NXP Semiconductors ISP1563 User manual

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User manual

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AN10050
Designing a Hi-Speed USB host PCI adapter using the
ISP1562, ISP1563
Rev. 04 — 1 November 2007 Application note
Document information
Info Content
Keywords isp1562; isp1563; usb; universal serial bus; host; pci adapter
Abstract This document contains a description of the ISP1562/3 application
schematics and the PCB design recommendations.
NXP Semiconductors
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Designing a Hi-Speed USB host PCI adapter using ISP1562/63
AN10050_4 © NXP B.V. 2007. All rights reserved.
Application note Rev. 04 — 1 November 2007 2 of 18
Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Revision history
Rev Date Description
04 20071101 Fourth revision. Corrected typo in Section 4: it is 2.5 inches ± 0.1 inch, not ± 1 inch.
Last line of Section
3.4.
03 20061212 Third revision. Updated Fig 6.
02 20060707 Second revision. Updated Section 5.
01 20051004 First release.
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Designing a Hi-Speed USB host PCI adapter using ISP1562/63
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1. Introduction
The ISP1562 and the ISP1563 are Hi-Speed Universal Serial Bus (USB) host controllers
(HCs) that can be directly connected to a standard 32-bit, 33 MHz PCI bus. For the rest
of this document, they will be known as ‘ISP1562/3’. The ISP1562/3 complies with PCI
Local Bus Specification Rev. 2.2 and PCI Bus Power Management Interface
Specification Rev. 1.1. No additional logic is required to implement a complete Hi-Speed
USB host controller solution on Peripheral Component Interconnect (PCI).
Adapter cards based on the ISP1562/3 implement three functions: function 0 and
function 1 for OHCI1 and OHCI2, and function 2 for EHCI. According to PCI Local Bus
Specification, each physical PCI device may incorporate one to eight separate functions
(logical devices). Each function contains its own memory-mapped individually
addressable configuration space of 256 bytes, containing configuration registers.
The configuration registers of the ISP1562/3 are used by the system’s BIOS and the
operating system to detect the presence of the respective functions, that is, Vendor ID
(VID) and Product ID (PID), to determine the necessary resource requirements, that is,
memory and I/O space, interrupt lines, and so on, and for specific capabilities.
A set of on-chip ‘operational’ registers is also defined for each of the three host
controllers implemented in the ISP1562/3. The respective host controller device driver
interacts with these registers to implement the USB functionality and the legacy support.
A detailed description of configuration registers and operational registers can be found in
the ISP1562 and ISP1563 data sheets.
The ISP1562/3 implements two internal ‘power wells’, V
DD
and V
DDX
, to benefit from the
PCI V
AUX
= 3.3 V dedicated power source, which is present on the PCI connector (pin
A14) even when PCI V
CC
= 3.3 V is off. This enables the ISP1562/3 PME# signal to be
asserted and activates the wake-up logic of the motherboard, even if the rest of the
system is powered down; for example, in S3
cold
system standby mode. This is applicable
mainly to onboard (desktop) or mobile designs, but not applicable to PCI add-on cards
because the PCI +5 V, used for V
BUS
, is also off during S3
cold
.
The ISP1562/3 may use PCI V
AUX
to power its four internal transceivers connected to the
ISP1562/3 V
DDA_AUX
(analog), and also the clock circuitry, port router, root hub and Power
Management Event (PME#) logic connected to the ISP1562/3
V
CC(I/O)_AUX
(digital).
For details on implementation of the PCB design, see Section
4.
The power management capabilities enabled by using PCI V
AUX
allow system designers
to meet the governmental energy regulations that are becoming increasingly essential
worldwide: Energy Star/USA: 30 W standby, White Swan/Europe: 5 W standby, Blue
Angel/Europe: 5 W standby.
This document provides a description of the application schematics and the PCB design
recommendations.
2. ISP1562/3 initialization
The following sequence is required during the ISP1562/3 initialization, for correct
functionality:
1. Register HcRhDescriptorA = 902h. This means that bit PSM = 1b.
2. Register HcControl = 680h. This means that bits HCFS[1:0] = 10b (operational
mode).
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3. Register HcRhStatus = 18000h. This implies that bit LPSC = 1b (port powered).
Microsoft Windows 2000, Windows XP and Linux drivers normally use this sequence.
The order of the steps may, however, be reversed in Windows CE default drivers so
changes are required for normal functionality.
3. Description of the application schematics
The schematics (see Section 5) contain a complete implementation of the ISP1562/3 and
allow testing of all its features in different types of design: PCI add-on card, onboard
design in standard desktop or mobile solution.
In the case of a standard PCI add-on card design, some simplifications to the schematics
can be done, as described here. Some features will not be normally used in a standard
PCI add-on card. For example: The legacy support, wake-up from S3
cold
(no external
+5 V input for V
BUS
) and the alternative 48 MHz clock input. All these alternatives,
however, are included in the schematics and are described in this document.
3.1 Distribution of power sources and power management support
As shown in the schematics (see Section 5), a simple solution by using one jumper (JP1)
may be adopted to choose between PCI V
CC
= 3.3 V or PCI V
AUX
= 3.3 V as the main
power source for the ISP1562/3. Power source PCI V
AUX
= 3.3 V is introduced in PCI
Local Bus Specification Revision 2.2. It allows powering an add-on card and generation
of the PME# signal, even if the system is in a deep power management state and PCI
V
CC
is off. An alternative solution to using a jumper may be a simple circuit containing a
pair of MOSFET transistors that allows to detect the presence of PCI V
AUX
= 3.3 V and
automatic selection of the input voltage.
Selection of PCI V
CC
= +3.3 V must be the default position of jumper JP1 in the case of a
standard add-on card design. The other possible position of JP1 selects PCI V
AUX
= 3.3 V
for complete Power Management tests, including S3
cold
in the case of on-motherboard or
notebook. Note that pins 3, 77, 98 and 100 of the ISP1562, and pins 6, 12 and 95 of the
ISP1563 are connected to the PCB V
CC(I/O)_AUX
power plane and pins 86 and 93 of the
ISP1562, and pins 104, 111, 120 and 128 of the ISP1563 are connected to the PCB
V
DDA_AUX
power plane. Each of these planes is separated from PCI V
AUX
by its own set of
inductors and decoupling capacitors.
