NXP i.MX 8M User guide

Type
User guide
i.MX 8M Nano to i.MX 8M Nano UltraLite
Design Compatibility User's Guide
Hardware Product Design Focus
NXP Semiconductors Document identifier: IMX8MNULDCUG
User Guide Rev. 0, 13 July 2021
Contents
Chapter 1 Introduction........................................................................................... 3
Chapter 2 Feature comparison.............................................................................. 4
Chapter 3 Key considerations for hardware design............................................... 6
3.1 MIPI DSI interface..................................................................................................................... 6
3.2 Power supplies.......................................................................................................................... 6
3.3 PMIC..........................................................................................................................................9
3.4 DDR Interface..........................................................................................................................10
Chapter 4 Package and ball map.........................................................................11
Chapter 5 References..........................................................................................12
Chapter 6 Revision history...................................................................................13
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User Guide 2 / 14
Chapter 1
Introduction
The i.MX 8M Nano UltraLite processor was designed to be a subset of the i.MX 8M Nano and the two parts share the same product
data sheet. This guide provides an overview of how to design a product using the i.MX 8M Nano when the final product utilizes
the i.MX 8M Nano UltraLite.
This guide focuses on the hardware features and requirements to ensure a smooth transition between the two
application processors.
This can also be expanded to product families that extend new customer features by upgrading from the i.MX 8M Nano UltraLite
SoC to the i.MX 8M Nano SoC.
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Chapter 2
Feature comparison
Table 1 provides a quick feature comparison of the i.MX 8M Nano and i.MX 8M Nano UltraLite. This is intended as a quick
introduction to the devices. For description, see
i.MX 8M Nano Applications Processor Datasheet for Consumer Products
(document IMX8MNCEC).
Table 1. Quick feature comparison
Feature i.MX 8M Nano i.MX 8M Nano UltraLite
Main CPU 4x A53 @ 1.5 GHz 4x A53 @ 1.4 GHz
Microcontroller M7 M7
DDR 16x / 8x
LPDDR4-3200
DDR4-2400
DDR3L-1600
16x / 8x
LPDDR4-3200
DDR4-2400
DDR3L-1600
Memory 8-bit NAND Interface
(3x) eMMC 5.1
(3x) SPI NOR
FlexSPI with XIP
8-bit NAND Interface
(3x) eMMC 5.1
(3x) SPI NOR
FlexSPI with XIP
GPU GC7000UL None
VPU None None
Display LCDIF Display Controller
4 Lane MIPI DSI
None
Camera 4 Lane MIPI CSI 4 Lane MIPI CSI
Synchronous Audio Interface (SAI)
modules
5x SAI Modules
---
(SAI2) 2 TX and 2 RX
(SAI3) 2 TX and 2 RX
(SAI5) 4 TX and 4 RX
(SAI6) 1 TX and 1 RX
(SAI7) 1 TX and 1 RX
5x SAI Modules
---
(SAI2) 2 TX and 2 RX
(SAI3) 2 TX and 2 RX
(SAI5) 4 TX and 4 RX
(SAI6) 1 TX and 1 RX
(SAI7) 1 TX and 1 RX
Audio (additional) S/PDIF
8-Channel Pulse Density Modulation
(PDM) input
ASRC
768 kHz sampling
S/PDIF
8-Channel Pulse Density Modulation
(PDM) input
ASRC
768 kHz sampling
Table continues on the next page...
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Table 1. Quick feature comparison (continued)
Feature i.MX 8M Nano i.MX 8M Nano UltraLite
Connectivity ---
(1x) USB 2.0
(3x) uSDHC
(1x) Gigabit Ethernet
(4x) UART
(4x) I2C
(3x) ECSPI
---
(1x) USB 2.0
(3x) uSDHC
(1x) Gigabit Ethernet
(4x) UART
(4x) I2C
(3x) ECSPI
Package 14 x 14 mm
486-pin BGA, 0.5 mm pitch
11 x 11 mm
306-pin BGA, 0.5 mm pitch
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Feature comparison
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Chapter 3
Key considerations for hardware design
The quick feature comparison as in Table 1 provides a quick insight into the functional blocks that changed between the two
devices. These sections focus on key considerations between the i.MX 8M Nano and i.MX 8M Nano UltraLite that affects the
hardware design:
MIPI DSI Interface
Power supplies
• Pinout
These sections also provide an in-depth discussion of how to manage the hardware differences between the i.MX 8M Nano and
i.MX 8M Nano UltraLite devices.
3.1 MIPI DSI interface
i.MX 8M Nano supports a 4-lanes MIPI-DSI interface. The MIPI-DSI interface has been de-featured from i.MX 8M Nano UltraLite,
and there is no related pin for the MIPI-DSI interface. Meanwhile, the VPU module was removed from i.MX8M Nano Ultralite.
Customer use-cases that require display and video support should instead use i.MX 8M Nano or other i.MX 8M family devices
such as the i.MX 8M Plus. i.MX8M Nano UltraLite is better suited for use-cases that do not require displays.
3.2 Power supplies
The power domains for each IOs are the same between i.MX 8M Nano and i.MX 8M Nano UltraLite.
