal transition time of 5 ns or less, timing reference levels of V
CC(typ.)
/2, input pulse levels of 0 to V
CC(typ.)
, and output loading of the
specified I
OL
/I
OH
and 30-pF load capacitance.
11.At any given temperature and voltage condition, t
HZCE
is less than t
LZCE
, t
HZBE
is less than t
LZBE
, t
HZOE
is less than t
LZOE
, and t
HZWE
is less than t
LZWE
for any
given device.
12.t
HZOE
, t
HZCE
, t
HZBE
, and t
HZWE
transitions are measured when the outputs enter a high-impedance state.
13.When both byte enables are toggled together this value is 10 ns.
14.The internal Write time of the memory is defined by the overlap of WE
, CE
1
= V
IL
, BHE and/or BLE = V
IL
, CE
2
= V
IH
. All signals must be ACTIVE to initiate a
Write and any of these signals can terminate a Write by going INACTIVE. The data input set-up and hold timing should be referenced to the edge of the signal
that terminates the Write.
[+] Feedback
CY62157CV30/33
Document #: 38-05014 Rev. *F Page 7 of 13
Switching Waveforms
Read Cycle No. 1 (Address Transition Controlled)
[15, 16]
Read Cycle No. 2 (OE Controlled)
[16, 17]
Notes:
15.Device is continuously selected. OE
, CE
1
= V
IL
, BHE and/or BLE = V
IL
, CE
2
= V
IH
.
16.WE
is HIGH for Read cycle.
17.Address valid prior to or coincident with CE
1
, BHE, BLE transition LOW and CE
2
transition HIGH.
ADDRESS
DATA OUT PREVIOUS DATA VALID
DATA VALID
t
RC
t
AA
t
OHA
50%
50%
DATA VALID
t
RC
t
ACE
t
DOE
t
LZOE
t
LZCE
t
PU
HIGH IMPEDANCE
t
HZOE
t
HZCE
t
PD
HIGH
OE
CE
1
I
CC
I
SB
IMPEDANCE
ADDRESS
CE
2
DATA OUT
V
CC
SUPPLY
CURRENT
BHE/BLE
t
LZBE
t
HZBE
[+] Feedback
CY62157CV30/33
Document #: 38-05014 Rev. *F Page 8 of 13
Write Cycle No. 1 (WE Controlled)
[14, 18, 19]
Notes:
18.Data I/O is high-impedance if OE
= V
IH
.
19.If CE
1
goes HIGH or CE
2
goes LOW simultaneously with WE HIGH, the output remains in a high-impedance state.
20.During this period, the I/Os are in output state and input signals should not be applied.
Switching Waveforms (continued)
t
HD
t
SD
t
PWE
t
SA
t
HA
t
AW
t
SCE
t
WC
t
HZOE
DATA
IN
VALID
CE
1
ADDRESS
CE
2
WE
DATA I/O
OE
NOTE
20
BHE/BLE
t
BW
[+] Feedback
CY62157CV30/33
Document #: 38-05014 Rev. *F Page 9 of 13
Write Cycle No. 2 (CE
1
or CE
2
Controlled)
[14, 18, 19]
Write Cycle No. 3 (WE Controlled, OE LOW)
[19]
Switching Waveforms (continued)
t
HD
t
SD
t
PWE
t
HA
t
AW
t
SCE
t
WC
t
HZOE
DATA
IN
VALID
CE
1
ADDRESS
CE
2
WE
DATA I/O
OE
NOTE
20
BHE/BLE
t
BW
t
SA
DATA
IN
VALID
t
HD
t
SD
t
LZWE
t
PWE
t
SA
t
HA
t
AW
t
SCE
t
WC
t
HZWE
CE
1
ADDRESS
CE
2
WE
DATAI/O
NOTE 20
t
BW
BHE/BLE
[+] Feedback
CY62157CV30/33
Document #: 38-05014 Rev. *F Page 10 of 13
Write Cycle No. 4 (BHE/BLE Controlled, OE LOW)
[19]
Truth Table
CE
1
CE
2
WE OE BHE BLE Inputs/Outputs Mode Power
H X X X X X High Z Deselect/Power-Down Standby (I
SB
)
X L X X X X High Z Deselect/Power-Down Standby (I
SB
)
X X X X H H High Z Deselect/Power-Down Standby (I
SB
)
L H H L L L Data Out (I/O
O
–I/O
15
) Read Active (I
CC
)
L H H L H L Data Out (I/O
O
–I/O
7
);
I/O
8
–I/O
15
in High Z
Read Active (I
CC
)
L H H L L H Data Out (I/O
8
–I/O
15
);
I/O
0
–I/O
7
in High Z
Read Active (I
CC
)
L H H H L L High Z Output Disabled Active (I
CC
)
L H H H H L High Z Output Disabled Active (I
CC
)
L H H H L H High Z Output Disabled Active (I
CC
)
L H L X L L Data In (I/O
O
–I/O
15