Although most of the motherboards provide the PCI V
AUX
power source in all system
power management modes, including S3
cold
, the PCI +5 V power supply is
simultaneously interrupted with PCI V
CC
= +3.3 V.
In certain standby modes (S3
cold
), the devices connected to USB ports will not be
powered once the +5 V power is removed because the V
BUS
voltage present on USB
connectors is normally derived from the PCI +5 V power supply. Therefore, PCI V
AUX
is
not useful in the case of a standard PCI add-on card implementation for a system wake-
up from S3
cold
. It is, however, a very useful feature for onboard and mobile application
designs because it allows additional considerable power savings and also wakes up the
system by using a USB device. The system wake-up from S3
cold
, generated from a USB
device, for example, USB mouse or USB keyboard, connected to the ISP1562/3 host
controller must be supported in system’s BIOS, hardware (a continuous +5 V must be
supplied to V
BUS
) and operating system drivers.
To be able to test the remote wake-up, especially, from those power management states
in which the +5 V power source on PCI is not present, for example, S3
cold
, a special
connector (J1) is added for an external +5 V source. Any external independent power
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supply that provides +5 V ± 5 % @ 2 A stabilized can be used. For example, a standard
hub power supply.
Note the distribution of pull-up resistors in the recommended schematics. For example,
to achieve correct functionality, it is recommended that you connect the pull-up resistors
placed on the PWEn_N and OCn_N input signals of the power switch, for example,
MIC2026, to DV
AUX
NET, maintaining a good condition of these signals even when
+3.3 V and +5 V are off. The ‘fault flag’ pins (OCn_N) of MIC2026 are open-drain and
require the presence of pull-up resistors. A 100 nF capacitor is used on each OCn_N
signal to prevent false fault conditions.
CLKRUN# is implemented in the ISP1562 on pin 42 and in the ISP1563 on pin 52. This
signal is targeted mainly for mobile system designs. CLKRUN is an I/O pin. It is used by
the system to safely turn-off the PCI CLK for power saving, with acknowledgment from
the ISP1562/3 according to a predefined protocol. In the case of the PCI adapter card
design, CLKRUN# must always be LOW because it is not present in the PCI connector.
CLKRUN# may directly be connected to GND. For details on CLKRUN# function, refer to
PCI Mobile Design Guide Version 1.1.
3.2 Input clock: applies only to the ISP1563
You can use either of the following as clock input:
A 12 MHz crystal; the default recommended solution for best ElectroMagnetic
Interference (EMI) results.
A 48 MHz oscillator; this may be a useful alternative, typically, in the case of on-
motherboard design.
Both solutions for the input clock are shown in the schematics.
To use a 48 MHz clock as input, connect the clock signal to the ISP1563 pin 86 (XTAL1),
pin 87 (XTAL2) can be left open, and pin 121 (SEL48M) must be pulled up as shown in
the schematics.
In an add-on card configuration, normally, the 12 MHz crystal is used. In such a case,
oscillators OSC2 and R45 are not necessary. Also, pin 121 (SEL48M) must directly be
connected to GND. Another possibility is using a 12 MHz clock as an input. In this case,
the 12 MHz-clock signal is directly connected to the ISP1563 pin 86 (XTAL1). This is
similar to the case in which the 48 MHz clock is used; however, the ISP1563 pin 121
must still be connected to GND.
3.3 Selecting the number of ports: applies only to the ISP1563
The selection of the number of ports, 2 or 4, is done using the SEL2PORTS signal
(ISP1563 pin 5). It must be pulled to LOW, that is, connected to GND, for normal use of
all four ports. If SEL2PORTS is HIGH, only two ports, that is, port 1 and port 2, are
enabled; one port from each OHCI will be used in this case for performance
improvement. Details regarding the power consumption and possible power savings in a
two-port configuration can be found in the ISP1563 data sheet.
3.4 Subsystem vendor ID and subsystem device ID
The ISP1562/3 allows loading of the Subsystem Vendor ID (VID) and the Subsystem
Device ID (DID) for both EHCI and OHCI from an external EEPROM. Loading of these
values in the configuration registers of the ISP1562/3 will occur only if a value of 15h is
found in byte 7 of the EEPROM. The necessary signals, I
2
C-bus clock and I
2
C-bus data,
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are defined on pins 96 (SCL) and 97 (SDA) of the ISP1562, and pins 122 (SCL) and 123
(SDA) of the ISP1563, respectively. When not in use, these signals must be connected to
ground using a pull-down resistor, typically 10 kΩ.
3.5 Legacy support: applies only to the ISP1563
Legacy signals, IRQ1, IRQ12, A20OUT, KBIRQ1, MUIRQ12 and SMI#, are not normally
used on a PCI add-on card design. In this case, the MUIRQ12 and KBIRQ1 input signals
must be connected to GND. The other signals that are mentioned in this category (that
are outputs) can be left open.
Details on legacy signals and a block diagram showing correct connection of these
signals in the case of onboard design can be found in ISP1563 Eval Board User Manual
(UM10066).
3.6 Overcurrent protection
The ISP1562/3 implements the digital overcurrent protection scheme.
The recommended solution to implement an external overcurrent protection is a standard
power switch with integrated overcurrent detection, such as:
LM3526 and MIC2526 (2 ports), or
LM3544 (4 ports).
The overcurrent protection logic of the ISP1562/3 uses the following two pins for each
USB port:
PWEn_N: It is used to enable or disable the respective external port power switch.
For example, MIC2526 and LM3526.
OCn_N: It is an input on which a fault condition on the respective USB port is
signaled to the ISP1562/3 by the external port power-switching device.
The fault condition that is usually signaled by an external power-switching device can be
an overcurrent or a thermal shutdown. The port power-switching integrated devices
commonly implement a delay of 1 ms to 3 ms to prevent false OC_N reporting because
of inrush currents, when plugging a USB device.
