PROCESSOR
Processor Support
• Intel®Core™i7andIntel®Core™i5processorsandother
Intel®processorsintheLGA1155package.
• SupportsIntel®64architecture
4
CHIPSET
Intel® Q77 Express Chipset
• Intel®Q77PlatformControllerHub(PCH)
PERIPHERAL CONNECTIVITY
• 4SATAports(2SATA6.0Gb/s;2SATA3.0Gb/s)
• DualIntegrated10/100/1000NetworkConnection
• 4Super-SpeedUSB3.0ports(4backpanelports)
• 5Hi-SpeedUSB2.0ports(5internalheaders)
SYSTEM BIOS
• 96MbFlashEEPROMwithIntel®PlatformInnovation
FrameworkforEFIPlugandPlay
• AdvancedcongurationandpowerinterfaceV3.0b,
SMBIOS2.5
• Intel®ExpressBIOSupdatesupport
SYSTEM MEMORY
Memory Capacity
• Two240-pinDIMMconnectorssupportinguptotwo
double-sidedDIMMs(16GB
5
max)
Memory Types
• DDR31600
6
/1333SDRAMmemorysupport
• Non-ECCMemory
Memory Modes
• Dual-orsingle-channeloperationsupport
Memory Voltage
• 1.2Vto1.8V
HARDWARE MANAGEMENT FEATURES
• Processorfanspeedcontrol
• Systemchassisfanspeedcontrol
• Voltageandtemperaturesensing
• Fansensorinputsusedtomonitorfanactivity
• ACPI-compliantpowermanagementcontrol
INTEL® PRO 10/100/1000 NETWORK CONNECTION
• Low-powerdesign
EXPANSION CAPABILITIES
• OnePCIExpress*3.0x16graphicsconnector
• OnePCIExpress*Mini(FullLength)–supportsmSATA
• OnePCIExpress*Mini(HalfLength)
HEADERS
• Oneserialportheader
• S/PDIFaudioheader
AUDIO
• Four-channelIntel®HighDenitionAudio
3
codec
JUMPERS AND FRONT-PANEL CONNECTORS
Jumpers
• Singlecongurationjumperdesign
• JumperaccessforBIOSmaintenancemode
Front-Panel Connectors
• Reset,HDDLED,powerLEDs,poweron/off
• Front-panelHi-SpeedUSB2.0headers
• Front-panelaudioheader
MECHANICAL
Board Style
• ThinMini-ITX
Board Size
• 6.7”×6.7”(17cm×17cm)
Baseboard Power Requirements
• ThinMini-ITX19V
ENVIRONMENT
Operating Temperature
• 0°Cto+55°C
Storage Temperature
• -20°Cto+70°C
REGULATIONS AND SAFETY STANDARDS
United States and Canada
CSA/UL60950-1,FirstEdition(BinationalStandard)
Europe
(LowVoltageDirective2006/95/EC)
EN60950-1
International
IEC60950-1
EMC REGULATIONS (tested in representative chassis)
United States
FCC47CFRPart15,SubpartB
Canada
ICES-003ClassB
Europe
(EMCDirective2004/108/EC)
EN55022andEN55024
Australia / New Zealand
EN55022ClassB
Japan
VCCIV-3,V-4ClassB
South Korea
KN-22andKN-24
Taiwan
CNS13438ClassB
International
CISPR22ClassB
ENVIRONMENTAL COMPLIANCE EUROPE
Europe
EuropeRoHS(Directive2002/95/EC)
China
ChinaRoHS(MIIOrder#39)
1 Intel®TurboBoostTechnology–maximumsingle-coreturbofrequency(GHz).Intel
turboBoostTechnologyrequiresaPCwithaprocessorwithIntelTurboboostTechnol-
ogycapability.IntelTurboBoostTechnologyperformancevariesdependingonhard-
ware,software,andoverallsystemconguration.CheckwithyourPCmanufacturer
onwhetheryoursystemdeliversIntelTurboBoostTechnology.Seewww.intel.com/
technology/tuboboostformoreinformation
2 Intel®Hyper-ThreadingTechnologyrequiresacomputersystemwithaprocessor
supportingHTTechnologyandanHTTechnology-enabledchipset,BIOS,andoperat-
ingsystem.Performancewillvarydependingonthespecichardwareandsoftware
youuse.Seewww.intel.com/info/hyperthreadingformoreinformation.