) Write Active (I
CC
)
L H L X H L Data In (I/O
O
–I/O
7
);
I/O
8
–I/O
15
in High Z
Write Active (I
CC
)
L H L X L H Data In (I/O
8
–I/O
15
);
I/O
0
–I/O
7
in High Z
Write Active (I
CC
)
Switching Waveforms (continued)
DATA I/O
ADDRESS
t
HD
t
SD
t
SA
t
HA
t
AW
t
WC
CE
1
WE
DATA
IN
VALID
NOTE 20
t
BW
BHE/BLE
t
SCE
CE
2
t
PWE
[+] Feedback
CY62157CV30/33
Document #: 38-05014 Rev. *F Page 11 of 13
Typical DC and AC Characteristics
12.0
10.0
6.0
4.0
0
8.0
I
SB (µA)
12.0
10.0
6.0
4.0
2.0
2.2
0.0
8.0
I
CC
(mA)
SUPPLY VOLTAGE (V)
SUPPLY VOLTAGE (V)
MoBL
MoBL
2.2
2.0
(f = 1 MHz)
(f = f
max
, 70ns)
14.0
2.5
2.7
2.5
2.7
12.0
10.0
6.0
4.0
2.0
2.7
3.3
0.0
8.0
I
CC
(mA)
SUPPLY VOLTAGE (V)
MoBL
(f = 1 MHz)
(f = f
max
, 70ns)
14.0
3.0
12.0
10.0
6.0
4.0
2.0
3.0
3.6
0.0
8.0
I
CC
(mA)
SUPPLY VOLTAGE (V)
14.0
3.3
MoBL
12.0
10.0
6.0
4.0
3.0
0
8.0
I
SB (µA)
SUPPLY VOLTAGE (V)
3.6
2.0
3.3
12.0
10.0
6.0
4.0
3.0
0
8.0
I
SB (µA)
Standby Current vs. Supply Voltage
SUPPLY VOLTAGE (V)
MoBL
2.0
2.7
3.3
50
30
20
10
3.0
3.6
SUPPLY VOLTAGE (V)
0
40
T
AA (ns)
60
3.3
50
30
20
10
2.2
SUPPLY VOLTAGE (V)
0
40
T
AA (ns)
60
2.5
2.7
50
30
20
10
SUPPLY VOLTAGE (V)
Access Time vs. Supply Voltage
0
40
T
AA (ns)
60
3.0
2.7
3.3
MoBL
Operating Current vs. Supply Voltage
MoBL
MoBL
MoBL
(f = f
max
, 70ns)
(f = 1 MHz)
[2]
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CY62157CV30/33
Document #: 38-05014 Rev. *F Page 12 of 13
© Cypress Semiconductor Corporation, 2006. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Package Diagram
MoBL, MoBL2, and More Battery Life are trademarks of Cypress Semiconductor Corporation. All product and company names
mentioned in this document may be the trademarks of their respective holders.
Ordering Information
Speed
(ns) Ordering Code
Package
Diagram Package Type
Operating
Range
70 CY62157CV30LL-70BAE 51-85128 48-Ball (6 mm x 10 mm x 1.2 mm) FBGA Automotive-E
CY62157CV33LL-70BAXA Automotive-A
CY62157CV33LL-70BAE Automotive-E
A
1
A1 CORNER
0.75
0.75
Ø0.30±0.05(48X)
Ø0.25 M C A B
Ø0.05 M C
B
A
0.15(4X)
0.21±0.05
1.20 MAX
C
SEATING PLANE
0.53±0.05
0.25 C
0.15 C
A1 CORNER
TOP VIEW
BOTTOM VIEW
234
3.75
5.25
B
C
D
E
F
G
H
65
465231
D
H
F
G
E
C
B
A
6.00±0.10
10.00±0.10
A
10.00±0.10
6.00±0.10
B
1.875
2.625
0.36
48-Ball (6 mm x 10 mm x 1.2 mm) FBGA (51-85128)
51-85128-*D
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CY62157CV30/33
Document #: 38-05014 Rev. *F Page 13 of 13
Document History Page
Document Title: CY62157CV30/33 512K x 16 Static RAM
Document Number: 38-05014
REV. ECN NO. Issue Date
Orig. of
Change Description of Change
** 106184 05/10/01 HRT/MGN New data sheet – Advance Information
*A 107241 07/24/01 MGN Made corrections to Advance Information
Added 55 ns bin
*B 109621 03/11/02 MGN Changed from Advance Information to Final
*C 114218 05/01/02 GUG/MGN Improved Typical and Max I
CC
values
*D 238448 See ECN AJU Added Automotive Product Information
*E 269729 See ECN SYT Added Automotive Product information for CY62157CV30 – 70 ns
Added I
IX
and I
OZ
values for Automotive range of CY62157CV33 – 70 ns
*F 498575 See ECN NXR Removed Industrial Operating Range
Removed 55 ns speed bin
Removed CY62157CV25 part number from the Product Offering
Added Automotive-A operating range
Updated the Ordering Information Table
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