Once a fault condition is received, it will be detected by the operating system and the
respective device driver will disable the port power switch by programming the Port
Power (PP) bit in the PORTSC register. This device driver is the OHCI driver in the case
of an Original USB device to create the fault condition, or the EHCI driver in the case of a
Hi-Speed USB device to create the overcurrent condition. This is according to the USB
port allocation at the moment when the OC# signal was asserted.
A possible alternative is to use a resettable fuse on each port. This has the advantage of
simplicity. It, however, does not inform the operating system of the fault condition and,
therefore, no message is generated to inform the user. The resettable fuse will continue
to protect the port by switching ‘on or off’ as long as the overcurrent condition persists.
A possible enhancement of this scheme is connecting V
BUS
to the OCn_N input of the
ISP1562/3 to detect the OCn_N condition, the first time V
BUS
is cut-off a LOW level will
appear on the OCn_N pin.
Using only an external PMOS transistor for overcurrent protection is not possible
because the ISP1562/3 does not implement the analog overcurrent protection (not
measuring the current through the transistor).
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4. PCB design recommendations
Some important recommendations for a successful PCB design, applicable to both
adapter card and motherboard design solutions, are as follows:
Typically, a solution using four layers PCB (signal 1, GND, V
CC
, signal 2) is sufficient
for proper routing, allowing you to obtain good functionality and meeting all
compliance tests requirements. Start your design by placing the ISP1562/3 chip, the
major components, and routing of the high-speed DP and DM traces and clock
traces. Also, a complete ‘clean’ solution for routing the power and GND (split planes)
must be defined before you start routing the rest of the signals.
The trace length for all PCI signals, except the PCI clock signal, to the PCI connector
must be limited to a maximum of 1.5 inches.
The length of the PCI clock signal from the PCI bus connector to the ISP1562/3 must
be 2.5 inches ± 0.1 inch in length and must be routed to only one load. It must
usually be ‘snaked’. Ensure that all corners of this trace are rounded. Do not use 90°
sharp corners.
Route the high-speed USB differential pairs over continuous GND or power planes.
Avoid crossing anti-etch areas and any breaks in the internal planes (plane splits).
The minimum recommended distance to a plane split is 25 mils. You must also avoid
placing a series of via holes near the DP and DM lines because these will create
‘break areas’ in the GND plane below. This is because of the clearance imposed by
the manufacturing process around any via holes to an internal plane.
Try to keep the length of the DP and DM traces equal. The maximum trace length
mismatch between high-speed USB signal pairs must not be greater than 70 mils.
Maintain parallelism between USB differential signals, with the trace spacing needed
to achieve 90 Ω differential impedance. To achieve the required impedance of the
pair traces, it is recommended that you use 8 mils traces and keep the distance
between the DP and DM traces at 8 mils. These values may vary, depending on the
actual PCB parameters.
Avoid corners when routing the differential pairs DP and DM. Any 90° direction
change of traces must be accomplished with two 45° turns or by using an arc of an
imaginary circle tangent to the DP and DM lines.
Avoid routing the USB differential pairs near I/O connectors, signal headers, crystals,
oscillators, magnetic devices and power connectors.
Maintain the maximum possible distance between high-speed USB differential pairs,
high-speed or low-speed clock, and non-periodic signals. The minimum
recommended distances are as follows:
20 mils between the DP and DM traces and low-speed non-periodic signal traces
50 mils between the DP and DM traces, and clock or high-speed periodic signal
traces
20 mils between two pairs of the DP and DM traces
Avoid creating stubs to connect the 15 kΩ pull-down resistors or to test points. If a
stub is unavoidable in the design, no stub must be greater than 80 mils.
Route all the DP and DM lines on one layer. Do not change layers (avoid using vias)
even to avoid crossing a plane split. It is better to place a non-split plane under high-
speed USB signals, ground layer or power layer. It is recommended that you place a
ground layer beneath the DP and DM lines.
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The maximum allowed length of the DP and DM lines for onboard solutions (or [trace
+ cable length] for a front-panel solution) is 18 inches.
A decoupling capacitor must be placed on V
BUS
as close as possible to each USB
connector. A value of about 150 µF/10 V is recommended on each port.
The common-mode choke used, if really necessary, on the DP and DM lines must be
placed as close as possible to the USB connector and must have
Z
com
< 8 Ω @ 100 MHz and Z
diff
< 300 Ω @ 100 MHz.
The common-mode choke, as well as the ElectroStatic Discharge (ESD) protection
components will be used only if necessary (in case the design does not pass EMI or
the ESD tests) because these may affect the signaling quality. Nevertheless, it is
recommended that you include the necessary footprints for common-mode chokes
and ESD protection components on the PCB as safeguards. The footprints must be
placed as close as possible to the USB connector. Special attention must be given
when placing additional components on the DP and DM lines and routing
recommendations must be followed.
Both V
DDA_AUX
(analog) and V
CC(I/O)_AUX
(digital) are derived from the PCI V
AUX
voltage,
found on pin A14 of the PCI connector.
V
CC(I/O)_AUX
can directly be connected to PCI
V
AUX
. V
DDA_AUX
is separated from PCI V
AUX
by an inductor and each of V
CC(I/O)_AUX
and
V
DDA_AUX
uses its own decoupling capacitors.
The design must ensure that the V
DDA_AUX
and V
CC(I/O)_AUX
power planes are isolated
from the main PCI 3.3 V power plane. This is achieved by creating two separate
power planes that do not come in contact with the PCI 3.3 V power plane.
The decoupling capacitors must be placed as close as possible to the ISP1562/3. A
good choice is the four corners of the IC because these areas will not normally be
occupied by traces or other components, according to the ISP1562/3 pinout.
For good EMI testing results, it is recommended that you provide a good path from
the USB connector shell to the chassis ground. The USB connector shell must be
connected to an isolated ground plane.
For more information, refer to the Intel document The USB 2.0 Platform Design
Guideline, Rev. 1.0.