3 Intel®HighDenitionAudiorequiresasystemwithanappropriateIntel®chipsetand
amotherboardwithanappropriatecodecandthenecessarydriversinstalled.System
soundqualitywillvarydependingonactualimplementation,controller,codec,drivers,
andspeakers.FormoreinformationaboutIntel®HDAudio,refertowww.intel.com/
design/chipsets/hdaudio.htm
4 64-bitcomputingonIntel®architecturerequiresacomputersystemwithaprocessor,
chipset,BIOS,operatingsystem,devicedrivers,andapplicationsenabledforIntel®
64architecture.Processorswillnotoperate(including32-bitoperation)without
anIntel64architecture-enabledBIOS.Performancewillvarydependingonyour
hardwareandsoftwarecongurations.Seehttp://developer.intel.com/technology/
intel64/index.htmformoreinformation.
5 Systemresourcesandhardware(suchasPCIandPCIExpress*)requirephysical
memoryaddresslocationsthatcanreduceavailableaddressablesystemmemory.This
couldresultinareductionofasmuchas1GBormoreofphysicaladdressablememory
beingavailabletotheoperatingsystemandapplications,dependingonthesystem
congurationandoperatingsystem.
6 WARNING:AlteringPCmemoryfrequency,voltageand/orlatencymay:(i)reduce
systemstabilityandusefullifeofthesystem,memoryandprocessor;(ii)causethe
processorandothersystemcomponentstofail;(iii)causereductionsinsystemper-
formance;(iv)causeadditionalheatorotherdamage;and(v)affectsystemdata
integrity.Intelhasnottested,anddoesnotwarranty,theoperationofthememory
beyonditsspecications.Intelassumesnoresponsibilitythatthememory,including
ifusedwithalteredclockfrequenciesand/orvoltages,willbetforanyparticular
purpose.Checkwithmemorymanufacturerforwarrantyandadditionaldetails.
INFORMATIONINTHISDOCUMENTISPROVIDEDINCONNECTIONWITHINTEL®PROD-
UCTS.NOLICENSE,EXPRESSORIMPLIED,BYESTOPPELOROTHERWISE,TOANY
INTELLECTUALPROPERTYRIGHTSISGRANTEDBYTHISDOCUMENT.EXCEPTAS
PROVIDEDININTEL’STERMSANDCONDITIONSOFSALEFORSUCHPRODUCTS,INTEL
ASSUMESNOLIABILITYWHATSOEVER,ANDINTELDISCLAIMSANYEXPRESSORIM-
PLIEDWARRANTY,RELATINGTOSALEAND/ORUSEOFINTELPRODUCTSINCLUDING
LIABILITYORWARRANTIESRELATINGTOFITNESSFORAPARTICULARPURPOSE,
MERCHANTABILITY,ORINFRINGEMENTOFANYPATENT,COPYRIGHT,OROTHERINTEL-
LECTUALPROPERTYRIGHT.
Intelproductsarenotintendedforuseinmedical,life-saving,orlife-sustainingap-
plications.Intelmaymakechangestospecicationsandproductdescriptionsatany
time,withoutnotice.
Allproducts,dates,andguresspeciedarepreliminarybasedoncurrentexpectations,
andaresubjecttochangewithoutnotice.Availabilityindifferentchannelsmayvary.
ActualIntel®DesktopBoardmaydifferfromtheimageshown.
Intel,theIntellogo,IntelCore,Pentium,andCeleronaretrademarksofIntelCorporation
intheU.S.andothercountries.
* Othernamesandbrandsmaybeclaimedasthepropertyofothers.
Copyright©2012,IntelCorporation05/12/ST/MED/PDF327431-001
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TechnicalSpecications
Executive Series