ii
Table of Contents
MSC8101 Features............................................................................................................................................. iii
Target Applications ............................................................................................................................................ iv
Product Documentation...................................................................................................................................... iv
Chapter 1 Signal/ Connection Descriptions
1.1 Signal Groupings..............................................................................................................................................1-1
1.2 Power Signals................................................................................................................................................... 1-4
1.3 Clock Signals ................................................................................................................................................... 1-5
1.4 Reset, Configuration, and EOnCE Event Signals............................................................................................ 1-6
1.5 System Bus, HDI16, and Interrupt Signals...................................................................................................... 1-8
1.6 Memory Controller Signals............................................................................................................................ 1-16
1.7 Communications Processor Module (CPM) Ports......................................................................................... 1-18
1.8 JTAG Test Access Port Signals...................................................................................................................... 1-45
1.9 Reserved Signals............................................................................................................................................1-46
Chapter 2 Specifications
2.1 Introduction...................................................................................................................................................... 2-1
2.2 Absolute Maximum Ratings ............................................................................................................................2-1
2.3 Recommended Operating Conditions .............................................................................................................. 2-2
2.4 Thermal Characteristics ...................................................................................................................................2-2
2.5 DC Electrical Characteristics...........................................................................................................................2-3
2.6 Clock Configuration......................................................................................................................................... 2-4
2.7 AC Timings...................................................................................................................................................... 2-7
Chapter 3 Packaging
3.1 Pin-Out and Package Information....................................................................................................................3-1
3.2 FC-PBGA Package Description.......................................................................................................................3-1
3.3 FC-PBGA Package Mechanical Drawing...................................................................................................... 3-32
Chapter 4 Design Considerations
4.1 Thermal Design Considerations.......................................................................................................................4-1
4.2 Electrical Design Considerations..................................................................................................................... 4-2
4.3 Power Considerations.......................................................................................................................................4-2
4.4 Layout Practices............................................................................................................................................... 4-4
Index
Ordering Information, Disclaimer, and Contact Information..................................................................Back Cover
Data Sheet Conventions
OVERBAR Used to indicate a signal that is active when pulled low (For example, the RESET pin is active when
low.)
“asserted” Means that a high true (active high) signal is high or that a low true (active low) signal is low
“deasserted” Means that a high true (active high) signal is low or that a low true (active low) signal is high
Examples: Signal/Symbol Logic State Signal State Voltage
PIN
True Asserted V
IL
/V
OL
PIN False Deasserted V
IH
/V
OH
PIN True Asserted V
IH
/V
OH
PIN False Deasserted V
IL
/V
OL
Note: Values for V
IL
, V
OL
, V
IH
, and V
OH
are defined by individual product specifications.