5. Schematics
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PCI CONNECTOR
AD[31:0]
PCICLK
RST#
IDSEL
GNT#
C/BE0#
C/BE1#
C/BE2#
C/BE3#
INTA#
REQ#
FRAME#
TRDY#
IRDY#
DEVSEL#
STOP#
PERR#
SERR#
PAR
PME#
AD[31:0]
PCICLK
RST#
IDSEL
GNT#
C/BE0#
C/BE1#
C/BE2#
C/BE3#
INTA#
REQ#
FRAME#
TRDY#
IRDY#
DEVSEL#
STOP#
PERR#
SERR#
PAR
PME#
PWE1#
PWE2#
OC1#
OC2#
DM1
DP1
DM2
DP2
DM1
DP1
DM2
DP2
PWE1#
PWE2#
OC1#
OC2#
ISP1562_ES1
USB PORTS
POWER CONTROL
Fig 1. ISP1562 eval board schematic – top level interfaces
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© NXP B.V. 2007. All rights reserved.
DV
AUX
C20
0.1 μF
C17
C22
0.1 μF
0.001 μF
+3.3 V
Should be placed
as close as
possible to pin 98
Should be placed
as close as
possible to pin 55
C21
0.1 μF
U2A
A1
A3
GND
VCC
NC/WP
SCL
SDA
AT24C01A-2.7
U2
A0
A1
A3
GND
VCC
NC/WP
SCL
SDA
AT24C01A-2.7
+3.3 V
C9
0.1 μF
R2
0 Ω
R4
R5
R3
0 Ω
R6
0 Ω
1
2
3
4
5
6
7
8
1
2
3
45
6
7
8
Should be placed
as close as
possible to pin 3
C38
0.1 μF
All capacitors should be placed as close as possible
to the corresponding power pins.
AV
AUX
+3.3 V
C49
1 nF
C50
1 nF
C51
1 nF
C31
C32
C33
0.1 μF
0.1 μF
0.1 μF
0.1 μF
C34
C35
C36
C37
0.1 μF
1 nF
1 nF
0.1 μF 0.1 μF
0.1 μF 0.1 μF
0.1 μF
C10
4.7 μF
C23
C24
C25
C26
C27
C30
4.7μF
+
+
+3.3 V
JP1
HEADER 3
3.3 V
AUX
1
2
3 BLM21PG221SN1
C28
C60 C59
0.1 μF
470 pF
47 μF / 6.3 V
AV
AUX
D3 LED
R1
330 Ω
DV
AUX
All capacitors should be placed
as close as possible to the
corresponding ferrite bead
AV
AUX
BLM18PG121SN1
FB2
+
FB 1
C29
C19
0.1 μF
1 nF
C61
+
4.7 μF / 6.3 V
SCL
SDA
96
97
SCL
SDA
AD[0]
AD[1]
AD[2]
AD[3]
AD[4]
AD[5]
AD[6]
AD[7]
AD[8]
AD[9]
AD[10]
AD[11]
AD[12]
AD[13]
AD[14]
AD[15]
AD[16]
AD[17]
AD[18]
AD[19]
AD[20]
AD[21]
AD[22]
AD[23]
AD[24]
AD[25]
AD[26]
AD[27]
AD[28]
AD[29]
AD[30]
AD[31]
AD0
AD1
AD2
AD4
AD3
70
69
68
67
66
65
AD5
AD6
63
AD7
AD8
AD9
AD10
AD11
AD12
AD13
AD14
AD15
AD16
AD17
AD18
AD19
AD20
AD21
AD22
AD23
AD24
AD25
AD26
AD27
AD28
AD29
AD30
AD31
62
59
57
56
54
53
52
51
50
34
33
31
30
29
28
27
26
22
21
20
15
14
13
12
10
C/BE#[0]
C/BE#[1]
C/BE#[2]
C/BE#[3]
C/BE0#
C/BE1#
C/BE2#
C/BE3#
60
48
35
23
78
87
OC1#
OC2#
PWE1#
PWE2#
DM1
DM2
DP1
DP2
79
88
83
90
85
92
OC1_N
OC2_N
PWE1_N
PWE2_N
DM1
DM2
DP1
DP2
RREF
GNDA
XTAL1
XTAL2
81
80
74
75
R7
12 kΩ / 1 %
C62
C63
OSC1
12 MHz
OC1#
OC2#
PWE1#
PWE2#
DM1
DM2
DP1
DP2
PME#
PCICLK
RST#
PA R
SERR#
PERR#
CLKRUN#
STOP#
DEVSEL#
TRDY#
IRDY#
FRAME#
IDSEL
GNT#
REQ#
INTA#
PME#
PCICLK
RST#
PA R
SERR#
PERR#
STOP#
DEVSEL#
TRDY#
IRDY#
FRAME#
IDSEL
GNT#
REQ#
INTA#
PME#
PCICLK
RST#
PA R
SERR#
PERR#
STOP#
DEVSEL#
TRDY#
IRDY#
FRAME#
IDSEL
GNT#
REQ#
INTA#
99
7
5
47
45
44
42
41
39
38
37
36
24
8
9
4
C/BE0#
C/BE1#
C/BE2#
C/BE3#
U1
ISP1562ESP
AUX1V18
AUX1V18
REG1V18
REG1V18
REG1V18
V
I(VREG3V3)
V
CC(I/O)
V
CC(I/O
)
V
CC(I/O)
V
CC(I/O)
V
CC(I/O)
V
I(VAUX3V3)
V
CC(I/O)_AUX
V
CC(I/O)_AUX
V
CC(I/O)_AUX
V
DDA_AUX
V
DDA_AUX
2
73
18
43
58
16
11
25
40
55
71
3
77
98
100
86
93
GNDA
GNDA
GNDA
GNDA
GNDA
GNDD
GNDD
GNDD
GNDD
GNDD
GNDD
GNDD
GNDD
GNDA
GNDA
GNDA
GNDA
1
17
46
61
72
6
19
32
49
64
76
94
95
82
89
84
91
AD[31:0]
22 pF
22 pF
1 kΩ
R8
4.7 kΩ
4.7 kΩ
DV
AUX
DV
AUX
DV
AUX
A0
DV
AUX
DV
AUX
FB3
BLM18PG121SN1
C18
0.001 μF
FB3 is optional. Can be directly tied to ground.
