Evaluation Board Manual
R15UZ0005EU0100 Rev.1.00 Page 1
Jun 27, 2022 © 2022 Renesas Electronics
The US159-DA16200MEVZ ultra-low power Wi-Fi
Pmod module enables you to add Wi-Fi capability to
any evaluation kit or MCU board equipped with a
Pmod expansion capability. The board provides a
standard Pmod Type 3A (expanded UART)
connection for the onboard Wi-Fi module.
The US159-DA16200MEVZ features a Type 3A
Pmod connector and incorporates the DA16200MOD
Module, which is based on the DA16200 SoC. With a
standard connector and software support, the
US159-DA16200MEVZ is ideal for the Renesas
Quick-Connect IoT to rapidly create an IoT system.
Kit Contents
▪ US159-DA16200MEVZ Pmod Board
Features
▪ DA16200MOD module
• Integrated chip antenna
• Cortex-M4F+ at 30MHz to 160MHz
• 802.11b/g/n radio PHY, 2.4GHz
• SoC runs full OS and TCP/IP stack
• Memory: 256kB ROM, 512kB RAM, 8kB OTP,
48B retention memory and 32Mb SPI Flash
• RF regulatory certifications: FCC, IC, CE, KC,
TELEC, SRRC
• Wi-Fi Alliance certifications:
Wi-Fi CERTIFIED b/g/n,
WPA, WPA2, and WPA3
• 3.3V supply voltage
• +20dBm range booster mode
• -100dBm Rx sensitivity
• Ultra-low power with 3 sleep modes:
(1) unconnected (nA), (2) connected ultra-low
(µA), and (3) connected ultra-fast (µA)
▪ Standardized Type 3A Pmod connector supports
an expanded UART interface
▪ Optional battery operation with onboard CR1220
coin cell
▪ LED (D1) to aid in user software debug
▪ 10-pin 1.27mm pitch Arm Cortex-Debug connector
(J2) for software development and debug support
Figure 1. US159-DA16200MEVZ Pmod Board (XE Evaluation Board)
US159-DA16200MEVZ
DA16200 Pmod™ Board
R15UZ0005EU0100 Rev.1.00 Page 2
Jun 27, 2022
US159-DA16200MEVZ Evaluation Board Manual
Contents
1. Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2. Setup . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.1 Required or Recommended User Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.2 Software Installation and Usage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
2.3 Kit Hardware Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3. Alternate Hardware Configurations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4. Schematic Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
5. Bill of Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
5.1 Board Layout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
6. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
7. Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
R15UZ0005EU0100 Rev.1.00 Page 3
Jun 27, 2022
US159-DA16200MEVZ Evaluation Board Manual
1. Functional Description
The US159-DA16200MEVZ functions as a Wi-Fi wireless building block to create a custom IoT system solution.
This module adds Wi-Fi 802.11b/g/n 2.4GHz connectivity capability to any IoT system that supports Pmod
expansion modules. Visit the Renesas website for more details on the DA16200 Wi-Fi SoC Module.
2. Setup
2.1 Required or Recommended User Equipment
The following additional lab equipment is recommended for using the board (and is sold separately):
▪ Any MCU board that supports Type 3A Pmod.
2.2 Software Installation and Usage
For the latest version of the e2 studio, use the Renesas website, and for the latest connectivity support and details
on creating customized IoT system solutions, visit the Quick-Connect IoT site.
The Renesas Flexible Software Package (FSP) is an enhanced software package that provides easy-to-use,
scalable, high-quality software for embedded system designs using the Renesas RA family of Arm
Microcontrollers. With the support of a new Arm TrustZone and other advanced security features, FSP provides a
quick and versatile way to build secure, connected IoT devices using production-ready drivers, Azure RTOS,
FreeRTOS, and other middleware stacks.
The firmware for operating the module with a Renesas EK-RA6M4 evaluation kit is pre-loaded on the
US159-DA16200MEVZ Pmod module.
For more details on the application, see the guide, Wi-Fi Enabled Cloud IoT Solution Kit Quick Start Guide.
2.3 Kit Hardware Connections
Follow these procedures to set up the kit as shown on Figure 2.
1. Ensure the MCU evaluation kit being used has a Pmod connector set to Type 3A. (For help, refer to the kit
hardware manual.)
2. Plug in the US159-DA16200MEVZ to the Pmod connector on the MCU evaluation kit, and be careful to align
Pin 1 on the module to Pin 1 on the MCU kit.
3. The US159-DA16200MEVZ is now ready to be used in the system. Follow the MCU kit instructions for
connecting and powering up the evaluation kit.