Several power rails in i.MX 8M Nano were combined in the i.MX 8M Nano UltraLite.
The i.MX 8M Nano Ultra Lite has a few different power supply requirements from the i.MX 8M Nano. These changes are from
two factors:
Removal of modules
Combination of power rails
Even with the power supply changes, the two devices are both design and functionally compatible.
3.2.1 Power rails combination
Table 2 provides the power pins changes between the i.MX 8M Nano and i.MX 8M Nano UltraLite.
Table 2. Power rails combination
Module Name i.MX 8M Nano Power Rails i.MX 8M Nano UltraLite Power Rails
Cortex® A53 VDD_ARM VDD_SOC
Cortex M7 VDD_SOC
DRAM VDD_DRAM
DRAM PLL VDD_DRAM_PLL_0P8
Analog PLL VDD_ANA_0P8
Arm® PLL VDD_ARM_PLL_0P8
MIPI PHY 0.8 V VDD_MIPI_0P8
USB PHY 0.8 V VDD_USB_0P8
Table continues on the next page...
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Table 2. Power rails combination (continued)
Module Name i.MX 8M Nano Power Rails i.MX 8M Nano UltraLite Power Rails
GPU VDD_GPU N/A
SNVS core Logic VDD_SNVS_0P8 VDD_SNVS_0P8
GPIO pre-driver for SNVS NVCC_SNVS_1P8 NVCC_SNVS_1P8
DRAM IO NVCC_DRAM NVCC_DRAM
Analog 1.8 V DRAM power VDD_DRAM_PLL_1P8 VDD_DRAM_PLL_1P8
MIPI PHY 1.2 V VDD_MIPI_1P2 VDD_MIPI_1P2
USB PHY 3.3 V VDD_USB_3P3 VDD_USB_3P3
Power supply for I2CNVCC_I2C NVCC_I2C_UART
Power supply for UART NVCC_UART
Power supply for SAI3 NVCC_SAI3 NVCC_SAI3_SAI5
Power supply for SAI5 NVCC_SAI5
Power supply for SD1 NVCC_SD1 NVCC_SD1_NAND
Power supply for NAND NVCC_NAND
Power supply for ENET NVCC_ENET NVCC_ENET_GPIO_SAI2
Power supply for GPIO NVCC_GPIO1
Power supply for SAI2 NVCC_SAI2
Power supply for CLK NVCC_CLK NVCC_CLK_JTAG_PVCC_1P8
Power supply for JTAG NVCC_JTAG
Power supply for GPIO Pre-Driver PVCC0_1P8
PVCC1_1P8
PVCC2_1P8
Power supply for SD2 NVCC_SD2 NVCC_SD2
Power supply for ECSPI NVCC_ECSPI NVCC_ECSPI
XTAL 1.8 V Power VDD_24M_XTAL_1P8 VDD_ANA1_XTAL_MIPI_USB_1P8
Analog-1 1.8 V power VDD_ANA1_1P8
MIPI PHY 1.8 V VDD_MIPI_1P8
USB PHY 1.8 V VDD_USB_1P8
Analog-0 1.8 V power VDD_ANA0_1P8 VDD_ANA0_ARM_PLL_1P8
Arm PLL 1.8 V Power VDD_ARM_PLL_1P8
i.MX8M Nano Arm core frequency can be maximum 1.5 GHz for Commercial part and 1.4 GHz for Industrial part.
NOTE
i.MX8M Nano UltraLite Arm core frequency can be a maximum 1.4 GHz for both Commercial and Industrial Parts.
NOTE
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3.2.2 Estimated power supply maximum current
Power consumption is highly dependent on the application.
The estimated power supply maximum current is changed because of module removal and power rails combination. See Table
3 and Table 4 for the maximum supply currents for i.MX8M Nano and i.MX8M Nano UltraLite respectively.
Table 3. Maximum supply currents for i.MX 8M Nano
Power rail Max current Unit
VDD_ARM 2200 mA
VDD_SOC 1000 mA
VDD_GPU 800 mA
VDD_DRAM 800 mA
VDD_ANA_0P8 50 mA
VDD_ANA0_1P8
VDD_ANA1_1P8
250 mA
NVCC_SNVS_1P8 3 mA
NVCC_<XXX> Imax = N x C x V x (0.5 x F) Where:
N - Number of IO pins supplied by the power line C—Equivalent external
capacitive load
V - IO voltage
(0.5 x F) - Data change rate. Up to 0.5 of the clock rate (F).
In this equation, Imax is in Amps, C in Farads, V in Volts, and F in Hertz.
NVCC_DRAM
DRAM_VFEF 10 mA
Electrical characteristics:
Table 4. Maximum supply currents for i.MX 8M Nano UltraLite
Power rail Max current Unit
VDD_SOC 3000 mA
NVCC_SNVS_1P8 3 mA
VDD_ANA1_XTAL_MIPI_USB_1P8, VDD_ANA0_ARM_PLL_1P8, and
VDD_DRAM_PLL_1P8
250 mA
VDD_MIPI_1P2 100 mA
NVCC_<XXX> Imax = N x C x V x (0.5 x F) Where:
N - Number of IO pins supplied by the power line
C - Equivalent external capacitive load
V - IO voltage
(0.5 x F)—Data change rate. Up to 0.5 of the clock
rate (F).