Fig 2. ISP1562 eval board schematic – ISP1562
NXP Semiconductors
Designing a Hi-Speed USB host PCI adapter using ISP1562/63
AN10050
Application note
A
N10050
_
4
Rev. 04 — 1 November 2007
11 of 18
© NXP B.V. 2007. All rights reserved.
INTA#
INTA#
INTA#
3.3 VAUX
RST#
RST#
RST#
GNT#
GNT#
GNT#
PME#
PME#
PME#
AD30
AD28
AD26
AD24
IDSEL
IDSEL
IDSEL
AD22
AD20
AD18
AD16
FRAME#
FRAME#
TRDY#
TRDY#
TRDY#
STOP#
STOP#
STOP#
PA R
PA R
PA R
AD15
AD13
AD11
AD9
C/BE0#
C/BE0#
C/BE0#
AD6
AD4
AD2
AD0
+5 V
+3.3 V
+
C52
47 μF / 10 V
47 μF / 10 V
C48
+
+
C58
47 μF / 6.3 V
C57
47 μF / 6.3 V
+
C16
0.1 μF
C53
0.1 μF
C54
1 nF
C64
100 pF
C15
0.1 μF
C14
0.1 μF
C47
1 nF
C46
1 nF
GND
PCICLK
PCICLK
PCICLK
REQ#
REQ#
REQ#
AD31
AD29
AD27
AD25
C/BE3#
C/BE3#
C/BE3#
AD23
AD21
AD19
AD17
C/BE2#
C/BE2#
C/BE2#
IRDY#
IRDY#
IRDY#
DEVSEL#
DEVSEL#
DEVSEL#
PERR#
PERR#
PERR#
SERR#
SERR#
SERR#
C/BE1#
C/BE1#
C/BE1#
AD14
AD12
AD10
AD8
AD7
AD5
AD3
AD1
GND
AD[31:0]
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
CON5
12 V
TCK
GND
TDO
+5 V
+5 V
INTB
INTD
PRSNT 1
RESERVED
PRSNT2
TRST
+12 V
TMS
TDI
+5 V
INTA
INTC
+5 V
RESERVED
VIO
RESERVED
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
B26
B27
B28
B29
B30
B31
B32
B33
B34
B35
B36
B37
B38
B39
B40
B41
B42
B43
B44
B45
B46
B47
B48
B49
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
RESERVED
GND
CLK
GND
REQ
VIO
AD31
AD29
GND
AD27
AD25
3V3
C/BE3
AD23
GND
AD21
AD19
3V3
AD17
C/BE2
GND
IRDY
3V3
DEVSEL
GND
LOCK
PERR
3V3
SERR
3V3
C/BE1
AD14
GND
AD12
AD10
M66EN
A14
A16
A17
A18
A19
A20
A21
A23
A25
A26
A27
A28
A29
A22
A24
A15
A30
A31
A32
A33
A34
A35
A36
A37
A38
A39
A40
A41
A42
A43
A44
A45
A46
A47
A48
A49
B52
B53
B54
B55
B56
B57
B58
B59
B60
B61
B62
A52
A53
A54
A55
A56
A57
A58
A59
A60
A61
A62
3V3_AUX
RST
VIO
GNT
GND
PME
AD30
3V3
AD28
AD26
GND
AD24
IDSEL
3V3
AD22
AD20
GND
AD18
AD16
3V3
FRAME
GND
TRDY
GND
STOP
3V3
RESERVED
RESERVED
GND
PA R
AD15
3V3
AD13
AD11
GND
AD9
AD8
AD7
3V3
AD5
AD3
GND
AD1
VIO
ACK64
+5V
+5V
C/BE0
3V3
AD6
AD4
GND
AD2
AD0
VIO
REQ64
+5V
+5V
PCIBUS
Fig 3. ISP1562 eval board schematic – PCI edge connector
NXP Semiconductors
Designing a Hi-Speed USB host PCI adapter using ISP1562/63
AN10050
Application note
A
N10050
_
4
Rev. 04 — 1 November 2007
12 of 18
© NXP B.V. 2007. All rights reserved.
D
VAUX
R11
10 kΩ
R12
10 kΩ
10 kΩ
R9
R10
10 kΩ
C39
0.1 μF
C40
0.1 μF
R13
10 kΩ
10 kΩ
R14
560 Ω
R21
PWE1#
PWE1#
OC1#
OC1#
OC2#
OC2#
PWE2#
PWE2#
U3
4
3
2
1
MIC2526
ENB#
FLGB#
FLGA#
ENA#
OUTB
GND
IN
OUTA
FB9
BLM31PG121SN1
FB10
BLM31PG121SN1
+5 V_Standby
C11
0.1 μF
C12
0.1 nF
+
C13
100 μF / 10 V
Optional
J1
1
2
3
+5 V
BUS
C5
47 μF / 10 V
C7
0.1 μF
C6
100 pF
5
6
7
8
R20
560 Ω
LED
D2
C1
0.01 μF
C2
47 μF / 10 V
+
C3
1 nF
+
C4
22 μF / 10 V
C41
0.1 μF
+5 V
BUS
FB8
BLM41PG600SN1
D1
LED
+5V_Standby
A
TT1
TT2
B
+5 V
C42
0.1 μF
C55
220 μF / 10 V
+
C43
1 nF
C
1
4
5
6
2
3
FB4
BLM18PG121SN1
V
BUS
GND
SHIELD
SHIELD
D
D+
CON1
USB1
IP 4220CZ6
1
2
3
4
6
5
ESD1
DM1
DM1
DP1
DP2
R24
15 kΩ
R25
15 kΩ
DP1
C44
0.1 μF
C56
220 μF / 10 V
+
C45
1 nF
FB5
BLM18PG121SN1
V
BUS
GND
SHIELD
SHIELD
D
D+
CON2
USB2
1
4
6
2
3
5
1
2
3
4
5
6
IP 4220CZ6
ESD2
R26
15 kΩ
R27
15 kΩ
DM2
DM2
DP2
Bracket holes
SW1
SOCKET
SW2
SOCKET
+
D
VAUX
Fig 4. ISP1562 eval board schematic – port power control and ESD protection
NXP Semiconductors
AN10050
Designing a Hi-Speed USB host PCI adapter using ISP1562/63
AN10050_4 © NXP B.V. 2007. All rights reserved.