Firmware
DA16200_v3.2.2.1 Standard DA16200 SDK
R15UZ0005EU0100 Rev.1.00 Page 4
Jun 27, 2022
US159-DA16200MEVZ Evaluation Board Manual
Figure 2. Evaluation Kit Details
D1 – LED to aid in user software debug J6 – Install jumper to initiate factory reset J3 – Arm Cortex-Debug connector
J1 – Pmod Connector to MCU Board
BT1 – Remove R17 before installing the
CR1220 coin cell, and be careful to observe
polarity (+ on cell facing upwards)
SW1 – Momentary pushbutton switch to initiate WPS
R17 – Be sure to remove before
installing the coin cell
R15UZ0005EU0100 Rev.1.00 Page 5
Jun 27, 2022
US159-DA16200MEVZ Evaluation Board Manual
3. Alternate Hardware Configurations
Referring to the schematic in the following section, there are a number of Do Not Fit (DNF) components that allow
for alternate hardware configurations as detailed in Ta ble 1:
Table 1. Alternate Hardware Configurations
DA16200MOD Pin Default Function Alt Function Alt Signal Name Read Modifications for Alt
Function
GPIOA0 GPIO UART1 TXD UART1_TXD Install R8 & R9 and remove
R11 & R12
GPIOA1 GPIO UART1 RXD UART1_RXD
GPIOA2 GPIO - - -
GPIOA3 NC - - -
GPIOA4/UART1_TXD UART1_TXD UART1 RTS CTS_HOST_GPIOA4 Install R2, R6, R8, R9, R10 &
R13 and remove R3, R5, R11
& R12
GPIOA5/UART1_RXD UART1_RXD UART1 CTS RTS_HOST_GPIOA5
GPIOA6/WPS WPS - - -
GPIOA7 Factory Reset - - -
GPIOA8 GPIO - - -
GPIOA9 GPIO - - -
GPIOA10 NC - - -
GPIOA11 GPIO INTn - -
JTAG_TCLK SWCLK_TCLK JTAG TCLK -
JTAG_TMS SWDIO_TMS JTAG TMS -
UART0_TXD UART0_TXD - - -
UART0_RXD UART0_RXD - - -
GPIOC6/nTRST GPIO JTAG nTRST -
GPIOC7/TDO GPIO JTAG TDO -
GPIOC8/TDI GPIO JTAG TDI -
R15UZ0005EU0100 Rev.1.00 Page 6
Jun 27, 2022
US159-DA16200MEVZ Evaluation Board Manual
4. Schematic Diagram
Figure 3. US159-DA16200MEVZ Application Schematic Diagram
1
1
2
2
3
3
4
4
5
5
6
6
D D
C C
B B
A A
1
4117 Emperor Blvd
Suite 100
Durham
NC 27703
1
DA16200 PMOD B
6/22/2022
Low Power WiFi PMOD RevB.SchDoc
Title
Size: Number:
Date:
File:
Revision:
Sheet of
B
Low Power WiFi PMOD
GND
PMOD Interface Type 3A (expanded UART)
TXD_HOST
RXD_HOST
R1
4K7
25V
C3
0.1uF
25V
C1
0.1uF
GND
GND
10V
C2
10uF
D1
LED, Red
R14
649R
22
44
66
88
10 10
1
1
3
3
5
5
9
9
J3
FTSH-105-01-L-DV-K-TR
GND
SWCLK_TCLK
SWDIO_TMS
1
2
3
4
5
6
7
8
9
10
11
12
J1
CON-2X6RA
25V
C4
0.1uF
GND
BT1
S8411-45R, CR1220 Coin Cell
R17
0R
VCC
VCC
VCC
R7
0R VCC
GND
VCC
3P3
FD1
FID, 1R27
FD2
FID, 1R27
FD3
FID, 1R27
i Net Class
Power
i
Net Class
Power
B1
Bumper
SWCLK_TCLK
SWDIO_TMS
RTC_PWR_KEY
3
RTC _ WAKE_UP
4
RTC _ WAKE_UP2
14
RTC _ SENSOR
5
UART0_RXD
13
UART0_TXD
12
F_CLK
21
F_CSN
16
F_IO0
19
F_IO1
17
F_IO2
18
F_IO3
20
JTAG_TCLK
8
JTAG_TMS
7
VBAT_3V3 35
VDD_DIO1 34
VDD_DIO2 15
GPIOA0 33
GPIOA1 32
GPIOA2 31
GPIOA3 30
GPIOA4/UART1_TXD 29
GPIOA5/UART1_RXD 28
GPIOA6/WPS 27
GPIOA7 26
GPIOA8 25
GPIOA9 24
GPIOA10 23
GPIOA11 22
GPIOC6/nTRST 11
GPIOC7/TDO 10
GPIOC8/TDI 9
NC
1
NC
6
NC
36
NC
37
ANT_GND
ANT_GND
GND
2
GND
GND
U1 DA16200MOD
TDO
TDI
TDO
TDI
nTRST
nTRST
GPIOA10
GPIOA11
GPIOA2
RTS_HOST_GPIOA5
TXD_HOST
RXD_HOST
CTS_HOST_GPIOA4
UART0_RXD
UART0_TXD
R8 0R
R9 0R
R11 0R
R10 0R
RXD_HOST
R12 0R
R13 0R
TXD_HOST
SW1
SW, Momentary
CTS_HOST_GPIOA4
RTS_HOST_GPIOA5
R3 0R
R5 0R
R2 0R
R6 0R
GPIOA0
GPIOA1
GPIOA2
GPIOA3
GPIOA0
GPIOA1
INTn
RESETn
1
2
3
4
J2
HDR-1X4V
GND
VCC
GND
R18
4K7
VCC
R4 4K7
GND
RTC_PWR_KEY