NVCC_DRAM
Table continues on the next page...
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Table 4. Maximum supply currents for i.MX 8M Nano UltraLite (continued)
Power rail Max current Unit
In this equation, Imax is in Amps, C in Farads, V in
Volts, and F in Hertz.
DRAM_VFEF 10 mA
3.2.3 Power sequence
The power sequence and power supplies states are minor changes on i.MX 8M Nano UltraLite because of the power rails
combination. For detail, see
i.MX 8M Nano Applications Processor Datasheet for Consumer Products
(document IMX8MNCEC).
3.3 PMIC
The NXP PMIC PCA9450B is used to support both i.MX 8M Nano and i.MX 8M Nano UltraLite. Table 5 provides the power rails
connections for each processor.
Table 5. Power rails connections
PMIC Regulators Voltage i.MX 8M Nano i.MX 8M Nano UltraLite
BUCK1 0.85/0.95V VDD_SOC
VDD_DRAM
VDD_GPU
VDD_DRAM_PLL_0P8
VDD_ARM_PLL_0P8
VDD_ANA_0P8
VDD_USB_0P8
VDD_MIPI_0P8
VDD_SOC
BUCK2 0.85/0.95V VDD_ARM No-Use
BUCK4 3.3 V VDD_3V3
NVCC_3V3
VDD_3V3
NVCC_3V3
BUCK5 1.8 V NVCC_1V8
PVCCx_1V8
NVCC_1V8
PVCCx_1V8
BUCK6 1.35 V for DDR3L
1.2 V for DDR4
1.1 V for LPDDR4
NVCC_DRAM NVCC_DRAM
BUCK3 N/A No-Use No-Use
LDO1 1.8 V NVCC_SNVS_1V8 NVCC_SNVS_1V8
LDO2 0.8 V VDD_SNVS_0V8 VDD_SNVS_0V8
LDO3 1.8 V VDD_xxx_1V8 VDD_xxx_1V8
Table continues on the next page...
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Table 5. Power rails connections (continued)
PMIC Regulators Voltage i.MX 8M Nano i.MX 8M Nano UltraLite
LDO4 1.2 V VDD_PHY_1V2 VDD_PHY_1V2
LDO5 3.3 V / 1.8 V NVCC_SD2 NVCC_SD2
LoadSW 3.3 V No-Use No-Use
i.MX8M Nano supports the Arm Cortex-A53 core running at 1.5 GHz when VDD_ARM is set at 1.0 V.
NOTE
i.MX8M Nano Ultralite limits the Arm Cortex-A53 running at 1.4 GHz.
NOTE
3.4 DDR Interface
i.MX 8M Nano and i.MX 8M Nano UltraLite can support 3 types of DDR memory interfaces: LPDDR4, DDR4, and DDR3L.
5 DRAM pins have been removed on i.MX 8M Nano UltraLite comparing with i.MX 8M Nano, see Table 6:
Table 6. Impact for i.MX 8M Nano UltraLite
Pins LPDDR4 DDR4 DDR3L Impact for i.MX 8M Nano UltraLite
DRAM_AC19 MTEST MTEST MTEST No Impact
DRAM_AC22 CS1_B - - No impact. It is for channel B. Even for the 14 x14 part,
the pin is not used.
DRAM_AC27 - PARITY - No impact
DRAM_AC37 - ODT1 ODT1 No impact
DRAM_AC38 - CS1_n CS1# No impact for using LPDDR4.
For DDR4 and DDR3L, the maximum memory size will be
reduced by half.
For the EVK design, the maximum supported 16-bit DDR
memory available in the market at the time of publication is
being used, so the pin is not used.
NXP Semiconductors
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Chapter 4
Package and ball map
i.MX 8M Nano is 14 x 14 mm package, which 0.5 mm pitch with 486 pads.
i.MX 8M Nano UltraLite is 11 x 11 mm package, which 0.5 mm pitch with 306 pads.
See the detailed package and ball map information in
i.MX 8M Nano Applications Processor Datasheet for Consumer Products
(document IMX8MNCEC).
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Chapter 5
References
The following reference documents are available on www.nxp.com:
i.MX 8M Nano Applications Processor Datasheet for Consumer Products
(document IMX8MNCEC)
i.MX 8M Nano Hardware Developer’s Guide
(document IMX8MNHDG)
i.MX 8M Nano EVK schematics and layout files (8MNANOLPD4-EVK-DESIGNFILES.zip)
i.MX 8M Nano UltraLite EVK schematics and layout files (8MNANOD3L-EVK-DESIGNFILES.zip)
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Chapter 6
Revision history
Table 7 summarizes the changes done to this document since the initial release.
Table 7. Revision history
Revision number Date Substantive changes
0 13 July 2021 Initial release
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User Guide 13 / 14
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Date of release: 13 July 2021
Document identifier: IMX8MNULDCUG
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NXP i.MX 8M User guide

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