Application note Rev. 04 — 1 November 2007 13 of 18
PCI
PCICONN.SCH
AD[31:0]
PCICLK
IDSEL
C/BE0#
C/BE1#
C/BE2#
C/BE3#
INTA#
REQ#
FRAME#
TRDY#
IRDY#
DEVSEL#
STOP#
PERR#
SERR#
PAR
PME#
PWE3#
PWE4#
DM1
DM2
DP2
ISP1563_ES1
ISP1563_ES1.SCH
POWER_SWITCH
POWER_SWITCH.SCH
RST#
GNT#
AD[31:0]
PCICLK
IDSEL
C/BE0#
C/BE1#
C/BE2#
C/BE3#
INTA#
REQ#
FRAME#
TRDY#
IRDY#
DEVSEL#
STOP#
PERR#
SERR#
PAR
PME#
RST#
GNT#
OC1#
OC2#
OC3#
OC4#
PWE1#
PWE2#
DP1
DM3
DP3
DP4
PWE3#
PWE4#
DM1
DM2
DP2
OC1#
OC2#
OC3#
OC4#
PWE1#
PWE2#
DP1
DM3
DP3
DP4
DM4
DM4
Fig 5. ISP1563 eval board schematic – top-level interfaces
NXP Semiconductors
Designing a Hi-Speed USB host PCI adapter using ISP1562/63
AN10050
Application note
A
N10050
_
4
Rev. 04 — 1 November 2007
14 of 18
© NXP B.V. 2007. All rights reserved.
C17
0.1 μF
C48
C19
+3.3 V
C49
Should be placed
as close as
possible to pin 95
Should be placed
as close as
possible to pin 67
C18
0.1 μF
1 nF
0.1 μF
1 nF
All capacitors should be placed as close as possible
to the corresponding power pins.
+3.3 V
C51
1 nF
C52
1 nF
C53
1 nF
C29
C30
C31
0.1 μF
0.1 μF
0.1 μF
0.1 μF
C32
C33
C34
C35
0.1 μF
0.1 μF
0.1 μF
Should be placed as close as
possible to pin 12
C36
0.1 μF
SCL
SDA
+3.3 V
C27
0.1 μF
1
2
3
4
6
8
5
7
U4A
A1
A3
VCC
NC/WP
SCL
SDA
AT24C01A-2.7
AT24C01A-2.7
A0
A1
A3
VCC
NC/WP
SCL
SDA
U4
1
2
3
4
6
8
7
5
R35
0 Ω
R46
0 Ω
DV
AUX
R25
R26
4.7 kΩ
4.7 kΩ
R34
0 Ω
DV
AUX
R28
51 kΩ
R33
0 Ω
SEL48M
121
122
123
SCL
SDA
SEL48M
C20 C21
C22
C68 C23
C24
0.1 μF
0.1 μF
4.7 μF
4.7 μF
C69
0.1 μF
+
0.1 μF
0.1 μF
+
JP1
HEADER 3
3.3 V
AUX
1
2
3
BLM21PG221SN1
C25
C70
C67
0.1 μF
470pF
47 μF / 6.3 V
D5
LED
R41
330 Ω
+
FB 10
All capacitors should be
placed as close as possible
to the corresponding ferrite
AV
AUX
BLM18PG121SN1
FB6
C26
C50
0.1 μF
1 nF
C71
+
4.7 μF/ 6.3 V
+3.3 V
DV
AUX
AV
AUX
AD0
AD1
AD2
AD4
AD3
AD5
AD6
AD7
AD8
AD9
AD10
AD11
AD12
AD13
AD14
AD15
AD16
AD17
AD18
AD19
AD20
AD21
AD22
AD23
AD24
AD25
AD26
AD27
AD28
AD29
AD30
AD31
AD[0]
AD[1]
AD[2]
AD[3]
AD[4]
AD[5]
AD[6]
AD[7]
AD[8]
AD[9]
AD[10]
AD[11]
AD[12]
AD[13]
AD[14]
AD[15]
AD[16]
AD[17]
AD[18]
AD[19]
AD[20]
AD[21]
AD[22]
AD[23]
AD[24]
AD[25]
AD[26]
AD[27]
AD[28]
AD[29]
AD[30]
AD[31]
AD[31:0]
C/BE0#
C/BE1#
C/BE2#
C/BE3#
C/BE0#
C/BE1#
C/BE2#
C/BE3#
C/BE#[0]
C/BE#[1]
C/BE#[2]
C/BE#[3]
PCICLK
IDSEL
GNT#
AMB1
INTA#
REQ#
FRAME#
TRDY#
IRDY#
DEVSEL#
STOP#
PERR#
SERR#
PAR
PME#
RST#
CLKRUN#
AMB2
AMB3
AMB4
GRN1
GRN2
GRN3
GRN4
OC1_N
OC2_N
OC3_N
OC4_N
PWE1_N
PWE2_N
PWE3_N
PWE4_N
DM1
DM2
DM3
DM4
OC1#
OC2#
OC3#
OC4#
93
91
89
63
DM1
DM2
DM3
DM4
GRN1
GRN2
GRN3
GRN4
AMB1
AMB2
PWE1#
PWE2#
PWE3#
PWE4#
94
92
90
64
97
106
113
115
96
105
112
114
101
108
117
125
DP1
DP2
DP3
DP4
DP1
DP2
DP3
DP4
103
110
119
127
R29
51 kΩ
R30
51 kΩ
R36
0 Ω
R37
0 Ω
OC1#
OC2#
OC3#
OC4#
PWE1#
PWE2#
PWE3#
PWE4#
DM1
DM2
DM3
DM4
DP1
DP2
DP3
DP4
RREF
GNDA
IDSEL
GNT#
INTA#
REQ#
FRAME#
TRDY#
IRDY#
DEVSEL#
STOP#
PERR#
SERR#
PAR
PCICLK
PME#
RST#
IDSEL
GNT#
INTA#
REQ#
FRAME#
TRDY#
IRDY#
DEVSEL#
STOP#
PERR#
SERR#
PAR
PCICLK
PME#
RST#
R42
1 kΩ
72
58
45
33
14
19
18
34
46
47
48
49
51
52
54
55
57
15
17
1
XTAL2
XTAL1
R44
99
98
86
87
12 kΩ / 1 %
FB7
BLM18PG121SN1
C73
22 pF
C72
22 pF
OSC1
12 MHz
R45
33Ω