RTC _ WAKE_UP
RTC_PWR_KEY
R19
0R
10V
C5
0.47uF
VCC
WPSFACTORY RESET
i Net Class
Power
R20
10K0
R15
4K7
R16
4K7
VCC
RTC _ WAKE_UP
12
J6
JP, 1X2, 0.05"
RESETnINTn42
U2A
SN74LVC1G06DCKT
GND 3
VCC
5
U2B
SN74LVC1G06DCKT
GND
VCC
GPIOA11
R21
4K7
GND
R15UZ0005EU0100 Rev.1.00 Page 7
Jun 27, 2022
US159-DA16200MEVZ Evaluation Board Manual
5. Bill of Materials
Qty Reference
Designator Description Manufacturer Manufacturer Part Number
1 B1 Bumper, Cylindrical, 0.375" D, 0.19" HSM Bumper Specialities BS35CL01X02RP
1BT1
Battery Holder, 12mm Coin Cell, CR1220, SM,
RoHS Harwin S8411-45R
3 C1, C3, C4 Capacitor, 0.1µF, 25V, SM 0402, Multilayer
Ceramic, X7R, RoHS Taiyo Yuden TMK105B7104KVHF
1C2
Capacitor, 10µF, 10V, SM 0603, Multilayer
Ceramic, X5R, RoHS
Samsung Electro-
Mechanics CL05A106MP5NUNC
1C5
Capacitor, 0.47uF, 10V, SM 0402, Multilayer
Ceramic, X7R, RoHS Kemet C0402C474K8RACTU
1 D1 LED, Red, Clear, 0805, SM, RoHS Wurth Elektronik 150080RS75000
1J1
Connector, 2×6, 0.1", Pmod, Right Angle,
Unshrouded, RoHS Harwin M20-9950645
1 J2 4 Pin, 0.1", Single Row, Vertical, Header, RoHS Sullins PBC04SAAN
1J3
Connector, 2×5 Header, Vertical, 1.27mm Pitch,
Pin 7, SM, RoHS Samtec FTSH-105-01-L-DV-007-K
1J6
1X2 Pin, 0.05", Single Row, Vertical, Header,
RoHS Sullins GRPB021VWVN-RC
6R1, R4, R15,
R16, R18, R21
Resistor, 4.7kΩ, 1/10W, 1%, 100ppm, SM,
50WV, 100OV, Thick Film, 0402, RoHS KOA Speer RK73H1ETTP4701F
7
R3, R5, R7,
R11, R12, R17,
R19
Resistor, 0Ω, 1/10W, 1%, 100ppm, SM,
50WV, 100OV, Thick Film, 0402, RoHS KOA Speer RK73Z1ETTP
1R14
Resistor, 649Ω, 1/10W, 1%, 100ppm, SM,
50WV, 100OV, Thick Film, 0402, RoHS KOA Speer RK73H1ETTP6490F
1R20
Resistor, 10kΩ, 1/10W, 1%, 100ppm, SM,
50WV, 100OV, Thick Film, 0402, RoHS KOA Speer RK73H1ETTP1002F
1 SW1 Switch, Pushbutton, Top Actuated, SM, RoHS C&K Components PTS810 SJG 250 SMTR LFS
1U1
DA16200MOD, WiFi, 802.11b/g/n, Transceiver,
256kB ROM, 512kB RAM, 8 kB OTP, 48 kB NV
Memory, 37-SMD Module, SM, RoHS
Dialog
Semiconductor DA16200MOD-AAC4WA32
1U2
IC, Digital, Buffer, Inverting, Open Drain, SM,
SC-70-5, RoHS Diodes Inc. 74LVC1G06SE-7
R15UZ0005EU0100 Rev.1.00 Page 8
Jun 27, 2022
US159-DA16200MEVZ Evaluation Board Manual
5.1 Board Layout
Figure 4. Silkscreen Top
Figure 5. Copper Top
Figure 6. Copper L1 Layer
R15UZ0005EU0100 Rev.1.00 Page 9
Jun 27, 2022
US159-DA16200MEVZ Evaluation Board Manual
Figure 7. Copper L2 Layer
Figure 8. Copper Bottom
Figure 9. Silkscreen Bottom
R15UZ0005EU0100 Rev.1.00 Page 10
Jun 27, 2022
US159-DA16200MEVZ Evaluation Board Manual
6. Ordering Information
7. Revision History
Part Number Description
US159-DA16200MEVZ DA16200 Pmod Board
Revision Date Description
1.00 Jun 27, 2022 Initial release
Corporate Headquarters
TOYOSU FORESIA, 3-2-24 Toyosu,
Koto-ku, Tokyo 135-0061, Japan
www.renesas.com
Contact Information
For further information on a product, technology, the most
up-to-date version of a document, or your nearest sales
office, please visit:
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Trademarks
Renesas and the Renesas logo are trademarks of Renesas
Electronics Corporation. All trademarks and registered
trademarks are the property of their respective owners.
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(Rev.1.0 Mar 2020)
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