DV
AUX
OSC2
48MHz
R38
0Ω
C74
2.2 μF / 10 V
0.1 μF
C28
14
8
7
1
IRQ12
IRQ1
IRQ12
IRQ1
A20OUT
KBIRQ1
MUIRQ12
SMI#
A20OUT
KBIRQ1
MUIRQ12
SMI#
3
4
7
8
9
13
SEL2PORTS
5
R27
DV
AUX
R31
R32
R39
R40
JP2
HEADER 4 X 2
1
2
3
4
5
7
6
8
DV
AUX
4.7 kΩ
R43
1kΩ
DV
AUX
DV
AUX
DV
AUX
AV
AUX
AUX1V8
AUX1V8
REG1V8
REG1V8
REG1V8
V
I(VREG3V3)
V
CC(I/O)
V
CC(I/O)
V
CC(I/O)
V
CC(I/O)
V
CC(I/O)
V
I(VAUX3V3)
V
CC(I/O)_AUX
V
CC(I/O)_AUX
V
DDA_AUX
V
DDA_AUX
V
DDA_AUX
V
DDA_AUX
DV
AUX
DV
AUX
DV
AUX
GNDA
GNDA
GNDA
GNDA
GNDA
GNDD
GNDD
GNDD
GNDD
GNDD
GNDD
GNDA
GNDA
GNDA
GNDA
GNDA
GNDA
GNDA
GNDA
GNDD
11
85
28
53
70
26
21
35
50
67
83
12
6
95
104
111
120
128
2
16
76
88
10
27
56
73
84
100
107
116
124
102
109
118
126
29
42
56
82
81
77
75
74
71
69
68
66
80
79
78
65
62
61
60
44
43
41
40
39
38
37
36
32
31
30
25
24
23
22
20
U3
ISP1563
+
GND
A0
GND
51 kΩ
51 kΩ
0 Ω
0 Ω
not to be implemented
FB7 is optional.
Can be directly
tied to ground.
Fig 6. ISP1563 eval board schematic – ISP1563
NXP Semiconductors
Designing a Hi-Speed USB host PCI adapter using ISP1562/63
AN10050
Application note
A
N10050
_
4
Rev. 04 — 1 November 2007
15 of 18
© NXP B.V. 2007. All rights reserved.
INTA#
INTA#
INTA#
3.3 V
AUX
RST#
RST#
RST#
GNT#
GNT#
GNT#
PME#
PME#
PME#
AD30
AD28
AD26
AD24
IDSEL
IDSEL
IDSEL
AD22
AD20
AD18
AD16
FRAME#
FRAME#
TRDY#
TRDY#
TRDY#
STOP#
STOP#
STOP#
PA R
PA R
PA R
AD15
AD13
AD11
AD9
C/BE0#
C/BE0#
C/BE0#
AD6
AD4
AD2
AD0
+5 V
+3.3 V
+
C75
47 μF / 10 V
47 μF / 10 V
C41
+
+
C65
47 μF / 6.3 V
C66
47 μF / 6.3 V
+
C16
0.1 μF
C76
0.1 μF
C77
1 nF
C63
100 pF
C15
0.1 μF
C14
0.1 μF
C47
1 nF
C46
1 nF
GND
PCICLK
PCICLK
PCICLK
REQ#
REQ#
REQ#
AD31
AD29
AD27
AD25
C/BE3#
C/BE3#
C/BE3#
AD23
AD21
AD19
AD17
C/BE2#
C/BE2#
C/BE2#
IRDY#
IRDY#
IRDY#
DEVSEL#
DEVSEL#
DEVSEL#
PERR#
PERR#
PERR#
SERR#
SERR#
SERR#
C/BE1#
C/BE1#
C/BE1#
AD14
AD12
AD10
AD8
AD7
AD5
AD3
AD1
GND
AD[31:0]
B1
B2
B3
B4
B5
B6
B7
B8
B9
B10
B11
CON5
12 V
TCK
GND
TDO
+5 V
+5 V
INTB
INTD
PRSNT 1
RESERVED
PRSNT2
TRST
+12 V
TMS
TDI
+5 V
INTA
INTC
+5 V
RESERVED
VIO
RESERVED
B14
B15
B16
B17
B18
B19
B20
B21
B22
B23
B24
B25
B26
B27
B28
B29
B30
B31
B32
B33
B34
B35
B36
B37
B38
B39
B40
B41
B42
B43
B44
B45
B46
B47
B48
B49
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
RESERVED
GND
CLK
GND
REQ
VIO
AD31
AD29
GND
AD27
AD25
3V3
C/BE3
AD23
GND
AD21
AD19
3V3
AD17
C/BE2
GND
IRDY
3V3
DEVSEL
GND
LOCK
PERR
3V3
SERR
3V3
C/BE1
AD14
GND
AD12
AD10
M66EN
A14
A16
A17
A18
A19
A20
A21
A23
A25
A26
A27
A28
A29
A22
A24
A15
A30
A31
A32
A33
A34
A35
A36
A37
A38
A39
A40
A41
A42
A43
A44
A45
A46
A47
A48
A49
B52
B53
B54
B55
B56
B57
B58
B59
B60
B61
B62
A52
A53
A54
A55
A56
A57
A58
A59
A60
A61
A62
3V3_AUX
RST
VIO
GNT
GND
PME
AD30
3V3
AD28
AD26
GND
AD24
IDSEL
3V3
AD22
AD20
GND
AD18
AD16
3V3
FRAME
GND
TRDY
GND
STOP
3V3
RESERVED
RESERVED
GND
PA R
AD15
3V3
AD13
AD11
GND
AD9
AD8
AD7
3V3
AD5
AD3
GND
AD1
VIO
ACK64
+5V
+5V
C/BE0
3V3
AD6
AD4
GND
AD2
AD0
VIO
REQ64
+5V
+5V
PCIBUS
FRAME#
Fig 7. ISP1563 eval board schematic – PCI edge connector
NXP Semiconductors
Designing a Hi-Speed USB host PCI adapter using ISP1562/63
AN10050
Application note
A
N10050
_
4
Rev. 04 — 1 November 2007
16 of 18
© NXP B.V. 2007. All rights reserved.
D
VAUX
R3
10 kΩ
R4
10 kΩ
10 kΩ
R1
R2
10 kΩ
C1
0.1 μF
C2
0.1 μF
R5
10 kΩ
10 kΩ
R7
560 Ω
R14
PWE1#
PWE1#
OC1#
OC1#
OC2#
OC2#
PWE2#
PWE2#
U3
4
3
2
1
MIC2526
ENB#
FLGB#
FLGA#
ENA#
OUTB
GND
IN
OUTA
FB8
BLM31PG121SN1
FB9
BLM31PG121SN1
+5 V_Standby
C13
0.1 μF
C45
0.1 nF
+
C64
100 μF / 10 V
Optional
J1
1
2
3
+5 V
BUS
C39
47 μF / 10 V
C5
0.1 μF
C6
0.1 μF
5
6
7
8
R13
560 Ω
LED
D2
C37
0.01 μF
C38
47 μF / 10 V
+
C42
1 nF
+
C54
22 μF / 10 V
C3
0.1 μF
+5 V
BUS
FB1
BLM41PG600SN1
D1
LED
+5V_Standby
A
TT1
TT2
B
+5 V
C4
0.1 μF
C55
220 μF / 10 V
+
C43
1 nF
C
1
4
5
6
2
3
FB2
BLM18PG121SN1
V
BUS
GND
SHIELD
SHIELD
D
D+
CON1
USB1
IP 4220CZ6
1
2
3
4
6
5
ESD1
DM1
DM1
DP1
DP2
R17
15 kΩ
R18
15 kΩ
DP1
C7
0.1 μF
C56
220 μF / 10 V
+
C44
1 nF
FB3
BLM18PG121SN1
V
BUS
GND
SHIELD
SHIELD
D
D+
CON2
USB2
1
4
6
2
3
5
1
2
3
4
5
6
IP 4220CZ6
ESD2
R19
15 kΩ
R20
15 kΩ
DM2
DM2
DP2
SW1
SOCKET
SW2
SOCKET
+
D
VAUX
D
VAUX
R6
10 kΩ
R8
10 kΩ
10 kΩ
R9
R10
10 kΩ
C8
0.1 μF
C9
0.1 μF
R12
10 kΩ
10 kΩ
R11
560 Ω
R16
PWE3#
PWE3#
OC3#
OC3#
OC4#
OC4#
PWE4#
PWE4#
U2
4
3
2
1
MIC2526
ENB#
FLGB#
FLGB#
ENA#
OUTB
IN
GND
OUTB
5
7
6
8
R15
560 Ω
LED
D4
C10
0.1 μF
D3
LED
C11
0.1 μF
C57
220 μF / 10 V
+
C61
1 nF
1
4
5
6
2
3
FB4
BLM18PG121SN1
V
BUS
GND
SHIELD
SHIELD
D
D+
CON3
USB3
IP 4220CZ6
1
2
3
4
6
5
ESD3
DM3
DM3
DP3
DP4
R21
15 kΩ
R22
15 kΩ
DP3
C12
0.1 μF
C58
220 μF / 10 V
+
C62
1 nF
FB5
BLM18PG121SN1
V
BUS
GND
SHIELD
SHIELD
D
D+
CON4
USB2
1
4
6
2
3
5
1
2
3
4
5
6
IP 4220CZ6
ESD4
R23
15 kΩ
R24
15 kΩ
DM4
DM4
DP4
D
VAUX
C59
100 pF
+
C40
47 μF / 10 V
C60
100 pF
Bracket holes
Fig 8. ISP1563 eval board schematic – port power control and ESD protection
NXP Semiconductors
AN10050
Designing a Hi-Speed USB host PCI adapter using ISP1562/63
AN10050_4 © NXP B.V. 2007. All rights reserved.
Application note Rev. 04 — 1 November 2007 17 of 18
6. Legal information
6.1 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences
of use of such information.
6.2 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations
or warranties, expressed or implied, as to the accuracy or completeness of
such information and shall have no liability for the consequences of use of
such information.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of a NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is for the customer’s own risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
6.3 Trademarks
Notice: All referenced brands, product names, service names and
trademarks are property of their respective owners.
I
2
C-bus — logo is a trademark of NXP B.V.
NXP Semiconductors
AN10050
Designing a Hi-Speed USB host PCI adapter using ISP1562/63
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in the section 'Legal information'.
© NXP B.V. 2007. All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, email to: salesad[email protected]
Date of release: 1 November 2007
Document identifier: AN10050_4
7. Contents
1. Introduction .........................................................3
2. ISP1562/3 initialization........................................3
3. Description of the application schematics........4
3.1 Distribution of power sources and power
management support .........................................
4
3.2 Input clock: applies only to the ISP1563................5
3.3 Selecting the number of ports: applies only to the
ISP1563 .............................................................
5
3.4 Subsystem vendor ID and subsystem device ID...5
3.5 Legacy support: applies only to the ISP1563 ........6
3.6 Overcurrent protection...........................................6
4. PCB design recommendations ..........................7
5. Schematics ..........................................................8
6. Legal information..............................................17
6.1 Definitions............................................................17
6.2 Disclaimers..........................................................17
6.3 Trademarks.........................................................17
7. Contents.............................................................18
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NXP Semiconductors ISP1563 User manual

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